Vacuum manipulator for semiconductor chip wafer production

Abstract

The utility model discloses a vacuum manipulator for semiconductor chip wafer production, which relates to the technical field of wafer production and comprises a control box, a transfer bin is fixedly connected onto the control box, processing bins are mounted on six surfaces of the transfer bin, a through groove is formed in the transfer bin, and the transfer bin is communicated with the processing bins through the through groove. A sealing assembly used for sealing the through groove is arranged in the transfer bin, and a rotary table is rotationally connected to the control box. The device is reasonable in design structure, the environment in the transfer bin is in an ultra-vacuum state through the vacuumizing pipe, the machining bins are filled with various different types of special gas through the gas supply pipe, products are independently machined in the machining bins through the through grooves by the mechanical arm and the clamp through the rotating assembly, and in the machining process, the machining efficiency is greatly improved. The processing bin is located in an independent cavity through the sealing assembly, the process types can be converted in vacuum, and the possibility that the wafer is oxidized and polluted is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a vacuum manipulator for semiconductor chip wafer production. Background Art

[0002] The wafer manufacturing process involves multiple complex steps, starting with the initial silicon extraction, and then preparing high-purity semiconductor wafers through processes such as crystal pulling and slicing. These wafers undergo a series of sophisticated semiconductor manufacturing processes, such as photolithography, etching, ion implantation, etc., to form extremely small circuit structures. Finally, the wafers are cut into individual chips, packaged and tested, and eventually become products that can be used in various electronic devices. After entering the nano era, due to quantum effects, surface and interface effects, the performance of nanomaterials and nanodevices does not only depend on the properties of bulk materials, but is more mainly determined by the surface and interface properties of the materials.

[0003] In order to avoid changes and damage caused by surface contamination, thin film materials usually need to be placed in a vacuum environment. Only in an ultra-high vacuum environment with a vacuum degree as low as 10-5Pa can an atomically clean surface be maintained for several hours, making atomic layer growth, surface / interface control and intrinsic property characterization possible.

[0004] In the wafer production process, it is often easy to obtain high vacuum in the process chamber, but it is more difficult to obtain high vacuum during the transmission process, and the wafer is also easily contaminated and oxidized during the transmission process. To this end, we provide a vacuum manipulator for semiconductor chip wafer production to solve the above problems. Utility Model Content

[0005] 1) Technical issues solved

[0006] The purpose of the utility model is to make up for the deficiencies of the prior art and to provide a vacuum manipulator for semiconductor chip wafer production.

[0007] 2) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a vacuum manipulator for semiconductor chip wafer production, comprising a control box, a transfer bin is fixedly connected to the control box, processing bins are installed on the six sides of the transfer bin, a through slot is opened on the transfer bin, and the transfer bin is connected with the processing bin through the through slot, a sealing assembly for sealing the through slot is arranged in the transfer bin, a turntable is rotatably connected to the control box, a robot arm is installed on the turntable, a clamp is installed on the working end of the robot arm, a rotating assembly for rotating the turntable is arranged in the control box, a vacuum pipe is fixedly connected to the transfer bin, and an air supply pipe is fixedly connected to each of the processing bins.

[0009] Furthermore, the sealing assembly includes a frame fixedly connected to the transfer bin, a slide groove is provided on the frame, and a sealing plate is slidably connected in the slide groove.

[0010] Furthermore, the sealing assembly also includes an electric push rod fixedly connected to the transfer bin, a linkage block is installed at the telescopic end of the electric push rod, and the linkage block is fixedly connected to the sealing plate.

[0011] Furthermore, the rotating assembly includes a motor rotatably connected to a control box, the top end of the motor is fixedly connected to a turntable, a drive shaft is installed in the control box, and the output shaft of the drive shaft is connected to the motor through a belt and a pulley.

[0012] Furthermore, a pressure gauge is installed on the transfer bin, and a detection end of the pressure gauge is located inside the transfer bin.

[0013] Furthermore, a controller is installed in the control box, and the controller is control-connected with the sealing component and the control component.

[0014] 3) Beneficial effects:

[0015] Compared with the prior art, the vacuum manipulator for semiconductor chip wafer production has the following beneficial effects:

[0016] The utility model coordinates the processing chamber, the through slot, the sealing component, the turntable, the rotating component, the vacuum tube, the air supply pipe, the robot arm and the clamp. The vacuum tube is used to put the environment in the transfer chamber into an ultra-vacuum state, and the air supply pipe is used to fill each processing chamber with different types of special gases. The rotating component is used to enable the robot arm and the clamp to process the product separately in each processing chamber through the through slot. In the process, the sealing component is used to place the processing chamber in a separate cavity, so that the process type can be changed in a vacuum, thereby reducing the possibility of oxidation and contamination of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of the utility model;

[0018] Figure 2 It is a cross-sectional view of the utility model;

[0019] Figure 3 For this utility model Figure 2 A magnified schematic diagram of the structure in the middle.

[0020] In the figure: 1. control box; 2. transfer chamber; 3. processing chamber; 4. vacuum tube; 5. air supply pipe; 6. through groove; 7. frame; 8. slide groove; 9. sealing plate; 10. electric push rod; 11. linkage block; 12. pressure gauge; 13. turntable; 14. robotic arm; 15. motor; 16. drive shaft; 17. controller; 18. fixture. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-3 As shown, the utility model provides a technical solution: a vacuum manipulator for semiconductor chip wafer production, comprising a control box 1, to which a transfer bin 2 is fixedly connected, the transfer bin 2 is a hexahedral structure, and six faces of the transfer bin 2 are installed with processing bins 3, any one of the six processing bins 3 is connected to the front-end module, so as to complete the entry of the product into the transfer bin 2 and the removal of the product from the transfer bin 2 after the production is completed, a through groove 6 is opened on the transfer bin 2, and the transfer bin 2 is connected with the processing bin 3 through the through groove 6, and a sealing component for sealing the through groove 6 is arranged in the transfer bin 2.

[0023] The sealing assembly includes a frame 7 fixedly connected to the transfer bin 2, a slide groove 8 is provided on the frame 7, a sealing plate 9 is slidably connected in the slide groove 8, and a sealing strip should be designed on the side of the sealing plate 9 close to the transfer bin 2 to improve the sealing effect after the sealing plate 9 covers the through groove 6.

[0024] The sealing assembly also includes an electric push rod 10 fixedly connected to the transfer bin 2, and a linkage block 11 is installed at the telescopic end of the electric push rod 10, and the linkage block 11 is fixedly connected to the sealing plate 9. The telescopic end of the electric push rod 10 can drive the linkage block 11 to move up and down, thereby moving the sealing plate 9 in the slide groove 8, thereby completing the opening and closing of the through groove 6.

[0025] A turntable 13 is rotatably connected to the control box 1, a robotic arm 14 is installed on the turntable 13, a clamp 18 is installed on the working end of the robotic arm 14, the robotic arm 14 and the motor 15 are both existing structures, the working end of the robotic arm 14 can move with multiple degrees of freedom, and the product can be moved and transmitted after being clamped by the clamp 18.

[0026] A rotating assembly for rotating the turntable 13 is provided in the control box 1. The rotating assembly includes a motor 15 rotatably connected to the control box 1. The top of the motor 15 is fixedly connected to the turntable 13. A driving shaft 16 is installed in the control box 1. The output shaft of the driving shaft 16 is connected to the motor 15 through a belt and a pulley.

[0027] The output shaft of the driving shaft 16 drives the motor 15 to rotate through the belt and the pulley, so that the motor 15 drives the mechanical arm 14 on the turntable 13 to rotate, and then the orientation of the working end of the mechanical arm 14 can be adjusted.

[0028] A controller 17 is installed in the control box 1 , and the controller 17 is connected to the sealing component and the control component. The controller 17 can be used to control the rotation of the telescopic end of the electric push rod 10 and the output shaft of the drive shaft 16 .

[0029] The transfer warehouse 2 is fixedly connected with a vacuum pipe 4, which is connected to an external vacuum pump, so as to provide an ultra-vacuum environment in the transfer warehouse 2. Each processing warehouse 3 is fixedly connected with an air supply pipe 5, which can transport nitrogen, helium, compressed air, hydrogen, and ammonia pipelines, so as to provide corresponding gases in the wafer processing environment. A pressure gauge 12 is installed on the transfer warehouse 2, and the detection end of the pressure gauge 12 is located in the transfer warehouse 2. The pressure gauge 12 can monitor the size of the negative pressure in the transfer warehouse 2.

[0030] After one end of the vacuum tube 4 away from the transfer chamber 2 and the end of the air supply tube 5 away from the processing chamber 3 are inserted into the upper surface of the control box 1, they extend out from the side wall of the control box 1. In addition, the connection points between the vacuum tube 4 and the processing chamber 3 and the control box 1 are sealed to prevent air leakage.

[0031] It should be noted that, in this article, the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model; the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected", and "connected" should be understood in a broad sense. For example, "installed" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a mechanical connection or an electrical connection; "connected" can be a direct connection, an indirect connection through an intermediate medium, or a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vacuum robot for semiconductor chip wafer production, comprising a control box (1), characterized in that: The control box (1) is fixedly connected to a transfer bin (2), and processing bins (3) are installed on six surfaces of the transfer bin (2). A through groove (6) is provided on the transfer bin (2), and the transfer bin (2) is connected to the processing bin (3) through the through groove (6). A sealing component for sealing the through groove (6) is arranged in the transfer bin (2). A turntable (13) is rotatably connected to the control box (1), and a mechanical arm (14) is installed on the turntable (13). A clamp (18) is installed at the working end of the mechanical arm (14). A rotating component for rotating the turntable (13) is arranged in the control box (1). A vacuum tube (4) is fixedly connected to the transfer bin (2), and an air supply tube (5) is fixedly connected to each processing bin (3).

2. A vacuum robot for semiconductor chip wafer production according to claim 1, characterized in that: The sealing assembly comprises a frame (7) fixedly connected to the transfer bin (2), a slide groove (8) is provided on the frame (7), and a sealing plate (9) is slidably connected in the slide groove (8).

3. A vacuum robot for semiconductor chip wafer production according to claim 2, characterized in that: The sealing assembly also includes an electric push rod (10) fixedly connected to the transfer bin (2), a linkage block (11) being installed at the telescopic end of the electric push rod (10), and the linkage block (11) being fixedly connected to the sealing plate (9).

4. A vacuum robot for semiconductor chip wafer production according to claim 1, characterized in that: The rotating assembly comprises a motor (15) rotatably connected to a control box (1), the top end of the motor (15) being fixedly connected to a turntable (13), a drive shaft (16) being installed in the control box (1), and an output shaft of the drive shaft (16) being transmission-connected to the motor (15) via a belt and a pulley.

5. A vacuum robot for semiconductor chip wafer production according to claim 1, characterized in that: A pressure gauge (12) is installed on the transfer bin (2), and a detection end of the pressure gauge (12) is located inside the transfer bin (2).

6. A vacuum robot for semiconductor chip wafer production according to claim 4, characterized in that: A controller (17) is installed in the control box (1), and the controller (17) is control-connected with the sealing component and the control component.

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