Material moving hand assembly of high-density integrated circuit lead frame electroplating production line

Abstract

The utility model relates to the technical field of feeding and discharging of lead frames, in particular to a material moving hand assembly of a high-density integrated circuit lead frame electroplating production line, which comprises a material holding module and a moving module for driving the material holding module to move transversely and longitudinally, each group of material clamping mechanism comprises a material clamping sliding plate slidably mounted on the material clamping base, material clamping fingers fixed on the material clamping sliding plate, and a material clamping cylinder used for driving the material clamping sliding plate to move, so as to drive the two groups of material clamping fingers to be close to or far away from the lead taking and placing frame; the material holding base is further provided with a position adjusting mechanism for adjusting the initial positions of the material clamping air cylinder and the material holding sliding plate. According to the grabbed lead frames of different specifications and sizes, the position adjusting mechanism is operated firstly to adjust the initial position of the clamping air cylinder, the initial distance between the clamping fingers of the two sets of clamping mechanisms is made to be matched with the width of the lead frames, taking and placing of the lead frames of the corresponding sizes and specifications can be met, and the taking and placing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frame loading and unloading, in particular to a material moving hand assembly of a high-density integrated circuit lead frame electroplating production line. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect to external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] Continuous electroplating is mainly suitable for some continuous strip coils or wires, such as the above-mentioned integrated circuit lead frame. Continuous plating requires pretreatment and electroplating process. The pretreatment process is degreasing, activation, water washing, etc. The electroplating process is divided into copper plating, nickel plating, gold plating, tin plating, etc. The post-treatment is generally sealing, dyeing and other processes.

[0004] During the electroplating process, the lead frame needs to be loaded and unloaded. The Chinese invention patent number CN201811397007.6 discloses a device and method for moving and transferring the lead frame. The device and method are used to automatically move and transfer the lead frame for preheating. The transmission module controls the movement of the lever, and the lever drives the lever to move the arranged lead frame from the loading platform to the preheating platform, thereby realizing the movement and preheating of the lead frame.

[0005] For example, the gripping type rotating loading mechanism disclosed in the Chinese patent document with publication number CN219566761U previously developed by the applicant includes a transfer module and a clamping mechanism, the transfer module includes a reciprocating drive seat, and a rotatable rotating drive member is installed at the bottom of the drive seat; the clamping mechanism includes a pair of clamping grippers that move toward and away from each other, the clamping grippers include a gripper drive plate arranged along the length direction of the gripper base plate, the gripper drive plate is equipped with more than one longitudinally arranged gripper drive strip, and the gripper drive strip is equipped with gripping fingers that lift and support the bottom plate edge of the lead frame; the lead frame to be clamped can first be attached to the bottom of the gripper base plate, and can cooperate with lead frames of different widths and sizes, thereby improving the clamping stability and being applicable to lead frames of various sizes; then, driven by the transfer module and the rotating drive member, the clamping mechanism can rotate 180°, and then can be transferred horizontally to one of the places for unloading or loading.

[0006] For example, the reciprocating transfer mechanism of the high-density integrated circuit lead frame device disclosed in the Chinese patent document with publication number CN219216699U previously developed by the applicant includes a driving seat for clamping the lead frame and a driving shaft that cooperates with the driving seat for transmission, the driving shaft is connected to a transmission member, and the driving shaft is formed with an external thread groove along the length direction, wherein the pitch of the middle part of the external thread groove of the driving shaft is greater than the pitch of the two end parts of the external thread groove, and the driving seat is equipped with a sliding block that slides in the external thread groove of the driving shaft; after clamping the lead frame, the transmission member drives the driving shaft to rotate, and the sliding block on the driving seat slides with the external thread groove on the driving shaft to make the driving seat reciprocate. When moving, the sliding seat moves slowly at both ends and moves faster in the middle part. The speed can change during linear transfer, thereby improving the transfer speed while ensuring safe transportation, thereby improving the transfer efficiency.

[0007] In the prior art, the clamping fingers of the lead frame are complex to adjust for lead frames of different sizes, which reduces the efficiency of taking and placing materials. Summary of the invention

[0008] In view of the above technical problems existing in the prior art, the utility model provides a material transfer hand assembly for a high-density integrated circuit lead frame electroplating production line.

[0009] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0010] A material transfer hand assembly for a high-density integrated circuit lead frame electroplating production line is provided, comprising a material holding module and a moving module for driving the material holding module to move horizontally and vertically, wherein the material holding module comprises a material holding base and two sets of clamping mechanisms, each set of clamping mechanisms comprises a material holding slide plate slidably mounted on the material holding base, clamping fingers fixed to the material holding slide plate and a clamping cylinder for driving the material holding slide plate to move, so as to drive the two sets of clamping fingers to move closer to or away from each other to pick up and place the lead frame; the material holding base is also provided with a positioning mechanism for adjusting the clamping cylinder and the initial position of the material holding slide plate.

[0011] As a further optional solution, the material holding base is provided with a material holding slide rail, and the material holding slide plates of the two sets of clamping mechanisms are respectively provided with a material holding slide seat adapted to the material holding slide rail.

[0012] As a further optional solution, a support arm and a support are provided on the top of the material holding base, the support can slide relative to the support arm, the cylinder barrel of the clamping cylinder is fixed to the support, and the piston rod of the clamping cylinder is fixedly connected to the material holding slide.

[0013] As a further optional solution, the positioning mechanism includes a positioning screw, which is rotatably mounted on the support arm, and the support arm and the support are threadedly connected.

[0014] As a further optional scheme, the two groups of clamping mechanisms are respectively the first clamping group and the second clamping group. The support of the first clamping group is fixed to the support arm, and the support of the first clamping group is fixed with a clamping slide rod. The support of the second clamping group is slidably connected to the clamping slide rod, and the clamping slide rod is arranged parallel to the adjusting screw.

[0015] As a further optional solution, the material holding slide of each group of clamping mechanisms may correspond to a plurality of material clamping fingers, and the plurality of material clamping fingers may be spaced apart along the length direction of the material holding slide.

[0016] As a further optional solution, the clamping side of the clamping finger is an inclined surface, and the inclined surface is provided with a clamping tooth groove.

[0017] As a further optional solution, the material holding slide plate is provided with a vacuum material suction tube.

[0018] Beneficial effects of the utility model:

[0019] The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line of the utility model is provided with a positioning mechanism for adjusting the initial position of the material clamping cylinder and the material holding slide plate. According to the lead frames to be grasped of different specifications and sizes, the positioning mechanism is first operated to adjust the initial position of the material clamping cylinder, so that the initial distance between the material clamping fingers of the two groups of material clamping mechanisms is adapted to the width of the lead frame, which can meet the requirements of taking and placing the lead frames of corresponding specifications and sizes, thereby improving the efficiency of taking and placing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the material transfer arm assembly of the high-density integrated circuit lead frame electroplating production line in the embodiment.

[0021] Figure 2 Schematic diagram of the structure of the material holding module in the embodiment.

[0022] Figure 3 It is an exploded view of the material holding module in the embodiment.

[0023] Figure 4 Schematic diagram of the structure of the clamping fingers in the embodiment.

[0024] Reference numerals:

[0025] The material holding module 50, the material holding base 51, the material clamping mechanism 52, the material holding slide plate 53, the material clamping finger 54, the material clamping tooth groove 541, the material clamping cylinder 55, the material holding slide rail 56, the material holding slide seat 57, the support arm 58, the support 59, the first material clamping group 510, the second material clamping group 511, the material clamping slide bar 512, and the vacuum suction pipe 513;

[0026] Moving module 514 and adjusting screw rod 515 . DETAILED DESCRIPTION

[0027] The present invention is described in detail below in conjunction with specific embodiments and drawings.

[0028] The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line of this embodiment is as follows: Figures 1 to 4 As shown, it includes a material holding module 50 and a moving module 514, and the moving module 514 is used to drive the material holding module 50 to move horizontally and vertically. For details, please refer to the mechanism disclosed in the Chinese patent document with publication number CN219566761U or the Chinese patent document with publication number CN219216699U, or use the gantry mechanical arm of the existing technology, which will not be elaborated here. The main improvements of this embodiment are:

[0029] The material holding module 50 includes a material holding base 51 and two groups of clamping mechanisms 52. Each group of clamping mechanisms 52 includes a material holding slide 53 slidably mounted on the material holding base 51, a material clamping finger 54 fixed to the material holding slide 53, and a material clamping cylinder 55 for driving the material holding slide 53 to move, so as to drive the two groups of clamping fingers 54 to move closer or farther to pick up and place the lead frame. The material holding base 51 is provided with two parallel material holding slide rails 56, and the material holding slide rails 53 of the two groups of clamping mechanisms 52 are respectively provided with material holding slide seats 57 adapted to the material holding slide rails 56 to achieve directional sliding.

[0030] In this embodiment, a support arm 58 is provided at the top of the material holding base 51. The support arm 58 is L-shaped, with a short side fixed to the top of the material holding base 51 and a long side arranged parallel to the plane of the support 59. Each group of clamping mechanisms 52 corresponds to a support 59, the cylinder of the clamping cylinder 55 is fixed to the support 59, and the piston rod of the clamping cylinder 55 is fixedly connected to the material holding slide plate 53. The two groups of clamping mechanisms 52 are respectively a first clamping group 510 and a second clamping group 511. The support 59 of the first clamping group 510 is fixed to the support arm 58, and a clamping slide bar 512 is fixed to the support 59 of the first clamping group 510. The support 59 of the second clamping group 511 is slidably connected to the clamping slide bar 512, and the clamping slide bar 512 is arranged in parallel with the adjustment screw. It can be seen from this that the support 59 of the first clamping group 510 and the cylinder barrel of the clamping cylinder 55 are stationary relative to the support arm 58, while the support 59 and the clamping cylinder 55 of the second clamping group 511 can move relative to the support arm 58. By adjusting the position of the support 59 of the second clamping group 511, the distance between the clamping fingers 54 of the first clamping group 510 and the clamping fingers 54 of the second clamping group 511 can be changed, thereby adapting to the requirements of taking and placing lead frames of different widths and improving the efficiency of taking and placing.

[0031] Specifically, the support 59 of the second clamping group 511 is adjusted as follows: the material holding base 51 is also provided with an adjustment mechanism for adjusting the initial position of the clamping cylinder 55 and the material holding slide plate 53, and the adjustment mechanism includes an adjustment screw 515, which is rotatably mounted on the support arm 58, and the support arm 58 is threadedly connected to the support 59. The position of the support 59 of the second clamping group 511 can be adjusted by manually rotating the adjustment screw 515, and the adjustment method is simple and convenient.

[0032] It should be noted that in this example, only the support 59 of one clamping group is movable. In practice, the support 59 of the first clamping group 510 can be threadedly connected to the support arm 58, so that the supports 59 of the two clamping groups can be adjusted in reverse at the same time.

[0033] In this embodiment, the number of clamping fingers 54 corresponding to the holding slide plate 53 of each group of clamping mechanisms 52 is multiple, and the multiple clamping fingers 54 are spaced apart along the length direction of the holding slide plate 53. The clamping side of the clamping finger 54 is an inclined surface, and the inclined surface is provided with a clamping tooth groove 541, so as to more stably clamp the side of the lead frame.

[0034] In this embodiment, the material holding slide plate 53 is provided with a plurality of vacuum suction tubes 513 along its length direction. According to the type of the lead frame, a vacuum suction method or a clamping method with the clamping fingers 54 can be selected.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt the conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A material transfer hand assembly for a high-density integrated circuit lead frame electroplating production line, comprising a material holding module and a moving module for driving the material holding module to move horizontally and vertically, and is characterized by: The material holding module includes a material holding base and two groups of clamping mechanisms. Each group of clamping mechanisms includes a material holding slide slidably mounted on the material holding base, clamping fingers fixed to the material holding slide and a clamping cylinder for driving the material holding slide to move, so as to drive the two groups of clamping fingers to move closer or farther away to pick up and place the lead frame; the material holding base is also provided with a positioning mechanism for adjusting the clamping cylinder and the initial position of the material holding slide.

2. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized by: Holding material The base is provided with a material holding slide rail, and the material holding slide plates of the two groups of clamping mechanisms are respectively provided with a material holding slide seat matched with the material holding slide rail.

3. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized by: A support arm and a support are arranged on the top of the material holding base. The support can slide relative to the support arm. The cylinder barrel of the clamping cylinder is fixed to the support. The piston rod of the clamping cylinder is fixedly connected to the material holding slide plate.

4. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 3 is characterized by: The positioning mechanism comprises a positioning screw rod, which is rotatably mounted on the support arm, and the support arm is threadedly connected to the support seat.

5. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 4 is characterized by: The two groups of clamping mechanisms are respectively the first clamping group and the second clamping group. The support of the first clamping group is fixed to the support arm. The support of the first clamping group is fixed with a clamping slide rod. The support of the second clamping group is slidably connected to the clamping slide rod. The clamping slide rod is arranged in parallel with the adjusting screw rod.

6. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized by: The number of clamping fingers corresponding to the material holding slide plate of each group of clamping mechanisms is multiple, and the multiple clamping fingers are distributed at intervals along the length direction of the material holding slide plate.

7. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized by: The clamping side of the clamping finger is an inclined surface, and the inclined surface is provided with a clamping tooth groove.

8. The material transfer hand assembly of the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized by: The material holding slide plate is provided with a vacuum material suction pipe.

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