Transportation assembly of substrate and production equipment of flip chip

Abstract

The utility model discloses a transportation assembly of a substrate and production equipment of a flip chip. The transportation assembly comprises a fixing frame, a conveying assembly and a conveying assembly, the conveying rail is arranged in the first direction, and the base plate can move on the conveying rail in the first direction; the mounting piece is used for mounting the material box, and the driving piece is used for pushing a base plate in the material box to move in the first direction; the carrier is provided with a first position and a second position; in the first position, the carrier is located at the tail end of the first conveying unit; in the second position, the carrier is located at the tail end of the second conveying unit. According to the utility model, the transportation track is arranged, so that the substrate can be conveniently received, the substrate transportation efficiency during multi-chip operation is improved, the substrate transportation stability is enhanced, the chips pasted on the substrate are prevented from loosening or shifting, and the cold solder joint of the chips is avoided; and the mounting piece is arranged, so that the material box can be directly placed on the mounting piece, the substrate does not need to be manually taken out from the material box, the working efficiency of a single chip can be improved, and labor is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, in particular to a substrate transportation component and flip chip production equipment. Background Art

[0002] Flip chip is a pinless structure that generally contains circuit units. It is designed to be electrically and mechanically connected to the circuit through an appropriate number of solder balls (covered by conductive adhesive) on its surface. One or more chips are mounted on the substrate by a flip chip machine, and then placed in a reflow oven for reflow to complete chip fixing and electrical connection.

[0003] With the rapid development of the semiconductor industry, the chip loading capacity of flip-chip products has gradually increased. Due to the quality and efficiency requirements of flip-chips, it is impossible to put each chip into the reflow oven for fixing. As a result, the existing process is to first mount all the chips on the substrate and finally fix them in the reflow oven at one time.

[0004] However, during the assembly of multiple chips, after each flip-chip machine completes a chip, it needs to be manually transported to the next flip-chip machine for subsequent chip mounting operations. During the transportation process, there is a chance that the mounted chips will shift and loosen, resulting in chip cold soldering after the product passes through the reflow oven. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to propose a substrate transportation assembly and flip chip production equipment, which are used to solve the problems of chip deviation and chip cold soldering caused by manual handling of substrates in the prior art.

[0006] The technical solution adopted by the utility model to solve the technical problem is a substrate transportation component, comprising:

[0007] Fixed frame;

[0008] A first transport unit, which is arranged on the fixed frame, the first transport unit comprises a transport track arranged along a first direction, and the substrate can move along the first direction on the transport track;

[0009] a second transport unit, which is disposed on the fixing frame, and comprises a mounting member for mounting the material box, and a driving member for pushing the substrate in the material box to move along the first direction;

[0010] A third transport unit is arranged on the fixed frame, and the second transport unit includes a carrier, the carrier has a first position and a second position, and the carrier can move along the second direction to move arbitrarily between the first position and the second position; in the first position, the carrier is at the end of the first transport unit, and the substrate can be moved from the transport track to the carrier along the first direction; in the second position, the carrier is at the end of the second transport unit, and the substrate can be moved from the material box to the carrier along the first direction.

[0011] Further, the first direction and the second direction are in the same horizontal plane, and the first direction is perpendicular to the second direction;

[0012] A plurality of substrates are arranged in the material box along the height direction, and the mounting member can also be lifted and lowered along the height direction so that the driving member can push any substrate in the material box to move toward the carrier direction.

[0013] Furthermore, the carrier includes two clamping plates, and the two clamping plates are arranged at an interval to form a clamping space between the two clamping plates;

[0014] When the carrier is at the second position, the substrate can be moved by the magazine along the first direction to enter the clamping space.

[0015] Furthermore, each of the clamping plates is provided with a first guide rail, and two of the first guide rails form a feeding track;

[0016] When the carrier is at the first position, the substrate can be moved from the transport track to the feeding track along a first direction.

[0017] Further, the two clamping plates can move simultaneously along the second direction to drive the base plate to move, and the two clamping plates can move separately along the second direction to adjust the distance between the two clamping plates;

[0018] When the substrate is in the clamping space, the two clamping plates are respectively in contact with two ends of the substrate.

[0019] Furthermore, the transport track includes two second guide rails, and the distance between the two second guide rails is adjustable.

[0020] Furthermore, the first transport unit also includes a conveyor belt arranged on the transport track, and a driving motor for driving the conveyor belt to rotate.

[0021] Furthermore, the driving member is a pushing cylinder arranged on the fixing frame, and the telescopic rod of the pushing cylinder can extend into the material box and abut against the base plate.

[0022] Furthermore, the utility model also discloses a flip chip production device, the production device comprising a flip chip machine for assembling the chip on a substrate, and a transport component for the substrate;

[0023] The flip-chip machine has a material inlet, and the substrate can be moved from the second transport unit to the third transport unit and enter the flip-chip machine through the material inlet.

[0024] Furthermore, the utility model also discloses a flip chip production device, the production device comprising a plurality of flip chips for assembling chips on a substrate, at least one substrate transport component is arranged between any two adjacent flip chips;

[0025] Each of the flip-chip machines has a feed port and a discharge port, and the substrate can be moved from the first transport unit to the third transport unit and enter the flip-chip machine through the feed port.

[0026] Compared with the prior art, the utility model has at least the following beneficial effects:

[0027] Providing a transport track on the first transport component can facilitate receiving substrates, improve substrate transport efficiency during multi-chip operations, enhance substrate transport stability, prevent chips mounted on the substrate from loosening or shifting, and avoid chip cold soldering. Providing a mounting piece on the second transport component facilitates placing the material box directly on the mounting piece, eliminating the need to manually take the substrate out of the material box, which can improve single-chip operation efficiency and save labor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the transport component in the embodiment;

[0029] Figure 2 Schematic diagram of the structure of the second transport unit and the third transport unit in the embodiment;

[0030] Figure 3 is a schematic structural diagram of the first transport unit in the embodiment;

[0031] In the figure:

[0032] 100, first transport unit; 110, transport track; 120, drive motor; 130, conveyor belt;

[0033] 200, second transport unit; 210, driving member; 220, material box; 230, mounting member;

[0034] 300, third transport unit; 310, clamping plate; 320, feeding track;

[0035] 400. Fixed bracket. DETAILED DESCRIPTION

[0036] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0037] Please refer to Figure 1-Figure 3 The utility model discloses a substrate transportation assembly, comprising:

[0038] Fixed frame 400;

[0039] A first transport unit 100, which is disposed on the fixing frame 400, wherein the first transport unit 100 comprises a transport track 110 disposed along a first direction, and the substrate can move along the first direction on the transport track 110;

[0040] The second transport unit 200 is arranged on the fixing frame 400. The second transport unit 200 includes a mounting member 230 for mounting the material box 220, and a driving member 210 for pushing the substrate in the material box 220 to move along the first direction; wherein the mounting member 230 can be specifically configured as a raisable mounting plate or a raisable clamping hand, and the material box is lifted and lowered by lifting and lowering the mounting plate or the clamping hand. Of course, the mounting member 230 can also be configured as a raisable mounting frame, in which a plurality of material boxes are stacked along the height direction. When the substrate in a material box is transported, different material boxes can be switched for loading by simply lifting and lowering the mounting frame.

[0041] The third transport unit 300 is arranged on the fixed frame 400, and the second transport unit 200 includes a carrier, which has a first position and a second position. The carrier can move along the second direction to move arbitrarily between the first position and the second position; in the first position, the carrier is at the end of the first transport unit 100, and the substrate can be moved from the transport track 110 to the carrier along the first direction; in the second position, the carrier is at the end of the second transport unit 200, and the substrate can be moved from the material box 220 to the carrier along the first direction.

[0042] Specifically, the present application sets up a first transport unit 100, a second transport unit 200 and a third transport unit 300. The substrate can be transferred by the first transport unit 100 or the second transport unit 200, and then the substrate is received by the third transport unit 300 at the first position or the second position, and finally the third transport unit 300 transports the substrate to the flip-chip machine for chip mounting.

[0043] It should be noted that the substrates are collected in the material box 220 before assembling the chip. When these substrates are only equipped with one chip, the entire material box 220 can be directly placed on the mounting member 230, and the substrates in the material box 220 are pushed one by one onto the carrier through the driving member 210, and then the substrates are sent to the flip-chip machine through the carrier for chip mounting. When these substrates need to be assembled with multiple chips, the substrates can be taken out of the material box 220 and placed directly on the feed track 320, and transferred to the carrier through the feed track 320, and the substrates are sent to the flip-chip machine through the carrier for chip mounting. After the chip is mounted, the substrate is sent to the transport track 110 on the next transport component, and is sent to the next flip-chip machine for the next chip mounting. In this way, the transport component in the present application is simultaneously provided with a first transport unit 100 and a second transport unit 200, and the substrate is received at the first position and the second position by the third transport unit 300, so that the substrate can meet the two usage scenarios of single chip mounting and multi-chip mounting.

[0044] The transport track 110 is provided on the first transport component to facilitate receiving the substrate, improve the substrate transport efficiency during multi-chip operation, enhance the stability of substrate transport, prevent the chips mounted on the substrate from loosening or shifting, and avoid chip cold soldering. The mounting member 230 is provided on the second transport component to facilitate directly placing the material box 220 on the mounting member 230, without the need to manually take the substrate out of the material box 220, which can improve the single chip operation efficiency and save labor.

[0045] Further, the first direction and the second direction are in the same horizontal plane, and the first direction is perpendicular to the second direction;

[0046] A plurality of substrates are arranged in the material box 220 along the height direction, and the mounting member 230 can also be raised and lowered in the height direction so that the driving member 210 can push any substrate in the material box 220 to move toward the carrier direction.

[0047] Specifically, the material box 220 is provided with a plurality of slots along the height direction, and a substrate is installed on each slot. By lifting and lowering the mounting member 230, the material box 220 is driven to rise and fall relative to the driving member 210, so that the driving member 210 can be at the same height as different substrates on the material box 220, and then the driving member 210 can push different substrates from the material box 220 to the carrier, thereby realizing the transportation of substrates during single-chip operations.

[0048] Among them, the first direction is the length direction of the device, the second direction is the width direction of the device, and the lifting direction of the mounting member 230 is the height direction of the device.

[0049] Furthermore, the carrier includes two clamping plates 310 , and the two clamping plates 310 are arranged at an interval to form a clamping space between the two clamping plates 310 ;

[0050] When the carrier is at the second position, the substrate can be moved by the magazine 220 along the first direction to enter the clamping space.

[0051] Furthermore, each of the clamping plates 310 is provided with a first guide rail, and two of the first guide rails form a feeding track 320;

[0052] When the carrier is at the first position, the substrate can be moved from the transport track 110 to the feed track 320 along a first direction.

[0053] Specifically, in the first position, the substrate moves along the length direction from the transport track 110 to enter the feeding track 320; in the second position, the substrate moves along the length direction from the material box 220 to enter the clamping space. Of course, in the second position, the substrate can also move along the length direction from the material box 220 to enter the feeding track 320, so that no matter the carrier is in the first position or the second position, the substrates it receives can enter the feeding track 320, so that each substrate is in the same position on the carrier, which is convenient for the carrier to accurately feed the substrate into the flip chip machine.

[0054] Furthermore, the two clamping plates 310 can move simultaneously along the second direction to drive the substrate to move, and the two clamping plates 310 can move separately along the second direction to adjust the distance between the two clamping plates 310;

[0055] When the substrate is in the clamping space, the two clamping plates 310 are respectively in contact with two ends of the substrate.

[0056] The two clamping plates 310 can be moved independently to adjust the distance between the two first guide rails and the width of the clamping space, so that the carrier can receive substrates of different widths.

[0057] Specifically, a slide rail is disposed on the fixing frame 400 , so that the two clamping plates 310 are slidably disposed on the slide rail respectively, so that the clamping plates 310 can move along the second direction.

[0058] Furthermore, the transport track 110 includes two second guide rails, and the distance between the two second guide rails is adjustable.

[0059] The distance between the two second guide rails is adjustable to facilitate the transportation of substrates of different widths.

[0060] Furthermore, the first transport unit 100 further includes a conveyor belt 130 disposed on the transport track 110 , and a drive motor 120 for driving the conveyor belt 130 to rotate.

[0061] Furthermore, the driving member 210 is a pushing cylinder disposed on the fixing frame 400 , and a telescopic rod of the pushing cylinder can extend into the material box 220 and abut against the substrate.

[0062] Furthermore, the utility model also discloses a flip chip production device, the production device comprising a flip chip machine for assembling the chip on a substrate, and a transport component for the substrate;

[0063] The flip-chip machine has a material inlet, and the substrate can be moved from the second transport unit 200 to the third transport unit 300 and enter the flip-chip machine through the material inlet.

[0064] Furthermore, the utility model also discloses a flip chip production device, the production device comprising a plurality of flip chips for assembling chips on a substrate, at least one substrate transport component is arranged between any two adjacent flip chips;

[0065] Each of the flip-chip machines has a feed port and a discharge port, and the substrate can be moved from the first transport unit 100 to the third transport unit 300 and enter the flip-chip machine through the feed port.

[0066] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0067] In addition, in the present invention, the descriptions of "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0068] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A substrate transport assembly, characterized in that: include: Fixed frame; A first transport unit, which is arranged on the fixed frame, the first transport unit comprises a transport track arranged along a first direction, and the substrate can move along the first direction on the transport track; a second transport unit, which is disposed on the fixing frame, and comprises a mounting member for mounting the material box, and a driving member for pushing the substrate in the material box to move along the first direction; A third transport unit is arranged on the fixed frame, and the second transport unit includes a carrier, the carrier has a first position and a second position, and the carrier can move along the second direction to move arbitrarily between the first position and the second position; in the first position, the carrier is at the end of the first transport unit, and the substrate can be moved from the transport track to the carrier along the first direction; in the second position, the carrier is at the end of the second transport unit, and the substrate can be moved from the material box to the carrier along the first direction.

2. A substrate transport assembly according to claim 1, characterized in that: The first direction and the second direction are in the same horizontal plane, and the first direction is perpendicular to the second direction; A plurality of substrates are arranged in the material box along the height direction, and the mounting member can also be lifted and lowered along the height direction so that the driving member can push any substrate in the material box to move toward the carrier direction.

3. A substrate transport assembly according to claim 1, characterized in that: The carrier includes two clamping plates, and the two clamping plates are arranged at an interval to form a clamping space between the two clamping plates; When the carrier is at the second position, the substrate can be moved by the magazine along the first direction to enter the clamping space.

4. A substrate transport assembly according to claim 3, characterized in that: Each of the clamping plates is provided with a first guide rail, and two of the first guide rails form a feeding track; When the carrier is at the first position, the substrate can be moved from the transport track to the feeding track along a first direction.

5. The substrate transport assembly according to claim 3, characterized in that: The two clamping plates can move simultaneously along the second direction to drive the base plate to move, and the two clamping plates can move separately along the second direction to adjust the distance between the two clamping plates; When the substrate is in the clamping space, the two clamping plates are respectively in contact with two ends of the substrate.

6. A substrate transport assembly according to claim 5, characterized in that: The transport track includes two second guide rails, and the distance between the two second guide rails is adjustable.

7. The substrate transport assembly according to claim 1, characterized in that: The first transport unit further includes a conveyor belt arranged on the transport track, and a driving motor for driving the conveyor belt to rotate.

8. The substrate transport assembly according to claim 1, characterized in that: The driving member is a pushing cylinder arranged on the fixing frame, and the telescopic rod of the pushing cylinder can extend into the material box and abut against the base plate.

9. A flip chip production device, characterized in that: The production equipment comprises a flip-chip machine for assembling chips on a substrate, and a transport assembly for the substrate as claimed in any one of claims 1 to 8; The flip-chip machine has a material inlet, and the substrate can be moved from the second transport unit to the third transport unit and enter the flip-chip machine through the material inlet.

10. A flip chip production device, characterized in that: The production equipment includes a plurality of flip-chip machines for assembling chips on substrates, and at least one substrate transport component according to any one of claims 1 to 8 is arranged between any two adjacent flip-chip machines; Each of the flip-chip machines has a feed port and a discharge port, and the substrate can be moved from the first transport unit to the third transport unit and enter the flip-chip machine through the feed port.

Images