Semiconductor grinding and polishing device
By using the design of the grinding and polishing mechanism and sealing rubber strip in the semiconductor grinding and polishing device, the problem of replacing the polishing disc due to different sizes of the semiconductor material is solved, effectively clamping and fine chip processing of materials of different sizes is achieved, and the Grinding efficiency and quality avoid device failure.
Patent Information
- Application Number
- CN202421044201.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-14
AI Technical Summary
The existing semiconductor polishing and polishing devices require replacement of different polishing discs due to different semiconductor material sizes, resulting in reduced efficiency and accuracy impacts, and frequent replacement of clamps can easily lead to failure.
A semiconductor grinding and polishing device including a rubber pad, a base and a grinding and polishing workbench was designed. A grinding and polishing mechanism and a sealing rubber strip are used to form a circular clamping mechanism by grinding a clamping disc and a slider to achieve the purpose of semiconductors of different sizes. Easy clamping of the material and grinding is carried out through a suction pump and a collection bottle to handle fine debris, keeping it in a vacuum state.
Improve the efficiency and quality of semiconductor polishing, avoid faults caused by frequent replacement of clamping parts, ensure effective clamping of materials of different sizes and timely handling of fine debris, improve the stability and convenience of use of the device. .
Smart Images
Figure CN222244251U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor grinding and polishing equipment, in particular to a semiconductor grinding and polishing device. Background Art
[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. The importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones, or the core units of digital recorders are closely related to semiconductors. Grinding and polishing equipment is required in the production process of semiconductor materials.
[0003] At present, the existing semiconductor grinding and polishing devices need to replace different polishing discs to polish semiconductor materials due to the different sizes of semiconductor materials, which reduces the efficiency of semiconductor grinding and polishing and affects the accuracy of grinding and polishing. At the same time, the frequent replacement of grinding and polishing clamps can easily lead to malfunction of the grinding and polishing device.
[0004] Therefore, in view of the above problems, we propose a semiconductor grinding and polishing device. Utility Model Content
[0005] The utility model aims to overcome the shortcomings of the prior art and to provide a semiconductor grinding and polishing device which is easy to use and improves the efficiency and quality of semiconductor grinding and polishing.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor grinding and polishing device, which includes a rubber pad, a base and a grinding and polishing workbench, the rubber pad is arranged at the four corners of the bottom of the base, the grinding and polishing workbench is arranged at the upper end of the base, the front end inclined surface of the grinding and polishing workbench is respectively provided with a prompt light, a control switch, a control button and a display screen, a sealing rubber strip is arranged on the outer side of the upper end of the grinding and polishing workbench, a sealing frame is arranged on the inner side of the sealing rubber strip, a fixing plate is arranged in the middle of the upper end of the sealing frame, a first lifting column is arranged at the lower end of the other side of the fixing plate, the first lifting column is arranged at the upper end of the rear side of the grinding and polishing workbench, a grinding and polishing mechanism and a grinding and polishing liquid tank are arranged on the inner side of the upper end of the grinding and polishing workbench, and the grinding and polishing mechanism and the grinding and polishing liquid tank are distributed on the left and right.
[0007] Preferably, an exhaust valve is fixed at a corner of the rear side of the sealing frame, the exhaust valve is connected to a telescopic hose, the telescopic hose is connected to a vacuum exhaust pump, and the vacuum exhaust pump is provided on the rear side of the grinding and polishing workbench.
[0008] Preferably, the grinding and polishing workbench is an L-shaped structure fixed on the upper end of the base, and a clamping groove is provided on the upper end of the grinding and polishing workbench, and a grinding and polishing mechanism is fixed inside the clamping groove.
[0009] Preferably, the grinding and polishing mechanism includes a second lifting column arranged in the middle of the upper end of the grinding and polishing workbench, a grinding and polishing disc is connected to one side of the second lifting column, a grinding clamping disc is arranged at the lower end of the grinding and polishing disc, a grinding clamping slider is arranged at the lower end of the grinding clamping disc, a fixed block is fixed to the outer side of the grinding clamping slider, a sliding block is fixed to the lower end of the fixed block, a grinding clamping base is fixed to the lower end of the sliding block, and the grinding clamping base is arranged at the inner bottom of the grinding and polishing workbench.
[0010] Preferably, there are several grinding clamping plates and grinding clamping sliders, and the several grinding clamping plates and grinding clamping sliders are distributed in a circle. Slider holes are provided at the bottom of the grinding clamping plate and the upper end of the grinding clamping slider, and connecting columns are fixed to the slider holes. The grinding clamping plate and the grinding clamping slider are connected through the connecting columns. A sliding column is provided on the rear side of the grinding clamping slider, and the sliding column is fixedly connected to the fixed block. The lower end of the fixed block is fixedly connected to the sliding block through the sliding column. The grinding and polishing plate and the clamping groove have a hollow structure. An air suction pump is provided at the upper end of the grinding and polishing plate, and a collecting bottle is provided at the lower end of the air suction pump. The collecting bottle is provided inside the grinding and polishing workbench, and the collecting bottle is a threaded disassembly structure.
[0011] Preferably, the grinding clamping base is a circular structure, and the upper end of the grinding clamping base and the grinding clamping slider are symmetrically provided with sliding grooves, and the sliding grooves are embedded with sliding blocks.
[0012] Preferably, a liquid pump is provided at the upper end of the fixed plate, the liquid pump is connected to the grinding and polishing mechanism through a pipeline, and a liquid pump tube is connected to the lower end of the liquid pump.
[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model is provided with a grinding and polishing mechanism on the upper end of the grinding and polishing workbench, so that the grinding and polishing disc is installed through the grinding and polishing disc provided by the grinding and polishing mechanism, and the semiconductor material is clamped by the grinding clamping disc to perform semiconductor grinding and polishing. At the same time, the grinding clamping disc is used to form a circular clamping mechanism for a plurality of clamping members, which is conducive to conveniently clamping semiconductor materials of different sizes, and can effectively solve the problem of frequently replacing grinding and polishing discs of different sizes for grinding and polishing semiconductor materials, thereby improving the grinding and polishing efficiency of semiconductor materials. At the same time, through the sealing rubber strip provided on the upper end of the grinding and polishing workbench, the sealing rubber strip is sealed and embedded in the upper end sealing frame, which is conducive to placing the grinding and polishing device in a vacuum state for grinding and polishing, and the suction pump provided through the clamping groove is conducive to timely processing some fine debris produced during grinding and polishing through gas, so that it is adsorbed into the inside of the collection bottle, so that it can well avoid damage to the grinding and polishing caused by fine debris, affecting its use, and improving its efficiency and quality of semiconductor grinding and polishing. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor grinding and polishing device of the utility model;
[0015] Figure 2 This is a schematic diagram of the upper structure of a semiconductor grinding and polishing device of the utility model;
[0016] Figure 3 This is a schematic diagram of the rear structure of a semiconductor grinding and polishing device of the utility model;
[0017] Figure 4 This is a schematic diagram of the internal structure of a semiconductor grinding and polishing device of the utility model;
[0018] Figure 5 yes Figure 4 Schematic diagram of the structure of the grinding clamping plate;
[0019] Figure 6 yes Figure 5 Schematic diagram of the structure of the intermediate grinding clamping slider;
[0020] Figure 7 yes Figure 5 Schematic diagram of the structure of the medium grinding clamping base.
[0021] Explanations in the figure: 1. Rubber pad; 2. Base; 3. Grinding and polishing workbench; 4. Prompt light; 5. Control switch; 6. Control button; 7. Display screen; 8. Sealing frame; 9. Grinding and polishing mechanism; 10. Exhaust valve; 11. First lifting column; 12. Fixed plate; 13. Grinding and polishing liquid tank; 14. Sealing rubber strip; 15. Second lifting column; 16. Grinding and polishing disc; 17. Grinding clamping disc; 18. Clamping groove; 19. Telescopic hose; 20. Vacuum pump; 21. Grinding clamping slider; 22. Grinding clamping base; 23. Liquid pump; 24. Liquid pump; 25. Slider hole; 26. Sliding column; 27. Sliding groove; 28. Sliding block; 29. Fixed block; 30. Collecting bottle. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Example
[0023] like Figure 1-3 As shown, the present embodiment discloses a semiconductor grinding and polishing device, which includes a rubber pad 1, a base 2 and a grinding and polishing workbench 3, wherein the rubber pad 1 is arranged at the four corners of the bottom of the base 2, the grinding and polishing workbench 3 is arranged at the upper end of the base 2, and the front end inclined surface of the grinding and polishing workbench 3 is respectively provided with a prompt light 4, a control switch 5, a control button 6 and a display screen 7, a sealing rubber strip 14 is arranged on the outer side of the upper end of the grinding and polishing workbench 3, a sealing frame 8 is arranged on the inner side of the sealing rubber strip 14, a fixing plate 12 is arranged in the middle of the upper end of the sealing frame 8, and a first lifting column 11 is arranged at the lower end of the other side of the fixing plate 12, and the first lifting column 11 is arranged on the upper end of the rear side of the grinding and polishing workbench 3, and the inner side of the upper end of the grinding and polishing workbench 3 is provided. A grinding and polishing mechanism 9 and a grinding and polishing liquid tank 13 are provided, and the grinding and polishing mechanism 9 and the grinding and polishing liquid tank 13 are distributed on the left and right. An exhaust valve 10 is fixed at a corner on the rear side of the sealing frame 8, and the exhaust valve 10 is connected to a telescopic hose 19, and the telescopic hose 19 is connected to a vacuum exhaust pump 20. The vacuum exhaust pump 20 is provided on the rear side of the grinding and polishing workbench 3. The grinding and polishing workbench 3 is an L-shaped structure fixed on the upper end of the base 2. A clamping groove 18 is provided on the upper end of the grinding and polishing workbench 3, and the grinding and polishing mechanism 9 is fixed on the inner side of the clamping groove 18. A liquid extraction pump 23 is provided on the upper end of the fixed plate 12, and the liquid extraction pump 23 is connected to the grinding and polishing mechanism 9 through a pipeline, and the lower end of the liquid extraction pump 23 is connected to a liquid extraction pipe 24.
[0024] In this embodiment, the rubber pads 1 provided at the four corners of the lower end of the base 2 are conducive to improving the stability of the overall grinding and polishing, so that the device can stably perform the grinding and polishing operation. The base 2 provides the power and control chip required for the whole, and the prompt light 4, control switch 5, control button 6 and display screen 7 provided on the inclined surface of the grinding and polishing workbench 3 are conducive to controlling the start and stop of the grinding and polishing, work prompts, grinding and polishing speed control and speed display. At the same time, the grinding and polishing mechanism 9 provided at the upper end of the grinding and polishing workbench 3 is provided with a grinding and polishing liquid tank 13 provided at the upper end of the grinding and polishing mechanism 9 and the grinding and polishing workbench 3. The collecting bottle 30 is conducive to improving the lubrication effect of grinding and polishing through the grinding and polishing liquid tank 13, and connecting the vacuum pump through the collecting bottle 30 to absorb the fine debris generated by grinding and polishing, and a first lifting column 11 is provided at the upper end of the rear side of the grinding and polishing workbench 3, so that it is connected to the sealing frame 8 through the fixing plate 12 provided at the upper end of the first lifting column 11, which is conducive to controlling the sealing frame 8 to be covered on the grinding and polishing workbench 3 through the lifting of the first lifting column 11, and through the telescopic hose 19 and the vacuum valve 10 connected to the upper end of the vacuum vacuum pump 20, the inside of the sealing frame 8 is in a vacuum state, so as to improve the efficiency and quality of grinding and polishing. Example
[0025] like Figure 1-7As shown, the present embodiment discloses a semiconductor grinding and polishing device, which includes a rubber pad 1, a base 2 and a grinding and polishing workbench 3, wherein the rubber pad 1 is arranged at the four corners of the bottom of the base 2, the grinding and polishing workbench 3 is arranged at the upper end of the base 2, and the front end inclined surface of the grinding and polishing workbench 3 is respectively provided with a prompt light 4, a control switch 5, a control button 6 and a display screen 7, a sealing rubber strip 14 is arranged on the outer side of the upper end of the grinding and polishing workbench 3, a sealing frame 8 is arranged on the inner side of the sealing rubber strip 14, a fixing plate 12 is arranged in the middle of the upper end of the sealing frame 8, and a first lifting plate is arranged at the lower end of the other side of the fixing plate 12 The lowering column 11, the first lifting column 11 is arranged at the upper end of the rear side of the grinding and polishing workbench 3, the inner side of the upper end of the grinding and polishing workbench 3 is provided with a grinding and polishing mechanism 9 and a grinding and polishing liquid tank 13, the grinding and polishing mechanism 9 and the grinding and polishing liquid tank 13 are distributed on the left and right, the grinding and polishing mechanism 9 includes a second lifting column 15 arranged in the middle of the upper end of the grinding and polishing workbench 3, one side of the second lifting column 15 is connected to a grinding and polishing disc 16, the lower end of the grinding and polishing disc 16 is provided with a grinding clamping disc 17, the lower end of the grinding clamping disc 17 is provided with a grinding clamping slider 21, the outer side of the grinding clamping slider 21 A fixed block 29 is fixed, a sliding block 28 is fixed at the lower end of the fixed block 29, a grinding clamping base 22 is fixed at the lower end of the sliding block 28, the grinding clamping base 22 is arranged at the inner bottom of the grinding and polishing workbench 3, a plurality of grinding clamping discs 17 and grinding clamping sliders 21 are arranged, and the plurality of grinding clamping discs 17 and grinding clamping sliders 21 are distributed in a circular shape, a slider hole 25 is arranged at the bottom of the grinding clamping disc 17 and the upper end of the grinding clamping slider 21, a connecting column is fixed to the slider hole 25, the grinding clamping disc 17 and the grinding clamping slider 21 are connected through the connecting column, and the grinding clamping A sliding column 26 is arranged on the rear side of the slider 21, and the sliding column 26 is fixedly connected to the fixed block 29. The lower end of the fixed block 29 is fixedly connected to the sliding block 28 through the sliding column 26. The grinding and polishing disc 16 and the clamping groove 18 are both hollow structures. An air suction pump is arranged on the upper end of the grinding and polishing disc 16, and a collecting bottle 30 is arranged on the lower end of the air suction pump. The collecting bottle 30 is arranged inside the grinding and polishing workbench 3. The grinding clamping base 22 is a circular structure. The upper end of the grinding clamping base 22 is symmetrically provided with a sliding groove 27 on the grinding clamping slider 21, and the sliding groove 27 is embedded with a sliding block 28 for sliding arrangement.
[0026] In this embodiment, the grinding and polishing mechanism 9 is installed and arranged through the clamping groove 18 provided on the upper end of the grinding and polishing workbench 3, and the second lifting column 15 provided on the grinding and polishing mechanism 9 controls the lifting and lowering of the grinding and polishing disc 16, so that the grinding clamping disc 17 clamps the semiconductor material. At the same time, the grinding and polishing liquid tank 13 and the collecting bottle 30 provided on the grinding and polishing disc 16 are arranged on the grinding and polishing disc 16 through the pipeline to lubricate and adsorb debris. At the same time, the grinding clamping slider 21 provided on the lower end of the grinding clamping disc 17 passes through the grinding clamping base 22 provided at the lower end of the grinding clamping slider 21, and passes through a plurality of sliding grooves 27 provided on the upper end of the grinding clamping base 22. The grinding clamping slider 21 is connected through the sliding block 28 provided on the inner side of the sliding groove 27, so that the grinding clamping slider 21 drives the grinding clamping disc 17 to clamp and fix the semiconductor material, so that it can meet the clamping of semiconductor materials of different sizes, which is conducive to avoiding the failure of the grinding and polishing device due to frequent replacement of the grinding and polishing clamping parts. At the same time, the device also has the advantages of simple structure, convenient use and good practical effect.
[0027] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description. Therefore, it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model, and any figure marks in the claims should not be regarded as limiting the claims involved.
[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A semiconductor grinding and polishing device, comprising a rubber pad (1), a base (2) and a grinding and polishing workbench (3), characterized in that: The rubber pad (1) is arranged at the four corners of the bottom of the base (2); the grinding and polishing workbench (3) is arranged at the upper end of the base (2); the front end inclined surface of the grinding and polishing workbench (3) is respectively provided with a prompt light (4), a control switch (5), a control button (6) and a display screen (7); a sealing rubber strip (14) is arranged on the outer side of the upper end of the grinding and polishing workbench (3); a sealing frame (8) is arranged on the inner side of the sealing rubber strip (14); a fixing plate (12) is arranged in the middle of the upper end of the sealing frame (8); a first lifting column (11) is arranged at the lower end of the other side of the fixing plate (12); the first lifting column (11) is arranged at the upper end of the rear side of the grinding and polishing workbench (3); a grinding and polishing mechanism (9) and a grinding and polishing liquid tank (13) are arranged on the inner side of the upper end of the grinding and polishing workbench (3); the grinding and polishing mechanism (9) and the grinding and polishing liquid tank (13) are distributed on the left and right.
2. A semiconductor grinding and polishing device according to claim 1, characterized in that: An exhaust valve (10) is fixed at a corner of the rear side of the sealing frame (8), the exhaust valve (10) is connected to a telescopic hose (19), the telescopic hose (19) is connected to a vacuum exhaust pump (20), and the vacuum exhaust pump (20) is arranged on the rear side of the grinding and polishing workbench (3).
3. A semiconductor grinding and polishing device according to claim 1, characterized in that: The grinding and polishing workbench (3) is an L-shaped structure fixed to the upper end of the base (2); a clamping groove (18) is provided at the upper end of the grinding and polishing workbench (3); a grinding and polishing mechanism (9) is fixed inside the clamping groove (18).
4. A semiconductor grinding and polishing device according to claim 3, characterized in that: The grinding and polishing mechanism (9) comprises a second lifting column (15) arranged in the middle of the upper end of the grinding and polishing workbench (3); a grinding and polishing disc (16) is connected to one side of the second lifting column (15); a grinding clamping disc (17) is arranged at the lower end of the grinding and polishing disc (16); a grinding clamping slider (21) is arranged at the lower end of the grinding clamping disc (17); a fixed block (29) is fixed to the outer side of the grinding clamping slider (21); a sliding block (28) is fixed to the lower end of the fixed block (29); a grinding clamping base (22) is fixed to the lower end of the sliding block (28); and the grinding clamping base (22) is arranged at the inner bottom of the grinding and polishing workbench (3).
5. A semiconductor grinding and polishing device according to claim 4, characterized in that: A plurality of the grinding clamping discs (17) and the grinding clamping sliders (21) are provided, and the plurality of grinding clamping discs (17) and the grinding clamping sliders (21) are distributed in a circular shape. A slider hole (25) is provided at the bottom of the grinding clamping disc (17) and the upper end of the grinding clamping slider (21), and a connecting column is fixed to the slider hole (25). The grinding clamping disc (17) and the grinding clamping slider (21) are connected via the connecting column. A sliding column (26) is provided at the rear side of the grinding clamping slider (21), and the sliding column (26) is fixedly connected to a fixed block (29). The lower end of the fixed block (29) is fixedly connected to the sliding block (28) via the sliding column (26). The grinding and polishing disc (16) and the clamping groove (18) are both hollow structures in the middle. An air suction pump is provided at the upper end of the grinding and polishing disc (16), and a collecting bottle (30) is provided at the lower end of the air suction pump. The collecting bottle (30) is provided inside the grinding and polishing workbench (3).
6. A semiconductor grinding and polishing device according to claim 4, characterized in that: The grinding clamping base (22) is a circular structure, and a sliding groove (27) is provided at the upper end of the grinding clamping base (22) symmetrically with the grinding clamping slider (21), and a sliding block (28) is slidably embedded in the sliding groove (27).
7. A semiconductor grinding and polishing device according to claim 1, characterized in that: A liquid extraction pump (23) is provided at the upper end of the fixed plate (12); the liquid extraction pump (23) is provided on the grinding and polishing mechanism (9) via a pipeline connection; and a liquid extraction pipe (24) is connected to the lower end of the liquid extraction pump (23).