Variable positioning pin carrier

Abstract

The utility model discloses a variable positioning pin carrier which comprises a carrier body, a plurality of through round holes are formed in the carrier body and form a round hole array, pin holes for installing positioning pins are formed in the two ends of the carrier body, and steps are arranged in the middles of the pin holes. The positioning pin comprises a bottom plate, a screw rod connected to the bottom plate, a positioning plate in threaded connection to the screw rod and an eccentric column connected to the positioning plate, the screw rod is movably arranged in the pin hole, and the positioning plate and the bottom plate are located on the upper side and the lower side of the step respectively; a pressing strip is arranged on the carrier body in a covering mode, strip-shaped holes matched with the pin holes are formed in the two ends of the pressing strip, and wedge-shaped blocks for positioning the pressing strip are arranged at the four corners of the carrier body. When the PCB substrate is positioned, different PCB substrates can be matched by adjusting the position of the positioning pin and the position of the eccentric column, the adaptability is improved, a large number of carriers do not need to be purchased, a special carrier does not need to be customized for a new product, and time and cost waste is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor carriers, in particular to a variable positioning pin carrier. Background Art

[0002] With the development of semiconductors and chips, carriers are commonly used as carriers for PCB substrates during operation and are widely used in the chip packaging industry. Their functions are: 1. When mounting components, the substrate is vacuum adsorbed on the carrier, which is beneficial for mounting and positioning. 2. When the substrate is reflowed, it is beneficial to reduce the warping of the substrate due to the different expansion coefficients of the substrate's own materials. In mass production, a large number of carriers will be used, but the positioning holes of substrates of different products are inconsistent, so a large number of carriers need to be purchased for each product, resulting in an increase in production costs. The utility model adopts a variable positioning pin carrier, which can be used for different substrates, thereby reducing production costs. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a variable positioning pin carrier to solve the problems mentioned in the above background technology.

[0004] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0005] A variable positioning pin carrier comprises a carrier body, a plurality of through circular holes are provided on the carrier body to form a circular hole array, pin holes for installing positioning pins are provided at both ends of the carrier body, and a step is provided in the middle of the pin hole; the positioning pin comprises a base plate, a screw connected to the base plate, a positioning plate threadedly connected to the screw, and an eccentric column connected to the positioning plate, the screw is movably arranged in the pin hole, and the positioning plate and the base plate are respectively located on the upper and lower sides of the step; a pressure strip is provided on the upper cover of the carrier body, strip holes matching the pin holes are provided at both ends of the pressure strip, and wedge blocks for positioning the pressure strip are provided at the four corners of the carrier body.

[0006] Preferably, the front side of the carrier body is provided with a plurality of grooves on both sides along the length direction, and a plurality of protrusions are formed on both sides of the carrier body, the bottom of the carrier body is flat, and a mounting hole is provided at the bottom of the carrier body opposite to the protrusion, a high temperature resistant magnet is installed in the mounting hole, and the material of the pressure strip is stainless steel.

[0007] In the above technical solution, after the PCB substrate is placed on the carrier body, the pressure strip is covered on the PCB substrate, the pressure strip is sucked by a high-temperature resistant magnet, and the substrate is fixed on the carrier body by the magnetic suction principle.

[0008] Preferably, the carrier body is provided with a plurality of heat conduction grooves which are crisscrossed to form a plurality of rectangular grooves, and the circular holes are arranged in the rectangular grooves and correspond to each other one by one.

[0009] In the above technical solution, when the PCB substrate and the carrier body are heated in the reflow furnace, the heat conduction groove can make the whole body heated evenly.

[0010] Preferably, the carrier body is processed from a whole piece of aluminum alloy.

[0011] The above technical solution improves the strength of the vehicle body and prolongs its service life.

[0012] Preferably, the circular hole array consists of 10 rows and 32 columns of circular holes.

[0013] When using the above technical solution, the carrier body needs to be placed under the vacuum adsorption device, vacuum is sucked by the vacuum adsorption device, and the PCB substrate is adsorbed through the circular hole for auxiliary positioning.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] When positioning the PCB substrate, by adjusting the position of the positioning pin and the position of the eccentric column, different PCB substrates can be matched to improve adaptability. There is no need to purchase a large number of carriers, and there is no need to customize special carriers for new products, which reduces the waste of time and cost.

[0016] Solve the problem of substrate damage and positioning deviation caused by temporary use of carriers that do not match the positioning holes. This carrier can be used for a variety of substrates, which can solve the problem of carrier storage and classification. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the vehicle body;

[0018] Figure 2 It is the rear view of the vehicle body;

[0019] Figure 3 is a schematic diagram of the layering strip;

[0020] Figure 4 A schematic diagram of a pin hole locating pin;

[0021] In the figure, 1-carrier body, 2-circular hole, 3-positioning pin, 301-bottom plate, 302-screw, 303-positioning plate, 304-eccentric column, 4-pin hole, 5-step, 6-pressure strip, 7-bar hole, 8-wedge block, 9-protrusion, 10-mounting hole, 11-heat conduction groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1

[0024] See also Figure 1-Figure 4 A variable positioning pin carrier comprises a carrier body 1 processed from a whole piece of aluminum alloy, the carrier body 1 is provided with a circular hole array formed by 10 rows and 32 columns of circular holes 2, pin holes 4 for installing positioning pins 3 are opened at both ends of the carrier body 1, and a step 5 is provided in the middle of the pin hole 4; the positioning pin 3 comprises a bottom plate 301, a screw 302 connected to the bottom plate, a positioning plate 303 threadedly connected to the screw, and an eccentric column 304 connected to the positioning plate, the screw 302 is movably arranged in the pin hole 4, and the positioning plate 303 and the bottom plate 301 are respectively located on the upper and lower sides of the step 5; a pressure strip 6 is provided on the upper cover of the carrier body 1, and strip holes 7 cooperating with the pin hole 4 are provided at both ends of the pressure strip 6, the positioning plate 303 and the bottom plate 301 can be embedded in the pin hole 4, and wedge blocks 8 for positioning the pressure strip are provided at the four corners of the carrier body 1.

[0025] In this embodiment, the carrier body 1 is provided with a plurality of crisscross heat conduction grooves 11, forming a plurality of rectangular grooves, and the round holes are arranged in the rectangular grooves and correspond to each other. When the PCB substrate and the carrier body 1 are heated in the reflow furnace, the heat conduction grooves 11 can make the whole body heated evenly.

[0026] In this embodiment, the front side of the carrier body 1 is provided with a plurality of grooves on both sides along the length direction, and a plurality of protrusions 9 are formed on both sides of the carrier body, the bottom of the carrier body 1 is flat, and the bottom of the carrier body 1 opposite to the protrusions 9 is provided with a mounting hole 10, and a high temperature resistant magnet is installed in the mounting hole 10. The material of the pressure strip 6 is stainless steel.

[0027] The method of using this embodiment is as follows: when in use, the carrier body 1 needs to be placed under the vacuum adsorption device, and the number and position of the positioning holes of the PCB substrate product need to be confirmed before use, and the positioning plate 303 is placed in the pin hole 4. After determining the position of the eccentric column 304, the bottom plate 301 is screwed, and the bottom plate 301 and the positioning plate 303 are tightened so that the two are pressed on the step 5. Similarly, multiple required positioning pins 3 are installed, and then the PCB substrate product is placed on the surface of the carrier body 1, and the vacuum is sucked by the vacuum adsorption device, and the PCB substrate is adsorbed through the circular hole 2 for auxiliary positioning, and the position is confirmed to be correctly aligned with the hole position, and the stainless steel carrier pressure strip 6 is placed, and the pressure strip 6 is attracted to the magnet on the back of the carrier body 1 to fix the PCB substrate on the carrier body.

[0028] At the time of production, all dimensions were as follows:

[0029] Vehicle body dimensions: long side width 240mm, short side width 90mm, height 5mm

[0030] Hole diameter: 4mm, heat conduction groove width: 1mm

[0031] Pin hole size: 3mm, length: 71.5mm

[0032] Positioning plate diameter: 2.9mm, thickness: 2mm, eccentric column height: 2mm

[0033] Base plate diameter: 2.9mm, thickness: 2mm, screw diameter: 1mm, thread height: 2.5mm

[0034] Layer size: 240*85*2mm

[0035] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A variable positioning pin carrier, characterized in that: The invention comprises a carrier body (1), a plurality of through circular holes (2) are provided on the carrier body (1) to form a circular hole array, pin holes (4) for installing positioning pins (3) are provided at both ends of the carrier body (1), and a step (5) is provided in the middle of the pin hole (4); the positioning pin (3) comprises a base plate (301), a screw rod (302) connected to the base plate, a positioning plate (303) threadedly connected to the screw rod, and an eccentric column (304) connected to the positioning plate, the screw rod (302) is movably arranged in the pin hole (4), and the positioning plate (303) and the base plate (301) are respectively located on the upper and lower sides of the step (5); a pressure strip (6) is provided on the upper cover of the carrier body (1), strip holes (7) matching with the pin holes (4) are provided at both ends of the pressure strip (6), and wedge blocks (8) for positioning the pressure strip are provided at the four corners of the carrier body (1).

2. A variable positioning pin carrier according to claim 1, characterized in that: The front side of the carrier body (1) is provided with a plurality of grooves on both sides along the length direction, and a plurality of protrusions (9) are formed on both sides of the carrier body. The bottom of the carrier body (1) is flat, and a mounting hole (10) is provided at the bottom of the carrier body (1) opposite to the protrusion (9), and a high temperature resistant magnet is installed in the mounting hole (10).

3. A variable positioning pin carrier according to claim 2, characterized in that: The material of the pressure strip (6) is stainless steel.

4. A variable positioning pin carrier according to claim 3, characterized in that: The carrier body (1) is provided with a plurality of heat conduction grooves (11) which are crisscrossed and form a plurality of rectangular grooves, and the circular holes are arranged in the rectangular grooves and correspond to each other one by one.

5. A variable positioning pin carrier according to claim 4, characterized in that: The carrier body (1) is processed from a whole piece of aluminum alloy.

6. A variable positioning pin carrier according to claim 1, characterized in that: The circular hole array consists of 10 rows and 32 columns of circular holes (2).

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