Double-layer glass-based display screen mounting structure

Abstract

The utility model discloses a double-layer glass-based display screen mounting structure which comprises a light-emitting layer and a bottom plate layer, the light-emitting layer and the bottom plate layer are both made of transparent materials, the bottom plate layer is composed of a plurality of substrates, conducting layers and LED chips are formed on the sides, facing the light-emitting layer, of the substrates, the LED chips are electrically connected with the conducting layers, and the LED chips are electrically connected with the light-emitting layer. A bonding layer is filled between the light emitting layer and the bottom plate layer, the bonding layer is made of a transparent material, the light emitting layer, the bonding layer and the bottom plate layer are the same in length and width, and the split type LED light source has the advantages that split type preparation is achieved, and production difficulty is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of transparent display screens, and in particular relates to a double-layer glass-based display screen installation structure. Background Art

[0002] The transparent display screen uses many tiny LED dot matrices on a substrate. Each LED dot matrix contains LED lamp beads of three basic colors: red, green and blue. They can emit light independently. By adjusting the brightness and color of the LED lamp beads of red, green and blue in each LED dot matrix, various images and videos are displayed on the LED transparent display screen. With a transparent substrate, the object behind the LED transparent display screen can be seen through it, which improves people's visual experience. Therefore, transparent display screens have been widely used. With the continuous expansion of application scenarios, the size requirements for transparent display screens have also diversified. Some large-size transparent display screens are extremely inconvenient to make and have extremely high manufacturing costs. In order to solve such problems, a double-layer glass-based display screen installation structure is proposed. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] To this end, the utility model proposes a double-layer glass-based display screen installation structure, which has the advantages of split preparation and reduced production difficulty.

[0005] According to the double-layer glass-based display screen installation structure of the embodiment of the utility model, it includes: a light emitting layer and a bottom plate layer, both of which are made of transparent materials, the bottom plate layer is composed of a plurality of substrates, a conductive layer and an LED chip are formed on the side of the substrate facing the light emitting layer, the LED chip is electrically connected to the conductive layer, and an adhesive layer is filled between the light emitting layer and the bottom plate layer, and the adhesive layer is made of transparent material.

[0006] According to an embodiment of the present invention, the thickness of the bonding layer is greater than 0.5-1 times the height of the LED chip.

[0007] According to an embodiment of the utility model, the length and width dimensions of the light emitting layer, the bonding layer and the bottom plate layer are the same.

[0008] According to an embodiment of the present invention, the bonding layer is transparent silicone.

[0009] According to an embodiment of the present invention, the substrate is glass-based.

[0010] According to an embodiment of the present invention, the conductive layer is distributed on the substrate in a grid shape.

[0011] According to an embodiment of the present invention, a signal layer is further formed on the side of the substrate facing the light emitting layer, and the signal layer and the conductive layer are arranged to overlap along the arrangement direction of the light emitting layer and the bottom plate layer.

[0012] According to an embodiment of the present invention, an insulating layer is formed between the signal layer and the conductive layer.

[0013] According to an embodiment of the utility model, a through hole is formed on the insulating layer, and the through hole is used to conduct the signal layer and the conductive layer.

[0014] The beneficial effect of the utility model is that the utility model adopts multiple substrates to splice into a bottom plate layer, so that the conductive layer and the LED chip can be prepared on each substrate respectively, and then the multiple substrates are assembled, thereby reducing the size of the substrate when preparing the conductive layer and installing the LED chip, reducing the production difficulty, and the substrates can be inspected separately during inspection, and a single substrate can be repaired or replaced when a defective product is encountered, thereby improving the convenience of repair or replacement and reducing the cost of repair or replacement;

[0015] The integrated injection-molded adhesive layer can fix the light emitting layer and the bottom plate layer while avoiding halo caused by the change of medium density when part of the light emitted by the LED chip passes through the gap between the light emitting layer and the bottom plate layer, thereby improving the visual clarity of the transparent display screen; in addition, the adhesive layer also seals the conductive layer and the LED chip, avoiding impurities from contaminating or corroding the conductive layer and the LED chip, and ensuring the service life of the conductive layer and the LED chip.

[0016] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments of the present invention, in which:

[0019] Figure 1 It is a schematic cross-sectional view of the overall structure of the utility model;

[0020] Figure 2 It is an enlarged schematic diagram of area A of the utility model;

[0021] Reference numerals:

[0022] 1. Light emitting layer; 21. Conductive layer; 22. LED chip; 23. Substrate; 24. Signal layer; 25. Insulating layer; 251. Through hole; 3. Adhesive layer. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] The double-layer glass-based display screen installation structure of the embodiment of the utility model is described in detail below with reference to the accompanying drawings.

[0027] like Figure 1-Figure 2 As shown, the double-layer glass-based display screen installation structure according to the embodiment of the utility model includes: a light emitting layer 1 and a bottom plate layer, both of which are made of transparent materials, the bottom plate layer is composed of a plurality of substrates 23, a conductive layer 21 and an LED chip 22 are formed on the side of the substrate 23 facing the light emitting layer 1, the LED chip 22 is electrically connected to the conductive layer 21, and an adhesive layer 3 is filled between the light emitting layer 1 and the bottom plate layer, and the adhesive layer 3 is made of a transparent material.

[0028] In this embodiment, the substrate 23 is externally connected to a controller, and multiple substrates 23 are spliced ​​into a bottom plate layer, so that the conductive layer 21 and the LED chip 22 can be prepared on each substrate 23 respectively, and then the multiple substrates 23 are assembled, thereby reducing the size of the substrate 23 when preparing the conductive layer 21 and installing the LED chip 22, reducing the production difficulty, and the substrates 23 can be inspected separately during inspection. If a defective product is encountered, a single substrate 23 can be repaired or replaced, which improves the convenience of repair or replacement and reduces the cost of repair or replacement; the bonding layer 3 is integrally injection-molded. Since the bonding layer 3 is formed by injection molding, it is in a fluid state. In the transparent state, the gap between the light emitting layer 1 and the bottom plate layer can be filled. The adhesive layer 3 can fix the light emitting layer 1 and the bottom plate layer. Since the light emitting layer 1 is a whole and has no gaps, it avoids the halo caused by the change of medium density when part of the light emitted by the LED chip 22 passes through the gap between the light emitting layer 1 and the bottom plate layer, thereby improving the visual clarity of the transparent display screen. In addition, the adhesive layer 3 also seals the conductive layer 21 and the LED chip 22, avoiding impurities from contaminating or corroding the conductive layer 21 and the LED chip 22, and ensuring the service life of the conductive layer 21 and the LED chip 22.

[0029] The thickness of the adhesive layer 3 is greater than 0.5-1 times the height of the LED chip 22, which can effectively avoid glue creeping near the LED chip 22 due to the thin adhesive layer 3 and avoid the formation of gaps between the light output layer 1 and the bottom plate layer.

[0030] The length and width of the light emitting layer 1, the adhesive layer 3 and the bottom plate layer are the same, that is, the four sides of the light emitting layer 1, the adhesive layer 3 and the bottom plate layer are aligned to ensure that the adhesive layer 3 has sufficient support for the edge positions of the light emitting layer 1 and the bottom plate layer, so that when the display screen is installed, it is not easy to deform or break when the edges are subjected to force.

[0031] The bonding layer 3 is transparent silica gel. The bonding layer 3 is a transparent colloid that does not contain sulfur to avoid blackening of the LED chip 22. The bonding layer 3 is preferably a potting glue.

[0032] The substrate 23 is glass-based. In order to improve the visual effect, the size of the conductive layer 21 is small, and it is a micron-level circuit. The glass base is resistant to high temperatures and is easy to adapt to various preparation processes of the conductive layer 21.

[0033] The conductive layer 21 is distributed on the substrate 23 in a grid pattern to achieve uniform distribution and improve visual perception.

[0034] A signal layer 24 is also formed on the side of the substrate 23 facing the light emitting layer 1. The signal layer 24 and the conductive layer 21 are arranged to overlap along the arrangement direction of the light emitting layer 1 and the bottom plate layer to reduce the area occupied by the substrate 23 when the signal layer 24 and the conductive layer 21 are arranged, increase the visible area of ​​the bottom plate layer, and achieve improved transparency of the display screen. At the same time, the signal layer 24 and the conductive layer 21 are arranged on the same side of the substrate 23, which facilitates the simultaneous packaging of the signal layer 24 and the conductive layer 21 by the adhesive layer 3, avoiding multiple packaging steps caused by arranging the signal layer 24 and the conductive layer 21 on both sides of the substrate 23, ensuring the service life of the signal layer 24 and the conductive layer 21 while reducing the production steps.

[0035] An insulating layer 25 is formed between the signal layer 24 and the conductive layer 21 . The insulating layer 25 is used to isolate the signal layer 24 from the conductive layer 21 to avoid a short circuit between the signal layer 24 and the conductive layer 21 .

[0036] A through hole 251 is formed on the insulating layer 25, and the through hole 251 is used to conduct the signal layer 24 and the conductive layer 21. A metal layer connecting the signal layer 24 and the conductive layer 21 is arranged in the through hole 251, thereby avoiding the use of external wiring to connect the signal layer 24 and the conductive layer 21, further saving the occupied area of ​​the substrate 23 and improving transparency.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A double-layer glass-based display screen installation structure, characterized in that: include: A light emitting layer (1) and a bottom plate layer, wherein the light emitting layer (1) and the bottom plate layer are both made of transparent materials, the bottom plate layer is composed of a plurality of substrates (23), a conductive layer (21) and an LED chip (22) are formed on the side of the substrate (23) facing the light emitting layer (1), the LED chip (22) is electrically connected to the conductive layer (21), and an adhesive layer (3) is filled between the light emitting layer (1) and the bottom plate layer, the adhesive layer (3) being made of a transparent material.

2. The double-layer glass-based display screen installation structure according to claim 1, characterized in that: The thickness of the bonding layer (3) is greater than 0.5 to 1 times the height of the LED chip (22).

3. The double-layer glass-based display screen installation structure according to claim 2, characterized in that: The length and width dimensions of the light emitting layer (1), the bonding layer (3) and the bottom plate layer are all the same.

4. The double-layer glass-based display screen installation structure according to claim 3, characterized in that: The bonding layer (3) is transparent silica gel.

5. The double-layer glass-based display screen installation structure according to claim 4, characterized in that: The substrate (23) is glass-based.

6. The double-layer glass-based display screen installation structure according to claim 5, characterized in that: The conductive layer (21) is distributed in a grid shape on the substrate (23).

7. The double-layer glass-based display screen installation structure according to claim 6, characterized in that: A signal layer (24) is also formed on the side of the substrate (23) facing the light output layer (1), and the signal layer (24) and the conductive layer (21) are arranged to overlap along the arrangement direction of the light output layer (1) and the bottom plate layer.

8. The double-layer glass-based display screen installation structure according to claim 7, characterized in that: An insulating layer (25) is formed between the signal layer (24) and the conductive layer (21).

9. The double-layer glass-based display screen installation structure according to claim 8, characterized in that: A through hole (251) is formed on the insulating layer (25), and the through hole (251) is used to conduct the signal layer (24) and the conductive layer (21).

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