Touch module and electronic equipment

Abstract

The utility model relates to the field of touch control, and discloses a touch control module and electronic equipment, and the touch control module comprises a substrate, a touch control conducting layer, pins, a first conducting layer, an insulating medium layer and a second conducting layer; the touch conducting layer is arranged on the upper surface of the substrate; the first conductive layer is arranged on the upper surface of the substrate and is distributed along the edge of the substrate; the pins are arranged on the upper surface of the first conductive layer; the insulating dielectric layer is arranged on the upper surfaces of the touch conducting layer and the first conducting layer and incompletely covers the pins; the second conductive layer is arranged on the upper surface of the insulating dielectric layer and is correspondingly positioned above the first conductive layer; the first conductive layer and the second conductive layer are electrically connected with the pins. The first conductive layer and the second conductive layer are arranged on the substrate, so that the antistatic release capability can be improved; the two conductive layers are located on the same side of the substrate and are both connected to the pins, so that electric connection is achieved, through holes do not need to be formed in the substrate, the method is very simple, and the manufacturing cost can be reduced.

Description

Technical Field

[0001] The present application relates to the field of touch control, and in particular to a touch control module and an electronic device. Background Art

[0002] The touch film group usually includes a capacitor film, a touch conductive layer, etc. A circle of anti-electrostatic discharge (ESD) shielding wire is distributed on the outermost edge of the capacitor film base or the opening to protect the circuit inside. When static electricity is released, the static electricity is absorbed by the shielding wire, but because the shielding wire is a single-layer structure, when the external static electricity release exceeds a certain range, the shielding wire cannot bear the load and burns out.

[0003] There are currently two ways to improve the anti-static release capability of capacitor diaphragms. One way is to thicken the shielding wire, but since thickening will take up a certain amount of space, not all products can meet the space requirements, and the scope of application is limited; the other way is to set shielding wires on the two surfaces of the substrate respectively, and the two layers of shielding wires are electrically connected through vias. However, the via manufacturing process is complicated, making the manufacturing cost relatively high.

[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Utility Model Content

[0005] The purpose of this application is to provide a touch module and an electronic device to improve the anti-static release capability while simplifying the manufacturing process.

[0006] In order to solve the above technical problems, the present application provides a touch module, including: a substrate, a touch conductive layer, a pin, a first conductive layer, an insulating medium layer, and a second conductive layer;

[0007] The touch conductive layer is disposed on the upper surface of the substrate;

[0008] The first conductive layer is disposed on the upper surface of the substrate and distributed along the edge of the substrate;

[0009] The pins are arranged on the upper surface of the first conductive layer;

[0010] The insulating medium layer is disposed on the upper surfaces of the touch conductive layer and the first conductive layer, and does not completely cover the pins;

[0011] The second conductive layer is disposed on the upper surface of the insulating dielectric layer and is correspondingly located above the first conductive layer; the first conductive layer and the second conductive layer are both electrically connected to the pin.

[0012] Optionally, also include:

[0013] A protective layer is disposed on the upper surface of the second conductive layer.

[0014] Optionally, the protective layer includes a laminating protective layer and an adhesive protective layer;

[0015] The coating protection layer covers the upper surface of the second conductive layer;

[0016] The adhesive protection layer is arranged on the upper surface of the coating protection layer and is connected to the coating protection layer through a first adhesive layer.

[0017] Optionally, it also includes: a second adhesive layer and a protective paper; the second adhesive layer is arranged on the upper surface of the protective layer; the protective paper is arranged on the upper surface of the second adhesive layer.

[0018] Optionally, when the substrate also includes a through hole, the first conductive layer is also distributed along the edge of the through hole, and the first conductive layer distributed along the edge of the substrate is connected to the first conductive layer distributed along the edge of the through hole through a first connecting portion; the second conductive layer distributed at the edge corresponding to the substrate is connected to the second conductive layer distributed at the edge corresponding to the through hole through a second connecting portion.

[0019] Optionally, the touch conductive layer is a transparent touch conductive layer.

[0020] Optionally, the first conductive layer and the second conductive layer include silver layers.

[0021] Optionally, also include:

[0022] A reinforcing component is arranged on the lower surface of the base.

[0023] Optionally, also include:

[0024] An identification code, wherein the identification code is arranged on the reinforcing component.

[0025] The present application also provides an electronic device, comprising any of the touch modules described above.

[0026] A touch module provided in the present application includes: a substrate, a touch conductive layer, a pin, a first conductive layer, an insulating dielectric layer, and a second conductive layer; the touch conductive layer is arranged on the upper surface of the substrate; the first conductive layer is arranged on the upper surface of the substrate and distributed along the edge of the substrate; the pin is arranged on the upper surface of the first conductive layer; the insulating dielectric layer is arranged on the upper surfaces of the touch conductive layer and the first conductive layer, and does not completely cover the pin; the second conductive layer is arranged on the upper surface of the insulating dielectric layer, and is correspondingly located above the first conductive layer; the first conductive layer and the second conductive layer are both electrically connected to the pin.

[0027] It can be seen that in the touch module of the present application, two conductive layers, namely, a first conductive layer and a second conductive layer, are provided on the substrate, and the two conductive layers can withstand greater electrostatic discharge, that is, the anti-static discharge capability is improved. At the same time, the first conductive layer and the second conductive layer are located on the same side of the substrate, and the first conductive layer and the second conductive layer are both connected to the pins, thereby realizing the electrical connection between the first conductive layer and the second conductive layer. It is not necessary to make vias on the substrate to realize the electrical connection between the first conductive layer and the second conductive layer, which is very simple and can reduce the manufacturing cost.

[0028] In addition, the present application also provides an electronic device having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic diagram of a separate structure of a touch module provided in an embodiment of the present application Figure 1 ;

[0031] Figure 2 A schematic diagram of a separate structure of a touch module provided in an embodiment of the present application Figure 1 ;

[0032] Figure 3 A top view of a touch module provided by an embodiment of the present application after a first conductive layer is provided;

[0033] Figure 4 A top view of a touch module provided by an embodiment of the present application after a second conductive layer is provided;

[0034] Figure 5 A schematic diagram of a separate structure of a touch module provided in an embodiment of the present application Figure 1 . DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0036] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] As described in the background technology section, in order to improve the anti-static release capability of the capacitor film, it can be achieved by thickening the shielding wire or making a layer of shielding wire on the two surfaces of the substrate. However, the thickening of the shielding wire is limited in scope of application, and the shielding wires on the two surfaces of the substrate need to be connected by making vias, and the via manufacturing process is complicated and the manufacturing cost is relatively high.

[0038] In view of this, the present application provides a touch module, please refer to Figure 1 , comprising: a substrate 1, a touch conductive layer 3, a pin 4, a first conductive layer 2, an insulating medium layer 5, and a second conductive layer 6;

[0039] The touch conductive layer 3 is disposed on the upper surface of the substrate 1;

[0040] The first conductive layer 2 is disposed on the upper surface of the substrate 1 and distributed along the edge of the substrate 1;

[0041] The pin 4 is arranged on the upper surface of the first conductive layer 2;

[0042] The insulating dielectric layer 5 is disposed on the upper surfaces of the touch conductive layer 3 and the first conductive layer 2 and does not completely cover the pins 4;

[0043] The second conductive layer 6 is disposed on the upper surface of the insulating dielectric layer 5 and is correspondingly located above the first conductive layer 2 ; the first conductive layer 2 and the second conductive layer 6 are both electrically connected to the pin 4 .

[0044] The pin 4 is made of a conductive material, such as carbon.

[0045] In this embodiment, the pins 4 are correspondingly arranged at the ends of the substrate 1, which is the same as the arrangement position in the touch module of the related art. The two ends of the first conductive layer 2 are connected to two different pins 4, and the two ends of the second conductive layer 6 are the same as the pins 4 connected to the two ends of the first conductive layer 2. Assuming that the two ends of the first conductive layer 2 are respectively connected to the pin A and the pin B, the two ends of the second conductive layer 6 are also respectively connected to the pin A and the pin B.

[0046] The first conductive layer 2 and the second conductive layer 6 can be manufactured by printing.

[0047] The materials of the first conductive layer 2 and the second conductive layer 6 can be metal materials. As an implementation method, the first conductive layer 2 and the second conductive layer 6 include a silver layer to further enhance the anti-static release capability.

[0048] In this embodiment, the first conductive layer 2 and the second conductive layer 6 are both located on the same side of the substrate 1, and are structurally in different structural layers. The two are isolated by the insulating medium layer 5. The first conductive layer 2 and the second conductive layer 6 are electrically connected by being connected to the pin 4. The insulating medium layer 5 may be an insulating oil layer.

[0049] The insulating dielectric layer 5 does not completely cover the pin 4 , including the insulating dielectric layer 5 not covering the pin 4 at all or only covering a local area of ​​the pin 4 , so that the first conductive layer 2 is connected to the pin 4 .

[0050] In order to improve the aesthetics of the touch module, as an implementable embodiment, the touch conductive layer 3 is a transparent touch conductive layer 3 .

[0051] In the touch module of this embodiment, two conductive layers, a first conductive layer 2 and a second conductive layer 6, are provided on the substrate 1. The two conductive layers can withstand greater electrostatic discharge, that is, the anti-static discharge capability is improved. At the same time, the first conductive layer 2 and the second conductive layer 6 are located on the same side of the substrate 1, and the first conductive layer 2 and the second conductive layer 6 are both connected to the pin 4, thereby realizing the electrical connection between the first conductive layer 2 and the second conductive layer 6. It is not necessary to make a via hole on the substrate 1 to realize the electrical connection between the first conductive layer 2 and the second conductive layer 6, which is very simple and can reduce the manufacturing cost.

[0052] Please refer to Figure 2 On the basis of the above embodiments, in one embodiment of the present application, the touch module further includes: a protective layer, which is disposed on the upper surface of the second conductive layer 6 .

[0053] The protection layer can protect the second conductive layer 6 and prevent the second conductive layer 6 from being oxidized.

[0054] As an implementation method, the protective layer includes a coating protective layer 7 and an adhesive protective layer 9;

[0055] The coating protection layer 7 covers the upper surface of the second conductive layer 6;

[0056] The adhesive protection layer 9 is disposed on the upper surface of the coating protection layer 7 and is connected to the coating protection layer 7 through the first adhesive layer 8 .

[0057] The coating protective layer 7 refers to a film layer formed by printing, and there is almost no gap between the coating protective layer 7 and the second conductive layer 6, and the coating protective layer 7 has good airtightness. The coating protective layer 7 can be an insulating oil layer or the like.

[0058] A coating protective layer 7 is printed on the second conductive layer 6. After the coating protective layer 7 is dried, a first adhesive layer 8 is attached to the coating protective layer 7. Then, an adhesive protective layer 9 is attached to the first adhesive layer 8. The adhesive protective layer 9 may be a PET layer.

[0059] The adhesive protective layer 9 is provided by pasting, and is prone to gaps. However, since the film protective layer 7 with good airtightness is provided before the adhesive protective layer 9, the second conductive layer 6 is well protected by double protection.

[0060] Furthermore, in an embodiment of the present application, the touch module may further include: a second adhesive layer 10 and a protective paper 11 ; the second adhesive layer 10 is disposed on the upper surface of the protective layer; and the protective paper 11 is disposed on the upper surface of the second adhesive layer 10 .

[0061] The second adhesive layer 10 is a double-sided adhesive layer, one side of which is bonded to the protective layer and the other side of which is bonded to the protective paper 11. The protective paper 11 is tearable paper, and after tearing off the protective paper 11, the touch module can be pasted to other positions through the second adhesive layer 10, which is very simple and convenient to operate.

[0062] Please refer to Figure 3 and Figure 4 On the basis of any of the above embodiments, in one embodiment of the present application, when the substrate 1 also includes a through hole, the first conductive layer 2 is also distributed along the edge of the through hole, and the first conductive layer 2 distributed along the edge of the substrate 1 is connected to the first conductive layer 2 distributed along the edge of the through hole through a first connecting portion 15; the second conductive layer 6 distributed at the edge corresponding to the substrate 1 is connected to the second conductive layer 6 distributed at the edge corresponding to the through hole through a second connecting portion 16.

[0063] When a through hole is provided on the substrate 1, the first conductive layer 2 is distributed on the outer edge of the substrate 1 and the edge of the through hole. The two parts of the first conductive layer 2 are connected by a first connecting portion 15. The material of the first connecting portion 15 is a metal material, so that the first conductive layer 2 distributed along the edge of the through hole is also connected to the pin 4.

[0064] In order to simplify the manufacturing process, the material of the first connection portion 15 is the same as that of the first conductive layer 2 , so that the first connection portion 15 and the first conductive layer 2 can be manufactured simultaneously.

[0065] It should be noted that when the first conductive layer 2 is distributed on both the outer edge of the substrate 1 and the edge of the through hole, the second conductive layer 6 also includes two parts, one part is located above the first conductive layer 2 at the outer edge of the substrate 1, and the other part is located above the first conductive layer 2 at the edge of the through hole. The two parts of the second conductive layer 6 are connected by a second connecting portion 16, and the material of the second connecting portion 16 is a metal material, so that the second conductive layer 6 distributed along the edge of the through hole is also connected to the pin 4.

[0066] In order to simplify the manufacturing process, the material of the second connection portion 16 is the same as that of the second conductive layer 6 , so that the second connection portion 16 and the second conductive layer 6 can be manufactured simultaneously during the manufacturing process.

[0067] Please refer to Figure 5 On the basis of any of the above embodiments, in one embodiment of the present application, the touch module further includes: a reinforcing component 12 , and the reinforcing component 12 is disposed on the lower surface of the substrate 1 .

[0068] The reinforcing component 13 can be bonded to the substrate 1 through the third adhesive layer 13. By arranging the reinforcing component 12 on the lower surface of the substrate 1, the strength is enhanced, and the insertion operation of the touch module is facilitated.

[0069] In order to achieve the traceability effect of the touch module, the touch module may further include:

[0070] An identification code 14 , wherein the identification code 14 is disposed on the reinforcing component 12 .

[0071] The identification code 14 includes but is not limited to a QR code and a bar code.

[0072] The present application also provides an electronic device, which includes the touch module described in any of the above embodiments.

[0073] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0074] The above is a detailed introduction to the touch module and electronic device provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the scheme and its core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A touch module, characterized in that: include: Substrate, touch conductive layer, pins, first conductive layer, insulating dielectric layer, second conductive layer; The touch conductive layer is disposed on the upper surface of the substrate; The first conductive layer is disposed on the upper surface of the substrate and distributed along the edge of the substrate; The pins are arranged on the upper surface of the first conductive layer; The insulating medium layer is disposed on the upper surfaces of the touch conductive layer and the first conductive layer, and does not completely cover the pins; The second conductive layer is disposed on the upper surface of the insulating dielectric layer and is correspondingly located above the first conductive layer; the first conductive layer and the second conductive layer are both electrically connected to the pin.

2. The touch module according to claim 1, characterized in that: Also includes: A protective layer is disposed on an upper surface of the second conductive layer.

3. The touch module according to claim 2, wherein: The protective layer includes a laminating protective layer and an adhesive protective layer; The coating protection layer covers the upper surface of the second conductive layer; The adhesive protection layer is arranged on the upper surface of the coating protection layer and is connected to the coating protection layer through a first adhesive layer.

4. The touch module according to claim 2, wherein: Also includes: A second adhesive layer and a protective paper; the second adhesive layer is disposed on the upper surface of the protective layer; The protective paper is arranged on the upper surface of the second adhesive layer.

5. The touch module according to claim 1, wherein: When the substrate also includes a through hole, the first conductive layer is also distributed along the edge of the through hole, and the first conductive layer distributed along the edge of the substrate is connected to the first conductive layer distributed along the edge of the through hole through a first connecting portion; the second conductive layer distributed at the edge corresponding to the substrate is connected to the second conductive layer distributed at the edge corresponding to the through hole through a second connecting portion.

6. The touch module according to claim 1, wherein: The touch conductive layer is a transparent touch conductive layer.

7. The touch module according to claim 1, wherein: The first conductive layer and the second conductive layer include silver layers.

8. The touch module according to any one of claims 1 to 7, characterized in that: Also includes: A reinforcing component is arranged on the lower surface of the base.

9. The touch module according to claim 8, wherein: Also includes: An identification code, wherein the identification code is arranged on the reinforcing component.

10. An electronic device, characterized in that: It comprises the touch module as claimed in any one of claims 1 to 9.

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