Array substrate packaging structure, display panel and display device

Abstract

The utility model discloses an array substrate packaging structure, a display panel and a display device. The array substrate packaging structure comprises a first substrate, a metal layer, a light-emitting layer, a first packaging layer and a second packaging layer which are stacked in sequence, the array substrate packaging structure comprises a non-display area, and a groove structure penetrating through the metal layer and the light-emitting layer is arranged in the non-display area. The groove structure is used for separating the metal layer from the light-emitting layer; the flexible waterproof layer is arranged between the first packaging layer and the second packaging layer. The packaging structure further comprises a flexible waterproof layer, and the flexible waterproof layer is arranged between the first packaging layer and the second packaging layer. According to the technical scheme provided by the embodiment of the utility model, the packaging effect of the corner area of the packaging layer is improved.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of display technology, and in particular to an array substrate packaging structure, a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is a display lighting technology that has gradually developed in recent years. Especially in the display industry, it has broad application prospects due to its advantages such as high response, high contrast, and flexibility.

[0003] However, since OLED devices are susceptible to corrosion and damage under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices. At present, in order to ensure the packaging effect of the packaging layer, multiple undercut structures are usually required for the edges of through holes in the OLED display panel, such as the edges of the through holes of the camera hole. Among them, the undercut structure is a structure in which the edge of the middle film layer is recessed inward relative to the upper and lower film layers. When the side engraving uniformity of the undercut structure is relatively poor, the film formation of the packaging undercut structure of the packaging layer is poor and it is easy to break, thereby forming a water and oxygen intrusion path, resulting in a reduced life of the OLED display panel. Utility Model Content

[0004] The utility model provides an array substrate packaging structure, a display panel and a display device, which improve the packaging effect of the corner area of ​​the packaging layer.

[0005] In a first aspect, an embodiment of the utility model provides an array substrate packaging structure, comprising a first substrate, a metal layer, a light-emitting layer, a first packaging layer, and a second packaging layer stacked in sequence;

[0006] The array substrate packaging structure includes a non-display area, in which a groove structure penetrating the metal layer and the light-emitting layer is arranged; the groove structure is used to separate the metal layer and the light-emitting layer; and also includes a flexible water-blocking layer, which is arranged between the first packaging layer and the second packaging layer.

[0007] Optionally, the groove structure includes a through structure penetrating the metal layer and the light-emitting layer and a bottom groove structure in the first substrate; the top opening area of ​​the bottom groove structure is larger than the bottom opening area of ​​the through structure.

[0008] Optionally, the flexible water-blocking layer is a graphene film.

[0009] Optionally, the flexible water-blocking layer is a metal film.

[0010] Optionally, the metal film is a gold film.

[0011] Optionally, the thickness of the flexible water-blocking layer is 1-5000 nm.

[0012] Optionally, in the non-display area, the perforated cutting paths are arranged between adjacent groove structures.

[0013] Optionally, the array substrate packaging structure further includes a second substrate and a buffer layer; the second substrate is arranged on a side of the first substrate away from the metal layer, and the buffer layer is arranged between the first substrate and the second substrate.

[0014] In a second aspect, an embodiment of the present invention provides a display panel, comprising the array substrate packaging structure described in any embodiment of the present invention.

[0015] In a third aspect, an embodiment of the utility model provides a display device, comprising the display panel described in any embodiment of the utility model.

[0016] The technical solution provided by the embodiment of the utility model adds a flexible water-blocking layer between the first encapsulation layer and the second encapsulation layer of the groove structure in the non-display area, and uses the flexible water-blocking layer to connect at the recessed position of the groove structure to form a combined structure of the first encapsulation layer, the flexible water-blocking layer and the second encapsulation layer, so as to relieve the stress of the first encapsulation layer and the second encapsulation layer, thereby avoiding the first encapsulation layer and the second encapsulation layer from breaking in the corner area of ​​the groove structure, and improving the encapsulation effect of the corner area of ​​the encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of an array substrate packaging structure is provided for an embodiment of the utility model;

[0018] Figure 2 A schematic structural diagram of a display device provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Figure 1 A schematic diagram of an array substrate packaging structure is provided for an embodiment of the utility model. Figure 1, comprising a first substrate 110, a metal layer 120, a light-emitting layer (not shown in the figure), a first encapsulation layer 130 and a second encapsulation layer 140 which are stacked in sequence;

[0021] The array substrate packaging structure includes a non-display area 10, in which a groove structure 150 penetrating the metal layer 120 and the light-emitting layer is arranged; the groove structure 150 is used to separate the metal layer 120 and the light-emitting layer; and also includes a flexible water-blocking layer 160, which is arranged between the first packaging layer 130 and the second packaging layer 140.

[0022] Specifically, the array substrate includes a display area and a non-display area 10, and also includes a first substrate 110, a metal layer 120, a light-emitting layer, a first packaging layer 130 and a second packaging layer 140 that are stacked; wherein the material of the substrate can be glass, quartz, or a hard or flexible transparent resin material, etc., and this application does not limit this.

[0023] In the non-display area 10, a groove structure 150 is provided that penetrates the metal layer 120, thereby forming an undercut structure. Usually, after forming the undercut structure, it is necessary to evaporate a light-emitting layer on the display panel to form a light-emitting device. Among them, the light-emitting layer is an organic material layer, and the metal layer 120 can be a metal layer 120 inside the display array substrate, for example, it can be a gate metal layer 120 or a source and drain metal layer 120. When patterning the metal layer 120, a pattern can be formed in the non-display area 10 at the same time.

[0024] When the light-emitting layer covers the groove structure 150, the light-emitting layer will be disconnected at the recessed position of the groove structure 150, thereby isolating the metal layer 120 and the light-emitting layer. When the display panel is subsequently encapsulated to form the first encapsulation layer 130 and the second encapsulation layer 140, the first encapsulation layer 130 and the second encapsulation layer 140 are connected at the recessed position of the groove structure 150, thereby cutting off the path for water and oxygen outside the display panel to enter the inside of the display panel through the light-emitting layer. Since the under cut structure has different morphological uniformity in the actual exposure process, the inorganic film of the encapsulation layer is poorly formed and easily broken when covering the under cut structure, thereby forming a water and oxygen invasion path, and the film internal stress of the first encapsulation layer 130 and the second encapsulation layer 140 formed in the corner area of ​​the under cut is large, and it is easy to break, resulting in encapsulation failure. Therefore, in order to ensure the encapsulation effect, a flexible water-blocking layer 160 is added between the first encapsulation layer 130 and the second encapsulation layer 140. The flexible water-blocking layer 160 is connected at the recessed position of the groove structure 150 to form a combined structure of the first encapsulation layer 130, the flexible water-blocking layer 160 and the second encapsulation layer 140, so as to relieve the stress of the first encapsulation layer 130 and the second encapsulation layer 140, thereby avoiding the first encapsulation layer 130 and the second encapsulation layer 140 from breaking in the corner area of ​​the groove structure 150, thereby improving the encapsulation effect of the corner area of ​​the encapsulation layer.

[0025] The technical solution provided by the embodiment of the utility model adds a flexible water-blocking layer between the first encapsulation layer and the second encapsulation layer of the groove structure in the non-display area, and uses the flexible water-blocking layer to connect at the recessed position of the groove structure to form a combined structure of the first encapsulation layer, the flexible water-blocking layer and the second encapsulation layer, so as to relieve the stress of the first encapsulation layer and the second encapsulation layer, thereby avoiding the first encapsulation layer and the second encapsulation layer from breaking in the corner area of ​​the groove structure, and improving the encapsulation effect of the corner area of ​​the encapsulation layer.

[0026] Optionally, the groove structure 150 includes a through structure penetrating the metal layer 120 and the light-emitting layer and a bottom groove structure in the first substrate 110; the top opening area of ​​the bottom groove structure is larger than the bottom opening area of ​​the through structure.

[0027] Specifically, the bottom of the through structure is connected to the top of the bottom groove structure, and the top opening area of ​​the bottom groove structure is larger than the bottom opening area of ​​the through structure, so that the edge of the first substrate 110 adjacent to the metal layer 120 in the same layer of the bottom groove structure is concave in the horizontal direction, so that the groove structure 150 forms an undercut structure, which is used to improve the packaging effect of the packaging structure. The through structure formed on the metal layer 120 and the bottom groove structure on the first substrate 110 can be formed by patterning, so the size of the through structure and the bottom groove structure can be controlled, and then the depth of the undercut structure can be controlled, so as to ensure that the light-emitting layer is not connected at the undercut structure, cut off the invasion of external water and oxygen through the light-emitting layer, and improve the packaging effect.

[0028] Optionally, the flexible water-blocking layer 160 is a graphene film or a metal film. The graphene film or the metal film has high flexibility and a certain water-blocking ability, thereby relieving the stress between the packaging film layers. Among them, graphene has high flexibility, and the metal film layer also has high flexibility. For example, a 100nm metal film layer, for example, the stress of the gold film is 0.85*10 8 Pa, the inorganic film stress SiN is -3*10 9 Pa, SiO stress is -5*10 9 Pa, it can be seen that the ductility is much better than that of the inorganic film layer, which can effectively relieve the stress between the inorganic packaging film layers. In addition, the graphene film and the metal film also have a certain resistance to water and oxygen, which can also enhance the effect of water and oxygen resistance. Among them, the thickness of the flexible water-blocking layer 160 needs to take into account the influence of flexibility and device thickness. Optionally, the thickness of the flexible water-blocking layer 160 is 1-5000nm.

[0029] Optionally, the array substrate packaging structure further includes a barrier wall 170, which is used to limit the printing range of the ink 180. After the ink is cured, a second packaging layer 140 is set. The first packaging layer 130 covers the structure to be packaged 200, which is a specific implementation structure of the OLED display function. The structure to be packaged generally includes a pixel circuit formed on the substrate, a pixel definition layer (Pixel Definition Layer, PDL) covering the pixel circuit, a bottom electrode located in the groove of the pixel definition layer, an organic material functional layer, such as a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, etc., and a top electrode covering the pixel definition layer, etc. Since part of the groove structure 150 is cured and packaged by the ink material, the extension length of the flexible water-blocking layer 160 in the horizontal direction can be cut off by the barrier wall 170, which can reduce the coverage area of ​​the flexible water-blocking layer 160, thereby reducing the material consumption of the flexible water-blocking layer 160.

[0030] Optionally, in the non-display area 10, the perforated cutting road 190 is set between adjacent groove structures 150. Specifically, in order to increase the screen-to-body ratio, existing OLED displays will design special-shaped openings, and the display screen above the camera projection will be cut by laser or other methods before the camera is installed to ensure that the camera can directly obtain external light. In the opening area of ​​the flexible product, the cutting road 190 is set between adjacent groove structures 150. After cutting, the light-emitting layer is separated by the groove structure 150 to prevent water and oxygen from invading.

[0031] Optionally, the array substrate packaging structure further includes a second substrate 210 and a buffer layer; the second substrate 210 is disposed on a side of the first substrate 110 away from the metal layer 120, and a buffer layer 220 is disposed between the first substrate 110 and the second substrate 210. The buffer layer 220 is elastic and plays a buffering role. When the display module is bent, the buffer layer can protect the display panel from being scratched by other structures.

[0032] The embodiment of the utility model further provides a display panel. The display panel includes the array substrate packaging structure provided by any embodiment of the utility model. Therefore, it has the same beneficial effects as the array substrate packaging structure provided by any embodiment of the utility model, which will not be described in detail here.

[0033] Figure 2 A schematic diagram of a display device provided by an embodiment of the utility model, referring to Figure 2 The display device 20 includes any display panel 19 according to any embodiment of the present utility model.

[0034] The display device 20 of this embodiment includes any display panel 19 of the embodiment of the utility model, and therefore has the same beneficial effects, which will not be repeated here; the display device 20 provided in the embodiment of the utility model can be a display device with a display function such as a mobile phone, a computer, and a smart wearable device, and the embodiment of the utility model is not limited to this.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. An array substrate packaging structure, characterized in that: It includes a first substrate, a metal layer, a light-emitting layer, a first encapsulation layer and a second encapsulation layer which are stacked in sequence; The array substrate packaging structure includes a non-display area, in which a groove structure penetrating the metal layer and the light-emitting layer is arranged; the groove structure is used to separate the metal layer and the light-emitting layer; and also includes a flexible water-blocking layer, which is arranged between the first packaging layer and the second packaging layer.

2. The array substrate packaging structure according to claim 1, characterized in that: The groove structure includes a through structure penetrating the metal layer and the light-emitting layer and a bottom groove structure in the first substrate; the top opening area of ​​the bottom groove structure is larger than the bottom opening area of ​​the through structure.

3. The array substrate packaging structure according to claim 1, characterized in that: The flexible water-blocking layer is a graphene film.

4. The array substrate packaging structure according to claim 1, characterized in that: The flexible water-blocking layer is a metal film.

5. The array substrate packaging structure according to claim 4, characterized in that: The metal film is a gold film.

6. The array substrate packaging structure according to claim 1, characterized in that: The thickness of the flexible water-blocking layer is 1-5000 nm.

7. The array substrate packaging structure according to claim 1, characterized in that: In the non-display area, the perforated cutting lanes are arranged between adjacent groove structures.

8. The array substrate packaging structure according to claim 1, characterized in that: It also includes a second substrate and a buffer layer; the second substrate is arranged on a side of the first substrate away from the metal layer, and the buffer layer is arranged between the first substrate and the second substrate.

9. A display panel, characterized in that: It comprises the array substrate packaging structure as described in any one of claims 1 to 8.

10. A display device, characterized in that: Comprising the display panel as claimed in claim 9.

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