Temperature control laser device
By integrating infrared temperature measurement modules and feedback drive modules in the laser welding system, the welding temperature is controlled in real time, and the problems of complex and inconvenient temperature control in the existing technology are solved, and the welding quality and ease of use of the equipment are improved.
Patent Information
- Application Number
- CN202420108640.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-16
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-01-16
AI Technical Summary
The existing laser welding system cannot control the welding temperature in real time, and the operation is complicated and inconvenient for function updates and expansion, resulting in the welding temperature being too low or too high, affecting the welding quality and possibly damaging the workpiece or causing short circuits.
A temperature control laser device is designed, including a housing, circuit board assembly and a first connector, integrated infrared temperature measurement module and feedback drive module, real-time temperature control is achieved by real-time detection of welding temperature and adjusting laser intensity, and through The integrated design of multiple board bodies and double-row pins is easy to disassemble and install and expand functions.
Real-time feedback and control of laser welding temperature is realized, welding quality is improved, operation is simplified, and subsequent functions are updated and expanded, reducing the risk of workpiece damage and short circuit during welding.
Smart Images
Figure CN222243154U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of laser technology, in particular to a temperature-controlled laser device. Background Art
[0002] In the field of laser welding technology, the temperature of the joints during welding has a significant impact on the welding results. When the welding temperature is too low, the melting temperature required for welding cannot be reached, and welding cannot be performed. If the laser welding temperature is too high, on the one hand, it means that the energy density of the laser is high, which can easily cause damage to the workpiece, especially for PCB soldering, which can easily damage the substrate. On the other hand, when high-energy lasers are concentrated, it is easy to cause solder paste to splash, which can lead to a short circuit and make the product scrapped.
[0003] Current laser welding systems are generally equipped with temperature detection systems, but they generally only display the measured temperature range but cannot control the temperature. Some welding systems that can control temperature have complicated operating steps and long delays. In addition, the welding systems that can control temperature in the prior art are not convenient for subsequent function updates and expansions. Utility Model Content
[0004] The main purpose of the utility model is to provide a temperature-controlled laser device, aiming to provide a temperature-controlled laser device that can provide real-time feedback of laser welding temperature and is easy to expand and assemble.
[0005] To achieve the above purpose, the temperature-controlled laser device proposed by the utility model comprises:
[0006] The housing is provided with a receiving cavity, and a matching portion is provided on a side wall of the receiving cavity;
[0007] A circuit board assembly, comprising a plurality of boards arranged in an up-down direction and at least one double-row needle arranged in a spaced relationship corresponding to the board, wherein the board and the double-row needle are located in the accommodating cavity, and each of the double-row needles is used to electrically connect adjacent boards; and
[0008] A first connecting member is disposed in the accommodating cavity, the first connecting member comprises a plate body mounting portion and a side wall mounting portion, the plate body mounting portion is respectively connected and fixed to each of the plates, and the side wall mounting portion is used for being detachably connected to the matching portion;
[0009] The circuit board assembly is further provided with an infrared temperature measurement module and a feedback drive module. Part of the infrared temperature measurement module is arranged at one board body, and part of the feedback drive module is arranged at another board body adjacent thereto.
[0010] Optionally, the first connecting member also includes a main body extending in the up and down directions, the plate body 21 mounting portion includes a plurality of mounting grooves spaced along the main body, each of the mounting grooves and each of the plate bodies are plugged into and matched with each other, and the side wall mounting portion is arranged on a side of the main body away from the plate body mounting portion, and the side wall mounting portion and the matching portion cooperate.
[0011] Optionally, the board is provided with two, including a first board and a second board, part of the infrared temperature measurement module is provided at the first board, part of the feedback drive module is provided at the second board, and the double-row needle is used to electrically connect the first board and the second board;
[0012] The number of the mounting grooves is set to 2, which are respectively arranged at the two end sides of the main body along the up and down extension direction, and each of the mounting grooves is respectively connected and fixed to the first plate body and the second plate body.
[0013] Optionally, a mounting hole is formed at the mounting groove, and matching holes are provided at positions corresponding to the plate bodies and the mounting holes. The first connecting member further comprises a threaded connecting member, and the threaded connecting member is fixedly matched with the mounting hole and the matching hole.
[0014] Optionally, the mounting groove includes groove walls that are relatively arranged along the up-down direction, and a flexible buffer is provided on the groove wall.
[0015] Optionally, the plate mounting portion includes a mounting block, and the mounting block is vertically extended and arranged on the main body;
[0016] The matching portion includes a guide rail disposed on the side wall of the accommodating cavity along the up-down direction, and the mounting block is slidably disposed on the guide rail along the up-down direction to connect and disassemble the first connecting member.
[0017] Optionally, a limit piece is provided at the end of the guide rail.
[0018] Optionally, the infrared temperature measurement module includes an infrared temperature measurement probe.
[0019] Optionally, the feedback drive module includes a laser transmitter.
[0020] Optionally, the number of the first connecting members is set to be multiple.
[0021] In the technical solution of the utility model, the temperature-controlled laser device includes a shell, a circuit board assembly and a first connecting member, wherein the shell is provided with a accommodating cavity, a matching portion is provided at the side wall of the accommodating cavity, the circuit board assembly includes a plurality of plate bodies arranged at intervals in the up-down direction and at least one double-row needle arranged corresponding to the intervals of the plate bodies for electrical connection, the plate body and the double-row needle are located in the accommodating cavity, the first connecting member is arranged in the accommodating cavity, the first connecting member includes a plate body mounting portion and a side wall mounting portion, the plate body mounting portion is used to respectively connect and fix each of the plate bodies, and the side wall mounting portion is used to detachably connect with the matching portion, wherein the circuit board assembly is also provided with an infrared temperature measurement module and a feedback drive module, part of the infrared temperature measurement module is provided at one plate body, and part of the feedback drive module is provided at another plate body adjacent thereto. In the scheme of the present application, the infrared temperature measurement module is used to detect the temperature of the welding part during laser welding, and the feedback drive module receives the temperature of the welding part in real time and feeds back to the laser drive, thereby changing the temperature of the welding point by adjusting the intensity of the laser. The circuit board assembly is fixed and installed to the housing through the first connecting member, which is convenient for disassembly and assembly, thereby achieving high efficiency in the installation and use process of the temperature-controlled laser device. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0023] Figure 1 A three-dimensional schematic diagram of an embodiment of a temperature-controlled laser device provided by the utility model at a viewing angle;
[0024] Figure 2 A three-dimensional schematic diagram of the connection between the circuit board assembly and the first connecting member provided by the utility model;
[0025] Figure 3 for Figure 2 A three-dimensional schematic diagram of the first connecting member.
[0026] Description of Figure Numbers:
[0027] Label name Label name 100 Temperature controlled laser device 22 Double row needle 1 case 3 First connecting piece 2 Circuit Board Assembly 31 main body 21 plate body 32 Mounting slot 211 The first plate 33 Mounting holes 211a Infrared temperature measurement module 34 Flexible buffer 211b Infrared temperature probe 35 Board installation part 212 The second plate
[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0030] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0031] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0032] In the field of laser welding technology, the temperature of the joints during welding has a significant impact on the welding results. When the welding temperature is too low, the melting temperature required for welding cannot be reached, and welding cannot be performed. If the laser welding temperature is too high, on the one hand, it means that the energy density of the laser is high, which can easily cause damage to the workpiece, especially for PCB soldering, which can easily damage the substrate. On the other hand, when high-energy lasers are concentrated, it is easy to cause solder paste to splash, which can lead to a short circuit and make the product scrapped.
[0033] Current laser welding systems are generally equipped with temperature detection systems, but they generally only display the measured temperature range but cannot control the temperature. Some welding systems that can control temperature have complicated operating steps and long delays. In addition, the welding systems that can control temperature in the prior art are not convenient for subsequent function updates and expansions.
[0034] In order to solve the above problems, the utility model proposes a temperature-controlled laser device, which aims to provide a temperature-controlled laser device that can provide real-time feedback of laser welding temperature and is easy to expand and assemble. Figures 1 to 3 The present invention is a schematic structural diagram of an embodiment of the temperature-controlled laser device provided by the present invention.
[0035] Please refer to Figure 1 to Figure 2The temperature-controlled laser device 100 includes a shell 1, a circuit board assembly 2 and a first connector 3, wherein the shell 1 is provided with a receiving cavity, a matching portion is provided at the side wall of the receiving cavity, the circuit board assembly 2 includes a plurality of plates 21 arranged at intervals in the up-down direction and at least one double-row needle 22 arranged at intervals corresponding to the plate 21, the plate 21 and the double-row needle 22 are located in the receiving cavity, each of the double-row needles 22 is used to electrically connect adjacent plates 21, the first connector 3 is arranged in the receiving cavity, the first connector 3 includes a plate 21 mounting portion 35 and a side wall mounting portion, the plate mounting portion 35 is respectively connected and fixed to each plate 21, and the side wall mounting portion is used to be detachably connected to the matching portion, wherein the circuit board assembly 2 is also provided with an infrared temperature measurement module 211a and a feedback drive module, a portion of the infrared temperature measurement module 211a is arranged at one plate, and a portion of the feedback drive module is arranged at another plate 21 adjacent thereto.
[0036] It can be understood that in the technical solution of the present utility model, the temperature-controlled laser device 100 includes a shell 1, a circuit board assembly 2 and a first connecting member 3, wherein the shell 1 is provided with a accommodating cavity, the accommodating cavity is used to accommodate the above-mentioned other components, and a matching portion is also provided at the side wall of the accommodating cavity, and the circuit board assembly 2 includes a plurality of plate bodies 21 arranged at intervals in the vertical direction, and at least one double-row needle 22 electrically connected to each of the plate bodies 21 and arranged at intervals, the double-row needle 22 is used to integrate each of the plate bodies 21, and the plate body 21, the double-row needle 22 and the first connecting member 3 are all arranged in the accommodating cavity, and the first connecting member 3 includes a plate body mounting portion 35 and a side wall mounting portion, the plate body mounting portion 35 is used to respectively connect and fix each of the plate bodies 21, and the side wall mounting portion is used to and The mating part is detachable and connected. In addition, the circuit board assembly 2 is also provided with an infrared temperature measuring module 211a and a feedback driving module. Part of the infrared temperature measuring module 211a is arranged at one board body 21, and part of the feedback driving module is arranged at another board body 21 adjacent thereto. The above-mentioned board bodies 21 are integrated through the double-row needles 22. Therefore, in the scheme of the present application, the infrared temperature measuring module 211a is used to detect the temperature of the welding part during laser welding, and the feedback driving module can receive the temperature of the welding part in real time and feed it back to the laser drive, and change the temperature of the welding point by adjusting the intensity of the laser. The circuit board assembly 2 is fixed and installed to the housing 1 through the first connecting member 3, which is convenient for disassembly and assembly, thereby achieving high efficiency in the installation and use process of the temperature-controlled laser device 100.
[0037] It should be noted that, in the present application, the shell 1 is made of aluminum, which can provide a better interference shielding effect, and the shell 1 is only provided with one installation opening for quick insertion with the internal circuit board assembly 2 to reduce interference.
[0038] Furthermore, since the present application adopts a solution of connecting and integrating multiple boards 21 through double-row pins 22, on the one hand, the integrated multiple boards 21 can form a system to realize the functions of monitoring temperature and closed-loop control, and on the other hand, for subsequent upgrades and expansions of related functions, a separate board 21 can be replaced and upgraded without affecting the normal operation of another board 21, or if additional functions need to be expanded, the functional expansion can be achieved by adding a board 21 with corresponding functions and integrating and connecting it with the previous board 21. It can be understood that a shielding ring is designed at the board 21, and the shielding ring can play a role in shielding interference.
[0039] In addition, please refer to Figure 3 The first connecting member 3 also includes a main body 31 extending in the up and down directions, the plate body mounting portion 35 includes a plurality of mounting grooves 32 spaced apart along the main body 31, each of the mounting grooves 32 is plugged into and matched with each of the plate bodies 21, and the side wall mounting portion is provided on a side of the main body 31 away from the plate body mounting portion 35, and the side wall mounting portion is matched with the matching portion. It can be understood that the gap between the two side walls of the mounting groove 32 along the upper and lower directions matches the thickness of the plate body 21, and can play a role of plug-in matching. The multiple mounting grooves 32 arranged at intervals on the main body 31 are respectively matched with the plate body 21 at the corresponding positions. When the plate body 21 and the mounting grooves 32 are matched and plugged in, the plate body 21 is limited. In addition, the first connecting member 3 is also provided with a side wall mounting portion, and the side wall mounting portion and the matching portion of the side wall of the accommodating cavity are detachably installed, so that the plate body 21 can be detachably installed to the side wall of the shell 1 after the first connecting member 3 and the plate body 21 are connected, so as to realize the positioning and installation of the circuit board assembly 2. With such a configuration, disassembly and assembly are convenient, and assembly in the production process and updating and replacement in subsequent processes can be facilitated.
[0040] In the embodiment of the present application, the plate body 21 is provided with two, including a first plate body 211 and a second plate body 212, the infrared temperature measurement module 211a is provided at the first plate body 211, the feedback drive module is provided at the second plate body 212, and the double row of pins 22 is used to electrically connect the first plate body 211 and the second plate body 212; correspondingly, the number of the mounting grooves 32 is also provided with two, which are respectively provided at the two end sides of the main body 31 along the vertical extension direction, and each mounting groove 32 is respectively connected and fixed to the first plate body 211 and the second plate body 212. The first plate body 211 and the second plate body 212 are integrated by the double row of pins 22, so as to realize the infrared temperature measurement function and the feedback drive function synchronously, and the number and position of the mounting grooves 32 are provided according to the first plate body 211 and the second plate body 212, so as to fix and install the first plate body 211 and the second plate body 212.
[0041] In order to better achieve the fixation of the plate body 21 and the first mounting member, a mounting hole 33 is penetrated at the mounting groove 32, and matching holes are set at the positions corresponding to the plate body 21 and the mounting holes 33. The first connecting member 3 also includes a threaded connecting member, and the threaded connecting member, the mounting hole 33 and the matching hole are matched and fixed. In some other embodiments, other methods can also be used for fixing, such as using a buckle to clamp the plate body 21. In this embodiment, the purpose of using a threaded connecting member, the mounting hole 33 and the matching hole for matching connection is the stability of the connection, which can achieve stable fixation of the plate body 21 and the first mounting member. On the other hand, the original holes on the edge of the plate body 21 can be used as matching holes for fixing. With this arrangement, the function of the original plate body 21 will not be destroyed during installation and disassembly, thereby playing a protective effect on the plate body 21.
[0042] Similarly, in order to achieve the protection effect on the plate body 21, the installation groove 32 includes groove walls relatively arranged in the up and down directions, and a flexible buffer 34 is arranged on the groove wall. The flexible buffer 34 includes a rubber material, and there is an interference fit between the flexible buffer 34 and the plate body 21, which is used to install the plate body 21. The friction between the flexible buffer 34 and the plate body 21 is relatively large. The plate body 21 and the flexible buffer 34 are not easy to fall out after being installed together, and can achieve a good fixing effect. In addition, since the flexible buffer 34 is made of flexible material, it will not cause damage to the plate body 21 during the installation and disassembly process.
[0043] It can be understood that the mounting portion 35 of the plate body 21 includes a mounting block, which extends vertically and is arranged at the main body 31, and the matching portion includes a guide rail arranged vertically and is arranged at the side wall of the accommodating cavity, and the mounting block is slidably arranged at the guide rail along the vertical direction to connect and remove the first connecting member 3. In some other embodiments, other detachable installation methods can also be adopted. For example, the mounting portion 35 of the plate body 21 and the matching portion can be set as a magnetic buckle to achieve a magnetic detachable installation, or the mounting portion 35 of the plate body 21 is set as a snap buckle, and the matching portion is set as a buckle portion, and the snap buckle and the buckle portion are installed in coordination to achieve a snap-on detachable installation. There are many other detachable installation methods, which are not limited here. The advantage of using the mounting block and the guide rail matching method in the embodiment of the present application is that the mounting block and the guide rail are easy to disassemble and assemble, and the subsequent addition of the plate body 21 or other components has a better bearing effect of the guide rail.
[0044] Furthermore, a limiting member is provided at the end of the guide rail. In some other embodiments, a limiting member may also be provided on the mounting block. The present application does not make any limitation thereto. As long as the limiting effect can be achieved, the limiting member can fix the first connecting member 3 to a specific position of the side wall to prevent it from being displaced within the shell 1.
[0045] In addition, in order to detect the temperature of the welding point, the infrared temperature measurement module 211a includes an infrared temperature measurement probe 211b. In some other embodiments, it can also be set as a temperature sensor or other temperature detection components. In the embodiment of the present application, the infrared temperature measurement probe 211b can receive infrared light when the object is heated, and the corresponding internal program converts the optical signal into an electrical signal. The electrical signal is returned to the circuit board assembly 2 through the wire, which can achieve real-time and accurate temperature measurement. Correspondingly, the feedback drive module includes a laser transmitter. When the electrical signal returned by the infrared temperature measurement returns to the circuit board assembly 2, the feedback drive module receives the relevant electrical signal and controls the drive component to adjust the intensity of the laser emitted by the laser transmitter accordingly through a preset program.
[0046] It can be understood that the number of the first connecting members 3 is set to be multiple. In the embodiment of the present application, the number of the first connecting members 3 is set to be 2, which are installed along the edge of the plate body 21 to the four corners of the same side of the plate body 21. In the embodiment of the present application, the first connecting member 3 is set to be square, and the mounting groove 32 is also set to be square. The groove wall of the mounting groove 32 is used to abut against the two side walls of the plate body 21 along the length and width directions.
[0047] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A temperature-controlled laser device, characterized in that: include: The housing is provided with a receiving cavity, and a matching portion is provided on a side wall of the receiving cavity; A circuit board assembly, comprising a plurality of boards arranged in an up-down direction and at least one double-row needle arranged corresponding to the board, the board and the double-row needle are located in the accommodating cavity, and each double-row needle is used to electrically connect adjacent boards; and A first connecting member is disposed in the accommodating cavity, the first connecting member comprises a plate body mounting portion and a side wall mounting portion, the plate body mounting portion is respectively connected and fixed to each of the plates, and the side wall mounting portion is used for being detachably connected to the matching portion; The circuit board assembly is further provided with an infrared temperature measurement module and a feedback drive module. Part of the infrared temperature measurement module is arranged at one board body, and part of the feedback drive module is arranged at another board body adjacent thereto.
2. The temperature-controlled laser device according to claim 1, characterized in that: The first connecting member also includes a main body extending in the up and down directions, the plate body mounting portion includes a plurality of mounting grooves arranged at intervals along the main body, each of the mounting grooves and each of the plate bodies are plugged into and matched with each other, and the side wall mounting portion is arranged on a side of the main body away from the plate body mounting portion, and the side wall mounting portion and the matching portion are matched with each other.
3. The temperature-controlled laser device according to claim 2, characterized in that: The board body is provided with two, including a first board body and a second board body, the infrared temperature measurement module is partly provided at the first board body, the feedback drive module is partly provided at the second board body, and the double row of needles is used to electrically connect the first board body and the second board body; The number of the mounting grooves is set to 2, which are respectively arranged at the two end sides of the main body along the up and down extension direction, and each of the mounting grooves is respectively connected and fixed to the first plate body and the second plate body.
4. The temperature-controlled laser device according to claim 2, characterized in that: The mounting groove is provided with a mounting hole, and matching holes are provided at positions corresponding to the plate bodies and the mounting holes. The first connecting member further comprises a threaded connecting member, and the threaded connecting member is matched and fixed with the mounting hole and the matching hole.
5. The temperature-controlled laser device according to claim 2, characterized in that: The installation groove comprises groove walls which are arranged opposite to each other in the up-down direction, and a flexible buffer is arranged on the groove wall.
6. The temperature-controlled laser device according to claim 2, characterized in that: The plate body mounting portion includes a mounting block, and the mounting block is vertically extended and arranged at the main body; The matching portion includes a guide rail disposed on the side wall of the accommodating cavity along the up-down direction, and the mounting block is slidably disposed on the guide rail along the up-down direction to connect and disassemble the first connecting member.
7. The temperature-controlled laser device according to claim 6, characterized in that: A limiting piece is arranged at the end of the guide rail.
8. The temperature-controlled laser device according to claim 1, characterized in that: The infrared temperature measurement module includes an infrared temperature measurement probe.
9. The temperature-controlled laser device according to claim 1, characterized in that: The feedback driving module includes a laser transmitter.
10. The temperature-controlled laser device according to claim 1, characterized in that: The number of the first connecting members is set to be plural.