Wafer rotating and carrying device

Abstract

The utility model discloses a wafer rotating and carrying device, which comprises a turntable, cantilevers, a gas distribution ring and an air exhaust pipe joint, the turntable is rotatably and concentrically arranged above the gas distribution ring, the cantilevers are arranged on the turntable at intervals, and the front ends of the cantilevers extend to the outer side of the turntable along the radial direction of the turntable; a cantilever is arranged on the rotating disc, a through hole located below the cantilever is axially formed in the rotating disc, a blind hole communicated with the corresponding through hole is formed in the bottom of the cantilever, an underflow hole communicated with the blind hole is formed in the front end of the cantilever in an inward concave mode, a wafer positioning seat is arranged on the cantilever, and adsorption holes communicated with the underflow hole are formed in the wafer positioning seat at intervals. A section of arc-shaped negative pressure groove located below the through hole is formed in the air distribution ring in an inward concave mode, and the air exhaust pipe connector is arranged on one side of the air distribution ring and communicated with the arc-shaped negative pressure groove. According to the wafer rotating and carrying device, rotating and carrying of the wafer can be carried out, and the stability of the wafer in the rotating and carrying process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transport, in particular to a wafer rotary transport device. Background Art

[0002] During the wafer production and testing process, wafer loading and unloading is required. Due to the limited space of some processing or testing equipment, the traditional robotic arm cannot be used to directly load and unload wafers. The wafer can be placed on the positioning seat on the cantilever, and the cantilever can be rotated to transport the wafer on the positioning seat into the processing or testing equipment. After the processing or testing is completed, the wafer can be removed by rotating the cantilever.

[0003] In order to improve the wafer handling efficiency, the cantilever rotates at a relatively fast speed, resulting in an unstable structure of the wafer when it moves with the cantilever. The wafer is easily dropped and damaged, which needs to be improved. Utility Model Content

[0004] The utility model aims to provide a wafer rotation transport device to carry out rapid rotation transport of wafers and improve the stability during the transport process.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer rotating transport device comprises: a turntable, a cantilever, an air distribution ring and an air extraction pipe joint, the turntable is rotatably and concentrically arranged above the air distribution ring, the cantilever is arranged on the turntable at intervals, and the front end of the cantilever extends to the outside of the turntable along the radial direction of the turntable, the turntable is axially provided with a through hole located below the cantilever, the bottom of the cantilever is provided with a blind hole connected with the corresponding through hole, the front end of the cantilever is concavely provided with a submerged flow hole connected with the blind hole, a wafer positioning seat is provided on the cantilever, and adsorption holes connected with the submerged flow holes are arranged at intervals on the wafer positioning seat, the air distribution ring is concavely provided with a section of arc-shaped negative pressure groove located below the through hole, the angle of the arc-shaped negative pressure groove is less than 350 degrees, and the air extraction pipe joint is arranged on one side of the air distribution ring and is connected with the arc-shaped negative pressure groove.

[0007] Wherein, a plug is arranged at the front end of the underflow hole.

[0008] A fixing seat is arranged below the air distribution ring, a guide sleeve pointing upward to the air distribution ring is arranged on the fixing seat, and a guide column inserted into the guide sleeve is arranged at the bottom of the air distribution ring.

[0009] Wherein, a spring located between the guide sleeve and the air distribution ring is arranged on the guide column.

[0010] Wherein, a rotation driving device concentrically connected to the turntable is arranged on the fixing seat.

[0011] Wherein, the rotation driving device adopts a cam divider or a servo motor.

[0012] Wherein, the cantilever is provided with a screw connected with the turntable.

[0013] The beneficial effects of the utility model include: a wafer rotation transport device, which drives the cantilever to rotate by a turntable to perform rotational transport of the wafer. The exhaust pipe joint is externally connected to an exhaust pump, which can extract the air in the arc-shaped negative pressure groove to form a negative pressure environment. During the rotation of the turntable, when the through hole is connected to the arc-shaped negative pressure groove, the air in the undercurrent hole enters the arc-shaped negative pressure groove through the through hole, generates suction on the adsorption hole, and adsorbs and fixes the wafer on the wafer positioning seat, thereby improving the stability of the wafer during rotational transport and avoiding the problem of falling off. After the wafer is transported to the right place, the through hole and the arc-shaped negative pressure groove are automatically disconnected, and no air valve is required for control, which is convenient for wafer removal, processing or detection, and easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 yes Figure 1 Top view of the central air ring. DETAILED DESCRIPTION

[0016] Combine the following Figure 1~Figure 2 The technical solution of the utility model is further illustrated by specific embodiments.

[0017] like Figure 1 The wafer rotating transport device shown includes: a turntable 1, a cantilever 9, an air distribution ring 6 and an exhaust pipe joint 15. The turntable 1 is rotatably and concentrically arranged above the air distribution ring 6. A fixed seat 3 is arranged below the air distribution ring 6. A rotating drive device 2 concentrically connected to the turntable 1 is arranged on the fixed seat 3. In the present embodiment, the rotating drive device 2 adopts a cam divider or a servo motor to perform intermittent rotation of the turntable 1.

[0018] A guide sleeve 4 pointing upward to the air distribution ring 6 is arranged on the fixing seat 3 , and a guide column 5 inserted into the guide sleeve 4 is arranged at the bottom of the air distribution ring 6 to guide the air distribution ring 6 to float and avoid rotation and deflection of the air distribution ring 6 .

[0019] The guide column 5 is provided with a spring 17 between the guide sleeve 4 and the air distribution ring 6 to elastically support the air distribution ring 6 and ensure the contact and sealing between the top surface of the air distribution ring 6 and the bottom surface of the turntable 1, thereby meeting the use requirements with low requirements on sealing performance.

[0020] The cantilever 9 is arranged on the turntable 1 at intervals, and the front end of the cantilever 9 extends to the outside of the turntable 1 along the radial direction of the turntable 1. In this embodiment, the cantilever 9 is provided with a screw 7 connected to the turntable 1, which is convenient for assembly and has a firm structure. The cantilever 9 is provided with a wafer positioning seat 12, which can position the wafer and transport it as the cantilever 9 rotates.

[0021] In order to improve the stability of the wafer during the rotating transportation process, it needs to be adsorbed and fixed. A through hole 10 is axially arranged on the turntable and located below the cantilever 9. A blind hole 8 connected to the corresponding through hole 10 is arranged at the bottom of the cantilever 9. A submerged hole 14 connected to the blind hole 8 is arranged in the front end of the cantilever 9. In this embodiment, a plug 13 is arranged at the front end of the submerged hole 14, which is convenient for processing and avoids the problem of air leakage of the submerged hole 14.

[0022] Adsorption holes 11 connected to the underflow holes 14 are arranged at intervals on the wafer positioning seat 12. The wafer positioning seat 12 and the cantilever 9 adopt an integrated aluminum alloy structure with high strength and light weight. A section of arc-shaped negative pressure groove 16 located below the through hole 10 is arranged inwardly on the air distribution ring 6. The exhaust pipe joint 15 is arranged on one side of the air distribution ring 6 and is connected to the arc-shaped negative pressure groove 16. The exhaust pipe joint 15 is connected to an external exhaust pump, which can extract the air in the arc-shaped negative pressure groove 16 to form a negative pressure environment. During the rotation of the turntable 1, when the through hole 10 is connected to the arc-shaped negative pressure groove 16, the air in the underflow hole 14 enters the arc-shaped negative pressure groove 16 through the through hole 10, and generates suction on the adsorption hole 11, so as to adsorb and fix the wafer on the wafer positioning seat 12, improve the stability of the wafer during rotation and transportation, and avoid the problem of falling off.

[0023] like Figure 2 As shown, the angle of the arc-shaped negative pressure groove 16 is less than 350 degrees. After the wafer is transported into place, the cantilever 9 corresponding to the wafer is misaligned with the arc-shaped negative pressure groove 16, and the through hole 10 is automatically disconnected from the arc-shaped negative pressure groove 16. The wafer is no longer adsorbed and fixed, which is convenient for wafer removal, processing or testing. No air valve is required for control, and the operation is simple.

[0024] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A wafer rotating transport device, characterized in that: include: A turntable, a cantilever, an air distribution ring and an air extraction pipe joint, wherein the turntable is rotatably and concentrically arranged above the air distribution ring, the cantilevers are arranged on the turntable at intervals, and the front end of the cantilever extends to the outside of the turntable along the radial direction of the turntable, the turntable is axially provided with a through hole located below the cantilever, the bottom of the cantilever is provided with a blind hole connected to the corresponding through hole, the front end of the cantilever is concavely provided with a submerged flow hole connected to the blind hole, a wafer positioning seat is provided on the cantilever, and adsorption holes connected to the submerged flow holes are arranged at intervals on the wafer positioning seat, the air distribution ring is concavely provided with a section of arc-shaped negative pressure groove located below the through hole, the angle of the arc-shaped negative pressure groove is less than 350 degrees, and the air extraction pipe joint is arranged on one side of the air distribution ring and is connected to the arc-shaped negative pressure groove.

2. The wafer rotation transport device according to claim 1, characterized in that: A plug is arranged at the front end of the underflow hole.

3. The wafer rotation transport device according to claim 1, characterized in that: A fixing seat is arranged below the air distribution ring, a guide sleeve pointing upward to the air distribution ring is arranged on the fixing seat, and a guide column inserted into the guide sleeve is arranged at the bottom of the air distribution ring.

4. The wafer rotation transport device according to claim 3, characterized in that: The guide column is provided with a spring located between the guide sleeve and the air distribution ring.

5. The wafer rotation transport device according to claim 3, characterized in that: The fixing seat is provided with a rotation driving device which is coaxially connected with the rotating disk.

6. The wafer rotary transport device according to claim 5, characterized in that: The rotary drive device adopts a cam divider or a servo motor.

7. The wafer rotation transport device according to claim 1, characterized in that: The cantilever is provided with a screw connected with the turntable.

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