Wafer accommodating device

Abstract

The utility model relates to the technical field of wafer accommodating or transporting, in particular to a wafer accommodating device. The wafer containing device comprises a first box body, a second box body and a wafer supporting unit, and a first annular groove and a protruding buckle structure are arranged on the end face of an opening of the first box body; a second annular groove is formed in the opening end face of the second box body, a spring bolt structure and a flanging structure are arranged on the outer wall of the second box body, a plurality of water outlets are symmetrically formed in the flanging structure, and a groove is formed between the flanging structure and the side wall of the second box body; the spring bolt structure is matched with the buckle structure, and the top ends of the water outlets are flush with the bottom end of the groove. According to the wafer accommodating device, in the process of overturning and cleaning the wafer accommodating device, the bottom end of the water outlet is flush with the bottom end of the groove, and the cleaning liquid is quickly discharged through the water outlet, so that the overall dryness of the wafer accommodating device is favorably kept, and the performance of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer accommodation or transportation, in particular to a wafer accommodation device. Background Art

[0002] Existing semiconductor wafers need to go through multiple steps during the production process. In different steps, the wafers need to be transported to different equipment, so the wafer transportation, storage and holding devices also play a relatively important role.

[0003] Different production processes involve transportation, storage, and cleaning. When cleaning the wafer device as a whole, spraying or overall cleaning is used. In order to discharge the cleaning liquid from around the wafer holding device as quickly as possible, some corresponding structures are designed on the device shell. Utility Model Content

[0004] In order to optimize the above-mentioned existing wafer accommodation device, the present application proposes a wafer accommodation device for accommodating a plurality of wafers placed in parallel, comprising:

[0005] A first box body, which is located at the upper part of the wafer accommodating device, and the first box body has a downward opening;

[0006] A second box body is located at the lower part of the wafer accommodating device, the second box body has an upward opening, a flange structure extending downward is arranged on the outer periphery of the second box body, the top of the flange structure extends toward the side wall of the second box body to form a groove; a plurality of drainage ports are arranged on the flange structure, and the top ends of the plurality of drainage ports are flush with the bottom end of the groove;

[0007] A wafer supporting unit is arranged in the first box body and the second box body, and the wafer supporting unit supports the plurality of wafers.

[0008] Specifically, in the above-mentioned wafer accommodating device, a plurality of ribs connecting the flange structure and the second box body are arranged in the groove, and the ribs divide the groove into several sections, and at least one drainage port is arranged in each section of the groove.

[0009] Optionally, in the above-mentioned wafer accommodating device, a first annular groove is arranged on the circumference of the opening end surface of the first box body, and a second annular groove is arranged on the circumference of the opening end surface of the second box body, wherein the first annular groove cooperates with the second annular groove to form a placement space, and a sealing ring is accommodated in the placement space.

[0010] Optionally, in the above-mentioned wafer accommodating device, the groove formed by the flange structure has a step structure, and the step structure extends along the flange structure; the drain outlet is opened at the position of the step structure and extends downward from the top of the groove to laterally disconnect the step structure.

[0011] Optionally, in the above-mentioned wafer accommodating device, a buckle structure protruding downwardly is provided on the opening end surface of the first box body, and a locking tongue structure is provided on the outer wall of the second box body, and the locking tongue structure matches the buckle structure.

[0012] Optionally, in the above-mentioned wafer accommodating device, the snap-fit ​​structure is provided with two groups, and the two groups of the snap-fit ​​structure are symmetrically arranged on two sides of the first box body, and a hole is provided on the snap-fit ​​structure, and the hole is used to accommodate the locking tongue structure.

[0013] Optionally, in the above-mentioned wafer accommodating device, the wafer support unit includes a top support frame and a side support frame, the top support frame is clamped on the inner wall of the top of the first box body, the top support frame is provided with a first support groove matching the shape of the wafer, and the inner wall of the side support frame is provided with a second support groove corresponding to the first support groove, the first support groove and the second support groove support the multiple wafers simultaneously.

[0014] Optionally, in the above-mentioned wafer accommodating device, a plurality of first supporting grooves are provided, and the first supporting grooves are arc-shaped.

[0015] Optionally, in the above-mentioned wafer accommodating device, the side support frame is composed of four surfaces to form an accommodating space suitable for accommodating the wafer, and the side support frame has a relative upper opening and a lower opening, the upper opening is larger than the lower opening, and the upper opening faces the top support frame.

[0016] Optionally, in the above-mentioned wafer accommodating device, multiple groups of second support grooves are provided, and the multiple groups of second support grooves are symmetrically arranged on the inner wall of the side support frame, and the second support grooves include an arc-shaped portion and a vertical portion; the second support grooves are located in the extension direction of the arc-shaped structure where the first support groove is located, and the second support grooves occupy two opposite surfaces of the four surfaces of the side support frame, and of the other two surfaces, one is a closed surface, and the other is an H-type connection structure surface.

[0017] Optionally, in the above-mentioned wafer accommodating device, the distance between adjacent first supporting grooves is equal to the distance between adjacent second supporting grooves.

[0018] Optionally, in the above-mentioned wafer accommodating device, a limiting structure is provided on the top of the first box body, and the limiting structure limits the side support frame.

[0019] Optionally, in the above-mentioned wafer accommodating device, a protrusion component is provided on the inner wall of the top of the first box body, and the protrusion component is clamped to the top support frame.

[0020] Optionally, in the above-mentioned wafer accommodating device, a protrusion structure is provided in the second box body, and a slot structure is provided at a portion where the side support frame abuts against the second box body, and the protrusion structure limits the slot structure.

[0021] One or more technical solutions provided by the utility model produce at least the following beneficial effects:

[0022] A wafer accommodating device proposed in the present application includes a first box body, a second box body, and a wafer supporting unit. When the wafer accommodating device is used to accommodate wafers, the wafer supporting unit supports the wafer to prevent damage to the wafer during transportation. A flange structure is provided on the open end surface of the second box body, and a plurality of drain outlets are symmetrically provided on the flange structure. During the process of flipping and cleaning the wafer accommodating device, the top ends of the plurality of drain outlets are flush with the bottom ends of the grooves, and the cleaning liquid is quickly discharged through the drain outlets, which is beneficial to maintaining the overall dryness of the wafer accommodating device, with high drying efficiency and improved wafer performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Further details, features and advantages of the present application are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which:

[0024] Figure 1 It is a schematic diagram of the overall structure of a wafer containing device;

[0025] Figure 2 It is a schematic diagram of the first box structure of a wafer containing device;

[0026] Figure 3 It is a schematic diagram of the structure of a second box body of a wafer containing device;

[0027] Figure 4 It is a partial schematic diagram of a second box structure of a wafer containing device;

[0028] Figure 5 It is a schematic diagram of the cooperation between the second box structure and the wafer supporting unit of a wafer containing device;

[0029] Figure 6 It is a schematic diagram of the cooperation between a first box structure and a wafer supporting unit of a wafer containing device;

[0030] Figure 7 It is another structural schematic diagram of a first box body of a wafer containing device;

[0031] Figure 8This is another structural schematic diagram of the second box body of a wafer containing device.

[0032] Description of reference numerals:

[0033] 1-first box body; 11-first annular groove; 12-buckle structure; 13-limiting structure; 14-protrusion assembly; 2-second box body; 21-second annular groove; 22-locking tongue structure; 23-flanged structure; 24-drain outlet; 25-groove; 26-rib; 27-sealing ring; 28-protrusion structure; 29-step structure; 3-wafer support unit; 31-top support frame; 32-side support frame; 33-first support groove; 34-second support groove; 35-slot structure. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0035] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0036] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0037] It should be noted that the modifications of "one" and "plurality" mentioned in the present application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0038] The names of the messages or information exchanged between multiple devices in the embodiments of the present application are only used for illustrative purposes and are not used to limit the scope of these messages or information. Specific embodiments

[0039] The utility model relates to the field of wafer accommodation or transportation technology, and in particular to a wafer accommodation device for accommodating a plurality of wafers placed in parallel, comprising: a first box body 1, a second box body 2 and a wafer supporting unit 3;

[0040] Figure 1 It is a schematic diagram of the overall structure of a wafer accommodation device. Figure 2 It is a schematic diagram of the first box structure of a wafer accommodating device as a whole. Figure 3 It is a schematic diagram of the second box structure of the whole wafer accommodating device. Figure 4 is a partial schematic diagram of a second box structure of a wafer accommodating device, Figure 5 It is a schematic diagram of the cooperation between the second box structure and the wafer supporting unit of an overall wafer containing device.

[0041] like Figure 1-5 As shown, in general, the first box body 1 is located at the upper part of the wafer accommodating device, and the second box body 2 is located at the lower part. The first box body 1 has a downward opening, and the second box body 2 has an upward opening. The wafer support unit 3 is arranged between the first box body 1 and the second box body 2 to support the wafer. A first annular groove 11 is arranged on the downwardly arranged opening end face of the first box body 1, and a protruding snap structure 12 is arranged downwardly in the vertical direction; a second annular groove 21 is arranged on the circumference of the opening end face of the second box body 2, and a locking tongue structure 22 is arranged on the outer wall of the second box body 2; a downwardly extending flange structure 23 is arranged on the outer periphery of the second box body 2, and a plurality of drainage ports 24 are symmetrically arranged on the flange structure 23, and the top of the flange structure 23 extends toward the side wall of the second box body 2 to form a groove 25, and the groove 25 A rib 26 is arranged inside to connect the above-mentioned flange structure 23 and the above-mentioned second box body 2; through the above-mentioned wafer accommodating device, support for multiple wafers is achieved, and a drain port 24 is arranged on the flange structure. During the cleaning process using the cleaning liquid, sometimes the upper and lower positions of the first box body 1 and the second box body 2 are: the first box body 1 is at the bottom, and the second box body 2 is at the top, and the end (top end) of the drain port 24 is flush with the end (bottom end) of the groove 25, so that after the wafer accommodating device is flipped over for cleaning, rapid drainage can be carried out to achieve rapid drying with high drying efficiency.

[0042] In some embodiments, a plurality of ribs 26 are provided in the groove 25 to connect the flange structure 23 and the second box body. The ribs 26 divide the groove 25 into several sections. Each section of the groove 25 is provided with at least one drain port 24, which can increase the connection strength between the flange structure and the box body, make the flange structure less likely to deform, and improve the stability of the wafer accommodating device during loading and transportation.

[0043] In some embodiments, a sealing ring 27 is provided between the first annular groove 11 and the second annular groove 21 to seal the box body from the outside air when the locking tongue structure 22 is matched with the buckle structure 12, thereby improving the sealing performance.

[0044] In some embodiments, the groove formed by the flange structure 23 has a step structure 29, and the step structure 29 extends along the flange structure 23; the drainage port 24 is provided at the position of the step structure 29, and extends downward from the top of the groove 11, horizontally disconnecting the step structure 29. The arrangement of the step structure can increase the strength of the flange structure without affecting the drainage performance.

[0045] In some embodiments, in the wafer receiving device, the buckle structure 12 is provided with two groups, and the two groups of the buckle structure 12 are symmetrically arranged on both sides of the first box body 1, and the buckle structure 12 is provided with a hole 13, and the hole is used to accommodate the locking tongue structure 22. Figure 2 As shown, the buckle structures are located at two opposite sides of the first box body 1, and two holes are set on each buckle structure. There are also two groups of corresponding lock tongue structures, and each group of lock tongue structures includes two lock tongues, which are matched with the above-mentioned buckle structures.

[0046] In some embodiments, Figure 6 FIG. 1 is a schematic diagram of the cooperation between the first box structure and the wafer supporting unit of a wafer containing device, as shown in FIG. Figure 6 As shown, the wafer support unit 3 includes a top support frame 31 and a side support frame 32. The top support frame 31 is clamped on the inner wall of the top of the first box body 1. The top support frame 31 is provided with a first support groove 33 matching the shape of the wafer. The inner wall of the side support frame 32 is provided with a second support groove 34 corresponding to the first support groove 33. The first support groove 33 and the second support groove 34 support the multiple wafers at the same time.

[0047] In some embodiments, in the wafer accommodating device, a plurality of the first support grooves 33 are provided, and the first support grooves 33 are arc-shaped as a whole. The shape of the arc-shaped first support grooves 33 matches the shape of the wafer, and during the process of moving and transporting the wafer, the wafer is better protected to prevent the chip from being impacted and damaged.

[0048] In some embodiments, in the wafer accommodating device, the side support frame 32 is composed of four surfaces to form an accommodating space suitable for accommodating the wafer, and the side support frame 32 has an upper opening and a lower opening relative to each other, the upper opening is larger than the lower opening, and the upper opening faces the top support frame 31. In actual use, the second box body 2 is placed on the platform, and then the wafer is placed from the upper opening to abut against the side support frame. After the wafer is placed, the first box body 1 is covered, and the top support frame 31 clamped on the top of the first box body 1 forms further protection for the wafer. The side support frame and the top support frame are made of softer plastic material.

[0049] In some embodiments, in the above-mentioned wafer accommodating device, the above-mentioned second support grooves 34 are provided with multiple groups, and the multiple groups of the above-mentioned second support grooves 34 are symmetrically arranged on the inner wall of the above-mentioned side support frame 32, and the above-mentioned second support grooves 34 include an arc portion and a vertical portion; the above-mentioned second support grooves 34 are located in the extension direction of the arc structure where the above-mentioned first support grooves 33 are located, and the above-mentioned second support grooves 34 occupy two opposite surfaces of the four surfaces of the above-mentioned side support frame 32, and one of the other two surfaces is a closed surface, and the other is an H-shaped connection structure surface. The distance between adjacent first support grooves 33 is equal to the distance between adjacent second support grooves 34; multiple groups of second support grooves are arranged on two opposite surfaces of the side support frame 32, and cooperate with the multiple groups of first support grooves on the top support frame to accommodate multiple groups of wafers at the same time, thereby improving the utilization rate of the wafer accommodating device.

[0050] In some embodiments, Figure 7 FIG. 2 is another structural schematic diagram of a first box body of a wafer accommodating device, such as Figure 7 As shown, a limiting structure 13 is provided on the inner wall of the first box body 1, and the limiting structure 13 limits the side support frame 32. The limiting structure 13 is provided on the axial inner wall of the first box body, and is used to limit the displacement of the side support frame. A protrusion assembly 14 is provided on the inner wall of the top of the first box body 1, and the protrusion assembly 14 clamps the top support frame 31. The protrusion assembly includes a plurality of protrusions, which are used to clamp the top support frame.

[0051] In some embodiments, Figure 8 FIG. 1 is another structural schematic diagram of a second box body of a wafer accommodating device, such as Figure 8 As shown, a protrusion structure 28 is provided in the second box body 2, and a slot structure 35 is provided at the part where the side support frame 32 abuts against the second box body 2, and the protrusion structure limits the slot structure. The side support frame is limited in multiple directions by the limiting assembly and the protrusion structure to prevent the wafer from shaking during the transportation process.

[0052] The above descriptions are only some embodiments of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solutions formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concepts. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

[0053] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A wafer accommodating device for accommodating a plurality of wafers placed in parallel, It is characterized in that include, A first box body, which is located at the upper part of the wafer accommodating device, and the first box body has a downward opening; A second box body is located at the lower part of the wafer accommodating device, the second box body has an upward opening, a flange structure extending downward is arranged on the outer periphery of the second box body, the top of the flange structure extends toward the side wall of the second box body to form a groove; a plurality of drainage ports are arranged on the flange structure, and the top ends of the plurality of drainage ports are flush with the bottom end of the groove; A wafer supporting unit is arranged in the first box body and the second box body, and the wafer supporting unit supports the plurality of wafers.

2. The wafer receiving device according to claim 1, It is characterized in that A plurality of ribs connecting the flange structure and the second box body are arranged in the groove, and the ribs divide the groove into a plurality of sections, and at least one drainage port is arranged in each section of the groove.

3. The wafer receiving device according to claim 2, It is characterized in that A first annular groove is provided on the circumference of the opening end surface of the first box body, and a second annular groove is provided on the circumference of the opening end surface of the second box body, wherein the first annular groove cooperates with the second annular groove to form a placement space, and a sealing ring is accommodated in the placement space.

4. The wafer receiving device according to claim 3, It is characterized in that The groove formed by the flange structure has a step structure, and the step structure extends along the flange structure; the drain port is opened at the position of the step structure and extends downward from the top of the groove to laterally disconnect the step structure.

5. The wafer receiving device according to claim 4, It is characterized in that The opening end surface of the first box body is provided with a protruding buckle structure downwardly along the vertical direction, and the outer wall of the second box body is provided with a locking tongue structure, and the locking tongue structure matches the buckle structure.

6. The wafer receiving device according to claim 5, It is characterized in that The buckle structures are provided in two groups, and the two groups of buckle structures are symmetrically arranged on two sides of the first box body. The buckle structures are provided with holes, and the holes are used to accommodate the locking tongue structure.

7. The wafer receiving device according to claim 6, It is characterized in that The wafer support unit includes a top support frame and a side support frame, the top support frame is clamped on the inner wall of the top of the first box body, the top support frame is provided with a first support groove matching the shape of the wafer, the inner wall of the side support frame is provided with a second support groove corresponding to the first support groove, the first support groove and the second support groove support the multiple wafers at the same time; there are multiple first support grooves, and the first support grooves are arc-shaped; the side support frame is composed of four surfaces to form a accommodating space suitable for accommodating the wafer, and the side support frame has a relative upper opening and a lower opening, the upper opening is larger than the lower opening, and the upper opening faces the top support frame.

8. The wafer receiving device according to claim 7, It is characterized in that There are multiple groups of second support grooves, and the multiple groups of second support grooves are symmetrically arranged on the inner wall of the side support frame. The second support groove includes an arc portion and a vertical portion; the second support groove is located in the extension direction of the arc structure where the first support groove is located, and the second support groove occupies two opposite surfaces of the four surfaces of the side support frame. Among the other two surfaces, one is a closed surface, and the other is an H-shaped connection structure surface.

9. The wafer receiving device according to claim 8, It is characterized in that The distance between adjacent first supporting grooves is equal to the distance between adjacent second supporting grooves; a limiting structure is arranged on the top of the first box body, and the limiting structure limits the side supporting frame; a protrusion assembly is arranged on the inner wall of the top of the first box body, and the protrusion assembly clamps the top supporting frame.

10. The wafer receiving device according to claim 9, It is characterized in that A protruding structure is provided in the second box body, and a slot structure is provided at a portion where the side support frame abuts against the second box body, and the protruding structure limits the slot structure.

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