Circuit board combining inlaying and etching

Abstract

The utility model relates to the technical field of circuit boards, in particular to an embedding and etching combined circuit board, which comprises a circuit board main body with a plurality of layers of circuits, a conducting hole is arranged on the circuit board main body, a copper block is embedded in the conducting hole, the copper block is used for conducting and connecting the plurality of layers of circuits of the circuit board main body, and one end of the copper block protruding out of the conducting hole is connected with a copper column. According to the utility model, a mode of embedding the copper block is used for replacing a metalized via hole and longitudinally connecting an etched pattern circuit, and by utilizing the mode of embedding the copper block, the problem that liquid medicine is not easy to fully exchange in a copper plating process of a blind via via hole can be avoided; and the copper block is also connected with the copper column, so that the heat dissipation area of the circuit board main body can be increased, and the whole circuit board has higher heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board combining inlaying and etching. Background Art

[0002] Circuit boards are important electronic components. They are the support bodies of electronic components and the carriers of electrical connections for electronic components. Circuit boards are classified into three major categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer boards. On a single-sided board, on the most basic PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Because the wires only appear on one side, this type of PCB is called a single-sided circuit board. Single-sided boards are usually simple to make and low in cost, but the disadvantage is that they cannot be applied to products that are too complex. Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and wiring. Circuit boards are classified into three major categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer boards.

[0003] At present, the circuits between multi-layer circuit boards are connected through metalized vias. However, when copper plating blind vias, it is difficult to plate copper due to poor flow of chemical solution. In addition, since multi-layer circuits are denser and generate more heat, there is a problem of insufficient heat dissipation. This project aims to develop a circuit board that combines inlay and etching to solve the problem. Utility Model Content

[0004] In view of at least one of the above technical problems, the present application provides a circuit board combining inlay and etching, which solves the problem by adopting the following technical solution.

[0005] According to one aspect of the present application, there is provided a circuit board combining inlay and etching, comprising: a circuit board body having a multi-layer circuit;

[0006] A via hole is provided on the main body of the circuit board, and a copper block is embedded in the via hole. The copper block is used to conduct the multi-layer circuits connected to the main body of the circuit board;

[0007] One end of the copper block protrudes from the conductive hole, and one end of the copper block protruding from the conductive hole is connected to a copper column.

[0008] The utility model is further configured that a threaded hole is provided in the middle of the copper column.

[0009] The utility model is further configured that the copper block is connected to the through hole by means of a conductive adhesive.

[0010] The utility model is further configured such that a concave annular pattern is provided on the inner wall of the conducting hole;

[0011] The outer wall of the copper block is surrounded by concave patterns.

[0012] The utility model is further configured that a through hole is provided in the middle of the copper block and passes through from top to bottom, and a plurality of dividing grooves are provided around the lower half of the copper block at equal intervals, so as to divide the lower half of the copper block into a plurality of parts;

[0013] The inner wall of the lower half of the copper block is an inclined surface, so that the diameter of the through hole in the lower half of the copper block gradually decreases from top to bottom.

[0014] The utility model is further configured that the inner wall of the through hole on the copper block is provided with a thread.

[0015] The utility model is further configured such that the lower half of the conducting hole is a horn structure, and the diameter thereof gradually increases from top to bottom.

[0016] The utility model is further configured that the copper block and the copper column are an integrated structure.

[0017] The utility model is further configured that an annular convex pattern is provided on the outer wall of the copper column.

[0018] The utility model is further configured that an annular concave pattern is provided on the outer wall of the copper column.

[0019] This application has the following technical effects:

[0020] The utility model can replace the metallized via holes by embedding copper blocks to vertically connect the etched graphic circuits. The use of the embedded copper blocks can avoid the problem of insufficient exchange of chemical liquid during the copper plating process of the blind via holes. The copper blocks are also connected to copper columns. The presence of the two can increase the heat dissipation area of ​​the circuit board body, thereby allowing the circuit board as a whole to have stronger heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a stereogram of the present application;

[0023] Figure 2 is another stereogram of the present application;

[0024] Figure 3 It is a three-dimensional diagram of the copper block and the copper column in the sixth embodiment of the present application;

[0025] Figure 4 It is a diagram of a copper block and a copper column in the fourth embodiment of the present application;

[0026] Figure 5It is a three-dimensional diagram of the copper block and copper column in this application.

[0027] Reference numerals:

[0028] 1. Circuit board body; 11. Through hole; 12. Annular pattern; 2. Copper block; 21. Dividing groove; 22. Inclined surface; 3. Copper column. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0030] Embodiment 1

[0031] In this embodiment of the present application, as shown in FIG. Figure 1-Figure 2 and Figure 5 As shown, a circuit board combining inlay and etching is provided, comprising: a circuit board body 1 having multi-layer circuits;

[0032] A via hole 11 is provided on the circuit board body 1, and a copper block 2 is embedded in the via hole 11. The copper block 2 is used to conduct the multi-layer circuits connected to the circuit board body 1. The copper block 2 is connected to the via hole 11 by a conductive adhesive. The conductive adhesive can fill the gap between the outer wall of the copper block 2 and the inner wall of the via hole 11, so that the copper block 2 and the via hole 11 are stably connected;

[0033] One end of the copper block 2 protrudes from the conductive hole 11, and the end of the copper block 2 protruding from the conductive hole 11 is connected to the copper pillar 3. The copper block 2 and the copper pillar 3 are an integrated structure. By inlaying the copper block 2 instead of the metallized conductive hole 11, the etched graphic circuit can be vertically connected. By using the method of inlaying the copper block 2, the problem of insufficient exchange of the chemical solution during the copper plating process of the blind hole conductive hole 11 can be avoided. The copper block 2 is also connected to the copper pillar 3. The presence of the two can increase the heat dissipation area of ​​the circuit board body 1, thereby allowing the circuit board as a whole to have stronger heat dissipation performance.

[0034] Embodiment 2

[0035] The second embodiment is a further improvement on the first embodiment. Figure 1 In the embodiment, a recessed annular pattern 12 is provided on the inner wall of the via hole 11. The annular pattern 12 can increase the surface area of ​​the inner wall of the via hole 11, thereby making the connection between the conductive adhesive and the inner wall of the via hole 11 more secure.

[0036] The outer wall of the copper block 2 is surrounded by concave patterns, which can increase the surface area of ​​the outer wall of the copper block 2, thereby making the connection between the conductive adhesive and the copper block 2 tighter. Due to the increase in the connection surface, the heat transfer efficiency can also be improved, and the heat dissipation performance can be improved.

[0037] Embodiment 3

[0038] This embodiment 3 is a further improvement on the basis of the embodiment 1. Figure 1-Figure 3 and Figure 5 A through hole is provided in the middle of the copper block 2 and passes through from top to bottom, and a plurality of dividing grooves 21 are equidistantly provided around the lower half of the copper block 2 to divide the lower half of the copper block 2 into a plurality of parts; the inner wall of the lower half of the copper block 2 is a slope 22, so that the diameter of the through hole in the lower half of the copper block 2 gradually decreases from top to bottom, and the through hole in the middle of the copper block 2 can be used to insert a nail. After the head of the nail enters the lower half of the copper block 2, the aperture gradually decreases, which will stretch the lower half of the copper block 2 to the surroundings, thereby enabling the lower half of the copper block 2 to be more tightly connected to the circuit board.

[0039] The inner wall of the through hole on the copper block 2 is provided with a thread, and this structure allows a screw to be inserted into the copper block 2.

[0040] The lower half of the via 11 is a horn structure, and its diameter gradually increases from top to bottom. This structure enables the via 11 to cooperate with the expanded lower half of the copper block 2, making the expanded lower half of the copper block 2 more firmly connected to the circuit board.

[0041] Embodiment 4

[0042] This fourth embodiment is a further improvement on the first embodiment. Figure 4 The outer wall of the copper column 3 is provided with an annular groove, which can increase the surface area of ​​the outer wall of the copper column 3, thereby improving the heat transfer efficiency and making the connection between the conductive adhesive and the copper column 3 more firmly.

[0043] Embodiment 5

[0044] The fifth embodiment is a further improvement on the first embodiment. An annular convex pattern is provided on the outer wall of the copper column 3. The structure of the annular convex pattern is similar to the annular concave pattern in the fourth embodiment. Its function is the same as that of the annular concave pattern, which is used to increase the heat dissipation area.

[0045] Embodiment 6

[0046] This embodiment 6 is a further improvement on the basis of the embodiment 1. Figure 3 As shown in , a threaded hole is provided in the middle of the copper column 3, which can not only increase the surface area of ​​the copper column 3, but also be used for later installation of the circuit board.

[0047] The above are only preferred embodiments of the present application, and do not constitute any formal limitation on the present application. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present application without departing from the scope of the technical solution of the present application, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the present application without departing from the content of the technical solution of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board combining inlay and etching, characterized in that: include: A circuit board body (1) having multi-layer circuits; The circuit board body (1) is provided with a conducting hole (11), a copper block (2) is embedded in the conducting hole (11), and the copper block (2) is used to conduct the multi-layer circuits connected to the circuit board body (1); One end of the copper block (2) protrudes from the conductive hole (11), and one end of the copper block (2) protruding from the conductive hole (11) is connected to a copper column (3).

2. A circuit board combining inlay and etching according to claim 1, characterized in that: A threaded hole is provided in the middle of the copper column (3).

3. The circuit board combined with inlay and etching according to claim 1, characterized in that: The copper block (2) and the conducting hole (11) are connected via conductive glue.

4. The circuit board combined with inlay and etching according to claim 1, characterized in that: The inner wall of the conducting hole (11) is provided with a concave annular pattern (12); The outer wall of the copper block (2) is surrounded by a concave pattern.

5. The circuit board combined with inlay and etching according to claim 1, characterized in that: A through hole is provided in the middle of the copper block (2) and passes through from top to bottom, and a plurality of dividing grooves (21) are provided around the lower half of the copper block (2) at equal intervals, so as to divide the lower half of the copper block (2) into a plurality of parts; The inner wall of the lower half of the copper block (2) is an inclined surface (22), so that the diameter of the through hole in the lower half of the copper block (2) gradually decreases from top to bottom.

6. The circuit board combined with inlay and etching according to claim 1, characterized in that: The inner wall of the through hole on the copper block (2) is provided with a thread.

7. The circuit board combined with inlay and etching according to claim 1, characterized in that: The lower half of the conducting hole (11) is a horn structure, and its diameter gradually increases from top to bottom.

8. The circuit board combined with inlay and etching according to claim 1, characterized in that: The copper block (2) and the copper column (3) are an integrated structure.

9. The circuit board combined with inlay and etching according to claim 1, characterized in that: An annular convex pattern is provided on the outer wall of the copper column (3).

10. The circuit board combined with inlay and etching according to claim 1, characterized in that: An annular groove is formed on the outer wall of the copper column (3).

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