Wafer processing equipment with positioning structure

Abstract

The utility model discloses wafer processing equipment with a positioning structure, and relates to the field of processing equipment. The device comprises a wafer film sticking machine main body, a film body arranged on the wafer film sticking machine main body, a cover shell rotationally connected with the wafer film sticking machine main body, a connecting column rotationally connected with the cover shell and a cutting knife used for cutting the film body, and the top end face of the wafer film sticking machine main body is provided with a positioning convex block used for positioning a wafer placing position. According to the wafer processing equipment with the positioning structure, the pressing mechanism is arranged on the inner wall of the housing, so that the position, close to a wafer, of a film body is fixed in the film body cutting process of a cutting knife, the film body cannot be wrinkled in the cutting process, and in combination with an auxiliary assembly, the film body can be conveniently cut. And the film body on the cutting path of the cutting knife can be pressed and smoothed at the same time, so that the film body can be conveniently cut by the cutting knife, and the fitting degree between the cut film body and the wafer is high.

Description

Technical Field

[0001] The utility model relates to the technical field of processing equipment, in particular to a wafer processing equipment with a positioning structure. Background Art

[0002] After the wafer is produced, it is necessary to coat the surface of the wafer with a film to protect the wafer during its later use. In the prior art, a wafer laminating machine is used to perform film laminating processing on the wafer surface. That is, the wafer is positioned on the main body of the wafer laminating machine through multiple sets of positioning bumps, and then the film body is pulled so that the film body covers the top end face of the wafer. Then, the cover is closed and the cutting knife is rotated so that the cutting knife cuts off the excess film body.

[0003] When the cutting knife cuts off the part of the film that extends beyond the wafer, the film is prone to wrinkles, causing the film on the surface of the wafer to be uneven, affecting the safety of the wafer during subsequent use.

[0004] The main reason for the above problems is that after the film covers the surface of the wafer, the film is connected to the wafer only by its own viscosity, and there is no other device outside the film to connect and fix it to the wafer. When the rotating cutting knife cuts off the excess part of the film, the external force generated during the rotation of the cutting knife will drive the film to move, and even the cutting knife and the film will stick to each other, causing the film to accumulate wrinkles after movement, resulting in a low degree of fit between the wafer and the film. To address the above problems, we propose a wafer processing equipment with a positioning structure. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a processing device which solves the problem that when the cutting knife cuts off the portion of the film that extends beyond the wafer, the film is prone to wrinkles, resulting in an uneven film on the surface of the wafer, affecting the safety of the wafer during later use.

[0006] To achieve the above purpose, the utility model is implemented by the following technical scheme: a wafer processing equipment with a positioning structure, including a wafer film mounting machine body, a film body arranged on the wafer film mounting machine body, a cover shell rotatably connected to the wafer film mounting machine body, a connecting column rotatably connected to the cover shell, and a cutting knife for cutting the film body, wherein a pressing mechanism is arranged on the inner top of the cover shell, and the pressing mechanism comprises:

[0007] A pressure ring and a pressure plate, both of which are connected to the inner top of the cover shell, and the film body and the wafer are positioned and connected through the pressure ring and the pressure plate;

[0008] The auxiliary component is connected to the connecting column, and the contact position between the cutting knife and the film body is smoothed by the auxiliary component.

[0009] Preferably, the top end surfaces of the pressure ring and the pressure plate are fixedly connected with a first support rod and a second support rod respectively, and one end of the first support rod and the second support rod are both fixedly connected to the inner top of the cover shell.

[0010] Preferably, one end of the second support rod passes through the connecting column and is fixedly connected to the inner top of the cover shell.

[0011] Preferably, the auxiliary components include:

[0012] The connecting rod and the connecting cylinder are slidably connected therebetween, and one end of the connecting cylinder is fixedly connected to the bottom end surface of the connecting column;

[0013] The ball is rotatably connected to one end of the connecting rod away from the connecting cylinder, and the outer wall of the ball contacts the outer wall of the membrane body.

[0014] Preferably, a spring is provided inside the connecting tube, and the spring is used for automatically adjusting the position of the ball relative to the membrane body.

[0015] Preferably, the top end surface of the wafer mounting machine body is provided with a positioning bump for positioning the wafer placement position, and the interior of the wafer mounting machine body is slidably provided with a flattening device for preliminary connection between the film body and the wafer.

[0016] Preferably, the inner wall of the pressure ring contacts the outer wall of the positioning protrusion, and the outer wall of the pressure plate contacts the inner wall of the positioning protrusion.

[0017] The utility model discloses a wafer processing equipment with a positioning structure, which has the following beneficial effects: the wafer processing equipment with a positioning structure, by arranging a pressing mechanism on the inner wall of a cover shell, enables the position of the film body close to the wafer to be fixed during the process of the cutting knife cutting the film body, so that the film body will not have wrinkles during the cutting process, and combined with an auxiliary component, the film body on the cutting path of the cutting knife can be pressed and smoothed at the same time, which is convenient for the cutting knife to cut the film body, and the fit between the cut film body and the wafer is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2This is a schematic diagram of the structure of the cutting knife, the pressing ring and the pressing plate of the utility model;

[0021] Figure 3 This is a schematic diagram of the positioning protrusion structure of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the cover shell, the pressure ring and the pressure plate of the utility model;

[0023] Figure 5 This is a schematic diagram of the cutting knife and ball structure of the utility model;

[0024] Figure 6 It is a plan view of the connecting tube, connecting rod and ball structure of the utility model.

[0025] In the figure, 1. wafer laminating machine body; 101. positioning bump; 2. flattening device; 3. film body; 4. cover shell; 401. connecting column; 402. cutting knife; 5. pressing mechanism; 501. pressing ring; 502. pressing plate; 503. first support rod; 504. second support rod; 505. auxiliary component; 5051. connecting rod; 5052. ball; 5053. connecting cylinder; 5054. spring. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] The embodiment of the present application provides a processing device to solve the problem that when the cutting knife cuts off the part of the film that extends beyond the wafer, the film body is prone to wrinkles, resulting in an uneven film surface on the wafer, which affects the safety of the wafer during later use, and realizes the pressing and positioning of the film body during the cutting process.

[0028] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] The utility model embodiment discloses a wafer processing device with a positioning structure.

[0030] According to the attached Figure 1-6As shown, it includes a wafer mounter main body 1, a film body 3 arranged on the wafer mounter main body 1, a cover shell 4 rotatably connected to the wafer mounter main body 1, a connecting column 401 rotatably connected to the cover shell 4, and a cutting knife 402 for cutting the film body 3. The top end surface of the wafer mounter main body 1 is provided with a positioning protrusion 101 for positioning the wafer placement position. The inside of the wafer mounter main body 1 is slidably provided with a flattening device 2 for preliminary connection between the film body 3 and the wafer. The wafer mounter main body 1, the film body 3, the cover shell 4, the connecting column 401, the cutting knife 402, the positioning protrusion 101 and the and a flattening device 2, etc., to form a wafer laminating machine with a model number of SU-150. When in use, the wafer is positioned on the wafer laminating machine body 1 through a plurality of positioning bumps 101, and then the film body 3 is pulled so that the film body 3 covers the top end surface of the wafer, and then the flattening device 2 is pulled so that the film body 3 fits the top end surface of the wafer, and then the cover shell 4 is covered, and the connecting column 401 and the cutting knife 402 set at one end of the connecting column 401 are rotated with the connecting column 401 as the axis, so that the cutting knife 402 cuts off the excess film body 3, so that the remaining film body 3 is equal to the shape of the wafer.

[0031] The inner top of the cover shell 4 is provided with a pressing mechanism 5, through which the position of the film body 3 close to the wafer is fixed during the cutting process of the cutting knife 402, so that the film body 3 will not be wrinkled during the cutting process. The pressing mechanism 5 includes a pressing ring 501 and a pressing plate 502, and the pressing ring 501 and the pressing plate 502 are both connected to the inner top of the cover shell 4. The film body 3 and the wafer are positioned and connected by the pressing ring 501 and the pressing plate 502. The top end surfaces of the pressing ring 501 and the pressing plate 502 are respectively A first support rod 503 and a second support rod 504 are fixedly connected respectively, one end of the first support rod 503 and the second support rod 504 are fixedly connected to the inner top of the cover shell 4, one end of the second support rod 504 passes through the connecting column 401 and is fixedly connected to the inner top of the cover shell 4, the inner wall of the pressing ring 501 contacts the outer wall of the positioning protrusion 101, the outer wall of the pressing plate 502 contacts the inner wall of the positioning protrusion 101, and the position between the pressing ring 501 and the pressing plate 502 is the cutting position of the cutting knife 402.

[0032] The auxiliary component 505 is connected to the connecting column 401, and the contact position between the cutting knife 402 and the membrane body 3 is smoothed by the auxiliary component 505, that is, when the cutting knife 402 is performing annular cutting, the auxiliary component 505 can press and smooth the membrane body 3 on its cutting path, so as to facilitate the cutting knife 402 to cut the membrane body 3. The auxiliary component 505 includes a connecting rod 5051 and a connecting cylinder 5053, and the connecting rod 5051 and the connecting cylinder 5053 are slidingly connected. One end of the connecting cylinder 5053 is fixedly connected to the bottom end surface of the connecting column 401, and the ball 5052 is rotatably connected to the end of the connecting rod 5051 away from the connecting cylinder 5053. The outer wall of the ball 5052 contacts the outer wall of the membrane body 3, and a spring 5054 is arranged inside the connecting cylinder 5053. The spring 5054 is used for automatically adjusting the position of the ball 5052 relative to the membrane body 3.

[0033] The wafer processing equipment with a positioning structure is provided with a pressing mechanism 5 on the inner wall of the cover shell 4, so that when the cutting knife 402 cuts the film body 3, the position of the film body 3 close to the wafer is fixed, so that the film body 3 will not have wrinkles during the cutting process. In addition, combined with the auxiliary component 505, the film body 3 on the cutting path of the cutting knife 402 can be pressed and smoothed at the same time, which is convenient for the cutting knife 402 to cut the film body 3, so that the film body 3 after cutting has a high degree of fit with the wafer.

[0034] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer processing device with a positioning structure, comprising a wafer film mounting machine body (1), a film body (3) arranged on the wafer film mounting machine body (1), a cover shell (4) rotatably connected to the wafer film mounting machine body (1), a connecting column (401) rotatably connected to the cover shell (4), and a cutting knife (402) for cutting the film body (3), characterized in that: A pressing mechanism (5) is provided at the inner top of the cover shell (4), and the pressing mechanism (5) comprises: A pressure ring (501) and a pressure plate (502), both of which are connected to the inner top of the cover shell (4), and the film body (3) and the wafer are positioned and connected via the pressure ring (501) and the pressure plate (502); An auxiliary component (505) is connected to the connecting column (401), and the contact position between the cutting knife (402) and the membrane body (3) is smoothed by the auxiliary component (505).

2. The wafer processing equipment with a positioning structure according to claim 1, characterized in that: The top end surfaces of the pressure ring (501) and the pressure plate (502) are respectively fixedly connected to a first support rod (503) and a second support rod (504), and one end of each of the first support rod (503) and the second support rod (504) is fixedly connected to the inner top of the cover shell (4).

3. The wafer processing equipment with a positioning structure according to claim 2, characterized in that: One end of the second support rod (504) passes through the connecting column (401) and is fixedly connected to the inner top of the cover shell (4).

4. The wafer processing equipment with a positioning structure according to claim 1, characterized in that: The auxiliary component (505) comprises: The connecting rod (5051) and the connecting tube (5053) are slidably connected therebetween, and one end of the connecting tube (5053) is fixedly connected to the bottom end surface of the connecting column (401); The ball (5052) is rotatably connected to an end of the connecting rod (5051) away from the connecting tube (5053), and the outer wall of the ball (5052) is in contact with the outer wall of the membrane body (3).

5. The wafer processing equipment with a positioning structure according to claim 4, characterized in that: A spring (5054) is arranged inside the connecting tube (5053), and the spring (5054) is used for automatically adjusting the position of the ball (5052) relative to the membrane body (3).

6. The wafer processing equipment with a positioning structure according to claim 1, characterized in that: The top end surface of the wafer mounting machine body (1) is provided with a positioning bump (101) for positioning the wafer placement position, and the inside of the wafer mounting machine body (1) is slidably provided with a flattening device (2) for preliminary connection between the film body (3) and the wafer.

7. The wafer processing equipment with a positioning structure according to claim 1, characterized in that: The inner wall of the pressure ring (501) contacts the outer wall of the positioning protrusion (101), and the outer wall of the pressure plate (502) contacts the inner wall of the positioning protrusion (101).

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