Lower wafer cutting, tracking, slag absorbing and collecting device

Abstract

The utility model discloses a lower wafer cutting, tracking, slag sucking and collecting device. The lower wafer cutting, tracking, slag sucking and collecting device comprises a front pressing roller set, a rear pressing roller set, a machine base, a first transverse movement driver, a first longitudinal movement driver, a laser cutting machine and a waste slag tracking and collecting mechanism. The front compression roller set and the rear compression roller set are arranged on the machine base according to the front-back movement of the metal plate, each compression roller set is provided with an upper compression roller and a lower compression roller, and the metal plate is located between the upper compression roller and the lower compression roller. The first transverse movement driver is installed between the two first longitudinal movement drivers in a sliding mode, and the laser cutting machine is installed on the first transverse movement driver. The waste residue tracking and collecting mechanism comprises a collecting pipe, a first transverse lead screw set and a first longitudinal lead screw set. According to the technical scheme, the lower wafer is prepared in a laser cutting mode, and meanwhile waste residues generated in the cutting process are tracked and collected.

Description

Technical Field

[0001] The utility model relates to a processing auxiliary device for a thermos cup, in particular to a device which cuts sheet metal into a lower disc by a laser cutting method, and is equipped with a waste residue tracking system to absorb waste residue generated by cutting to avoid damaging the sheet metal or the lower disc. Background Art

[0002] The lower disc of the thermos cup is a part of the bottom of the thermos cup. The current manufacturing process is to use a punch press to stamp the sheet metal. This process has many problems. For example, each specification of the thermos cup needs to be equipped with a set of molds. Many molds are expensive and require a large area for storage, which incurs more costs. In addition, various molds are easily damaged and have high maintenance costs. The working environment of stamping and cutting needs to be improved. The installation of molds is labor-intensive, requires high technical requirements and poses safety hazards. Laser cutting is a current metal processing method. If laser cutting is used to prepare the lower disc of sheet metal, waste slag will be generated during processing, which can easily damage the sheet metal or the lower disc. These problems need to be solved by using laser cutting technology to replace the existing stamping and cutting technology. Utility Model Content

[0003] The utility model aims to provide a lower wafer cutting tracking slag collection device, and solves the technical problem of preparing the lower wafer by laser cutting and tracking and collecting the waste slag generated in the cutting process.

[0004] The lower wafer cutting tracking slag collection device comprises a front pressure roller group, a rear pressure roller group, a machine base, a first transverse moving driver, a first longitudinal moving driver, a laser cutting machine, and a waste slag tracking and collection mechanism; the front pressure roller group and the rear pressure roller group are installed on the machine base according to the front and rear placement of the sheet metal movement, each pressure roller group has two upper and lower pressure rollers, and the sheet metal is located between the two upper and lower pressure rollers; the first transverse moving driver is slidably installed between the two first longitudinal moving drivers, and the laser cutting machine is installed on the first transverse driving driver; the waste slag tracking and collection mechanism comprises a collection tube, a first transverse screw group, and a first longitudinal screw group; the collection tube is hollow inside and is directly below the cutting head of the laser cutting machine in real time, the above-mentioned collection tube is installed on the first transverse screw group, and the first transverse screw group is fixed on the first longitudinal screw group.

[0005] The front pressing roller group includes four pressing rollers, and every two pressing rollers form a row, so that the upper row has two pressing rollers and the lower row has two pressing rollers.

[0006] The rear pressing roller group includes four pressing rollers, and every two pressing rollers form a row, so that the upper row has two pressing rollers and the lower row has two pressing rollers.

[0007] The pressure rollers on the front pressure roller group and the rear pressure roller group are both equipped with a first motor.

[0008] Both sides of the first transverse moving driver are provided with L-shaped first connecting seats, and the first connecting seats are installed on the first longitudinal moving driver.

[0009] The laser cutting machine is provided with a cylinder, which is fixed on the first transverse moving driver via a second connecting seat.

[0010] The side arm of the collecting tube is equipped with an electromagnet.

[0011] The collecting tube is installed on a third connecting seat, which cooperates with the screw on the first transverse screw group. The first transverse screw group has a bottom plate, which cooperates with the screw of the first longitudinal screw group; the screws cooperate with the second motor.

[0012] The base plate is fixed on a longitudinally arranged linear slide rail.

[0013] The beneficial effects of the utility model are as follows: the utility model designs front and rear pressure roller groups, thereby sending the sheet metal to the bottom of the laser cutting machine to wait for cutting; designs a first transverse moving driver and two first longitudinal moving drivers, so that the two drivers cooperate together to realize the circular cutting action of the laser cutting machine; designs a collection tube, which can use electromagnets and negative pressure adsorption to immediately recycle the waste slag generated during the laser cutting process, thereby avoiding damaging the sheet metal or the lower disc; designs a first transverse screw group and a first longitudinal screw group, so that the actions of the first transverse moving driver and the first longitudinal moving driver are tracked, so that the collection head is always directly below the laser cutting head, ensuring that the waste slag is completely collected. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the lower wafer cutting tracking slag suction and collection device cutting the sheet metal and collecting the waste slag;

[0015] Figure 2 yes Figure 1 A schematic diagram of the bottom structure of the device;

[0016] Figure 3 yes Figure 1 A schematic diagram of the device from another angle;

[0017] Figure 4 yes Figure 3 Schematic diagram of the explosion of the device;

[0018] In the picture

[0019] 1. Front pressure roller group;

[0020] 2. Rear pressure roller group;

[0021] 3. Machine base;

[0022] 4. A first lateral movement actuator;

[0023] 5. A first longitudinal movement driver;

[0024] 6. Laser cutting machine;

[0025] 7. Waste slag tracking and collecting mechanism, 71. Collection pipe, 72. First transverse screw group, 73. First longitudinal screw group;

[0026] 81. sheet metal, 82. first motor, 83. first connecting seat, 84. second connecting seat, 85. cylinder, 86. electromagnet, 87. third connecting seat, 88. slide rail, 89. second motor, 810. bottom plate. DETAILED DESCRIPTION

[0027] Please refer to Figures 1 to 4 The lower wafer cutting tracking slag collection device in the figure is mainly designed with a front pressure roller group 1, a rear pressure roller group 2, two machine bases 3, a first transverse moving driver 4, two first longitudinal moving drivers 5, a laser cutting machine 6, and a waste slag tracking and collecting mechanism 7. Other supporting structures such as brackets, bearings, etc. can be added accordingly according to the technical solution.

[0028] The front pressure roller group 1 in the figure is composed of four pressure rollers, and each upper and lower two conventional pressure rollers constitute a group. The sheet metal 81 is located between the upper and lower pressure rollers so that the sheet metal 81 moves under the action of the pressure rollers. A first motor 82 and a corresponding gear structure are arranged on both sides of one pressure roller of one group of pressure rollers, so that the pressure roller rotates under the action of the first motor 82 to move the sheet metal 81.

[0029] The structure of the rear roller group 2 in the figure is similar to that of the front roller group 1 and is arranged at the rear position of the front roller group 1 according to the movement direction of the sheet metal 81. The two roller groups are installed on the machine base 3. The rear roller group 2 is also composed of four conventional rollers, each of which is composed of two upper and lower rollers. It is also equipped with a corresponding first motor 82 and a gear structure. The front roller group 1 and the rear roller group 2 work together to enable the sheet metal 81 to be cut by the laser cutting head in a moving or stationary state, and the movement directions of the two roller groups can also be kept in the same direction or in the opposite direction. The specific type of the first motor 82 can be selected according to actual conditions, and the matching structure between the first motor 82 and the roller can refer to the existing method.

[0030] The machine base 3 in the figure is mainly used to fix and install the first motor 82 and the pressure roller accordingly. The specific shape thereof is not limited, and the machine base 3 can also be used to install and fix other components.

[0031] The first transverse moving driver 4 in the figure is equipped with an L-shaped first connecting seat 83 structure at both sides, so that the first transverse moving driver 4 is installed between the two first longitudinal moving drivers 5, so that the first transverse moving driver 4 moves longitudinally through the action of the two first longitudinal moving drivers 5, and the laser cutting machine 6 is installed on the first transverse moving driver 4, so that the first transverse moving driver 4 makes the laser cutting machine 6 move transversely. Through the control of the transverse and longitudinal directions, the circular cutting action of the laser cutting machine 6 can be realized, thereby completing the production of lower wafers of different specifications. The above-mentioned first transverse moving driver 4 and the first longitudinal moving driver 5 can both adopt existing component designs, such as the existing components represented by the figure in the figure. In actual applications, other styles of driver structures can also be adopted.

[0032] The laser cutting machine 6 in the figure is equipped with a cylinder 85 and a corresponding second connecting seat 84 structure. The cylinder 85 drives the cutting head to move up and down, and the second connecting seat 84 is a conventional structure, which can be installed on the first horizontal moving driver 4.

[0033] The waste slag tracking and collecting mechanism 7 in the figure is mainly designed with a collecting tube 71, a first transverse screw group 72, and a first longitudinal screw group 73. The collecting tube 71 is installed on the first transverse screw group 72, and the first transverse screw group 72 is fixed on the first longitudinal screw group 73. The specific installation can refer to the figure or the existing method; wherein the collecting tube 71 is used to collect the waste slag generated during the cutting process, the first transverse screw group 72 is used to make the collecting tube 71 move transversely, and the first longitudinal screw group 73 is used to make the first transverse screw group 72 move longitudinally, thereby driving the collecting tube 71 to move longitudinally. Through the cooperation of the transverse and longitudinal screw groups, the collecting tube 71 can perform a circular movement like the cutting head, so as to track the cutting head and place it directly below the cutting head of the laser cutting machine 6 in real time, so as to ensure that the waste slag generated after cutting can be accurately dropped and collected in the collecting tube 71 through the electromagnet 86, negative pressure, etc., to avoid splashing; the specific tracking method is that the controller senses the position of the first motor 82 and the second motor 89 as a whole together with the control and the corresponding sensor. The above-mentioned collecting tube 71 is a strip-shaped hollow tube structure, and its outer wall can be installed with an electromagnet 86 and other structures by screws. In order to facilitate the mutual fixation between the components, a third connecting seat 87 structure of a conventional structure can be installed on the collecting tube 71. The third connecting seat 87 has a thread so that it can be spirally driven with the screw in the screw group. As shown in the figure, the first horizontal screw group 72 is installed as a whole on a base plate 810, and the base plate 810 can be understood as a structure similar to a screw seat. The base plate 810 can maintain spiral drive cooperation with the screw of the first longitudinal screw group 73, and the longitudinally arranged linear slide rail 88 can realize accurate linear movement. The above-mentioned screw groups are all conventional screw structures, and the specific structure can be referred to as shown in the figure. Each screw is also driven to rotate by a second motor 89. The second motor 89 can refer to the existing motor structure that cooperates with the screw.

[0034] In this case, when the laser head moves in the horizontal and vertical directions to achieve circular cutting of the sheet metal 81, the collection tube 71 follows the same movement trajectory based on the movement data of the laser head, and cooperates with the electromagnet 86, the negative pressure absorber and other components to achieve timely and accurate collection of waste slag. The number of the above laser heads can be adjusted as needed, and the cutting of the sheet metal can be static or dynamic, that is, when the sheet metal is stationary, the laser head is cutting, which is static cutting, and when the sheet metal moves, the laser head is cutting synchronously, which is dynamic cutting.

[0035] The specific embodiments described above are only used to explain the present technical solution and are not used to limit the present technical solution. In the description of the present technical solution, it should be noted that the terms such as "upper" and "inner" indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present technical solution and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present technical solution.

[0036] At the same time, in the description of this technical solution, it should be noted that, unless otherwise clearly specified and limited, the terms "fixed" and "matched" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this technical solution can be understood according to specific circumstances.

[0037] Although embodiments of the present technical solution have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present technical solution, and that the scope of the present technical solution is defined by the appended claims and their equivalents.

Claims

1. The lower wafer cutting tracking slag collection device is characterized by: The invention comprises a front pressure roller group (1), a rear pressure roller group (2), a machine base (3), a first transverse moving driver (4), a first longitudinal moving driver (5), a laser cutting machine (6), and a waste residue tracking and collecting mechanism (7); the front pressure roller group (1) and the rear pressure roller group (2) are arranged on the machine base (3) in a front-to-back manner according to the movement of the sheet metal (81); each pressure roller group comprises two upper and lower pressure rollers, and the sheet metal (81) is located between the two upper and lower pressure rollers; the first transverse moving driver (4) is slidably installed between the two first longitudinal moving drivers (5), and the laser cutting machine (6) is installed on the first transverse driving driver; the waste residue tracking and collecting mechanism (7) comprises a collecting pipe (71), a first transverse screw group (72), and a first longitudinal screw group (73); the collecting pipe (71) is hollow inside and is located directly below the cutting head of the laser cutting machine (6) in real time; the collecting pipe (71) is installed on the first transverse screw group (72), and the first transverse screw group (72) is fixed on the first longitudinal screw group (73).

2. The lower wafer cutting tracking slag collection device according to claim 1 is characterized in that: The front pressing roller group (1) comprises four pressing rollers, and every two pressing rollers form a row, so that the upper row has two pressing rollers and the lower row has two pressing rollers.

3. The lower wafer cutting tracking slag collection device according to claim 2 is characterized in that: The rear pressing roller group (2) comprises four pressing rollers, and every two pressing rollers form a row, so that the upper row has two pressing rollers and the lower row has two pressing rollers.

4. The lower wafer cutting tracking slag collection device according to claim 3 is characterized in that: The pressure rollers on the front pressure roller group (1) and the rear pressure roller group (2) are both equipped with a first motor (82).

5. The lower wafer cutting tracking slag collection device according to claim 4 is characterized in that: Both sides of the first transverse movement driver (4) are provided with L-shaped first connection seats (83), and the first connection seats (83) are mounted on the first longitudinal movement driver (5).

6. The lower wafer cutting tracking slag collection device according to claim 5 is characterized in that: The laser cutting machine (6) is provided with a cylinder (85), which is fixed on the first transverse movement driver (4) via a second connecting seat (84).

7. The lower wafer cutting tracking slag collection device according to claim 6 is characterized in that: The side arm of the collecting tube (71) is provided with an electromagnet (86).

8. The lower wafer cutting tracking slag collection device according to claim 7, characterized in that: The collecting pipe (71) is mounted on a third connecting seat (87), and the third connecting seat (87) cooperates with a screw on a first transverse screw group (72). The first transverse screw group (72) has a bottom plate (810), and the bottom plate (810) cooperates with a screw of a first longitudinal screw group (73); the screws cooperate with a second motor (89).

9. The lower wafer cutting tracking slag collection device according to claim 8, characterized in that: The base plate (810) is fixed on a longitudinally arranged linear slide rail (88).

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