Temperature detection device

Abstract

The utility model discloses a temperature detection device, and the device comprises a pedestal which is erected above a heat-conducting seat or a chip carried on a carrying platform; the guide rail is arranged on the upper edge of the base and is parallel to the length direction of the heat conducting seat or the chip; the moving assembly is used for sliding along the guide rail; and the temperature measuring assembly is fixed on one side of the moving assembly and is used for detecting the temperature of the heat conducting seat or the surface of the chip. In the temperature detection device provided by the invention, the moving assembly can drive the temperature measurement assembly to slide in the process of sliding along the guide rail, the temperature measurement assembly can slide to the middle or edge position of the heat conduction seat or the chip as required, the plurality of temperature measurement assemblies can realize multi-point detection, and the device has the advantages of fewer parts used in total, simple structure, lower cost and higher practicability. And moreover, the operation steps are fewer, so that testers can complete measurement in a shorter time, and the problems of complicated operation and low efficiency in the prior art are solved.

Description

Technical Field

[0001] The present application belongs to the technical field of in vitro diagnostic instruments, and specifically relates to a temperature detection device. Background Art

[0002] In actual use, the gene sequencer needs to take pictures of the sample chip, and before taking pictures, chemical reagents need to flow into the chip, and the sample and chemical reagents need to react at a certain temperature. The picture taken is the actual situation of the chip sample after the reaction. In order to achieve the above reaction, the gene sequencer is provided with a carrier for carrying a thermal seat, which is used to heat the chip. Since the sequencing process includes many reactions that need to be carried out at a specific temperature, such as PCR amplification, chain termination reaction, etc., the temperature uniformity of the gene sequencer carrier is very critical to the accuracy of the sequencing results. If the temperature of the carrier is uneven, the efficiency and accuracy of these reactions may be affected, thereby affecting the quality and accuracy of the sequencing results.

[0003] In order to detect whether the temperature of the carrier is uniform, in the prior art, a metal sheet is fixed to a thermal seat or chip using thermal grease. A channel is provided on the side of the metal sheet, and a thermocouple is fixed to the metal sheet through the channel. Since both the thermal grease and the metal sheet have excellent thermal conductivity, the temperature measured by the thermocouple is the temperature of the surface of the thermal seat or the chip. However, due to the limited area of ​​the metal sheet, the metal sheet is prone to fall off due to loose fit during the measurement process; after each temperature measurement, the surface temperature of the metal sheet may be high and cannot be disassembled in time, and the thermal grease remaining on the surface of the thermal seat or the chip needs to be cleaned after disassembly. The above multiple aspects make the operation of temperature measurement using metal sheets cumbersome and inefficient. Utility Model Content

[0004] The present application provides a temperature detection device to solve the problems of complicated operation and low efficiency in the prior art.

[0005] The present application provides a temperature detection device, comprising:

[0006] A base is mounted above the heat conducting base or chip carried on the carrier;

[0007] A guide rail, arranged on the upper edge of the base, parallel to the length direction of the heat conducting base or the chip;

[0008] A moving assembly, used for sliding along the guide rail;

[0009] The temperature measuring component is fixed to one side of the moving component and is used to detect the temperature of the surface of the thermal seat or the chip.

[0010] Optionally, the temperature measurement component includes:

[0011] A fixed part, fixedly connected to the moving component;

[0012] A temperature probe, movably arranged at the center of the fixed part, comprising a contact part arranged at the bottom and a sliding part connected to the contact part, wherein the contact part is used to contact the surface of the thermal seat or the chip, and the sliding part is used to insert a thermocouple;

[0013] A retaining ring, fixed on the top of the temperature probe;

[0014] The elastic member is sleeved on the outside of the temperature probe, with the top of the elastic member abutting against the fixing portion and the bottom of the elastic member abutting against the contact portion.

[0015] Optionally, a heat insulating ring is provided between the fixing portion and the temperature probe.

[0016] Optionally, when the bottom end of the temperature probe contacts the thermal seat or the chip, the elastic member is in a contracted state.

[0017] Optionally, the temperature measurement component further comprises a blocking column, wherein the blocking column is provided with a spike portion, and when a thermocouple is inserted into the temperature probe, the spike portion is used to compress the thermocouple.

[0018] Optionally, the mobile component includes:

[0019] A locking slider, used for sliding on the guide rail;

[0020] The knob is used to release the locking slider in a loose state and to fix the locking slider in a tightened state.

[0021] Optionally, a limit member is provided at the end of the guide rail, and the limit member is used to limit the locking slider within the travel of the guide rail.

[0022] Optionally, the guide rails are symmetrically arranged relative to the central axis of the heat-conducting seat or the chip in the length direction, and a plurality of the moving components and temperature measuring components are arranged on each guide rail.

[0023] Optionally, the temperature detection device further includes a heat insulation plate, and the heat insulation plate is arranged at the bottom of the base.

[0024] Optionally, the heat-conducting seat includes a boss structure, and the boss structure is clamped between the heat insulation plates on both sides of the base.

[0025] It can be seen from the above technical scheme that in the temperature detection device provided by the present application, the moving component can drive the temperature measuring component to slide during the sliding process along the guide rail. In actual applications, the temperature measuring component can slide to the middle or edge position of the thermal seat or chip as needed. Multiple temperature measuring components can realize multi-point detection. The device uses a total of fewer parts, has a simple structure, low cost, and fewer operating steps, which is more conducive to the test personnel to complete the measurement in a shorter time, and solves the problems of cumbersome operation and low efficiency in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A scene diagram of the actual working process of the temperature detection device provided in the embodiment of the present application;

[0027] Figure 2 A schematic diagram of the main structure of the temperature detection device provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the side view structure of a temperature detection device provided in an embodiment of the present application;

[0029] Figure 4 A schematic cross-sectional view of a temperature detection device provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of the partial structure of a temperature detection device provided in an embodiment of the present application.

[0031] Figure numerals: 10-carrier; 20-thermal seat; 30-temperature detection device; 1-base; 2-guide rail; 3-moving component; 4-temperature measuring component; 5-thermal insulation board; 21-limiting member; 31-locking slider; 32-knob; 41-fixing part; 42-thermal insulation ring; 43-temperature probe; 431-contact part; 432-sliding part; 44-retaining ring; 45-elastic member; 46-blocking column; 461-spike part. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0033] Figure 1 The following is a scene diagram of the actual working process of the temperature detection device. Figure 1 As shown, the gene sequencer carrier 10 is a dual-chip carrier, and has a thermal conductive seat 20 on each side, and the temperature detection device 30 is located above the thermal conductive seat 20 .

[0034] Reference Figure 2 As shown in the structural schematic diagram, an embodiment of the present application provides a temperature detection device 30, including: a base 1, mounted above a thermally conductive seat or chip carried on a carrier; a guide rail 2, arranged on the upper edge of the base 1 and parallel to the length direction of the thermally conductive seat or chip; a moving component 3, used for sliding along the guide rail 2; a temperature measuring component 4, fixed to one side of the moving component 3, used for detecting the temperature of the surface of the thermally conductive seat or chip.

[0035] Before sequencing begins, the carrier first heats the thermal seat on the carrier through the TEC (semiconductor cooler) below the thermal seat, then places a temperature detection device above the thermal seat, and then uses the temperature detection device to detect the temperature of the thermal seat below. After measuring the temperature of different points on the thermal seat, the temperature difference between the maximum and minimum values ​​of these points is calculated to determine whether the temperature difference is less than a preset threshold, such as 1°C, so as to obtain the temperature uniformity of the thermal seat and determine whether the carrier can be sequenced.

[0036] In this embodiment, the heat-conducting seat is used to place the chip, and the temperature of the surface of the heat-conducting seat is the temperature of the lower surface of the reaction chip. The temperature detection device provided in this embodiment first detects the temperature of the heat-conducting seat, and then places the chip on the heat-conducting seat to detect the temperature of the chip surface, thereby determining the temperature of the upper and lower surfaces of the sequencing chip during actual operation. By calculating the temperature difference between the upper and lower surfaces of the chip, the actual reaction temperature of the chemical reagent in the reaction chip can be more realistically determined, providing more reliable data for the inspection results.

[0037] It can be seen from the above technical scheme that in the temperature detection device provided by the present application, the moving component 3 can drive the temperature measuring component 4 to slide during the sliding process along the guide rail 2. In actual applications, the temperature measuring component 4 can slide to the middle or edge position of the thermal seat or chip as needed. Multiple temperature measuring components 4 can realize multi-point detection. The device uses a total of fewer parts, has a simple structure, low cost, and fewer operating steps, which is more conducive to the test personnel to complete the measurement in a shorter time, and solves the problems of cumbersome operation and low efficiency in the prior art.

[0038] Reference Figure 3-5 As shown in the structural schematic diagram, the temperature measuring component 4 includes: a fixed part 41, which is fixedly connected to the movable component 3; a temperature probe 43, which is movably arranged at the center of the fixed part 41, including a contact part 431 arranged at the bottom and a sliding part 432 connected to the contact part 431, and the sliding part 432 is used to insert a thermocouple; a retaining ring 44, which is fixed on the top of the temperature probe 43; an elastic member 45, which is sleeved on the outside of the temperature probe 43, and its top abuts against the fixed part 41, and its bottom abuts against the contact part 431.

[0039] The temperature probe 43 is made of a material with good thermal conductivity, and its interior is a hollow structure. A thermocouple can be placed inside, and the thermocouple can be fixed by controlling the tolerance of the hollow part. In addition, the temperature probe 43 will fit closely with the surface of the thermal seat or chip, so that the temperature of the surface of the thermal seat or chip is transferred to the temperature probe, and then the thermocouple detects the temperature of the surface of the thermal seat or chip. The temperature probe 43 includes a contact portion 431 and a sliding portion 432. The contact portion 431 is a disc pad, and the diameter of the disc pad is larger than the diameter of the sliding portion 432, thereby increasing the contact area between the temperature probe 43 and the thermal seat or chip, and improving the efficiency of heat transfer. The sliding portion 432 is a hollow structure, and the thermocouple is placed inside the sliding portion 432. Since the chip is placed on the thermal seat, according to the change of the height of the measured target, the sliding portion 432 can slide up and down along the central axis of the fixed portion 41 under the action of the elastic member 45, thereby adapting to the height of the measured target, so that the contact portion 431 is close to the surface of the measured target.

[0040] In the prior art, a metal sheet is bonded and fixed to a thermal seat or a chip surface, and then a thermocouple is fixed inside the metal sheet to measure temperature. However, the above process is difficult to disassemble after fixing, troublesome to select a position, and easy to loosen. The unique structure of the device can fix the thermocouple inside the temperature probe and can select different measurement points, thus solving the above problems.

[0041] When the temperature detection device is not in use, the temperature probe 43 can still move downward under the action of gravity. The retaining ring 44 in this embodiment can prevent the temperature probe 43 from sliding off the fixing portion 41 .

[0042] When the temperature detection device provided in this embodiment is placed on a horizontal plane, the distance between the contact portion 431 and the horizontal plane is H1 when the elastic member 45 is in a naturally extended state; since the target to be measured has a certain height, the distance between the upper surface of the target to be measured and the horizontal plane after being placed on the horizontal plane is H2, H2>H1, then when the bottom end of the temperature probe 43 contacts the surface of the thermal seat or the chip, the elastic member 45 will inevitably be subjected to the upward squeezing force of the thermal seat or the chip and generate an upward elastic force, and since the sum of the weight of the temperature detection device itself and the friction between the temperature detection device and the side of the thermal seat is greater than the upward force of the elastic member 45, the temperature detection device as a whole will not be displaced, and the elastic member 45 is in a contracted state. At the same time, the downward force generated by the elastic member 45 will press the temperature probe 43 to move downward, so that the temperature probe 43 is close to the surface of the thermal seat or the chip, thereby improving the detection accuracy of the temperature detection device. In this embodiment, the elastic member is usually a spring, and can also be other parts with elastic deformation, which are not specifically limited here.

[0043] Furthermore, a heat insulating ring 42 is provided between the fixed portion 41 and the temperature probe 43; the temperature probe 43 is displaced up and down along the heat insulating ring 42. The heat insulating ring 42 is made of high temperature resistant material, and its main function is to prevent the heat transferred along the temperature probe 43 from being conducted to the moving component 3, thereby generating higher heat in the entire temperature detection device.

[0044] It can be seen from the above technical solution that when the temperature detection device is placed above the thermal seat or chip, the thermocouple is placed inside the temperature probe 43. The temperature probe 43 fits tightly with the surface of the thermal seat or chip under the action of elastic force, thereby detecting the temperature value of the thermal seat or chip, feeding it back to the computer and recording the data.

[0045] This temperature detection device can be used for temperature uniformity detection of gene sequencer platforms and chips. The temperature of the target to be measured is detected in real time by a temperature probe. Experimenters can obtain the temperature uniformity result of the gene sequencer platform through calculation, thereby improving sequencing efficiency, accuracy, and repeatability, and ensuring the reliability of sequencing results.

[0046] When the thermocouple is placed in the temperature probe 43, in addition to using the structure of the temperature probe 43 itself to fix it, in order to further fix the thermocouple and prevent the thermocouple from displacement, the temperature measuring component 4 also includes a blocking column 46, and the blocking column 46 is provided with a spike portion 461. When the temperature probe 43 is inserted with a thermocouple, the spike portion 461 is placed on the temperature probe 43 and pressed downward, so that a part of the spike portion 461 is tightly matched with the sliding portion 432 to press the thermocouple, thereby achieving a fixing effect.

[0047] Reference Figure 5 As shown in the structural diagram, the moving component 3 includes: a locking slider 31 for sliding on the guide rail 2; a knob 32 for releasing the locking slider 31 in a loose state and fixing the locking slider 31 in a tightened state.

[0048] The knob 32 is located above the locking slider 31 and is connected to the locking slider 31 through a thread. It mainly fixes the locking slider. When the locking slider moves to the point to be measured, the tester can fix the locking slider 31 by turning the knob 32. At this time, there is a large friction between the knob 32 and the guide rail 2 below the locking slider 31, thereby playing a fixing role. It can be seen that in this embodiment, by pushing the moving component 3 to different positions, the moving component 3 carries the temperature measuring component 4 to the corresponding position, and the position of the temperature measuring component 4 is fixed by the knob 32, so as to achieve the purpose of fixed-point measurement.

[0049] In order to prevent the locking slider from moving out of the stroke, a limit member 21 is provided at the end of the guide rail 2, and the limit member 21 is used to limit the locking slider 31 within the formation of the guide rail 2. In this embodiment, the limit member 21 can be a limit screw or other parts with a limit function.

[0050] In this embodiment, the guide rails 2 are symmetrically arranged relative to the central axis of the heat-conducting seat or the chip in the length direction, and a plurality of the movable components 3 and the temperature measuring components 4 are arranged on each guide rail 2. Usually, 3 or 4 movable components 3 are arranged on each guide rail 2, and a temperature measuring component is arranged on each movable component 3. Taking 3 temperature measuring components arranged on each guide rail 2 as an example, when measuring temperature, the 3 temperature measuring components respectively detect the temperature of two edge positions and one middle position, and the temperature of 6 points on both sides is detected in total, thereby realizing multi-point detection, which can better reflect the temperature uniformity.

[0051] In this embodiment, the knob 32 can be operated by the test personnel. In order to prevent the temperature of the surface of the thermal conductive seat or the chip from being transferred to the knob 32 and causing inconvenience to the operator, the temperature detection device also includes a heat insulation board 5, which is arranged at the bottom of the base 1. The heat insulation board 5 is located at the bottom of the temperature detection device. It is made of high-temperature resistant material and is connected to the base 1 through positioning pins, screws, etc. It is mainly used to isolate the heat transferred by the thermal conductive seat or the chip to prevent the test personnel from being burned during operation. In addition to positioning the heat insulation board 5, the positioning pin can also make the distance between the heat insulation boards 5 on both sides within the tolerance range, so that the temperature detection device can be accurately placed on the raised part of the thermal conductive seat to achieve the positioning effect.

[0052] In one practicable manner, the heat-conducting seat includes a boss structure, which is clamped between the heat-insulating plates 5 on both sides of the base. The heat-insulating plates 5 are in close contact with the side of the heat-conducting seat to position the temperature detection device, and generate a certain friction with the side of the heat-conducting seat to prevent the temperature detection device from being offset due to vibration or shaking, causing a change in the measurement position, thereby ensuring the reliability of the detection process and the measurement results.

[0053] The above are merely embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application are included in the scope of the claims of the present application to be approved.

Claims

1. A temperature detection device, characterized in that: include: A base is mounted above the heat conducting base or chip carried on the carrier; A guide rail, arranged on the upper edge of the base, parallel to the length direction of the heat conducting base or the chip; A moving assembly, used for sliding along the guide rail; The temperature measuring component is fixed to one side of the moving component and is used to detect the temperature of the surface of the thermal seat or the chip.

2. A temperature detection device according to claim 1, characterized in that: The temperature measuring component comprises: A fixed part, fixedly connected to the moving component; A temperature probe, movably arranged at the center of the fixed part, comprising a contact part arranged at the bottom and a sliding part connected to the contact part, wherein the contact part is used to contact the surface of the thermal seat or the chip, and the sliding part is used to insert a thermocouple; A retaining ring, fixed on the top of the temperature probe; The elastic member is sleeved on the outside of the temperature probe, with the top of the elastic member abutting against the fixing portion and the bottom of the elastic member abutting against the contact portion.

3. A temperature detection device according to claim 2, characterized in that: A heat insulating ring is arranged between the fixing part and the temperature probe.

4. A temperature detection device according to claim 2, characterized in that: When the bottom end of the temperature probe contacts the heat-conducting seat or the chip, the elastic member is in a contracted state.

5. A temperature detection device according to claim 2, characterized in that: The temperature measurement component also includes a blocking column, which is provided with a spike portion. When a thermocouple is inserted into the temperature probe, the spike portion is used to press the thermocouple.

6. A temperature detection device according to claim 1, characterized in that: The mobile assembly comprises: A locking slider, used for sliding on the guide rail; The knob is used to release the locking slider in a loose state and to fix the locking slider in a tightened state.

7. A temperature detection device according to claim 6, characterized in that: A limiting member is provided at the end of the guide rail, and the limiting member is used to limit the locking slider within the travel of the guide rail.

8. A temperature detection device according to claim 1, characterized in that: The guide rails are symmetrically arranged relative to the central axis of the heat-conducting seat or the chip in the length direction, and a plurality of the moving components and the temperature measuring components are arranged on each guide rail.

9. A temperature detection device according to claim 1, characterized in that: The temperature detection device also includes a heat insulation plate, and the heat insulation plate is arranged at the bottom of the base.

10. A temperature detection device according to claim 9, characterized in that: The heat-conducting seat comprises a boss structure, and the boss structure is clamped between the heat-insulating plates on both sides of the base.

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