Laser module and laser projection apparatus

Abstract

The utility model relates to the technical field of display, and provides a laser module and laser projection equipment, the laser module comprises a laser, a light path transmission part, a heat dissipation part and a non-contact temperature sensor, and the laser is used for providing laser rays for the laser projection equipment; the light path transmission part is located on the light emitting side of the laser device, is connected with the laser device and is used for conducting laser emitted by the laser device; the heat dissipation part is located on the backlight side of the laser, is connected with the laser and is used for dissipating heat of the laser; the non-contact temperature sensor is used for detecting the real-time temperature of the laser; wherein the non-contact temperature sensor is arranged on the light path transmission part, and / or the non-contact temperature sensor is arranged on the heat dissipation part. According to the laser module and the laser projection equipment provided by the embodiment of the invention, the temperature of the laser can be monitored in real time while the structure of the laser is not influenced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a laser module and a laser projection device. Background Art

[0002] The most important component of laser display products is the laser, which determines the image display and brightness of the entire laser display product. The temperature of the laser will gradually increase with its working time. When the temperature is too high, the laser cannot work normally and may even cause irreversible damage to the laser. Utility Model Content

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a laser module and a laser projection device.

[0004] In a first aspect, the present application discloses a laser module, which includes: a laser, the laser is used to provide laser light for a laser projection device; an optical path transmission part, the optical path transmission part is located on the light output side of the laser and is connected to the laser, the optical path transmission part is used to conduct the laser emitted by the laser; a heat dissipation part, the heat dissipation part is located on the backlight side of the laser and is connected to the laser, the heat dissipation part is used to dissipate heat for the laser; a non-contact temperature sensor, the non-contact temperature sensor is used to detect the real-time temperature of the laser; wherein the non-contact temperature sensor is arranged in the optical path transmission part, and / or the non-contact temperature sensor is arranged in the heat dissipation part.

[0005] In this way, by setting the non-contact temperature sensor on the heat dissipation part or the optical transmission part, the laser temperature can be monitored in real time without affecting the structure of the laser, thereby avoiding excessive temperature of the laser and ensuring the normal operation of the laser.

[0006] In some embodiments of the present application, the non-contact temperature sensor is formed as a thermopile infrared temperature sensor.

[0007] In some embodiments of the present application, the heat dissipation portion includes a first surface facing the laser, and the first surface abuts the laser; the heat dissipation portion is provided with a mounting groove, and the mounting groove is recessed from a portion of the first surface toward a direction away from the laser, and the non-contact temperature sensor is arranged in the mounting groove.

[0008] In some embodiments of the present application, the heat dissipation part is also provided with a wiring groove, which is recessed from a portion of the first surface toward a direction away from the laser, one end of the wiring groove is connected to the installation groove, and the other end of the wiring groove extends to the circumferential side of the heat dissipation part and is connected to the outside of the heat dissipation part.

[0009] In some embodiments of the present application, the heat dissipation portion is further provided with a wiring through hole, one end of the wiring through hole is connected to the installation groove, and the other end of the wiring through hole is connected to the outside of the heat dissipation portion.

[0010] In some embodiments of the present application, the laser module further includes: a mounting plate, the mounting plate is disposed in the mounting groove, and the non-contact temperature sensor is disposed on the mounting plate.

[0011] In some embodiments of the present application, a first connecting portion is provided on the mounting plate, a second connecting portion is provided in the mounting groove, and the first connecting portion and the second connecting portion are detachably connected.

[0012] In some embodiments of the present application, the laser module further includes: an electrical connection plug, the electrical connection plug is located in the installation groove, and the electrical connection plug is used to supply power to the non-contact temperature sensor.

[0013] In some embodiments of the present application, the non-contact temperature sensor is disposed in the optical path transmission portion, and the non-contact temperature sensor is disposed close to the laser; wherein the non-contact temperature sensor is located outside the light output path of the laser.

[0014] In a second aspect, the present application further provides a laser projection device, which includes a laser module and a protective shell provided in any of the above embodiments, wherein a housing cavity is defined in the protective shell, and the laser module is located in the housing cavity.

[0015] Among them, the technical effects brought about by any design method in the second aspect can refer to the technical effects brought about by different design methods in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A schematic diagram of a laser module provided for some embodiments of the present application;

[0019] Figure 2 A schematic diagram of a heat dissipation unit provided in some embodiments of the present application;

[0020] Figure 3 Schematic diagram of a heat dissipation unit provided in some other embodiments of the present application;

[0021] Figure 4 for Figure 3 Schematic diagram of the mounting plate shown in FIG. after integration with the non-contact temperature sensor;

[0022] Figure 5 Schematic diagram of a laser module provided for some other embodiments of the present application;

[0023] Figure 6 Schematic diagram of a laser module provided for some other embodiments of the present application;

[0024] Figure 7 Schematic diagram of a laser module provided for some other embodiments of the present application;

[0025] Figure 8 Thermopile infrared temperature measurement sensors in some embodiments of the present application;

[0026] Fig. 9 This is the working principle diagram of the thermopile infrared temperature sensor;

[0027] Fig.10 This is a curve chart showing the change of signal voltage of the thermopile infrared temperature sensor with the temperature of the target object.

[0028] Reference numerals:

[0029] 100. Laser module;

[0030] 110. Laser;

[0031] 120, heat dissipation portion; 121, first surface; 122, mounting groove; 123, heat dissipation fin; 124, wiring through hole; 125, mounting plate; 126, wiring groove;

[0032] 130. Optical transmission unit;

[0033] 140, non-contact temperature sensor; 141, NTC sampling resistor; 142, optical lens; 143, infrared filter; 144, thermopile chip; 1403, amplifier; 1404, analog-to-digital converter; 1405, mainboard; 1406, temperature sensor;

[0034] 150. Wiring harness. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0036] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0037] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0039] In the description of the embodiments of the present application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0040] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. In addition, the directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only references to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0041] In the description of the embodiments of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0042] This application provides a laser projection device, see Figure 1 The laser projection device may include a laser module 100 and a protective shell. A housing cavity is defined in the protective shell, and the laser module 100 is located in the housing cavity. In this way, the laser module 100 can be isolated from the external environment by setting the protective shell, thereby protecting the laser module 100 and preventing dust, which is beneficial to extending the service life of the laser module 100 and improving the product's usage texture.

[0043] The laser 110 determines the image display and brightness of the entire laser projection device. The temperature of the laser 110 will gradually increase with its working time. When the temperature is too high, the laser 110 cannot work normally and may even cause irreversible damage to the laser 110.

[0044] In order to monitor the working temperature of the laser 110 in real time, in the related art, a temperature sensor is generally provided on the laser 110 to obtain the real-time temperature of the laser 110; specifically, the laser temperature detection methods adopted are all contact detection, and the detectors used are all thermistors (Negative Temperature Coefficient Sensor, NTC). The resistance of the thermistor will change with the change of temperature. Then, when the temperature of the measured area changes, its resistance changes, and the voltage value obtained by the voltage division will also change accordingly. Therefore, the temperature of the object to be measured can be obtained according to the analog to digital converter (Analog to Digital Converter, ADC) value finally converted.

[0045] Specifically, there are two forms: one is a surface-mount NTC, which is directly integrated into the printed circuit board of the laser 110. The printed circuit board and the laser 110 are combined by welding. There is a temperature transfer process, so the temperature measured by this detection method has deviations. The other is a fixed NTC, which needs to be fixed to the laser 110 with screws. The operation is complicated. Specifically, the temperature sensor is fixed to the laser 110 with screws. However, with the miniaturization of the laser 110, the fixing screw holes and screws of the laser 110 are gradually reduced. The temperature sensor is not easy to fix and is easy to fall off. At the same time, it is difficult to manage the wires, and it is easy to display errors, which affects the user experience.

[0046] To resolve the above technical issues, please refer to Figure 2 The present application also provides a laser module 100, which may include a laser 110, an optical transmission unit 130, a heat dissipation unit 120, and a non-contact temperature sensor 140. The laser 110 is used to provide laser light for the laser projection device; the optical transmission unit 130 is located on the light-emitting side of the laser 110, and the optical transmission unit 130 is connected to the laser 110, and the optical transmission unit 130 is used to conduct the laser light emitted by the laser 110; the heat dissipation unit 120 is located on the backlight side of the laser 110, and the heat dissipation unit 120 is connected to the laser 110, and the heat dissipation unit 120 is used to dissipate heat for the laser 110; the non-contact temperature sensor 140 is used to detect the real-time temperature of the laser 110.

[0047] The non-contact temperature sensor 140 refers to a temperature sensor that can detect the temperature of the object to be measured without contacting the object to be measured. In the present application, the object to be measured of the non-contact temperature sensor 140 is a laser 110 .

[0048] In some embodiments of the present application, the non-contact temperature sensor 140 may be disposed on the optical path transmission portion 130. Thus, by disposing the non-contact temperature sensor 140 on the optical path transmission portion 130, the size of the laser 110 may not be considered, and the stability of the non-contact temperature sensor 140 disposed on the optical path transmission portion 130 may be ensured while realizing temperature detection of the laser 110.

[0049] In other embodiments of the present application, the non-contact temperature sensor 140 may be disposed on the heat dissipation portion 120. Thus, by disposing the non-contact temperature sensor 140 on the heat dissipation portion 120, the size of the laser 110 may not be considered, and the stability of the non-contact temperature sensor 140 disposed on the optical path transmission portion 130 may be ensured while realizing temperature detection of the laser 110.

[0050] In some other embodiments of the present application, the number of non-contact temperature sensors 140 may be two, one of which is disposed on the optical path transmission portion 130, and the other is disposed on the heat dissipation portion 120. In this way, by disposing two non-contact temperature sensors 140, the real-time temperature of the laser 110 can be more accurately known, and the phenomenon of damage to the laser 110 due to excessive temperature of the laser 110 can be more effectively avoided.

[0051] The optical path transmission part 130 and the laser 110 may be detachably connected via fasteners; the heat dissipation part 120 and the laser 110 may also be detachably connected via fasteners.

[0052] In some embodiments of this application, please refer to Figure 2 and Figure 3 The heat dissipation part 120 may include a first surface 121 facing the laser 110, and the first surface 121 abuts against the laser 110; the heat dissipation part 120 has a mounting groove 122, and the mounting groove 122 is recessed from a portion of the first surface 121 toward a direction away from the laser 110, and the non-contact temperature sensor 140 is arranged in the mounting groove 122. In this way, by arranging the mounting groove 122 on the first surface 121, on the one hand, the first surface 121 and the laser 110 can be fitted together, and the heat dissipation effect of the heat dissipation part 120 can be ensured; on the other hand, under the premise that the non-contact temperature sensor 140 is arranged on the heat dissipation part 120, the distance between the non-contact temperature sensor 140 and the laser 110 can be shortened, and the accuracy of the temperature detection of the laser 110 can be further ensured.

[0053] The heat dissipation portion 120 may further include a second surface facing away from the laser 110 . The second surface is provided with heat dissipation fins 123 . The heat dissipation fins 123 are used to conduct heat generated by the laser 110 , which is beneficial to the heat dissipation of the laser 110 .

[0054] In some embodiments of this application, please refer to Figure 2 The heat dissipation part 120 is also provided with a wiring groove 126, which is recessed from a portion of the first surface 121 toward a direction away from the laser 110, one end of the wiring groove 126 is connected to the mounting groove 122, and the other end of the wiring groove 126 extends to the circumferential side of the heat dissipation part 120 and is connected to the outside of the heat dissipation part 120. In this way, the wiring groove 126 is used for wiring, and the wiring harness 150 electrically connected to the non-contact temperature sensor 140 is arranged through the wiring groove 126 to ensure the neatness of the wiring harness 150, avoid the phenomenon of the wiring harness 150 being tangled during the use of the laser module 100, and ensure the normal operation of the laser module 100.

[0055] In some embodiments of this application, please refer to Figure 3A wiring through hole 124 may also be provided on the heat dissipation portion 120, one end of the wiring through hole 124 being connected to the mounting groove 122, and the other end of the wiring through hole 124 being connected to the outside of the heat dissipation portion 120. In this way, the wiring through hole 124 is used for wiring, and the wiring harness 150 electrically connected to the non-contact temperature sensor 140 is laid out through the wiring through hole 124 to ensure the neatness of the wiring harness 150, avoid the wiring harness 150 from getting tangled during the use of the laser module 100, and ensure the normal operation of the laser module 100.

[0056] In some embodiments of this application, please refer to Figures 2 to 4 The laser module 100 may further include a mounting plate 125, the mounting plate 125 is disposed in the mounting groove 122, and the non-contact temperature sensor 140 is disposed on the mounting plate 125. In this way, by providing the mounting plate 125 with a mounting position for the non-contact temperature sensor 140, in a specific implementation process, the non-contact temperature sensor 140 may be integrated with the mounting plate 125, and then the mounting plate 125 may be assembled into the mounting groove 122, so that the assembly difficulty of the assembler can be reduced.

[0057] It should be noted that the non-contact temperature sensor 140 is relatively small in size. It is difficult to assemble the non-contact temperature sensor 140 directly in the mounting groove 122, and it is not easy for maintenance personnel to operate. The non-contact temperature sensor 140 is first integrated into the mounting plate 125, and the mounting plate 125 is relatively large in size. Assembling the mounting plate 125 into the mounting groove 122 is less difficult to operate, which is beneficial to improving the work efficiency of the assemblers, and also facilitates the later maintenance and replacement of the non-contact temperature sensor 140.

[0058] In some embodiments of the present application, a first connection portion is provided on the mounting plate 125, and a second connection portion is provided in the mounting groove 122, and the first connection portion and the second connection portion are detachably connected. Thus, through the detachable connection between the first connection portion and the second connection portion, the detachable connection between the mounting plate 125 and the mounting groove 122 is achieved, which is convenient for maintenance personnel to repair and replace the non-contact temperature sensor 140.

[0059] Specifically, the first connection part can be a connection column, and the second connection part can be a connection hole. The connection column and the connection hole are threadedly matched to achieve a detachable connection between the first connection part and the second connection part. In order to ensure the stability of the mounting plate 125 assembled to the mounting groove 122, multiple groups of first connection parts and second connection parts can be provided. In a specific implementation process, three groups of first connection parts and second connection parts, or four groups of first connection parts and second connection parts can be provided.

[0060] In some embodiments of the present application, the laser module 100 may further include an electrical connection plug, which is located in the mounting groove 122 and is electrically connected to the wiring harness 150 , and is used to supply power to the non-contact temperature sensor 140 .

[0061] In some embodiments of this application, please refer to Figure 5 The non-contact temperature sensor 140 can also be arranged in the optical path transmission part 130, and the non-contact temperature sensor 140 is arranged close to the laser 110, wherein the non-contact temperature sensor 140 is located outside the light output path of the laser 110. In this way, the temperature of the laser 110 can be detected while ensuring that the laser 110 emits light normally.

[0062] Specifically, after the non-contact temperature sensor 140 is integrated with the mounting plate 125, it is installed on the optical path transmission part 130, wherein a mounting groove 122 may also be provided on the optical path transmission part 130. In order to realize the electrical connection of the non-contact temperature sensor 140, a wiring groove 126 or a wiring through hole 124 may be provided on the optical path transmission part 130.

[0063] Please note that Figure 6 and Figure 7 According to the actual light emission path of the laser 110 and the spatial layout inside the optical path transmission unit 130, the mounting plate 125 can be arranged parallel to the circumferential side of the optical path transmission unit 130 (for example Figure 7 ), it may also be arranged vertically to the circumferential side of the optical path transmission portion 130 (e.g. Figure 6 Layout of mounting plate 125 shown in ).

[0064] It should be noted that the non-contact temperature sensor 140 may be a thermopile infrared temperature sensor. The thermopile infrared temperature sensor is a temperature sensor based on the thermoelectric effect and is widely used in industrial fields and scientific research.

[0065] Thermopile infrared temperature sensors are composed of multiple thermocouples, each of which is connected by two wires of different metals to form a closed loop. When the thermopile infrared temperature sensor absorbs the infrared energy emitted by the object being measured, the heat flowing through will cause the temperature difference between the two metals to generate a potential difference. Using the Seebeck effect, this potential difference can be measured and correlated with the temperature.

[0066] The conversion of incident radiation (heat) to an output signal (voltage) is based on the thermoelectric effect, also known as the Seebeck effect. The thermoelectric effect describes the separation of charge carriers inside an electrical conductor due to a temperature difference. If the temperature on one side of the conductor is higher than on the other side, the charges will be in an unbalanced state. The degree of charge separation depends on the material and is a constant known as the thermoelectric coefficient.

[0067] Thermopile infrared temperature sensors have a wide detection temperature range (thermopile infrared temperature sensors can be used to measure extremely low temperatures to extremely high temperatures, covering the range from liquid nitrogen temperature to high-temperature molten metal), fast response (thermopile infrared temperature sensors respond very quickly to temperature changes, and can monitor temperature changes in real time and respond promptly), high measurement accuracy (thermopile infrared temperature sensors have high accuracy and stability, and can provide accurate temperature measurement structures), and corrosion resistance (thermopile infrared temperature sensors are usually made of high temperature and corrosion-resistant materials, so they have good durability and stability in harsh environments).

[0068] For laser projection equipment, the laser 110 is a relatively important component and the loss after damage is large. Therefore, it is necessary to detect the temperature of the laser 110 in real time to ensure that when the temperature is too high, the system can shut down the laser 110 in time to ensure that the laser 110 will not be damaged.

[0069] See also Figure 8 The thermopile infrared temperature sensor may include an NTC sampling resistor 141, an optical lens 142, an infrared filter 143 that can transmit a specific wavelength range, and a thermopile chip 144 that can receive infrared signals.

[0070] Among them, the infrared filter 143 is a light-sensitive element that can filter different wavelengths, and combines the Micro Electromechanical System (MEMS) technology to form a highly accurate light-transmitting window. Windows of different specifications can transmit infrared rays within a designed range or a specific wavelength, but not other wavelengths. Since different objects release infrared light of different wavelengths, different windows need to be designed as specific light-sensitive elements of infrared temperature sensors that detect different objects.

[0071] The function of the optical lens 142 is to collect the infrared light signal of the object to be measured to the detection area of ​​the red thermopile infrared temperature sensor;

[0072] The function of NTC sampling resistor 141 is to measure the ambient temperature. The temperature here refers to the internal ambient temperature of the sensor, not the external atmospheric ambient temperature. In the actual infrared temperature measurement process, the environment in which the thermopile infrared temperature sensor is located has a great influence on the temperature measurement; in addition, from the perspective of the detector itself, the thermopile infrared temperature sensor is very sensitive to the ambient temperature. After a long period of work, the internal electronic components of the thermopile infrared temperature sensor will basically experience temperature drift. Therefore, NTC sampling resistor 141 is required to measure the ambient temperature, and the real-time collected ambient temperature is used to calibrate the output voltage to output the correct target temperature value.

[0073] See also Figures 9 and 10 The main working principle of the thermopile temperature sensor is as follows: when the host is powered on normally, the thermopile infrared temperature sensor also starts to work synchronously, detects the temperature of the laser 110 in real time, and converts the temperature information into a digital signal through an analog-to-digital converter and sends it to the display board or the main board 1406 as a control unit (Microcontroller Uni, MCU), which processes and compares the detected temperature information with the pre-stored temperature information. If the detected temperature exceeds the pre-stored temperature, the MCU will send a signal to turn off the laser 110 and let the host indicator light an error to avoid further temperature increase and damage to the laser 110 and the host; if the detected temperature is lower than the pre-stored temperature, the MCU will not send an instruction to turn off the laser 110, and the host will light up normally.

[0074] Any object above absolute zero will emit infrared rays, and the infrared filter 143 will transmit the infrared light emitted by the object being measured. At this time, the infrared sensitive material on the thermopile chip 144 absorbs the infrared light and converts the light energy into heat energy, causing the temperature of the absorption area to rise. Hundreds of groups of miniature thermocouples are connected in series based on the MEMS process to convert the temperature difference between the absorption area and the cold end area into a voltage output. However, since the voltage caused by the temperature change is small, the voltage signal output by the infrared thermopile chip 144 needs to be amplified by an amplifier. The fixed amplification factor lacks configurability and flexibility, and it is difficult to meet the actual test requirements. In order to increase the range of the input electrical signal, an amplifier with a configurable amplification factor can be used. Therefore, in terms of design, a variety of pre-stage amplification factors can be adopted, which can be flexibly adjusted according to needs.

[0075] The built-in temperature sensor 1406 is used to sample the ambient temperature. However, the digital system cannot parse the analog signal, so an analog-to-digital converter is needed to convert the analog electrical signal into digital binary data to collect the sensor signal and the ambient temperature signal with high precision. The converted digital signal is then sent to the display board or the main board via I2C (I2C bus is a simple, bidirectional, two-wire synchronous serial bus. It only needs two wires to transmit information between devices connected to the bus.), and the MCU with an internal integrated sensor calibration algorithm calibrates the zero point and sensitivity of the sensor, the second-order temperature drift below, and the nonlinearity up to the third order, and compensates for the ambient temperature, and finally outputs the target temperature.

[0076] The EEPROM (storage module) in the display panel or main board 1405 is used to store sensor calibration coefficients, chip configuration parameters, and infrared thermopile temperature sensor VT table.

[0077] The amplifier 1403 is used to amplify the voltage signal output by the infrared thermopile temperature sensor.

[0078] The analog-to-digital converter 1404 is used to convert the analog voltage signal amplified by the amplifier into a digital voltage signal.

[0079] See also Fig.10 , Fig.10 The figure below is a curve of the signal voltage of the thermopile infrared temperature sensor changing with the temperature of the target object (VT). It can be seen that the signal voltage amplitude increases with the increase of the target temperature, and is approximately linear. The resistance value of the negative temperature coefficient temperature sensor (NTC) decreases with the increase of the target temperature. When the temperature is too high, the resistance value changes little for every 1°C change in temperature, resulting in a small voltage divider difference between the two temperatures. After being converted into an analog-to-digital converter (ADC) value, the two temperature values ​​cannot be distinguished, resulting in inaccurate measurement.

[0080] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser module, characterized in that: include: A laser, wherein the laser is used to provide laser light for a laser projection device; An optical path transmission part, the optical path transmission part is located at the light output side of the laser, and the optical path transmission part is connected to the laser, and the optical path transmission part is used to transmit the laser light emitted by the laser; A heat dissipation unit, the heat dissipation unit is located at the backlight side of the laser, and the heat dissipation unit is connected to the laser, and the heat dissipation unit is used to dissipate heat for the laser; A non-contact temperature sensor, wherein the non-contact temperature sensor is used to detect the real-time temperature of the laser; Wherein, the non-contact temperature sensor is arranged in the optical path transmission part, and / or the non-contact temperature sensor is arranged in the heat dissipation part.

2. The laser module according to claim 1, characterized in that: The non-contact temperature sensor is formed as a thermopile infrared temperature measurement sensor.

3. The laser module according to claim 1, characterized in that: The heat dissipation portion includes a first surface facing the laser, and the first surface abuts against the laser; The heat dissipation portion is provided with a mounting groove, the mounting groove is recessed from a portion of the first surface toward a direction away from the laser, and the non-contact temperature sensor is arranged in the mounting groove.

4. The laser module according to claim 3, characterized in that: The heat dissipation part is also provided with a wiring groove, which is recessed from a portion of the first surface toward a direction away from the laser, one end of the wiring groove is connected to the installation groove, and the other end of the wiring groove extends to the circumferential side of the heat dissipation part and is connected to the outside of the heat dissipation part.

5. The laser module according to claim 3, characterized in that: The heat dissipation part is further provided with a wiring through hole, one end of the wiring through hole is communicated with the mounting groove, and the other end of the wiring through hole is communicated with the outside of the heat dissipation part.

6. The laser module according to claim 3, characterized in that: The laser module further comprises: a mounting plate, wherein the mounting plate is arranged in the mounting groove, and the non-contact temperature sensor is arranged on the mounting plate.

7. The laser module according to claim 6, characterized in that: A first connecting portion is disposed on the mounting plate, a second connecting portion is disposed in the mounting groove, and the first connecting portion and the second connecting portion are detachably connected.

8. The laser module according to claim 3, characterized in that: The laser module further comprises: an electrical connection plug, which is located in the mounting groove and is used to supply power to the non-contact temperature sensor.

9. The laser module according to claim 1, characterized in that: The non-contact temperature sensor is arranged on the optical path transmission part, and the non-contact temperature sensor is arranged close to the laser; Wherein, the non-contact temperature sensor is located outside the light output path of the laser.

10. A laser projection device, characterized in that: include: The laser module according to any one of claims 1 to 9; A protective shell defines a housing cavity, and the laser module is located in the housing cavity.

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