Wafer pickup auxiliary device
By setting up extension grooves in the wafer pickup auxiliary device to form a mobile pickup channel, the problem of lack of support and fixation during wafer removal is solved, and the two-point fixation of the wafer is achieved, avoiding scratches and improving yield.
Patent Information
- Application Number
- CN202420013124.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-03
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-01-03
AI Technical Summary
When the prior art removes wafers from the wafer box, the lack of two-point or multiple-point support and fixes, causing the wafer to tilt forward and backward, move left and right, causing scratches and wear, and affecting the yield rate.
Design a wafer pickup auxiliary device, including a fixed base and an extension wall, and set multiple extension grooves on the extension wall correspond to the placement grooves in the wafer box to form a wafer moving pickup channel, and use gas tweezers to transfer the wafer from the channel. Take it out to achieve two-point fixation and avoid scratching.
Effectively prevent wafers from shaking and scratching during removal, reduce wear and breakage, and improve wafer yield.
Smart Images
Figure CN222233603U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer picking auxiliary device. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.
[0003] At present, when taking wafers out of the wafer box, it is necessary to use air tweezers to suck the wafers out of the wafer box. The existing wafer taking operation only has one support point, the air tweezers. When part of the wafer is removed from the basket teeth, the wafer cannot be supported and fixed at two or more points. The wafer will tilt forward and backward and move left and right, thereby scratching the adjacent wafers and affecting the wafer yield. Utility Model Content
[0004] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a wafer picking auxiliary device.
[0005] In a first aspect, an embodiment of the present application provides a wafer picking auxiliary device, the wafer picking auxiliary device comprising:
[0006] Fixed base and extended wall;
[0007] The fixed base is used to position a wafer box for holding wafers, the wafer box is arranged on the fixed base with its opening facing a first direction, the fixed base extends along a second direction, and the first direction is perpendicular to the second direction;
[0008] The extension wall is located at one side of the fixed base and extends from the fixed base along the first direction, and when the wafer box is arranged on the fixed base, the height of the extension wall is greater than the height of the wafer box;
[0009] A plurality of extension grooves are arranged on one side of the extension wall close to the wafer box. When the wafer box is arranged on the fixed base, the plurality of extension grooves respectively correspond to the positions of the wafer placement grooves in the wafer box and form a wafer moving and picking channel.
[0010] In a possible implementation, the extended wall includes an extension area and a mounting area;
[0011] A plurality of guide teeth are arranged on one side of the extension area close to the wafer box, and the extension groove is formed between two adjacent guide teeth.
[0012] In a possible implementation, the length of the extension groove extending along the first direction is greater than 2 / 5 of the diameter of the wafer; the length of the installation area extending along the first direction is equal to the length of the wafer box extending along the first direction.
[0013] In a possible implementation manner, a thickness of the extension area in the second direction is greater than a thickness of the installation area in the second direction.
[0014] In a possible implementation, the thickness of the extended area in the second direction is 41.4 mm, the length of the extended area extending along the first direction is 75.5 mm; and the length of the installation area extending along the first direction is 163.5 mm.
[0015] In a possible implementation, the number of the guide teeth is 25.
[0016] In a possible implementation, two wafer box fixing grooves are provided on the fixing base, and a distance between the two wafer box fixing grooves matches a size of the wafer box.
[0017] In a possible implementation, the depth of the wafer box fixing groove is 7 mm, and the width of the wafer box fixing groove is 4.8 mm.
[0018] In a possible implementation, the width of the extended wall is equal to the width of the fixed base, and the width of the extended wall and the width of the fixed base are 170-180 mm.
[0019] In a possible implementation, the wafer picking auxiliary device is made of polypropylene material.
[0020] Based on any one of the above aspects, the wafer picking auxiliary device provided in the embodiment of the present application includes a fixed base and an extended wall connected to one side of the fixed base, the fixed base is used to position the wafer box containing the wafers, and a plurality of the extended grooves are arranged on the extended wall, corresponding to the positions of the wafer placement grooves in the wafer box and forming a wafer moving and picking channel, so that the wafer can be taken out from the corresponding wafer picking channel using air tweezers, and the wafer can be supported and fixed at two points to prevent shaking when the wafer is picked up by air tweezers, thereby avoiding scratches between wafers, reducing wear and breakage of wafers, improving the yield of wafers, and avoiding unnecessary damage. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 One of the structural schematic diagrams of the wafer picking auxiliary device provided in this embodiment;
[0023] Figure 2 A schematic diagram of the structure of the wafer moving and picking channel provided in this embodiment;
[0024] Figure 3 A schematic diagram of the structure of the extended wall provided in this embodiment;
[0025] Figure 4 The second structural schematic diagram of the wafer picking auxiliary device provided in this embodiment;
[0026] Figure 5 This is the third structural schematic diagram of the wafer picking auxiliary device provided in this embodiment.
[0027] Icons: 110-fixed base; 120-extension wall; 200-wafer box; 121-extension slot; 210-wafer placement slot; 130-wafer moving and picking channel; 122-extension area; 123-installation area; 111-wafer box fixing slot. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0031] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0032] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0033] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0034] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.
[0035] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.
[0036] This embodiment provides a wafer picking auxiliary device, which can be used to prevent scratches between adjacent wafers during the process of taking wafers out of the wafer box 200 .
[0037] Please refer to Figure 1 , Figure 1 The schematic diagram of the structure of the wafer picking auxiliary device provided by the present embodiment is shown as an example. In the present embodiment, the wafer picking auxiliary device may be an L-shaped structure, and the wafer picking auxiliary device may include a fixed base 110 and an extension wall 120 .
[0038] The fixed base 110 is used to position a wafer box 200 for holding wafers. When the wafer box 200 is disposed on the fixed base 110 , its opening faces a first direction D1 . The fixed base 110 extends along a second direction D2 , and the first direction D1 is perpendicular to the second direction D2 .
[0039] Specifically, the fixing base 110 may be a rectangular parallelepiped structure. In other embodiments, the fixing base 110 may also be in other shapes, which can be selected according to needs and are not limited here.
[0040] In this embodiment, the wafer box 200 can be disposed on the fixing base 110 with the opening facing the first direction D1 , so that the wafer can be easily picked up from the wafer box 200 .
[0041] The extension wall 120 is located at one side of the fixing base 110 and extends from the fixing base 110 along the first direction D1 . When the wafer box 200 is disposed on the fixing base 110 , the height of the extension wall 120 is greater than the height of the wafer box 200 .
[0042] Specifically, the extension wall 120 may be a rectangular parallelepiped structure, the extension arm is vertically connected to a side of the fixed base 110 , and the connection between the extension arm and the fixed base 110 may be a fixed connection.
[0043] Please refer to Figure 2 A plurality of extension grooves 121 are provided on one side of the extension wall 120 close to the wafer box 200 . When the wafer box 200 is set on the fixed base 110 , the plurality of extension grooves 121 respectively correspond to the positions of the wafer placement grooves 210 in the wafer box 200 and form a wafer moving and picking channel 130 .
[0044] In this embodiment, a plurality of the extension grooves 121 are evenly distributed on the extension wall 120 , and the extension grooves 121 extend along the first direction D1 . One wafer corresponds to one wafer moving and picking channel 130 .
[0045] It should be noted that wafers of different sizes require wafer picking auxiliary devices of different sizes to perform wafer picking operations. For example, wafers can be divided into specifications such as 4 inches, 6 inches, 8 inches, and 12 inches according to their diameters.
[0046] In the above structure, the fixed base 110 is used to position the wafer box 200 for holding the wafers. By arranging a plurality of the extension grooves 121 on the extension wall 120, the positions of the wafer placement grooves 210 in the wafer box 200 are corresponding to form the wafer moving and picking channels 130, which facilitates the use of air tweezers to take the wafers out of the corresponding wafer picking channels, and enables the wafers to be supported and fixed at two points, thereby reducing the collision and friction between the wafers and adjacent wafers during the process of picking up the wafers, thereby reducing the wear and breakage of the wafers and improving the wafer yield.
[0047] In one possible implementation, please refer to Figure 3The extended wall 120 includes an extension area 122 and a mounting area 123. The mounting area 123 is located at a side close to the fixed base 110, and the extended area 122 is located at a side away from the fixed base 110.
[0048] A plurality of guide teeth are disposed on one side of the extension area 122 close to the wafer box 200 , and the extension groove 121 is formed between two adjacent guide teeth. The guide teeth are in contact with the mounting area 123 .
[0049] In the above structure, by setting the guide teeth on the extension area 122 to form the extension groove 121, the wafer can be moved from the wafer placement groove 210 to the extension groove 121, and a support point is added in the process of picking up the wafer, so that the wafer will not tilt forward and backward or move left and right, thereby preventing the wafer from being scratched.
[0050] In a possible implementation, the length of the extension groove 121 extending along the first direction D1 is greater than 2 / 5 of the diameter of the wafer. The length of the installation area 123 extending along the first direction D1 is equal to the length of the wafer box 200 extending along the first direction D1.
[0051] In this embodiment, when picking up a wafer from the wafer box 200, it is necessary to use air tweezers to perform an air suction operation. In the process of pulling the wafer upward, when the 3 / 5 area of the wafer is located outside the wafer placement groove 210, the wafer will tilt forward and backward and move left and right. Therefore, the length of the extension groove 121 extending along the first direction D1 needs to be greater than 2 / 5 of the wafer diameter. In this way, it can be avoided that the wafer is scratched by the adjacent wafer during the upward movement.
[0052] In a possible implementation, the thickness of the extension area 122 in the second direction D2 is greater than the thickness of the mounting area 123 in the second direction D2. With such a design, the wafer placement groove 210 in the wafer box 200 can correspond to the position of the extension groove 121 and form the wafer moving and picking channel 130, so that the wafer can move in the wafer moving and picking channel 130 without scratching the adjacent wafers.
[0053] Optionally, please refer again to Figure 1 When the size of the wafer contained in the wafer box 200 is 6 inches, the thickness of the extended area 122 in the second direction D2 is L1, preferably, L1 can be 41.4 mm, and the length of the extended area 122 extending along the first direction D1 is H1, preferably, H1 can be 75.5 mm.
[0054] It should be noted that the length H1 of the extension area 122 extending along the first direction D1 may be equal to the length of the extension groove 121 extending along the first direction D1, that is, the length H1 of the extension area 122 extending along the first direction D1 is greater than 2 / 5 of the diameter of the wafer in the wafer box 200 placed on the fixed base 110. The length H1 of the extension area 122 extending along the first direction D1 may be greater than the length of the extension groove 121 extending along the first direction D1.
[0055] The installation area 123 extends along the first direction D1 by a length H2, which may be 163.5 mm. Specifically, the installation area 123 extends along the first direction D1 by a length H2 that is the same as the height of the wafer box 200 placed on the fixing base 110 extending along the first direction D1.
[0056] In one possible implementation, please refer to Figure 4 The number of the guide teeth may be 25, and 25 extension grooves 121 may be formed. The thickness of the guide teeth is L2, and L2 may be 14.4 mm. The width of each guide tooth may be 4 mm.
[0057] In this embodiment, the guide teeth correspond to the positions of the basket teeth of the wafer box 200, and the number of the guide teeth is the same as the number of the basket teeth of the wafer box 200. With such a design, it can be ensured that the extended grooves 121 correspond to the positions of the wafer placement grooves 210 in the wafer box 200 and form a wafer moving and picking channel 130, so that the wafer can be taken out of the wafer moving and picking channel 130 without scratching the adjacent wafers.
[0058] In one possible implementation, please refer to Figure 5 The fixing base 110 is provided with two wafer box fixing grooves 111 , and the distance between the two wafer box fixing grooves 111 matches the size of the wafer box 200 .
[0059] In this embodiment, the size of the wafer box fixing groove 111 needs to match the bottom size of the wafer box 200. For example, the bottom of the wafer box 200 usually has two brackets (on the left and right sides), and the size and depth of the wafer box fixing groove 111 need to match the size of the wafer bracket. When the wafer box 200 is placed on the fixed base 110, the two brackets of the wafer box 200 are correspondingly placed in the wafer box fixing groove 111, and according to the different sizes of the wafer box 200, the size and depth of the wafer box fixing groove 111 can be adjusted accordingly to achieve the positioning and installation of the wafer box 200.
[0060] In the upper structure, the wafer box 200 is limited and fixed by setting the wafer box fixing groove 111, so that the wafer box 200 can be stably placed on the fixed base 110 to prevent the wafer box 200 from moving on the fixed base 110 during the process of picking up the wafer.
[0061] Optionally, when the size of the wafers contained in the wafer box 200 is 6 inches, the depth of the wafer box fixing groove 111 is H3, H3 may be 7 mm, and the width of the wafer box fixing groove 111 is W1, W1 may be 4.8 mm.
[0062] In one possible implementation, please refer again to Figure 4 The width of the extended wall 120 is equal to the width of the fixed base 110, and the width of the extended wall 120 and the width of the fixed base 110 are W2, W2 includes 170mm, 172mm, 173mm, 175mm, 176mm, 179mm and 180mm. Preferably, W2 can be 175mm.
[0063] The height of the wafer picking auxiliary device in the first direction D1 may be 260-270 mm. Preferably, the height of the wafer picking auxiliary device in the first direction D1 is 266 mm.
[0064] Preferably, the fixed base 110 and the extension wall 120 are integrally formed. The integrally formed fixed base 110 and the extension wall 120 have better structural strength and are more stable.
[0065] In a possible implementation, the material of the wafer picking auxiliary device can be polypropylene. Such a design is convenient to manufacture, has low production cost, and has a wide range of applications. At the same time, it can improve the safety of the production process.
[0066] It should be noted that the dimensions provided in this embodiment are only applicable to 6-inch wafers. In other implementations of this embodiment, the sizes of the wafers are different, and the sizes of the wafer box 200 are also different. The size of the wafer picking auxiliary device can be adjusted as needed, and no specific limitation is made here.
[0067] Based on the above design, the working principle of the wafer picking auxiliary device provided in this embodiment is:
[0068] The wafer box 200 is placed on the fixed base 110, the positioning flat edge of the wafer contained in the wafer box 200 is parallel to the positioning flat edge of the wafer box 200, and the wafer box 200 is slowly pushed into the wafer box fixing groove 111 to fix the wafer box 200 on the fixed base 110. At this time, the multiple extension grooves 121 on the extension wall 120 correspond to the positions of the wafer placement grooves 210 in the wafer box 200 and form a wafer moving and picking up channel 130. The wafer is sucked by air tweezers, and the side wall of the wafer contacts the wafer moving and picking up channel 130. The wafer is fixed and guided by the air tweezers and the wafer moving and picking up channel 130 at two points, and will not tilt forward and backward or move left and right, so that the wafer can be taken out without scratching the adjacent wafer.
[0069] To summarize, the present embodiment provides a wafer picking auxiliary device, which includes a fixed base and an extended wall connected to one side of the fixed base, the fixed base is used to position a wafer box for holding wafers, and a plurality of extended grooves are arranged on the extended wall, which correspond to the positions of the wafer placement grooves in the wafer box and form a wafer moving and picking channel, so that the wafer can be taken out from the corresponding wafer picking channel using air tweezers, and the wafer can be supported and fixed at two points to prevent shaking when the wafer is picked up by air tweezers, thereby avoiding scratches between wafers, reducing wear and breakage of wafers, improving the yield of wafers, and avoiding unnecessary damage.
[0070] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0071] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer picking auxiliary device, comprising: Fixed base and extended wall; The fixed base is used to position a wafer box for holding wafers, the wafer box is arranged on the fixed base with its opening facing a first direction, the fixed base extends along a second direction, and the first direction is perpendicular to the second direction; The extension wall is located at one side of the fixed base and extends from the fixed base along the first direction, and when the wafer box is arranged on the fixed base, the height of the extension wall is greater than the height of the wafer box; A plurality of extension grooves are arranged on one side of the extension wall close to the wafer box. When the wafer box is arranged on the fixed base, the plurality of extension grooves respectively correspond to the positions of the wafer placement grooves in the wafer box and form a wafer moving and picking channel.
2. The wafer picking auxiliary device according to claim 1, characterized in that: The extended wall includes an extension area and a mounting area; A plurality of guide teeth are arranged on one side of the extension area close to the wafer box, and the extension groove is formed between two adjacent guide teeth.
3. The wafer picking auxiliary device according to claim 2, characterized in that: The length of the extended groove extending along the first direction is greater than 2 / 5 of the diameter of the wafer; the length of the mounting area extending along the first direction is equal to the length of the wafer box extending along the first direction.
4. The wafer picking auxiliary device according to claim 2, characterized in that: A thickness of the extension region in the second direction is greater than a thickness of the mounting region in the second direction.
5. The wafer picking auxiliary device according to claim 2, characterized in that: The thickness of the extended area in the second direction is 41.4 mm, and the length of the extended area extending along the first direction is 75.5 mm; the length of the installation area extending along the first direction is 163.5 mm.
6. The wafer picking auxiliary device according to claim 2, characterized in that: The number of the guide teeth is 25.
7. The wafer picking auxiliary device according to claim 1, characterized in that: The fixing base is provided with two wafer box fixing grooves, and the distance between the two wafer box fixing grooves matches the size of the wafer box.
8. The wafer picking auxiliary device according to claim 7, characterized in that: The depth of the wafer box fixing groove is 7 mm, and the width of the wafer box fixing groove is 4.8 mm.
9. The wafer picking auxiliary device according to claim 1, characterized in that: The width of the extended wall is equal to the width of the fixed base, and the width of the extended wall and the width of the fixed base are 170-180 mm.
10. The wafer picking auxiliary device according to claim 1, characterized in that: The material of the wafer picking auxiliary device is polypropylene material.