Flexible printed circuit (FPC) attached with nano carbon copper foil
By attaching nano-carbon copper foil to the FPC board and forming a high-radiation nano-heat dissipation layer, the heat dissipation problem of FPC board is solved, efficient heat dissipation and electromagnetic wave shielding are achieved, and high-speed data transmission of intelligent products under low power consumption is supported.
Patent Information
- Application Number
- CN202420375960.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-28
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-28
AI Technical Summary
During long-term use, FPC boards are prone to accumulate heat, affecting heat dissipation, and cannot meet the high requirements of smart products for rapid heat dissipation of components.
Using FPC attached to nano-carbon copper foil, a high-radiation nano-radiation layer is formed on the surface of the copper foil, combined with the high specific surface area of the nanoparticles, to achieve efficient heat dissipation, and a rectangular opening is cut on the shield cover to cover the nano-carbon copper foil for Electromagnetic wave shielding.
It has achieved an increase in heat dissipation efficiency of more than 50%, supports high-speed data transmission under low power consumption, and effectively shields the impact of external electromagnetic waves on internal circuits.
Smart Images
Figure CN222216033U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of FPC, in particular to an FPC with nano-carbon copper foil attached. Background Art
[0002] FPC board, also called flexible circuit board, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material.
[0003] With the rapid development of smart phones, notebooks, and tablet computers, the data transmission of smart product touch screens has become faster, the power consumption has been lower, the electronic components have become more miniaturized, and the data transmission has become faster, thus placing higher requirements on the rapid heat dissipation of components. However, FPC boards are prone to accumulate heat during long-term use, which is not conducive to the heat dissipation of FPC boards.
[0004] To this end, we propose an FPC with nano-carbon copper foil attached. Utility Model Content
[0005] The purpose of the utility model is to provide an FPC with nano-carbon copper foil attached to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an FPC with nano-carbon copper foil attached, comprising an FPC body, a screen pressing gold finger end is arranged at the bottom of the FPC body, a BTB connection end is arranged on one side of the top of the FPC body, a touch IC is arranged on one side of the top of the FPC body, the FPC body is provided with a passive device area located above the touch IC, the remaining area of the FPC body is an EMI shielding area, a shielding cover is arranged on the front of the touch IC, and the nano-carbon copper foil is arranged on the front of the shielding cover.
[0007] Optionally, the screen pressing gold finger end uses ACF to press and connect the screen pressing gold finger and the touch panel.
[0008] Optionally, the shielding cover cuts a rectangular opening that is 1.2MM larger than one side of the touch IC, the nano-carbon copper foil covers the rectangular opening, the shielding cover is welded to the ground wire PAD of the FPC body, and the EMI shielding material in the EMI shielding area is connected to the ground wire of the FPC body.
[0009] Optionally, the nano-carbon copper foil is bonded to the surface of the shielding cover by a pressure-sensitive conductive adhesive.
[0010] Optionally, the passive device area is provided with a variety of electronic devices for adjusting voltage and current.
[0011] Optionally, the BTB connection end is snap-connected to a connector of the mainboard via a BTB connector.
[0012] Optionally, a release film is bonded to the front side of the nano-carbon copper foil, the release film is composed of 25 μm blue PET, and the release force of the release film is 10 grams.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The FPC with nano-carbon copper foil is equipped with nano-carbon copper foil. The copper foil has excellent thermal conductivity and can quickly absorb the heat generated by the working components. A high-radiation nano-heat dissipation layer is formed on the surface of the copper foil through a specific process. Based on the high thermal radiation of the nano-heat dissipation layer and the high specific surface area of the nanoparticles, efficient heat dissipation is achieved, and the heat dissipation efficiency is improved by more than 50%, thereby enabling smartphones to achieve high-speed data transmission with lower power consumption.
[0015] The FPC with nano-carbon copper foil attached cuts a rectangular window with a single edge distance of 1.2MM larger than the touch IC on the shielding cover on the top of the touch IC entity, and then attaches the nano-carbon copper foil on the surface of the shielding cover. The copper foil layer of the nano-carbon copper foil can communicate and play a shielding role, shielding the influence of external electromagnetic waves on the internal circuit and the electromagnetic waves generated inside from radiating outward. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The utility model is a structural schematic diagram of an FPC with nano-carbon copper foil attached.
[0017] In the figure: 1. BTB connection end; 2. EMI shielding area; 3. Screen pressing gold finger end; 4. Shielding cover; 5. Passive device area; 6. Nano-carbon copper foil; 7. Touch IC; 8. Release film; 9. FPC body. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] See also Figure 1The utility model provides an FPC with nano-carbon copper foil attached, including an FPC body 9, a screen pressing gold finger terminal 3 is arranged at the bottom of the FPC body 9, a BTB connection terminal 1 is arranged on one side of the top of the FPC body 9, a touch IC 7 is arranged on one side of the top of the FPC body 9, the FPC body 9 is provided with a passive device area 5 located above the touch IC 7, the remaining area of the FPC body 9 is an EMI shielding area 2, a shielding cover 4 is arranged on the front of the touch IC 7, and a nano-carbon copper foil 6 is arranged on the front of the shielding cover 4.
[0020] The screen pressing gold finger terminal 3 uses ACF to press the screen pressing gold finger and the touch panel to connect, and transmits the analog signal collected from the touch panel to the touch IC7 for processing through the gold finger terminal.
[0021] The shielding cover 4 cuts a rectangular opening 1.2MM larger than one side of the touch IC 7, and the nano-carbon copper foil 6 covers the rectangular opening. The shielding cover 4 is welded to the ground wire PAD of the FPC body 9 by welding. The EMI shielding material in the EMI shielding area 2 is connected to the ground wire of the FPC body 9, and the redundant electromagnetic waves generated by the FPC body 9 and the electromagnetic waves of external interference are eliminated through the ground wire, thereby shielding the influence of external electromagnetic waves on the internal circuit of the FPC body 9 and the electromagnetic waves generated inside from radiating outward.
[0022] The nano-carbon copper foil 6 is bonded to the surface of the shielding cover 4 by its own pressure-sensitive conductive adhesive. The electromagnetic waves generated by the touch IC7 and the external electromagnetic waves are absorbed by the nano-carbon copper foil 6 layer and transmitted to the shielding cover 4, and then transmitted to the ground wire through the shielding cover 4 to achieve the shielding function. The heat generated by the touch IC7 when working is scattered to the copper foil layer of the nano-carbon copper foil 6 through the rectangular opening of the shielding cover 4, and is quickly transmitted to the nano-carbon layer of the nano-carbon copper foil 6 by the copper foil with excellent conductivity. Since the nano-carbon layer has a unique grain orientation, it conducts heat evenly in both horizontal and vertical directions, and exerts the functions of efficient heat conduction and high-temperature radiation heat dissipation.
[0023] The passive device area 5 is provided with various electronic devices for adjusting voltage and current, so as to ensure that the touch IC 7 can work normally under the rated voltage and current.
[0024] The BTB connection terminal 1 is connected to the connector of the main board through the BTB connector, and transmits the digital signal processed by the touch IC 7 to the main board.
[0025] A release film 8 is bonded to the front of the nano-carbon copper foil 6. The release film 8 is made of 25μm blue PET and has a release force of 10 grams. The release film 8 protects the nano-carbon copper foil 6 and protects the FPC body 9 to maintain the flatness and good, undamaged appearance of the nano-carbon copper foil 6 before use. The release film 8 is removed from the FPC body 9 after assembly and use.
[0026] Working principle:
[0027] The electromagnetic waves generated by the touch IC7 and the external electromagnetic waves are absorbed by the nano-carbon copper foil 6 layer and transmitted to the shielding cover 4, and then transmitted to the ground wire through the shielding cover 4 to achieve the shielding function. The heat generated by the touch IC7 when working is scattered to the copper foil layer of the nano-carbon copper foil 6 through the rectangular opening of the shielding cover 4, and is quickly transmitted to the nano-carbon layer of the nano-carbon copper foil 6 by the copper foil with excellent conductivity. Since the nano-carbon layer has a unique grain orientation, it conducts heat evenly in both horizontal and vertical directions, and plays the functions of efficient heat conduction and high-temperature radiation heat dissipation.
[0028] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An FPC with nano-carbon copper foil attached, comprising an FPC body (9), characterized in that: A screen pressing gold finger terminal (3) is arranged at the bottom of the FPC body (9), a BTB connection terminal (1) is arranged on one side of the top of the FPC body (9), a touch IC (7) is arranged on one side of the top of the FPC body (9), the FPC body (9) is provided with a passive device area (5) located above the touch IC (7), the remaining area of the FPC body (9) is an EMI shielding area (2), a shielding cover (4) is arranged on the front of the touch IC (7), and a nano-carbon copper foil (6) is arranged on the front of the shielding cover (4).
2. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: The screen pressing gold finger end (3) uses ACF to press the screen pressing gold finger and the touch panel together.
3. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: The shielding cover (4) cuts a rectangular opening that is 1.2 mm larger than one side of the touch IC (7); the nano-carbon copper foil (6) covers the rectangular opening; the shielding cover (4) is welded to the ground wire PAD of the FPC body (9); and the EMI shielding material in the EMI shielding area (2) is connected to the ground wire of the FPC body (9).
4. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: The nano-carbon copper foil (6) is bonded to the surface of the shielding cover (4) via the pressure-sensitive conductive adhesive provided therewith.
5. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: The passive device area (5) is provided with a variety of electronic devices for adjusting voltage and current.
6. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: The BTB connection end (1) is snap-connected to the connector of the mainboard via a BTB connector.
7. The FPC with nano-carbon copper foil attached according to claim 1, characterized in that: A release film (8) is bonded to the front side of the nano-carbon copper foil (6); the release film (8) is made of 25 μm blue PET; and the release force of the release film (8) is 10 grams.