Slitting device for semiconductor chip processing
By introducing adjustable slitting components and limiting components into the semiconductor chip processing slitting device, fixed size and displacement problems are solved, and flexible slitting and stable slitting effects are achieved.
Patent Information
- Application Number
- CN202420013792.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-04
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-01-04
AI Technical Summary
The existing semiconductor chip processing and slitting devices cannot adjust the spacing between the slitting tools, resulting in only slitting chip plates of fixed sizes, and lacking a limit structure, which easily leads to displacement of the chip plates during slitting.
A slitting device including a lifting frame, a slitting assembly and a limiting assembly is designed. The slitting assembly realizes the adjustment of the cutter spacing through the slide groove, slider, screw and spring, and the limiting assembly prevents the chip by driving the motor and screw. Board offset.
It realizes flexible adjustment of cutting blade spacing and effective limit of chip boards, and can cut out chip boards of different sizes to prevent chip boards from being offset during slicing.
Smart Images
Figure CN222214163U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip processing, in particular to a slitting device for semiconductor chip processing. Background Art
[0002] A semiconductor chip refers to a semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. When semiconductor chips are mass-produced, they are generally cut into chip boards to obtain semiconductor chip boards of the required size.
[0003] After searching the Chinese patent with the publication number CN215451363U, a semiconductor chip processing and slitting device is disclosed, which includes a slitting mechanism and an automatic unloading mechanism; the slitting mechanism is installed on the slitting frame, and the slitting frame is installed on the slitting table; the slitting mechanism includes a telescopic cylinder installed on the upper part of the slitting frame, the output end of the telescopic cylinder is connected to a lifting base, and a plurality of slitting knives are fixedly installed at the bottom of the lifting base, and the automatic unloading mechanism includes a loading table installed directly below the slitting knife, and a unloading console is installed at the bottom of the loading table, and the front end of the unloading console and the front end of the loading table are rotatably connected by a hinge; a connecting groove is opened inside the unloading console, and a transmission screw is rotatably connected inside the connecting groove, and a transmission slider is threadedly connected on the transmission screw, and a lifting arm is installed on the transmission slider, and the upper and lower ends of the lifting arm are respectively rotatably connected with the transmission slider and the loading table through hinges; the end of the transmission screw away from the unloading console is connected to the motor.
[0004] The above-mentioned prior art solutions have the following deficiencies: the spacing between the cutting knives cannot be adjusted, and only chip boards of fixed sizes can be cut out, which is not flexible enough, and no limiting structure is provided, so the chip boards are prone to displacement during cutting. Utility Model Content
[0005] In view of the above-mentioned deficiencies in the prior art, the utility model provides a slitting device for semiconductor chip processing to solve the problems raised in the above-mentioned background technology.
[0006] In order to achieve the above-mentioned purpose of the utility model, the technical solution adopted by the utility model is a slitting device for semiconductor chip processing, including a base, a bracket is fixedly connected to the upper side wall of the base, a cylinder is installed at the center of the upper outer wall of the bracket, the telescopic end of the cylinder passes through the upper side wall of the bracket and is fixedly connected to a lifting frame, a slitting assembly is provided on the lifting frame, and a limiting assembly is also provided on the base.
[0007] As an improvement, the slitting assembly includes a first slide groove, a first slider, a first screw rod, an adjusting button, an adjusting plate, an extrusion block, a fixing rod, a mounting plate, a cutter, a pressure block, a positioning telescopic plate, a first return spring and a second return spring, the inner walls of both sides of the lifting frame are provided with a first slide groove, the first slide groove is slidably connected with the first slide groove, a first screw rod is rotatably provided on the lower side wall of one of the first slide grooves, the upper end of the first screw rod is threaded through the first slider and extends to the top of the lifting frame and is fixedly connected with an adjusting button, an adjusting plate is fixedly connected between the two first sliders, a plurality of extrusion blocks are provided on the lower side wall of the adjusting plate, and the extrusion block located on the far right The pressure block is fixedly connected to the adjusting plate, and the rest of the extrusion blocks are slidably connected to the adjusting plate. A fixing rod is fixedly connected between the inner walls on both sides of the lifting frame. A plurality of mounting plates are slidably sleeved on the fixing rod, and a cutting knife is installed on the mounting plate. A positioning telescopic plate is fixedly sleeved on the right end of the fixing rod. A pressure block is fixedly connected on one side wall where the plurality of mounting plates are close to each other and on one side wall where the rightmost mounting plate and the positioning telescopic plate are close to each other. A first return spring is provided between the plurality of mounting plates and between the rightmost mounting plate and the positioning telescopic plate. The first return spring is sleeved on the fixing rod, and a second return spring is provided between the plurality of extrusion blocks.
[0008] As an improvement: the limiting assembly includes a second slide groove, a second slider, a limiting plate, a driving motor and a second screw. A second slide groove is opened on the upper side wall of the base, a second slider is slidably arranged in the second slide groove, a limiting plate is fixedly connected to the upper side wall of the second slider, a driving motor is installed on one side wall of the base, an output shaft end of the driving motor extends into the second slide groove and is fixedly connected to a second screw, and the other end of the second screw is threaded through the second slider and is rotatably connected to a side wall of the second slide groove away from the driving motor.
[0009] As an improvement: guide rods are slidably inserted on the upper side wall of the bracket and located on both sides of the cylinder, and the bottom ends of the guide rods are fixedly connected to the lifting frame.
[0010] As an improvement: a distance ruler is fixedly connected to the front side wall of the lifting frame, and a distance line is provided on the front side wall of the rightmost mounting plate.
[0011] As an improvement: the extrusion block and the pressure block are wedge-fitted.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] 1. By setting the first slide groove, the first slider, the first screw rod, the adjusting button, the adjusting plate, the extrusion block, the fixing rod, the mounting plate, the cutter, the pressure block, the positioning telescopic plate, the first return spring and the second return spring, the spacing between the multiple cutters can be adjusted, so that chip boards of different sizes can be cut out, which is more flexible and practical. By setting the second slide groove, the second slider, the limit plate, the drive motor and the second screw rod, the chip board to be cut can be limited to prevent the chip board from shifting during cutting. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip processing slitting device according to the utility model;
[0015] Figure 2 This is a schematic diagram of the lifting frame structure of a semiconductor chip processing cutting device of the utility model;
[0016] Figure 3 This is a schematic diagram of the structure of an adjustment plate of a slitting device for semiconductor chip processing according to the utility model;
[0017] As shown in the figure:
[0018] 1. Base; 1.1. Bracket; 1.2. Cylinder; 1.3. Lifting frame; 2. Cutting assembly; 3. Limiting assembly; 2.1. First slide; 2.2. First slider; 2.3. First screw; 2.4. Adjusting button; 2.5. Adjusting plate; 2.6. Extrusion block; 2.7. Fixing rod; 2.8. Mounting plate; 2.9. Cutter; 2.10. Pressure block; 2.11. Positioning telescopic plate; 2.12. First return spring; 2.13. Second return spring; 3.1. Second slide; 3.2. Second slider; 3.3. Limiting plate; 3.4. Driving motor; 3.5. Second screw; 1.4. Guide rod; 1.31. Distance ruler; 2.81. Distance line. DETAILED DESCRIPTION
[0019] In order to make the technical means, creative features and purpose effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both sides", "one side", "the other side" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0022] like Figure 1 As shown, a slitting device for semiconductor chip processing includes a base 1, a bracket 1.1 is fixedly connected to the upper side wall of the base 1, a cylinder 1.2 is installed at the center of the upper outer wall of the bracket 1.1, the telescopic end of the cylinder 1.2 passes through the upper side wall of the bracket 1.1 and is fixedly connected to a lifting frame 1.3, the telescopic end of the cylinder 1.2 can push the lifting frame 1.3 to move downward to cut the chip board, a slitting component 2 is provided on the lifting frame 1.3, and a limiting component 3 is also provided on the base 1.
[0023] Specifically, Figure 2 and Figure 3As shown, a slitting device for semiconductor chip processing, the slitting assembly 2 includes a first slide 2.1, a first slider 2.2, a first screw 2.3, an adjusting button 2.4, an adjusting plate 2.5, an extrusion block 2.6, a fixing rod 2.7, a mounting plate 2.8, a cutter 2.9, a pressure block 2.10, a positioning telescopic plate 2.11, a first return spring 2.12 and a second return spring 2.13, first slides 2.1 are provided on the inner walls of both sides of the lifting frame 1.3, the first slides 2.1 are slidably connected to the first slides 2.1, a first screw 2.3 is rotatably provided on the lower side wall of one of the first slides 2.1, and the first screw 2.3 The upper end thread passes through the first slider 2.2 and extends to the top of the lifting frame 1.3 and is fixedly connected with an adjusting button 2.4. An adjusting plate 2.5 is fixedly connected between the two first sliders 2.2. A plurality of extrusion blocks 2.6 are arranged on the lower side wall of the adjusting plate 2.5. The extrusion block 2.6 located on the far right is fixedly connected to the adjusting plate 2.5. The remaining extrusion blocks 2.6 are all slidably connected to the adjusting plate 2.5. A fixing rod 2.7 is fixedly connected between the inner walls of both sides of the lifting frame 1.3. A plurality of mounting plates 2.8 are slidably sleeved on the fixing rod 2.7. A cutter 2.9 is installed on the mounting plate 2.8. A positioning telescopic plate is fixedly sleeved on the right end of the fixing rod 2.7 2.11, a pressure block 2.10 is fixedly connected on one side wall where multiple mounting plates 2.8 are close to each other and on one side wall where the rightmost mounting plate 2.8 and the positioning telescopic plate 2.11 are close to each other, and a first return spring 2.12 is arranged between multiple mounting plates 2.8 and between the rightmost mounting plate 2.8 and the positioning telescopic plate 2.11, and the first return spring 2.12 is sleeved on the fixed rod 2.7, and a second return spring 2.13 is arranged between multiple extrusion blocks 2.6, and the adjusting knob 2.4 is turned to drive the first screw rod 2.3 to rotate, and when the first screw rod 2.3 rotates, the first slider 2.2 threadedly connected thereto can be brought The movable adjustment plate 2.5 moves downward, and the downward movement of the adjustment plate 2.5 will drive the extrusion block 2.6 to move downward, and the downward movement of the extrusion block 2.6 will squeeze the pressure block 2.10. Since the rightmost extrusion block 2.6 and the positioning telescopic plate 2.11 are fixed, the pressure block 2.10 can drive the mounting plate 2.8 to move on the fixed rod 2.7 to change the spacing between the cutters 2.9. The reverse adjustment button 2.4 can make the adjustment plate 2.5 rise. Under the action of the first return spring 2.12 and the second return spring 2.13, the spacing between the cutters 2.9 can be reduced, thereby achieving the purpose of adjusting the spacing between the cutters 2.9, which is more flexible and practical.
[0024] Specifically, Figure 1As shown, a slitting device for semiconductor chip processing is provided, wherein the limiting assembly 3 comprises a second slide groove 3.1, a second slider 3.2, a limiting plate 3.3, a driving motor 3.4 and a second screw 3.5. The upper side wall of the base 1 is provided with a second slide groove 3.1, a second slider 3.2 is slidably arranged in the second slide groove 3.1, the upper side wall of the second slider 3.2 is fixedly connected with the limiting plate 3.3, a driving motor 3.4 is installed on one side wall of the base 1, and the output shaft end of the driving motor 3.4 extends into the second slide groove 3.1 and is fixedly connected with the second screw 3.5. .5, the other end of the second screw 3.5 is threaded through the second slider 3.2 and is rotatably connected to a side wall of the second slide groove 3.1 away from the drive motor 3.4. After the chip board to be cut is placed on the base 1, one side of the chip is close to the positioning telescopic plate 2.11, and the output shaft of the drive motor 3.4 can drive the second screw 3.5 to rotate. When the second screw 3.5 rotates, the second slider 3.2 threadedly connected thereto can drive the limiting plate 3.3 to approach the positioning telescopic plate 2.11, clamping the chip board to prevent the chip board from shifting during cutting.
[0025] Specifically, Figure 1 As shown, a slitting device for semiconductor chip processing, guide rods 1.4 are slidably inserted on the upper side wall of the bracket 1.1 and located on both sides of the cylinder 1.2, and the bottom end of the guide rod 1.4 is fixedly connected to the lifting frame 1.3. The guide rod 1.4 can make the lifting frame 1.3 more stable when lifting.
[0026] Specifically, Figure 3 As shown, a slitting device for semiconductor chip processing, a distance ruler 1.31 is fixedly connected to the front side wall of the lifting frame 1.3, and a distance line 2.81 is provided on the front side wall of the rightmost mounting plate 2.8. When adjusting the spacing between the cutting knives 2.9, the distance line 2.81 cooperates with the distance ruler 1.31 to determine the slitting distance.
[0027] Specifically, Figure 3 As shown, a slitting device for semiconductor chip processing, the extrusion block 2.6 and the pressure block 2.10 are wedge-shaped.
[0028] When the utility model is implemented, the chip board to be cut is placed on the base 1, so that one side of the chip is close to the positioning telescopic plate 2.11, and then the driving motor 3.4 is started. The output shaft of the driving motor 3.4 can drive the second screw 3.5 to rotate. When the second screw 3.5 rotates, the second slider 3.2 threadedly connected thereto can drive the limiting plate 3.3 to approach the positioning telescopic plate 2.11 to clamp the chip board to prevent the chip board from shifting during cutting. After the chip board is fixed, the adjusting knob 2.4 is turned to drive the first screw 2.3 to rotate. When the first screw 2.3 rotates, the first slider 2.2 threadedly connected thereto can drive the adjusting plate 2.5 to move downward. The downward movement of the section plate 2.5 will drive the extrusion block 2.6 to move downward, and the downward movement of the extrusion block 2.6 will squeeze the pressure block 2.10. Since the rightmost extrusion block 2.6 and the positioning telescopic plate 2.11 are fixed, the pressure block 2.10 can drive the mounting plate 2.8 to move on the fixed rod 2.7, and change the spacing between the cutters 2.9. At this time, the slitting distance is determined according to the spacing ruler 1.31 and the spacing line 2.81. After the slitting distance is determined, the telescopic end of the cylinder 1.2 pushes the lifting frame 1.3 to move downward, and the positioning telescopic plate 2.11 will shrink to adapt to the downward movement of the lifting frame 1.3. The downward movement of the lifting frame 1.3 will drive the cutter 2.9 to move downward, so that the cutter 2.9 cuts the chip board.
[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A slitting device for semiconductor chip processing, comprising a base (1), characterized in that: A bracket (1.1) is fixedly connected to the upper side wall of the base (1); a cylinder (1.2) is installed at the center of the upper outer wall of the bracket (1.1); the telescopic end of the cylinder (1.2) passes through the upper side wall of the bracket (1.1) and is fixedly connected to a lifting frame (1.3); a slitting assembly (2) is provided on the lifting frame (1.3); and a limiting assembly (3) is also provided on the base (1).
2. A semiconductor chip processing slitting device according to claim 1, characterized in that: The slitting assembly (2) comprises a first sliding groove (2.1), a first sliding block (2.2), a first screw rod (2.3), an adjusting button (2.4), an adjusting plate (2.5), an extruding block (2.6), a fixing rod (2.7), a mounting plate (2.8), a cutter (2.9), a pressure block (2.10), a positioning telescopic plate (2.11), a first return spring (2.12) and a second return spring (2.13). The inner walls of both sides of the lifting frame (1.3) are provided with first sliding grooves (2.1), and the first A first slider (2.2) is slidably connected in a slide groove (2.1), a first screw rod (2.3) is rotatably provided on the lower side wall of one of the first slide grooves (2.1), the upper end of the first screw rod (2.3) passes through the first slider (2.2) through a thread and extends to the top of the lifting frame (1.3) and is fixedly connected to an adjustment button (2.4), an adjustment plate (2.5) is fixedly connected between the two first sliders (2.2), a plurality of extrusion blocks (2.6) are provided on the lower side wall of the adjustment plate (2.5), the rightmost of which is provided with a plurality of extrusion blocks (2.6). The extrusion block (2.6) on the side is fixedly connected to the adjustment plate (2.5), and the other extrusion blocks (2.6) are all slidably connected to the adjustment plate (2.5). A fixing rod (2.7) is fixedly connected between the inner walls on both sides of the lifting frame (1.3). A plurality of mounting plates (2.8) are slidably sleeved on the fixing rod (2.7). A cutting knife (2.9) is installed on the mounting plate (2.8). A positioning telescopic plate (2.11) is fixedly sleeved on the right end of the fixing rod (2.7). The plurality of mounting plates (2.8) are ) are fixedly connected on a side wall where the rightmost mounting plate (2.8) and the positioning telescopic plate (2.11) are close to each other, and a pressure block (2.10) is fixedly connected, a first return spring (2.12) is provided between the plurality of mounting plates (2.8) and between the rightmost mounting plate (2.8) and the positioning telescopic plate (2.11), the first return spring (2.12) is sleeved on the fixing rod (2.7), and a second return spring (2.13) is provided between the plurality of extrusion blocks (2.6).
3. A semiconductor chip processing slitting device according to claim 1, characterized in that: The limiting assembly (3) comprises a second slide groove (3.1), a second slider (3.2), a limiting plate (3.3), a driving motor (3.4) and a second screw (3.5); a second slide groove (3.1) is provided on the upper side wall of the base (1); a second slider (3.2) is slidably provided in the second slide groove (3.1); a limiting plate (3.3) is fixedly connected to the upper side wall of the second slider (3.2); a driving motor (3.4) is installed on one side wall of the base (1); an output shaft end of the driving motor (3.4) extends into the second slide groove (3.1) and is fixedly connected to the second screw (3.5); the other end of the second screw (3.5) is threadedly passed through the second slider (3.2) and is rotatably connected to a side wall of the second slide groove (3.1) away from the driving motor (3.4).
4. A semiconductor chip processing slitting device according to claim 1, characterized in that: Guide rods (1.4) are slidably inserted on the upper side wall of the bracket (1.1) and located on both sides of the cylinder (1.2), and the bottom ends of the guide rods (1.4) are fixedly connected to the lifting frame (1.3).
5. A semiconductor chip processing slitting device according to claim 2, characterized in that: A distance ruler (1.31) is fixedly connected to the front side wall of the lifting frame (1.3), and a distance line (2.81) is provided on the front side wall of the rightmost mounting plate (2.8).
6. A semiconductor chip processing slitting device according to claim 2, characterized in that: The extrusion block (2.6) and the pressure block (2.10) are wedge-matched.