Semiconductor lead frame mold convenient to adjust in size

Abstract

The utility model provides a semiconductor lead frame mold convenient to adjust in size, and relates to the field of lead frames. The device comprises a base, a female die and a punch, a plurality of supporting rods are fixedly installed above the base, a supporting plate is fixedly installed above the supporting rods, an air cylinder is fixedly installed in the supporting plate, a collecting frame is fixedly installed above the base, the female die is fixedly installed above the collecting frame, and the punch is fixedly installed above the collecting frame. An adjusting assembly facilitating adjustment of the space size of the female die is installed in the female die and comprises two symmetrical sliding plates connected into the female die in a sliding mode, and a disassembling and assembling assembly facilitating rapid replacement of the punch is installed above the punch. According to the utility model, through the arrangement of the adjusting assembly, the problems that the processing cost is increased and the working efficiency is reduced because the existing lead frame die can only adapt to a lead frame with a specific size are solved.

Description

Technical Field

[0001] The present application relates to the technical field of lead frames, and in particular to a semiconductor lead frame mold that is easy to adjust in size. Background Art

[0002] Punching is required in the manufacturing process of the lead frame. The lead frame is a part of the semiconductor device that is used to connect the chip to the external circuit or package. In the manufacturing process of the lead frame, punching can be used to form through holes for leads or holes for other connecting parts so that they can be connected or fixed in subsequent process steps. When punching the lead frame, a lead frame mold is required.

[0003] The existing lead frame molds are generally designed to be relatively fixed and can only adapt to lead frames of specific sizes. If lead frames of different sizes need to be produced, additional molds are required, which increases processing costs and reduces work efficiency. The punches of the existing molds are not easy to replace, so they cannot adapt to lead frames of different sizes. In addition, the punches will wear out after long-term use, and burrs will appear during the subsequent processing of the lead frame, affecting the processing quality. In view of this, we propose a semiconductor lead frame mold that is easy to adjust in size. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies of the prior art, the present application provides a semiconductor lead frame mold that is easy to adjust in size, thereby solving the problems mentioned in the above background technology.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present application is implemented through the following technical solutions: a semiconductor lead frame mold that is easy to adjust the size, including a base, a die and a punch, a plurality of support rods are fixedly installed above the base, a support plate is fixedly installed above the support rods, a cylinder is fixedly installed inside the support plate, a collection frame is fixedly installed above the base, the die is fixedly installed above the collection frame, an adjustment component that is easy to adjust the size of the die space is installed inside the die, the adjustment component includes two symmetrical sliding plates slidably connected to the inside of the die, and a disassembly and assembly component that is easy to quickly replace the punch is installed above the punch.

[0008] By adopting the above technical solution, the adjustment component can adjust the space size inside the die and clamp and fix the lead frame at the same time, thereby improving its practicality. The disassembly and assembly component can quickly replace punches of different sizes or worn punches, thereby improving work efficiency.

[0009] Preferably, a sliding rod is fixedly installed on one side of the two sliding plates, one end of the two sliding rods passes through the two sides of the die respectively and is slidably connected to the die, and a first spring is fixedly installed on the surface of the two sliding rods.

[0010] By adopting the above technical solution, the sliding rods on both sides are pulled outward to drive the sliding plates on both sides to move, and the sliding rods on both sides are loosened, and the sliding rods on both sides move toward each other through the elastic force of the first spring, so that the left and right sides of the lead frame can be clamped.

[0011] Preferably, the adjusting assembly also includes a motor fixedly mounted above the sliding plate, a first bevel gear fixedly mounted on the output end of the motor, second bevel gears meshing on both side surfaces of the first bevel gear, threaded rods fixedly mounted on one end of two second bevel gears, the threaded rods are rotatably connected to the inside of the sliding plate, moving blocks are threadedly connected on the surfaces of the two threaded rods, a sliding block is fixedly mounted on one side of the moving block, and a clamping plate is fixedly mounted on one end of the sliding block.

[0012] By adopting the above technical solution, the motor drives the first bevel gear to rotate, the first bevel gear drives the second bevel gears on both sides to rotate, and then drives the two threaded rods to rotate, the two threaded rods respectively drive the two moving blocks to move toward each other, and then drive the sliding block and the clamping plate to move toward each other, so that the front and back sides of the lead frame can be clamped.

[0013] Preferably, a placement plate is fixedly mounted on the inner surfaces of the plurality of clamping plates.

[0014] By adopting the above technical solution, it is convenient to place the lead frame.

[0015] Preferably, the disassembly and assembly assembly includes a mounting plate and a mounting frame fixedly mounted on the bottom end of the cylinder, the punch is fixedly mounted below the mounting plate, both sides of the interior of the mounting frame are slidably connected with clamping rods, a connecting plate is fixedly mounted on the upper surface of the clamping rods, a second spring is fixedly mounted between the connecting plate and the mounting frame, two symmetrical mounting rods are fixedly mounted on the upper surface of the mounting plate, both of the two mounting rods are slidably connected to the mounting frame, and a clamping groove that fits with the clamping rod is opened on one side of the mounting rod.

[0016] By adopting the above technical solution, the clamping rods on both sides are pulled outward, and the second spring is squeezed, so that the clamping rods on both sides are disengaged from the clamping slots, and the mounting plate can be disassembled. The two mounting rods are inserted into the mounting frame, and when the clamping slot opened on one side of the mounting rod moves to the clamping rod, the clamping rod moves toward the clamping slot by the elastic force of the second spring, and the punch can be installed.

[0017] Preferably, two symmetrical third springs are fixedly installed inside the installation frame, a limit plate is fixedly installed on one end of the third spring, the limit plate is slidably connected to the installation frame, and the limit plate is vertically arranged to the clamping rod.

[0018] By adopting the above technical solution, the limiting plate is moved to one side to the clamping rod by the elastic force of the third spring, so as to limit the clamping rod.

[0019] Preferably, two symmetrical fixing rods are slidably connected to both sides of the mounting plate, the fixing rods are arranged through the mounting plate, fixing plates are fixedly installed at the bottom ends of the two fixing rods on the same side, and fourth springs are fixedly installed on the surfaces of the four fixing plates.

[0020] By adopting the above technical solution, the lead frame can be reinforced when punching, thereby improving the stability during punching.

[0021] Preferably, the concave mold is hollow, a material storage box is slidably connected to the interior of the collection frame, and a handle is fixedly installed on one side of the material storage box.

[0022] By adopting the above technical solution, it is convenient to uniformly process the waste generated by punching.

[0023] (III) Beneficial effects

[0024] The present application provides a semiconductor lead frame mold that is easy to adjust in size. The beneficial effects are as follows:

[0025] 1. The semiconductor lead frame mold that is easy to adjust the size can adjust the space size inside the die by adjusting the setting of the components, and at the same time clamp and fix the lead frame, which solves the problem that the existing lead frame mold is generally designed to be relatively fixed and can only adapt to lead frames of specific sizes. If lead frames of different sizes need to be produced, additional molds are required, which increases processing costs and reduces work efficiency.

[0026] 2. The semiconductor lead frame mold that is easy to adjust in size can quickly replace punches of different sizes or worn punches through the setting of disassembly and assembly components, thereby solving the problem that the punches of the existing molds are difficult to replace and thus cannot adapt to lead frames of different sizes, and the punches will be worn after long-term use, and burrs will appear in the subsequent processing of the lead frame, affecting the processing quality.

[0027] 3. The semiconductor lead frame mold that is easy to adjust in size can reinforce the lead frame when punching it through the setting of the fixing rod, the fixing plate and the fourth spring, thereby improving the stability during punching. The setting of the material storage box facilitates the unified treatment of waste generated by punching. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of this application;

[0029] Figure 2 This is a schematic diagram of the top view of the concave mold structure of the present application;

[0030] Figure 3 This is a schematic diagram of the front cross-sectional structure of the sliding plate of the present application;

[0031] Figure 4 This is a schematic diagram of the front cross-sectional structure of the disassembly and assembly components of the present application;

[0032] Figure 5 It is a front view structural schematic diagram of this application.

[0033] In the figure: 1. base; 2. die; 3. punch; 4. support rod; 5. support plate; 6. cylinder; 7. collection frame; 8. adjustment component; 801. sliding plate; 802. sliding rod; 803. first spring; 804. motor; 805. first bevel gear; 806. second bevel gear; 807. threaded rod; 808. moving block; 809. sliding block; 810. clamping plate; 811. placement plate; 9. disassembly and assembly component; 901. mounting plate; 902. mounting frame; 903. clamping rod; 904. connecting plate; 905. second spring; 906. mounting rod; 907. slot; 908. third spring; 909. limit plate; 10. fixing rod; 11. fixing plate; 12. fourth spring; 13. storage box; 14. handle. DETAILED DESCRIPTION

[0034] The present application is further described in detail below through drawings and examples.

[0035] Reference Figures 1 to 3 The embodiment of the present application provides a semiconductor lead frame mold which is easy to adjust the size, including a base 1, a die 2 and a punch 3, and is characterized in that: a plurality of support rods 4 are fixedly installed above the base 1, a support plate 5 is fixedly installed above the support rods 4, a cylinder 6 is fixedly installed inside the support plate 5, a collection frame 7 is fixedly installed above the base 1, the die 2 is fixedly installed above the collection frame 7, an adjustment component 8 for adjusting the space size of the die 2 is installed inside the die 2, the adjustment component 8 includes two symmetrical sliding plates 801 slidably connected inside the die 2, and a disassembly and assembly component 9 for quickly replacing the punch 3 is installed above the punch 3.

[0036] A sliding rod 802 is fixedly installed on one side of the two sliding plates 801. One end of the two sliding rods 802 passes through the two sides of the die 2 and is slidably connected to the die 2. A first spring 803 is fixedly installed on the surface of the two sliding rods 802.

[0037] The adjustment component 8 also includes a motor 804 fixedly mounted above the sliding plate 801, a first bevel gear 805 fixedly mounted on the output end of the motor 804, second bevel gears 806 are meshed on both side surfaces of the first bevel gear 805, threaded rods 807 are fixedly mounted on one end of the two second bevel gears 806, the threaded rods 807 are rotatably connected to the inside of the sliding plate 801, moving blocks 808 are threadedly connected on the surfaces of the two threaded rods 807, a sliding block 809 is fixedly mounted on one side of the moving block 808, and a clamping plate 810 is fixedly mounted on one end of the sliding block 809.

[0038] A placement plate 811 is fixedly mounted on the inner surfaces of the plurality of clamping plates 810 .

[0039] The first bevel gear 805 is driven to rotate by the motor 804, and the first bevel gear 805 drives the second bevel gear 806 meshed on both sides to rotate, and then drives the two threaded rods 807 to rotate, and the two threaded rods 807 respectively drive the moving blocks 808 connected by the surface threads to move toward or in the opposite direction, and then drive the sliding block 809 and the clamping plate 810 to move toward or in the opposite direction, so as to adjust the distance between the two clamping plates 810 on the same side, and by pulling the sliding rods 802 on both sides outward to drive the sliding plates 801 on both sides to move, the distance between the clamping plates 810 on both sides can be adjusted, and the space size inside the die 2 can be adjusted, so as to facilitate the processing of lead frames of different sizes, and solve the problem that the existing lead frame mold is generally designed to be relatively fixed and can only adapt to lead frames of specific sizes. If lead frames of different sizes need to be produced, additional molds are required, which increases the processing cost and reduces the work efficiency.

[0040] Reference Figure 1 and Figure 4 In one aspect of the present embodiment, the disassembly and assembly component 9 includes a mounting plate 901 and a mounting frame 902 fixedly mounted at the bottom end of the cylinder 6, the punch 3 is fixedly mounted below the mounting plate 901, and both sides of the interior of the mounting frame 902 are slidably connected with clamping rods 903, and a connecting plate 904 is fixedly mounted on the upper surface of the clamping rod 903, and a second spring 905 is fixedly mounted between the connecting plate 904 and the mounting frame 902, and two symmetrical mounting rods 906 are fixedly mounted on the upper surface of the mounting plate 901, and the two mounting rods 906 are both slidably connected to the mounting frame 902, and a clamping groove 907 that matches the clamping rod 903 is opened on one side of the mounting rod 906.

[0041] Two symmetrical third springs 908 are fixedly installed inside the installation frame 902 . A limiting plate 909 is fixedly installed at one end of the third spring 908 . The limiting plate 909 is slidably connected to the installation frame 902 . The limiting plate 909 and the clamping rod 903 are vertically arranged.

[0042] By pulling the clamping rods 903 on both sides outward, the second spring 905 is squeezed, so that the clamping rods 903 on both sides are disengaged from the clamping grooves 907, and the mounting plate 901 can be disassembled. At the same time, the limiting plate 909 moves downward to the clamping rod 903 by the elastic force of the second spring 905, and the clamping rod 903 can be limited. If it is necessary to replace the punch 3 of different sizes, it is only necessary to insert the two mounting rods 906 installed on the upper side of the mounting plate 901 adapted to the lead frame into the mounting frame 902. When the clamping groove 907 opened on one side of the mounting rod 906 moves to the clamping rod 903, the clamping rod 903 moves toward the clamping groove 907 by the elastic force of the second spring 905, and the punch 3 can be replaced. This solves the problem that the punch 3 of the existing mold is not easy to replace, so that it cannot adapt to lead frames of different sizes, and the punch 3 will cause wear after long-term use, and burrs will appear in the subsequent processing of the lead frame, affecting the processing quality.

[0043] Reference Figure 1 and Figure 5 In one aspect of the present embodiment, two symmetrical fixing rods 10 are slidably connected to both sides of the mounting plate 901, and the fixing rods 10 are arranged to penetrate the mounting plate 901. A fixing plate 11 is fixedly installed at the bottom ends of the two fixing rods 10 on the same side, and a fourth spring 12 is fixedly installed on the surface of the four fixing plates 11.

[0044] The concave mold 2 is hollow, and a material storage box 13 is slidably connected to the interior of the collecting frame 7 , and a handle 14 is fixedly installed on one side of the material storage box 13 .

[0045] The cylinder 6 drives the mounting plate 901 and the punch 3 to move downward, and the fixing plates 11 on both sides first fix the lead frame. Then the cylinder 6 continues to move downward, driving the mounting plate 901 to move downward, and the fourth spring 12 is squeezed, so that the punch 3 can punch the lead frame. Because the die 2 is hollow, the waste generated by punching will directly fall into the storage box 13. The staff can pull out the storage box 13 through the handle 14 to uniformly handle the waste.

[0046] All electrical equipment in this solution are powered by an external power supply.

[0047] Working principle: When the semiconductor lead frame mold that is easy to adjust in size is used, the sliding rods 802 on both sides should be pulled first to drive the sliding plates 801 on both sides to move in opposite directions, and then the lead frame should be placed on the placement plate 811, and the sliding rods 802 on both sides should be loosened. The sliding rods 802 on both sides move toward each other through the elastic force of the first spring 803, so that the lead frame can be clamped, and then the motors 804 on both sides are started at the same time, and the motor 804 drives the first bevel gear 805 to rotate, and the first bevel gear 805 drives the second bevel gear 806 meshed on the surfaces on both sides to rotate, and then drives the two threaded rods 807 to rotate, and the two threaded rods 807 respectively drive the moving blocks 808 threadedly connected on the surface to move toward each other, and then drive the sliding block 809 and the clamping plate 810 to move toward each other, so that the lead frame can be clamped. The two mounting rods 906 mounted on the mounting plate 901 matched with the lead frame are then inserted into the mounting frame 902. When the slot 907 opened on one side of the mounting rod 906 moves to the clamping rod 903, the clamping rod 903 moves toward the slot 907 through the elastic force of the second spring 905, and the punch 3 is installed. The cylinder 6 is started, and the cylinder 6 drives the mounting plate 901 and the punch 3 to move downward. The fixing plates 11 on both sides fix the lead frame again. Then the cylinder 6 continues to move downward, driving the mounting plate 901 to move downward. The fourth spring 12 is squeezed, so that the punch 3 can punch the lead frame. The waste generated by the punching will directly fall into the storage box 13. The staff can pull out the storage box 13 by the handle 14 to uniformly process the waste.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame mold that is easy to adjust in size, comprising a base (1), a die (2) and a punch (3), characterized in that: A plurality of support rods (4) are fixedly mounted above the base (1), a support plate (5) is fixedly mounted above the support rods (4), a cylinder (6) is fixedly mounted inside the support plate (5), a collection frame (7) is fixedly mounted above the base (1), the die (2) is fixedly mounted above the collection frame (7), an adjustment component (8) for facilitating adjustment of the spatial size of the die (2) is installed inside the die (2), the adjustment component (8) comprises two symmetrical sliding plates (801) slidably connected inside the die (2), and a disassembly and assembly component (9) for facilitating rapid replacement of the die (3) is installed above the punch (3).

2. A semiconductor lead frame mold that is easy to adjust in size according to claim 1, characterized in that: A sliding rod (802) is fixedly installed on one side of the two sliding plates (801), one end of the two sliding rods (802) respectively passes through the two sides of the die (2) and is slidably connected to the die (2), and a first spring (803) is fixedly installed on the surface of the two sliding rods (802).

3. The semiconductor lead frame mold that is easy to adjust in size according to claim 1, characterized in that: The adjustment assembly (8) further comprises a motor (804) fixedly mounted above the sliding plate (801); a first bevel gear (805) is fixedly mounted on the output end of the motor (804); second bevel gears (806) are meshed on both side surfaces of the first bevel gear (805); threaded rods (807) are fixedly mounted on one end of two second bevel gears (806); the threaded rods (807) are rotatably connected to the inside of the sliding plate (801); moving blocks (808) are threadedly connected on the surfaces of the two threaded rods (807); a sliding block (809) is fixedly mounted on one side of the moving block (808); and a clamping plate (810) is fixedly mounted on one end of the sliding block (809).

4. The semiconductor lead frame mold that is easy to adjust in size according to claim 3, characterized in that: A placement plate (811) is fixedly mounted on the inner surfaces of the plurality of clamping plates (810).

5. The semiconductor lead frame mold that is easy to adjust in size according to claim 1, characterized in that: The disassembly and assembly component (9) comprises a mounting plate (901) and a mounting frame (902) fixedly mounted at the bottom end of the cylinder (6); the punch (3) is fixedly mounted below the mounting plate (901); both sides of the interior of the mounting frame (902) are slidably connected with a clamping rod (903); a connecting plate (904) is fixedly mounted on the upper surface of the clamping rod (903); a second spring (905) is fixedly mounted between the connecting plate (904) and the mounting frame (902); two symmetrical mounting rods (906) are fixedly mounted on the upper surface of the mounting plate (901); the two mounting rods (906) are slidably connected to the mounting frame (902); and a clamping groove (907) that matches the clamping rod (903) is provided on one side of the mounting rod (906).

6. The semiconductor lead frame mold that is easy to adjust in size according to claim 5, characterized in that: Two symmetrical third springs (908) are fixedly installed inside the installation frame (902), and a limiting plate (909) is fixedly installed on one end of the third spring (908). The limiting plate (909) is slidably connected to the installation frame (902), and the limiting plate (909) is vertically arranged with the clamping rod (903).

7. The semiconductor lead frame mold that is easy to adjust in size according to claim 5, characterized in that: Two symmetrical fixing rods (10) are slidably connected to both sides of the mounting plate (901), and the fixing rods (10) are arranged to penetrate the mounting plate (901). A fixing plate (11) is fixedly installed at the bottom ends of the two fixing rods (10) on the same side, and a fourth spring (12) is fixedly installed on the surface of the four fixing plates (11).

8. The semiconductor lead frame mold that is easy to adjust in size according to claim 1, characterized in that: The concave mold (2) is hollow, and a material storage box (13) is slidably connected inside the collection frame (7), and a handle (14) is fixedly mounted on one side of the material storage box (13).

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