Ceramic carrier plate with thermal stress resistance and high thermal stability

Abstract

The utility model discloses a thermal stress resistant and high thermal stability ceramic carrier plate, which comprises a carrier plate body, a plurality of groups of liquid cooling flow channels are arranged in the carrier plate body side by side, each group of liquid cooling flow channels are distributed from top to bottom in an S shape, a plurality of groups of air cooling flow channels are arranged in the carrier plate body in a penetrating manner, each group of air cooling flow channels penetrate through the plurality of groups of liquid cooling flow channels, and each group of air cooling flow channels penetrate through the corresponding group of liquid cooling flow channels. The flow direction of the air cooling flow channel is perpendicular to the flow direction of each group of liquid cooling flow channels, an exhaust fan is arranged at an inlet of the air cooling flow channel, an inlet and an outlet of each group of liquid cooling flow channels are connected through a total circulating pipeline, a heat conducting plate is further connected between the total circulating pipelines, and a semiconductor chilling plate is connected to one end of the heat conducting plate in an attached mode. The ceramic carrier plate has the advantages that the liquid cooling flow channels and the air cooling flow channels are staggered and parallel, so that rapid dissipation of internal temperature is realized, temperature difference in the ceramic carrier plate is reduced, and internal heat is discharged as soon as possible.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic carrier plate preparation, in particular to a ceramic carrier plate with high thermal stability and resistance to thermal stress. Background Art

[0002] Alumina ceramic carrier is a carrier or carrier plate made of alumina ceramic material. Alumina ceramic has excellent high temperature resistance, wear resistance and corrosion resistance, so it is often used as a carrier or carrier plate material in high temperature processes.

[0003] Alumina ceramic carriers are usually made of high-purity alumina ceramic powder through molding, sintering and other processes. Its main features include:

[0004] 1. Excellent high temperature resistance: Alumina ceramic carrier can be used for a long time in high temperature environment and can withstand temperatures up to 1500℃.

[0005] 2. Good wear resistance: Since alumina ceramics have good hardness and wear resistance, alumina ceramic carriers can be used in high friction environments to reduce wear and debris generation.

[0006] 3. Strong corrosion resistance: Alumina ceramics have good corrosion resistance to acids, alkalis and other chemical substances, and can be used stably in acid and alkali corrosion environments.

[0007] 4. High dimensional accuracy: The manufacturing process of alumina ceramic carrier is mature, and the size can be customized according to customer requirements. It has high precision and can meet the requirements of different equipment.

[0008] Alumina ceramic carriers are widely used in electronics, optoelectronics, semiconductors, ceramics, chemicals and other fields, such as high temperature sintering, electronic component manufacturing, thin film coating and other processes. It plays an important role in these fields, ensuring process stability and product quality consistency.

[0009] The existing ceramic carrier plate has temperature differences inside itself, which causes deformation, cracks, breakage and other damage to the ceramic carrier plate. Utility Model Content

[0010] The utility model aims to provide a ceramic carrier plate with high thermal stability and resistance to thermal stress, which can effectively realize rapid derivation of the internal temperature of the carrier plate and realize internal temperature balance at the same time.

[0011] The above technical objectives of the utility model are achieved through the following technical solutions:

[0012] A ceramic carrier with resistance to thermal stress and high thermal stability, characterized in that it includes a carrier body, wherein a plurality of groups of liquid cooling channels are arranged in parallel inside the carrier body, and each group of the liquid cooling channels is distributed in an S shape from top to bottom. A plurality of groups of air cooling channels are also penetrated inside the carrier body, and each group of the air cooling channels penetrates a plurality of groups of liquid cooling channels. The flow direction of the air cooling channels is perpendicular to the flow direction of each group of liquid cooling channels. An exhaust fan is arranged at the inlet of the air cooling channels, and the inlet and outlet of each group of the liquid cooling channels are connected by a total circulation pipeline. A heat conduction plate is also connected between the total circulation pipelines, and a semiconductor refrigeration plate is bonded and connected to one end of the heat conduction plate.

[0013] Preferably, a plurality of bending structures are provided on any horizontal flow channel of each group of S-shaped liquid-cooling flow channels, and four groups of bending flow channels are provided on the bending structures, namely, the first bending flow channel, the second bending flow channel, the third bending flow channel and the fourth bending flow channel; one side of the first bending flow channel is connected to the second bending flow channel, the other side of the second bending flow channel is connected to the third bending flow channel, the other side of the third bending flow channel is connected to the fourth bending flow channel, and the other side of the fourth bending flow channel is connected to the first bending flow channel of the adjacent bending structure.

[0014] Preferably, the third bending channel has the same included angle with the fourth bending channel and the second bending channel, respectively, and the first bending channel and the third bending channel are arranged horizontally.

[0015] Preferably, the air-cooling flow channel is arranged between the second bending flow channel, the third bending flow channel and the fourth bending flow channel adjacent to each other in the upper and lower directions.

[0016] Preferably, the cross-section of the air-cooling channel is arc-shaped.

[0017] Preferably, the air outlet of the air-cooling channel and the air inlet of the exhaust fan are both provided with filters.

[0018] Preferably, several guide islands are evenly spaced at the inlet and outlet of the air-cooling flow channel in the same plane, and the guide islands are capsule-shaped. Several rows of diverter islands are arranged in parallel between the guide islands and the inlet and outlet of the air-cooling flow channel, and the diverter islands are cube-shaped. The diverter islands are staggered with the guide islands.

[0019] Preferably, the inlet and the outlet of the liquid cooling channel are respectively arranged at opposite corners of the carrier body.

[0020] Preferably, the carrier body is provided with a plurality of stress grooves on a side close to the outlet of the liquid cooling channel, and the depth of the stress grooves close to the inlet of the liquid cooling channel is smaller than the stress grooves close to the outlet of the liquid cooling channel.

[0021] In summary, the beneficial effects of the present invention are as follows: the present invention realizes rapid dissipation of internal temperature by staggering and paralleling liquid cooling channels and air cooling channels, reduces temperature differences inside the ceramic carrier, and discharges internal heat as quickly as possible, thereby achieving resistance to thermal stress and high thermal stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the front internal structure of the utility model;

[0023] Figure 2 yes Figure 1 The structural diagram at A in the middle;

[0024] Figure 3 It is a side internal structure schematic diagram of the utility model. DETAILED DESCRIPTION

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The specific implementation manner of the present utility model is further described below in conjunction with the accompanying drawings. This embodiment does not constitute a limitation to the present utility model.

[0028] like Figures 1 to 3A ceramic carrier with resistance to thermal stress and high thermal stability is shown, including a carrier body 1, wherein a plurality of groups of liquid cooling channels 2 are arranged in parallel inside the carrier body 1, and each group of liquid cooling channels 2 is distributed in an S shape from top to bottom. A plurality of groups of air cooling channels 3 are also penetrated inside the carrier body 1, and each group of air cooling channels 3 penetrates a plurality of groups of liquid cooling channels 2, and the flow direction of the air cooling channels 3 is perpendicular to the flow direction of each group of liquid cooling channels 2. An exhaust fan 4 is arranged at the inlet of the air cooling channels 3, and the inlet and outlet of each group of liquid cooling channels 2 are connected by a total circulation pipe 5, and a heat conducting plate 6 is also connected between the total circulation pipes 5, and a semiconductor refrigeration sheet 7 is bonded and connected to one end of the heat conducting plate 6.

[0029] A plurality of bending structures are arranged on any horizontal flow channel of each group of S-shaped liquid-cooling flow channels 2, and four groups of bending flow channels are arranged on the bending structures, namely the first bending flow channel 8, the second bending flow channel 9, the third bending flow channel 10 and the fourth bending flow channel 11. One side of the first bending flow channel 8 is connected to the second bending flow channel 9, the other side of the second bending flow channel 9 is connected to the third bending flow channel 10, the other side of the third bending flow channel 10 is connected to the fourth bending flow channel 11, and the other side of the fourth bending flow channel 11 is connected to the first bending flow channel 8 of the adjacent bending structure.

[0030] The third bending channel 10 has the same included angle with the fourth bending channel 11 and the second bending channel 9, respectively. The first bending channel 8 and the third bending channel 10 are arranged horizontally.

[0031] The air-cooling channel 3 is disposed between the upper and lower adjacent second bending channel 9 , the third bending channel 10 and the fourth bending channel 11 , and the cross section of the air-cooling channel 3 is an arc shape.

[0032] The air outlet of the air-cooling channel 3 and the air inlet of the exhaust fan 4 are both provided with a filter screen 12 to filter the impurities in the incoming air and prevent the impurities from entering from the air outlet.

[0033] Several guide islands 13 are evenly spaced at the inlet and outlet of the air-cooling flow channel 3 in the same plane. The guide islands 13 are capsule-shaped. Several rows of diverter islands 14 are arranged in parallel between the guide islands 13 and the inlet and outlet of the air-cooling flow channel 3. The diverter islands 14 are cube-shaped. The diverter islands 14 and the guide islands 13 are staggered to balance the intake pressure and make the air intake more balanced.

[0034] The inlet and the outlet of the liquid cooling channel 2 are respectively arranged at opposite corners of the carrier body 1 , thereby realizing the circulation of the liquid cooling channel 2 .

[0035] The carrier body 1 is provided with a plurality of stress grooves 15 near the outlet of the liquid cooling channel 2 . The depth of the stress grooves 15 near the inlet of the liquid cooling channel 2 is smaller than that of the stress grooves 15 near the outlet of the liquid cooling channel 2 .

[0036] The utility model realizes rapid dissipation of internal temperature by staggered and parallel liquid cooling channels and air cooling channels, reduces temperature differences inside the ceramic carrier plate, and discharges internal heat as quickly as possible, thereby achieving thermal stress resistance and high thermal stability.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions should also be deemed to fall within the protection scope of the technical solution of the present invention.

Claims

1. A ceramic carrier plate with high thermal stability and resistance to thermal stress, characterized in that: It includes a carrier body, wherein a plurality of groups of liquid cooling channels are arranged in parallel inside the carrier body, and each group of the liquid cooling channels is distributed in an S shape from top to bottom. A plurality of groups of air cooling channels are also penetrated inside the carrier body, and each group of the air cooling channels penetrates a plurality of groups of liquid cooling channels. The flow direction of the air cooling channels is perpendicular to the flow direction of each group of liquid cooling channels. An exhaust fan is arranged at the inlet of the air cooling channels, and the inlet and outlet of each group of the liquid cooling channels are connected through a total circulation pipeline. A heat conduction plate is also connected between the total circulation pipelines, and a semiconductor refrigeration sheet is bonded and connected to one end of the heat conduction plate.

2. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 1, characterized in that: A plurality of bending structures are arranged on any horizontal flow channel of each group of S-shaped liquid-cooling flow channels, and four groups of bending flow channels are arranged on the bending structures, namely, the first bending flow channel, the second bending flow channel, the third bending flow channel and the fourth bending flow channel; one side of the first bending flow channel is connected to the second bending flow channel, the other side of the second bending flow channel is connected to the third bending flow channel, the other side of the third bending flow channel is connected to the fourth bending flow channel, and the other side of the fourth bending flow channel is connected to the first bending flow channel of the adjacent bending structure.

3. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 2, characterized in that: The third bending channel has the same included angle as the fourth bending channel and the second bending channel, and the first bending channel and the third bending channel are arranged horizontally.

4. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 3, characterized in that: The air-cooling flow channel is arranged between the second bending flow channel, the third bending flow channel and the fourth bending flow channel adjacent to each other in the upper and lower directions.

5. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 1, characterized in that: The cross section of the air cooling channel is arc-shaped.

6. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 1, characterized in that: The air outlet of the air cooling channel and the air inlet of the exhaust fan are both provided with filter screens.

7. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 1, characterized in that: Several guide islands are evenly spaced at the inlet and outlet of the air-cooling flow channel in the same plane. The guide islands are capsule-shaped. Several rows of diverter islands are arranged in parallel between the guide islands and the inlet and outlet of the air-cooling flow channel. The diverter islands are cube-shaped and are staggered with the guide islands.

8. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 6, characterized in that: The inlet and the outlet of the liquid cooling channel are respectively arranged at opposite corners of the carrier body.

9. The ceramic carrier with high thermal stability and resistance to thermal stress according to claim 1, characterized in that: The carrier body is provided with a plurality of stress grooves on the side close to the outlet of the liquid cooling channel, and the depth of the stress grooves close to the inlet of the liquid cooling channel is smaller than that of the stress grooves close to the outlet of the liquid cooling channel.

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