Wafer rotating mechanism and wafer post-processing device

Abstract

The embodiment of the utility model provides a wafer rotating mechanism and a wafer cleaning device, the wafer rotating mechanism comprises a rotating shaft, a rotating disc and a shielding member, the rotating shaft is arranged perpendicular to the horizontal plane, and the rotating shaft can rotate along the rotating axis of the rotating shaft; the turntable is concentrically arranged at the upper end of the rotating shaft to support a wafer; the shielding piece is pivotally connected to the turntable so as to pivot between a first position and a second position, and the shielding piece is positioned on the periphery of the wafer on the turntable; when the rotating shaft rotates, the shielding piece is pivoted to the first position from the second position, so that the top of the shielding piece is higher than the wafer; and when the rotating shaft stops rotating, the shielding piece is located at the second position, so that the top of the shielding piece is lower than the wafer. According to the wafer rotating mechanism provided by the embodiment of the invention, the shielding piece which is variable in height and can rotate synchronously with the rotating shaft is arranged, waste liquid thrown out by rotation of the wafer is shielded, and interaction between the transmission mechanism and the wafer is prevented from being hindered.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning equipment, and more particularly to a wafer rotating mechanism and a wafer post-processing device. Background Art

[0002] At present, the wafer post-processing device generally places the wafer on the turntable of the wafer rotating mechanism, and then sprays cleaning liquid or detergent on the surface of the wafer. In order to prevent the cleaning liquid from being thrown out and splashing when the wafer rotates, and polluting the surrounding environment. Therefore, it is necessary to cooperate with a fixed shielding member. The shielding member is arranged at the periphery of the wafer, so that the chemical liquid or water on the wafer is thrown onto the inner wall of the shielding member through the rotation of the wafer, and then the waste liquid flows down along the inner wall of the shielding member. However, the speed of the thrown waste liquid has a large speed difference relative to the inner wall of the stationary shielding member. Therefore, it is easy to cause the waste liquid to contact the inner wall of the shielding member and then sputter back onto the surface of the wafer. That is, the dirty waste liquid that flows out of the wafer returns to the surface of the wafer, thereby contaminating the wafer.

[0003] In addition, at least one of the shielding member or the turntable itself must be able to achieve lifting and lowering movement. Because, in order for the shielding member to be able to block the waste liquid thrown out by the rotation of the wafer, the height of the shielding member needs to be higher than the height of the wafer during the wafer cleaning process. When the wafer is placed on the transmission mechanism (such as a robotic arm) or taken from the wafer rotation mechanism, the wafer can be higher than the shielding member. That is, the height of the shielding member is less than the height of the wafer to prevent the shielding member from blocking the wafer, making it inconvenient for the transmission mechanism and the wafer to interact. If the shielding member is lifted, it is difficult to achieve lifting due to the large size and span of the shielding member, and either the structure is complicated or it is easy to shake; if the turntable is lifted, the turntable is prone to shaking, affecting the process effect. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a wafer rotation mechanism and a wafer post-processing device having the same, which has a shielding member whose height can be changed and can rotate synchronously with the rotating shaft, thereby shielding the waste liquid thrown out by the rotation of the wafer and avoiding obstruction of the interaction between the transmission mechanism and the wafer.

[0005] According to the first aspect of the present application, an embodiment provides a wafer rotation mechanism, which includes: a rotating shaft, which is arranged perpendicular to a horizontal plane and can rotate along its rotation axis; a turntable, which is concentrically arranged to the upper end of the rotating shaft to support the wafer; a shielding member, which is pivotally connected to the turntable to pivot between a first position and a second position, and the shielding member is located on the outer periphery of the wafer on the turntable; when the rotating shaft rotates, the shielding member pivots from the second position to the first position, so that the top of the shielding member is higher than the wafer; when the rotating shaft stops, the shielding member is located at the second position, so that the top of the shielding member is lower than the wafer.

[0006] Optionally, the shielding member includes: a connecting portion, which is pivotally connected to the turntable; and a shielding portion, which is arranged on the upper surface of the connecting portion, and the inner wall surface of the shielding portion is a surface with a certain curvature along the circumference of the wafer, and the width of the shielding portion is greater than the width of the connecting portion.

[0007] Optionally, the wafer rotation mechanism includes a plurality of the shielding members, and when the plurality of the shielding members are all in the first position, the plurality of the shielding parts are sequentially connected to form a closed circular ring.

[0008] Optionally, the wafer rotation mechanism further includes: a fixing member, which is arranged on the turntable and can fix and release the wafer.

[0009] Optionally, the wafer rotation mechanism further includes: a first limit member, the first limit member is arranged on the lower surface of the turntable, and when the shielding member is located at the second position, the first limit member abuts against the lower surface of the connecting part.

[0010] Optionally, the first limiting member includes: a base, which is arranged on the lower surface of the turntable; and a limiting protrusion, which is arranged on the side wall of the base to abut against the lower surface of the connecting part when the shielding member is located at the second position.

[0011] Optionally, the wafer rotation mechanism further includes: a second position-limiting member, the second position-limiting member is arranged on the upper surface of the turntable, and when the shielding member is located at the first position, the second position-limiting member abuts against the upper surface of the connecting portion.

[0012] Optionally, the second limiting member is a limiting plate, the size of the limiting plate is larger than the size of the turntable, the limiting plate is arranged on the upper surface of the turntable, and when the shielding member is located at the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting part.

[0013] Optionally, the shielding member is made of a hydrophilic material.

[0014] According to the second aspect embodiment of the present application, a wafer post-processing device is provided, and the wafer post-processing device includes: the wafer rotation mechanism described in the above-mentioned first aspect embodiment; a transmission mechanism, which can transmit the wafer between multiple positions; and a post-processing mechanism, which is arranged above the wafer rotation mechanism to perform a post-processing process on the rotated wafer.

[0015] The wafer rotation mechanism provided in the embodiment of the present application has the following beneficial effects:

[0016] 1. The shielding member can rotate between the first position and the second position. Therefore, when the shaft rotates, the shielding member can pivot from the second position to the first position with a height higher than the wafer through the centrifugal motion, thereby effectively shielding the waste liquid thrown by the wafer. When the shaft stops rotating, the shielding member pivots from the first position to the second position with a height lower than the wafer due to gravity, avoiding blocking the monitoring operation between the transmission mechanism and the wafer.

[0017] 2. The shielding member is arranged on the rotating shaft and can rotate synchronously with the rotating shaft. Therefore, when the shielding member shields the waste liquid thrown out by the wafer, the speed difference between the shielding member and the waste liquid is small, so that the splashing force when the waste liquid is thrown out and contacts the inner wall of the shielding member can be effectively reduced. In addition, it can effectively prevent the waste liquid from splashing from the inner wall of the shielding member and then falling back to the surface of the wafer to dirty the wafer.

[0018] 3. The overall structure is simple, and there is no need for multiple power mechanisms to control the lifting and lowering of the shielding member and the turntable, which avoids the shaking of the shielding member or the turntable caused by the lifting and lowering of the turntable. The relative height between the shielding member and the wafer is controlled by gravity and centrifugal motion, which not only ensures the process effect, but also saves costs and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0020] Figure 1 A position relationship diagram of an existing shielding member when shielding a wafer;

[0021] Figure 2 A position relationship diagram when the existing shielding member does not shield the wafer;

[0022] Figure 3 A schematic diagram of the waste liquid sputtering onto the wafer when the existing shielding member contacts the waste liquid;

[0023] Figure 4 is a simplified structural diagram of a wafer rotation mechanism according to an embodiment of the first aspect of the present application, wherein the shielding member is located at the second position;

[0024] Figure 5 is a simplified structural diagram of a wafer rotation mechanism according to an embodiment of the first aspect of the present application, wherein the shielding member is located at a first position;

[0025] Figure 6 A schematic diagram of the positional relationship between the wafer rotation mechanism and the transmission mechanism of the first aspect of the present application;

[0026] Figure 7 A schematic diagram of the three-dimensional structure of a shielding member of a wafer rotating mechanism according to an embodiment of the first aspect of the present application;

[0027] Figure 8 It is a schematic diagram of the three-dimensional structure of the wafer rotation mechanism of the embodiment of the first aspect of the present application, and the shielding member is located at the second position at this time;

[0028] Fig. 9 It is a schematic diagram of the three-dimensional structure of the wafer rotating mechanism of the embodiment of the first aspect of the present application from another angle, and at this time, the shielding member is located at the second position;

[0029] Fig.10 It is a schematic diagram of the three-dimensional structure of the wafer rotating mechanism of the embodiment of the first aspect of the present application from another angle, and at this time, the shielding member is located at the second position;

[0030] Fig.11 It is a side cross-sectional view of the wafer rotation mechanism of the embodiment of the first aspect of the present application, and the shielding member is located at the second position at this time;

[0031] Fig.12 It is a schematic diagram of the three-dimensional structure of the wafer rotation mechanism of the first aspect of the present application, and the shielding member is located at the first position at this time;

[0032] Fig.13 It is a side cross-sectional view of the wafer rotation mechanism of the first aspect of the present application, and the shielding member is located at the first position at this time;

[0033] Fig.14 A schematic diagram of the three-dimensional structure of the rotating shaft and the turntable of the wafer rotating mechanism according to the first aspect of the present application;

[0034] Fig.15 A schematic diagram of the three-dimensional structure of the rotating shaft and the turntable of the wafer rotating mechanism of the first aspect of the present application in another angle;

[0035] Fig.16 This is a schematic diagram of the three-dimensional structure of the second limit member of the wafer rotation mechanism of the first aspect embodiment of the present application.

[0036] Description of reference numerals:

[0037] Wafer rotating mechanism 100;

[0038] Rotating shaft 10; rotating disk 20;

[0039] Shielding member 30; connecting portion 301; shielding portion 302; fixing member 40;

[0040] A first limiting member 50; a base 501; a limiting protrusion 502; a second limiting member 60;

[0041] Transmission mechanism 200;

[0042] Wafer 2000. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0044] As mentioned above, the current wafer post-processing device generally places the wafer 2000 on the turntable 20 of the wafer rotating mechanism 100, and then sprays a cleaning liquid or a detergent onto the surface of the wafer 2000. Figure 1 and Figure 2 As shown, in order to prevent the cleaning liquid from splashing out when the wafer 2000 rotates, which will pollute the surrounding environment and make it inconvenient to clean up later, it is necessary to cooperate with a fixed shielding member 30. The shielding member 30 is set at the periphery of the wafer 2000, so that the chemical liquid or water on the wafer 2000 is thrown onto the inner wall of the shielding member 30 through the rotation of the wafer, and then the waste liquid flows down along the inner wall of the shielding member 30. Figure 3 As shown, the speed of the thrown waste liquid is much different from the speed of the inner wall of the stationary shielding member 30. Therefore, it is easy for the waste liquid to contact the inner wall of the shielding member 30 and then be reversely sputtered onto the surface of the wafer 2000. That is, the dirty waste liquid that flows out of the wafer 2000 returns to the surface of the wafer 2000, thereby contaminating the wafer 2000. Figure 3 The direction of the straight arrow in FIG. 1 is a schematic diagram showing that the waste liquid is reversely sputtered onto the wafer 2000 after contacting the inner wall of the shielding member 30 . Figure 3 The arrow W1 in the middle shows the rotation direction of the turntable 20.

[0045] In addition, at least one of the shielding member 30 or the turntable 20 itself must be able to achieve lifting and lowering movement. Because, in order for the shielding member 30 to block the waste liquid thrown out by the rotation of the wafer 2000, the height of the shielding member 30 needs to be higher than the height of the wafer 2000 during the cleaning process of the wafer 2000. When the transmission mechanism 200 (such as a robotic arm) places the wafer 2000 or takes the wafer 2000 from the wafer rotation mechanism 100, the wafer 2000 can be higher than the shielding member 30. That is, the height of the shielding member 30 is less than the height of the wafer 2000, preventing the shielding member 30 from blocking the wafer 2000, which is inconvenient for the interactive operation between the transmission mechanism 200 and the wafer 2000. If the shielding member 30 is lifted, it is difficult to achieve lifting and lowering due to the large size and span of the shielding member 30, and either the structure is complicated or it is easy to shake; if the turntable 20 is lifted and lowered, the turntable 20 is easy to shake, affecting the process effect.

[0046] Therefore, the wafer rotating mechanism 100 of the embodiment of the utility model has a shielding member 30 whose height can be changed and can rotate synchronously with the rotating shaft 10, so as to shield the waste liquid thrown out by the rotation of the wafer 2000 and avoid hindering the interaction between the transmission mechanism 200 and the wafer 2000.

[0047] The following is attached to the instruction manual Figure 4-Figure 16 The wafer rotating mechanism 100 according to the embodiment of the present application is described in detail.

[0048] like Figure 4-Figure 11 As shown, according to an embodiment of the present invention, a wafer rotating mechanism 100 includes a rotating shaft 10, a rotating disk 20 and a shielding member 30. Figure 4 and Figure 5 As shown, the rotating shaft 10 is arranged perpendicular to the horizontal plane, and the rotating shaft 10 can rotate along its rotating axis. The rotating axis of the rotating shaft 10 is as shown in FIG. Figure 4 and Figure 5 As shown by the line L1 in the figure, the rotation direction of the shaft 10 is along W2 in the figure. Figure 4 and Figure 5 As shown, the turntable 20 is concentrically arranged to the upper end of the rotating shaft 10 to support the wafer 2000. Thus, the wafer 2000 can be driven to rotate synchronously by the rotation of the rotating shaft 10. The shielding member 30 is pivotally connected to the turntable 20 to pivot between a first position and a second position, and the shielding member 30 is located at the periphery of the wafer on the turntable 20. Thus, the shielding member 30 can not only rotate synchronously with the rotation of the rotating shaft 10, but also switch between the first position and the second position. Figure 4 and Figure 8-Figure 11 As shown, the rotating shaft 10 stops rotating and the shielding member 30 is located at the second position. Figure 5 and Figure 12-13 As shown, the rotating shaft 10 rotates and the shielding member 30 is located at the first position.

[0049] Specifically, when the rotating shaft 10 rotates, the shielding member 30 will pivot from the lower second position to the higher first position due to the centrifugal motion, and the top of the shielding member 30 is higher than the wafer 2000. It should be noted that the top of the shielding member 30 can be understood as the portion above the center of the shielding member 30. It can also be the portion higher than the wafer 2000. Figure 5 As shown, the arrow in the figure is a schematic diagram of the movement direction of the waste liquid after it contacts the shielding member 30 after the cleaning liquid is sprayed onto the surface of the wafer 2000 and the waste liquid is thrown outward by the rotation of the wafer 2000. Therefore, the shielding member 30 can shield the outer periphery of the wafer 2000, and the waste liquid thrown out by the rotation of the wafer 2000 can be blocked by the inner wall of the shielding member 30, thereby preventing the waste liquid from being thrown out and causing an unclean environment. When the rotating shaft 10 stops rotating, due to the disappearance of the effect of the centrifugal motion, the shielding member 30 automatically rotates from the first position with a higher height to the second position with a lower height due to the effect of gravity, and the top of the shielding member 30 is lower than the wafer 2000. At this time, the wafer 2000 can be exposed, which is convenient for the interaction and operation between the transmission mechanism 200 and the wafer 2000, such as Figure 6 As shown, it is a schematic diagram of the handover operation between the transmission mechanism 200 and the wafer 2000 when the shielding member 30 is located at the second position (for example, the transmission mechanism 200 grabs the wafer 2000, or the transmission mechanism 200 places a new wafer 2000 to be cleaned on the wafer rotating mechanism 100).

[0050] The wafer rotation mechanism 100 provided in the embodiment of the present application has the following beneficial effects:

[0051] 1. The shielding member 30 can rotate between a first position and a second position. Thus, when the rotating shaft 10 rotates, the shielding member 30 can pivot from the second position to the first position whose height is higher than the height of the wafer 2000 by the centrifugal motion, thereby effectively shielding the waste liquid thrown away by the wafer 2000. When the rotating shaft 10 stops rotating, the shielding member 30 pivots from the first position to the second position whose height is lower than the height of the wafer 2000 by the gravity, avoiding blocking the interactive operation between the transmission mechanism 200 and the wafer 2000.

[0052] 2. The shielding member 30 is disposed on the rotating shaft 10 and can rotate synchronously with the rotating shaft 10. Therefore, when the shielding member 30 shields the waste liquid thrown out by the wafer 2000, the speed difference between the shielding member 30 and the waste liquid is small, thereby effectively reducing the sputtering force when the waste liquid is thrown out and contacts the inner wall of the shielding member 30. In addition, it can effectively prevent the waste liquid from being sputtered from the inner wall of the shielding member 30 and then falling back onto the surface of the wafer 2000 to dirty the wafer 2000.

[0053] 3. The overall structure is simple, and there is no need for multiple power mechanisms to control the lifting and lowering of the shielding member 30 and the turntable 20, which avoids the shaking of the shielding member 30 or the turntable 20 caused by lifting and lowering the turntable 20. The relative height between the shielding member 30 and the wafer 2000 is controlled by gravity and centrifugal motion, which not only ensures the process effect, but also saves costs and is easy to operate.

[0054] In some embodiments of the present invention, Figure 7 As shown, the shielding member 30 includes a connecting portion 301 and a shielding portion 302, and the connecting portion 301 is pivotally connected to the turntable 20, that is, the connecting portion 301 is pivotally connected to the turntable 20. The shielding portion 302 is set to the upper surface of the connecting portion 301, and the inner wall surface of the shielding portion 302 is a surface with a certain curvature along the circumference of the wafer 2000. It can be understood by those skilled in the art that the wafer 2000 is disc-shaped, and the shielding portion 302 is set to a surface with a certain curvature. It can follow the circumference of the wafer 2000, so when the waste liquid thrown out of the wafer 2000 contacts the inner wall of the shielding portion 302, the probability of reverse sputtering back to the surface of the wafer 2000 can be effectively reduced.

[0055] The pivot connection between the shielding member 30 and the rotating disk 20 can be achieved by providing a first through hole on the connecting portion 301 and a corresponding second through hole on the rotating disk 20. Thus, after the first through hole corresponds to the second through hole, the pivot connection can be achieved by penetrating a pin.

[0056] like Figure 7 As shown, the width of the shielding portion 302 is greater than the width of the connecting portion 301. This can prevent the width of the connecting portion 301 from being too large. Figure 8 As shown, when the wafer rotating mechanism 100 has a plurality of shielding members 30 , during the process of the plurality of shielding members 30 being dropped from the first position to the second position, the shielding members 30 cannot smoothly drop downward due to the mutual contact of the larger connecting portions 301 .

[0057] Furthermore, if Figure 8-Figure 13 As shown, the wafer rotating mechanism 100 includes a plurality of shielding members 30. Fig.12 and Fig.13 As shown, when the multiple shielding members 30 are all in the first position, the multiple shielding parts 302 are connected in sequence to form a closed ring. Thus, a circular shielding structure surrounding the periphery of the wafer 2000 can be formed, so that the periphery of the wafer 2000 can be completely shielded to prevent the waste liquid thrown out by the wafer 2000 from being completely shielded. The shielding effect of the waste liquid is improved.

[0058] In some embodiments of the present invention, Figure 8-Figure 12As shown, the turntable structure 100 includes four shielding members 30. When the four shielding members 30 are all located at the first position, the shielding portions 302 of the four shielding members 30 are sequentially connected to form a closed ring, thereby completely surrounding the periphery of the wafer 2000, ensuring that the waste liquid thrown out of the wafer 2000 is shielded.

[0059] Furthermore, the number of shielding members 30 of the turntable structure 100 can be designed according to actual needs, for example, there can be five shielding members 30 or six shielding members 30. When the plurality of shielding members 30 are all in the first position, a closed circular ring is formed.

[0060] like Figure 8 , Fig.10 , Fig.11 , Fig.13 and Fig.15 As shown, the wafer rotating mechanism 100 further includes a fixing member 40, which is arranged on the turntable 20, and the fixing member 40 can fix and release the wafer 2000. The fixing member 40 can be a clamping claw, through which the wafer 2000 can be quickly clamped or released, so as to facilitate the cooperation with the transmission mechanism 200, and to place and take out the wafer 2000.

[0061] like Fig. 9 , Fig.11 and Fig.13 As shown, the wafer rotation mechanism 100 also includes a first limiter 50, which is set to the lower surface of the turntable 20. When the shielding member 30 is in the second position, the first limiter 50 abuts against the lower surface of the connecting portion 301. Thus, the first limiter 50 limits the angle of the shielding member 30 when it rotates from the first position to the second position. It should be noted here that the limit on the rotation angle can be set according to the needs during actual use, that is, the position of the first limiter 50 is adjusted. In this way, the overall stability of the wafer rotation mechanism 100 can be ensured.

[0062] In some embodiments of the present invention, Fig.16 The structure of the first stopper 50 is shown, and the first stopper includes a base 501 and a stopper protrusion 502. The base 501 is set to the lower surface of the turntable 20. The stopper protrusion 502 is set to the side wall of the base 501 to abut against the lower surface of the connecting portion 301 when the shielding member 30 is in the second position.

[0063] Specifically, Fig.16 As shown, the first stopper 50 has a main body, namely a base 501. Fig. 9As shown, the base 501 can be arranged on the lower surface of the turntable 20. The side wall of the main body is provided with a protruding limiting portion, namely, a limiting protrusion 502. When the shielding member 30 rotates from the first position to the second position, the lower surface of the shielding portion 302 of the shielding member 30 can abut against the limiting protrusion 502, thereby limiting the further rotation of the shielding member 30.

[0064] In some embodiments of the present invention, Fig.13 , Fig.14 and Fig.15 As shown, the wafer rotation mechanism 100 further includes a second stopper 60, which is disposed on the upper surface of the turntable 20. When the shielding member 30 is located at the first position, the second stopper 60 abuts against the upper surface of the connecting portion 301. This can limit the angle of the shielding member 30 when it rotates from the second position to the first position.

[0065] Furthermore, if Fig.14 and Fig.15 As shown, the second limiting member 60 is a limiting plate, which can be a rectangular plate, whose size is larger than that of the turntable 20, and the limiting plate is arranged on the upper surface of the turntable 20. Therefore, the limiting plate has a portion of the area exceeding the turntable 20, and a shielding flange is formed above the turntable 20. When the shielding member 30 is located at the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting portion 301. Thus, the rotation angle of the shielding member 30 can be limited.

[0066] In some embodiments of the present invention, the shielding member 30 is made of a hydrophilic material, so that the waste liquid thrown out by the rotation of the wafer 2000 can better fit the inner wall of the shielding member 30 after contacting the inner wall of the shielding member 30, effectively preventing the waste liquid from back-sputtering onto the surface of the wafer 2000.

[0067] According to the wafer post-processing device of the embodiment of the second aspect of the utility model, the wafer post-processing device includes a wafer rotation mechanism 100, a transmission mechanism 200 and a post-processing mechanism (not shown in the figure), the wafer rotation mechanism 100 is the wafer rotation mechanism 100 of the embodiment of the first aspect, and the transmission mechanism 200 can transmit the wafer 2000 between multiple positions. Specifically, the transmission mechanism 200 can be a wafer clamping mechanism with a robotic arm. The transmission mechanism 200 can clamp and place the wafer on the wafer rotation mechanism 100. The post-processing mechanism can be a cleaning liquid spraying assembly arranged above the wafer to spray cleaning liquid or other chemical liquid toward the surface of the wafer 2000.

[0068] According to the wafer post-processing device of the second embodiment of the utility model, since it has the wafer rotation mechanism 100 of the first embodiment, it has the same beneficial effects as the wafer rotation mechanism 100 of the first embodiment, which will not be described in detail here.

[0069] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer rotation mechanism, characterized in that: The wafer rotation mechanism includes: A rotating shaft, the rotating shaft is arranged perpendicular to the horizontal plane and can rotate along its rotation axis; A turntable, the turntable is concentrically arranged to the upper end of the rotating shaft to support the wafer; a shielding member pivotally connected to the turntable to pivot between a first position and a second position, and the shielding member is located at an outer periphery of the wafer on the turntable; When the rotating shaft rotates, the shielding member pivots from the second position to the first position, so that the top of the shielding member is higher than the wafer; When the rotating shaft stops rotating, the shielding member is located at the second position, so that the top of the shielding member is lower than the wafer.

2. The wafer rotation mechanism according to claim 1, characterized in that: The shielding member comprises: A connecting portion, the connecting portion being pivotally connected to the turntable; The shielding portion is arranged on the upper surface of the connecting portion, the inner wall surface of the shielding portion is a surface with a certain curvature along the circumference of the wafer, and the width of the shielding portion is greater than the width of the connecting portion.

3. The wafer rotation mechanism according to claim 2, characterized in that: The wafer rotating mechanism comprises a plurality of the shielding members. When the plurality of the shielding members are all in the first position, the plurality of the shielding parts are sequentially connected to form a closed circular ring.

4. The wafer rotation mechanism according to claim 3, characterized in that: The wafer rotating mechanism also includes: A fixing member is provided on the turntable, and the fixing member can fix and release the wafer.

5. The wafer rotating mechanism according to claim 2, characterized in that: The wafer rotating mechanism also includes: A first limiting member, wherein the first limiting member is arranged on the lower surface of the rotating disk, and when the shielding member is located at the second position, the first limiting member abuts against the lower surface of the connecting portion.

6. The wafer rotating mechanism according to claim 5, characterized in that: The first limiting member comprises: a base, the base being arranged on the lower surface of the turntable; A limiting protrusion is arranged on the side wall of the base so as to abut against the lower surface of the connecting portion when the shielding member is located at the second position.

7. The wafer rotating mechanism according to claim 2, characterized in that: The wafer rotating mechanism also includes: A second limiting member is disposed on the upper surface of the rotating disk, and when the shielding member is located at the first position, the second limiting member abuts against the upper surface of the connecting portion.

8. The wafer rotating mechanism according to claim 7, characterized in that: The second limiting member is a limiting plate, the size of which is larger than the size of the turntable, and the limiting plate is arranged on the upper surface of the turntable. When the shielding member is located at the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting portion.

9. The wafer rotating mechanism according to any one of claims 1 to 8, characterized in that: The shielding member is made of a hydrophilic material.

10. A wafer post-processing device, characterized in that: include: The wafer rotating mechanism according to any one of claims 1 to 9, for driving the wafer to rotate; a transport mechanism capable of transporting the wafer between a plurality of locations; The post-processing mechanism is arranged above the wafer rotating mechanism to perform a post-processing process on the rotating wafer.

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