Wafer flatness detection equipment

Abstract

The utility model relates to the field of flatness detection equipment, in particular to wafer flatness detection equipment. Comprising a machine body, a display screen is installed on one side of the machine body, an adjusting button is installed on the side, close to the display screen, of the machine body, a workbench is fixedly connected to the upper surface of the machine body, a supporting frame is fixedly connected to the upper surface of the machine body, a detector is installed on one side of the supporting frame, and an adjusting structure is arranged on the upper surface of the workbench. The adjusting structure comprises four lead screws, the lower ends of the lead screws are fixedly connected with the workbench, the arc surfaces of the lead screws are in threaded connection with adjusting rings, and the outer walls of the adjusting rings are fixedly connected with rotating discs. The wafer flatness detection equipment provided by the utility model has the advantages that a worker can conveniently adjust the arc plate to limit the to-be-detected wafer placed on the workbench, so that the wafer is prevented from shaking during flatness detection, and the wafer flatness detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of flatness detection equipment, in particular to a wafer flatness detection equipment. Background Art

[0002] Flatness detection equipment is used to detect the flatness of wafers. During the wafer production process, the flatness detection step is very important for controlling the quality of wafers.

[0003] The utility model with announcement number CN217358475U discloses a wafer dicing machine workbench flatness detection device, and its technical solution key points are: it includes a support table, a plurality of casters are installed at the bottom of the support table, the top of the support table is rotatably connected to a vertical plate through a rotating flange, a crossbeam arm is installed on the vertical plate, the outer wall of the vertical plate is equidistantly penetrated with a plurality of threaded holes from top to bottom, the crossbeam arm is connected with the threaded holes through a height adjustment mechanism, a third hand-tightening bolt is penetrated on the top of the crossbeam arm, the threaded end of the third hand-tightening bolt is connected with a hanger, the inner side of the hanger is connected with a placement plate, and six displacement sensors are installed on the placement plate; in the utility model, by matching the first hand-tightening bolt and the second hand-tightening bolt with two adjacent threaded holes of different heights, the fixed height of the crossbeam arm can be adjusted on the vertical plate, thereby adjusting the installation height of the displacement sensor, and the operation is simple and convenient.

[0004] In response to the relevant content above, the inventor believes that the following technical defects exist: when the flatness detection equipment in the prior art is in use, it is not easy to limit wafers of different sizes, which can easily cause the wafer to shake during the flatness detection process, thereby affecting the accuracy of the detection and the normal use of the flatness detection equipment. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a wafer flatness detection device.

[0006] In order to solve the above technical problems, the utility model provides a wafer flatness detection device, comprising: a body, a display screen is installed on one side of the body, an adjustment button is installed on the side of the body close to the display screen, a workbench is fixedly connected to the upper surface of the body, a support frame is fixedly connected to the upper surface of the body, a detector is installed on one side of the support frame, an adjustment structure is provided on the upper surface of the workbench, the adjustment structure comprises four screw rods, the lower ends of the screw rods are fixedly connected to the workbench, the arc surface of the screw rods is threadedly connected with an adjustment ring, the outer wall of the adjustment ring is fixedly connected with a turntable, the arc surface of the screw rods is slidably connected with a connecting plate, the cross-section of the connecting plate is "U"-shaped, the lower surface of the connecting plate is fitted with the workbench, one side of the connecting plate is fixedly connected with an arc plate, the center of a plurality of the arc plates and the center point of the workbench are located on the same straight line, a guide rod is slidably penetrated through one side of the connecting plate, the cross-section of the guide rod is "T"-shaped, and one end of the guide rod is fixedly connected to the arc surface of the screw rod.

[0007] The effect achieved by the above components is: by setting the adjustment structure, personnel can easily adjust the arc plate to limit the wafer to be tested placed on the workbench, thereby avoiding shaking of the wafer during flatness testing, thereby improving the efficiency of wafer flatness testing.

[0008] Preferably, the arc surface of the guide rod is sleeved with a spring, and two ends of the spring are fixedly connected to the guide rod and the connecting plate respectively.

[0009] The effect achieved by the above components is: after the rotating adjustment ring is separated from the connecting plate, the spring can drive the connecting plate to move quickly toward the center point of the workbench, thereby achieving the effect of conveniently controlling the connecting plate and the arc plate.

[0010] Preferably, a rubber pad is fixedly connected to the lower surface of the adjusting ring, and the diameter of the rubber pad is slightly larger than the diameter of the adjusting ring.

[0011] The effect achieved by the above components is that the rubber pad can increase the friction force of the lower surface of the adjusting ring, so that the adjusting ring can limit the connection plate firmly with the help of the rubber pad.

[0012] Preferably, the inner wall of the arc plate is provided with multi-stage grooves, the multi-stage grooves are composed of a plurality of slot holes, and the diameters of the plurality of slot holes decrease sequentially from bottom to top.

[0013] The effect achieved by the above components is: by providing multi-level grooves on the inner wall of the arc plate, the arc surface can limit the position of wafers of various thicknesses.

[0014] Preferably, an auxiliary structure is provided on one side of the body, and the auxiliary structure includes a fixing plate, one side of the fixing plate is fixedly connected to the body, one side of the fixing plate is fixedly connected to a positioning column, the cross-section of the positioning column is "T"-shaped, and the side of the fixing plate away from the body is fixedly connected to an elastic line, the end of the elastic line away from the fixing plate is fixedly connected to a cleaning brush, and the upper surface of the cleaning brush is fixedly connected to a connecting rope.

[0015] The effect achieved by the above components is: by setting up the auxiliary structure, personnel can use a cleaning brush to clean the dust on the surface of the workbench, thereby preventing dust from adhering to the workbench and affecting the normal use of the flatness detection equipment.

[0016] Preferably, a positioning groove is formed on the arc surface of the positioning column.

[0017] The effect achieved by the above components is that when the positioning column and the connecting rope are connected, the connecting rope is hung in the positioning groove of the arc surface of the positioning column, so that the positioning column and the connecting rope can be stably connected.

[0018] Preferably, the cleaning brush is made of pig bristle.

[0019] The effect achieved by the above components is: by setting the cleaning brush to be made of pig bristle material, the pig bristle can be anti-static and has good elasticity, which can effectively improve the cleaning efficiency of the cleaning brush.

[0020] Compared with the related art, the wafer flatness detection device provided by the utility model has the following advantages:

[0021] Beneficial effects:

[0022] The utility model provides a wafer flatness detection device. By setting an adjustment structure, personnel can conveniently adjust the arc plate to limit the wafer to be detected placed on a workbench, thereby avoiding shaking of the wafer during flatness detection, thereby improving the wafer flatness detection efficiency.

[0023] By setting up the auxiliary structure, personnel can use a cleaning brush to clean the dust on the surface of the workbench, thereby preventing dust from adhering to the workbench and affecting the normal use of the flatness detection equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of a wafer flatness detection device provided by the utility model;

[0025] Figure 2 for Figure 1 A schematic diagram of the structure of the regulatory structure shown;

[0026] Figure 3 for Figure 1A schematic diagram of the local structure of the regulating structure shown;

[0027] Figure 4 for Figure 1 A schematic diagram of the auxiliary structure shown.

[0028] Numbers in the figure: 1. Machine body; 2. Display screen; 3. Adjustment structure; 31. Screw rod; 32. Adjustment ring; 33. Turntable; 34. Connecting plate; 35. Guide rod; 36. Arc plate; 37. Spring; 38. Rubber pad; 39. Multi-stage groove; 4. Auxiliary structure; 41. Fixed plate; 42. Positioning column; 43. Elastic line; 44. Cleaning brush; 45. Connecting rope; 46. Positioning groove; 5. Adjustment button; 6. Support frame; 7. Detector; 8. Workbench. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0030] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0031] See also Figures 1 to 4 A wafer flatness detection device provided by an embodiment of the utility model includes: a body 1, a display screen 2 is installed on one side of the body 1, an adjustment button 5 is installed on the side of the body 1 close to the display screen 2, a workbench 8 is fixedly connected to the upper surface of the body 1, a support frame 6 is fixedly connected to the upper surface of the body 1, a detector 7 is installed on one side of the support frame 6, an adjustment structure 3 is provided on the upper surface of the workbench 8, and an auxiliary structure 4 is provided on one side of the body 1.

[0032] In the embodiments of the present invention, please refer to Figure 2 and Figure 3The adjusting structure 3 includes four screw rods 31, the lower ends of the screw rods 31 are fixedly connected to the workbench 8, the arc surface of the screw rod 31 is threadedly connected with an adjusting ring 32, the outer wall of the adjusting ring 32 is fixedly connected with a turntable 33, the arc surface of the screw rod 31 is slidably connected with a connecting plate 34, the cross-section of the connecting plate 34 is "U"-shaped, the lower surface of the connecting plate 34 is in contact with the workbench 8, one side of the connecting plate 34 is fixedly connected with an arc plate 36, the centers of several arc plates 36 and the center point of the workbench 8 are located on the same straight line, and a guide rod 35 is slidably penetrated on one side of the connecting plate 34, the cross-section of the guide rod 35 is "T"-shaped, and one end of the guide rod 35 is fixedly connected to the arc surface of the screw rod 31. By setting the adjusting structure 3, personnel can easily adjust the arc plate 36 to limit the wafer to be tested placed on the workbench 8, thereby avoiding shaking of the wafer during flatness detection, thereby improving the flatness detection of the wafer. The measuring efficiency is measured. The arc surface of the guide rod 35 is sleeved with a spring 37. The two ends of the spring 37 are fixedly connected to the guide rod 35 and the connecting plate 34 respectively. After the adjusting ring 32 is rotated to separate from the connecting plate 34, the spring 37 can drive the connecting plate 34 to move quickly in the direction close to the center point of the workbench 8, thereby achieving the effect of conveniently controlling the connecting plate 34 and the arc plate 36. The lower surface of the adjusting ring 32 is fixedly connected with a rubber pad 38. The diameter of the rubber pad 38 is slightly larger than the diameter of the adjusting ring 32. The rubber pad 38 can increase the friction force of the lower surface of the adjusting ring 32, thereby achieving the effect of enabling the adjusting ring 32 to limit the connecting plate 34 with the help of the rubber pad 38. The inner wall of the arc plate 36 is provided with a multi-stage groove 39. The multi-stage groove 39 is composed of a plurality of slot holes. The diameters of the plurality of slot holes decrease in sequence from bottom to top. By providing the multi-stage groove 39 on the inner wall of the arc plate 36, the arc surface can be used to limit wafers of various thicknesses.

[0033] In the embodiments of the present invention, please refer to Figure 4 The auxiliary structure 4 includes a fixing plate 41, one side of the fixing plate 41 is fixedly connected to the machine body 1, a positioning column 42 is fixedly connected to one side of the fixing plate 41, and the cross section of the positioning column 42 is "T"-shaped, and an elastic line 43 is fixedly connected to the side of the fixing plate 41 away from the machine body 1, and a cleaning brush 44 is fixedly connected to the end of the elastic line 43 away from the fixing plate 41, and a connecting rope 45 is fixedly connected to the upper surface of the cleaning brush 44. By setting the auxiliary structure 4, personnel can use the cleaning brush 44 to clean the dust on the upper surface of the workbench 8 , thereby preventing dust from adhering to the workbench 8 and affecting the normal use of the flatness detection equipment. A positioning groove 46 is provided on the arc surface of the positioning column 42. When connecting the positioning column 42 and the connecting rope 45, the connecting rope 45 is hung in the positioning groove 46 on the arc surface of the positioning column 42, so that the positioning column 42 and the connecting rope 45 can be stably connected. The cleaning brush 44 is specifically made of bristle material. By setting the cleaning brush 44 to be made of bristle material, the bristle can be anti-static and has good elasticity, which can effectively improve the cleaning effect of the cleaning brush 44.

[0034] The working principle of a wafer flatness detection device provided by the utility model is as follows: when the device needs to be used to detect the flatness of the wafer, the wafer is first placed at the center point of the workbench 8, and then the adjusting ring 32 is rotated with the help of the turntable 33 to drive the rubber pad 38 to separate the rubber pad 38 from the connecting plate 34. At this time, the spring 37 can drive the connecting plate 34 to move quickly in the direction close to the center point of the workbench 8, so as to achieve the effect of conveniently controlling the connecting plate 34 and the arc plate 36. When the connecting plate 34 drives the arc plate 36 to abut against the wafer, the adjusting ring 32 is rotated in the opposite direction so that the adjusting ring 32 drives the rubber pad 38 to abut against the connecting plate 34, and the wafer can be limited. Then the adjusting button 5 can be operated to make the detector 7 detect the flatness of the wafer. The flatness is detected. After the detection is completed, the turntable 33 is rotated to drive the adjusting ring 32, so that the adjusting ring 32 drives the rubber pad 38 to separate from the connecting plate 34, and finally the wafer is removed from the workbench 8. Among them, the rubber pad 38 can increase the friction force of the lower surface of the adjusting ring 32, so that the adjusting ring 32 can use the rubber pad 38 to limit the connecting plate 34 firmly. In addition, by providing a multi-level groove 39 on the inner wall of the arc plate 36, the arc surface can limit wafers of various thicknesses. By setting the adjustment structure 3, personnel can easily adjust the arc plate 36 to limit the wafer to be detected placed on the workbench 8, thereby avoiding shaking of the wafer during flatness detection, thereby improving the efficiency of wafer flatness detection.

[0035] When it is necessary to clean the dust on the upper surface of the workbench 8, the connecting rope 45 is first removed from the positioning groove 46 of the arc surface of the positioning column 42, and then the cleaning brush 44 is moved to make the cleaning brush 44 clean the dust on the upper surface of the workbench 8. The elastic line 43 can restrain the cleaning brush 44 to prevent the cleaning brush 44 from being lost after use. When the cleaning brush 44 is used up, the connecting rope 45 is hung in the positioning groove 46 of the arc surface of the positioning column 42 to store the cleaning brush 44. When connecting the rope 45, the connecting rope 45 is hung in the positioning groove 46 of the arc surface of the positioning column 42, so as to achieve the effect of stably connecting the positioning column 42 and the connecting rope 45. Among them, by setting the cleaning brush 44 to be a bristle material, the bristle can be anti-static and has good elasticity, which can effectively improve the cleaning efficiency of the cleaning brush 44. By setting the auxiliary structure 4, personnel can use the cleaning brush 44 to clean the dust on the surface of the workbench 8, thereby avoiding dust adhering to the workbench 8 and affecting the normal use of the flatness detection equipment.

[0036] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0037] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer flatness detection device, characterized in that: include: A machine body (1), a display screen (2) is installed on one side of the machine body (1), an adjustment button (5) is installed on the side of the machine body (1) close to the display screen (2), a workbench (8) is fixedly connected to the upper surface of the machine body (1), a support frame (6) is fixedly connected to the upper surface of the machine body (1), a detector (7) is installed on one side of the support frame (6), an adjustment structure (3) is provided on the upper surface of the workbench (8), the adjustment structure (3) comprises four screw rods (31), the lower ends of the screw rods (31) are fixedly connected to the workbench (8), the arc surface of the screw rods (31) is threadedly connected to an adjustment ring (32), the adjustment ring The outer wall of the connecting plate (32) is fixedly connected with a rotating disk (33), the arc surface of the screw rod (31) is slidably connected with a connecting plate (34), the cross section of the connecting plate (34) is "U"-shaped, the lower surface of the connecting plate (34) is in contact with the workbench (8), one side of the connecting plate (34) is fixedly connected with an arc plate (36), the centers of a plurality of the arc plates (36) and the center point of the workbench (8) are located on the same straight line, one side of the connecting plate (34) is slidably penetrated with a guide rod (35), the cross section of the guide rod (35) is "T"-shaped, and one end of the guide rod (35) is fixedly connected with the arc surface of the screw rod (31).

2. A wafer flatness detection device according to claim 1, characterized in that: The arc surface of the guide rod (35) is sleeved with a spring (37), and the two ends of the spring (37) are respectively fixedly connected to the guide rod (35) and the connecting plate (34).

3. The wafer flatness detection device according to claim 1, characterized in that: A rubber pad (38) is fixedly connected to the lower surface of the adjusting ring (32), and the diameter of the rubber pad (38) is slightly larger than the diameter of the adjusting ring (32).

4. The wafer flatness detection device according to claim 1, characterized in that: The inner wall of the arc plate (36) is provided with a multi-stage groove (39), the multi-stage groove (39) is composed of a plurality of slot holes, and the diameters of the plurality of slot holes decrease sequentially from bottom to top.

5. The wafer flatness detection device according to claim 1, characterized in that: An auxiliary structure (4) is provided on one side of the machine body (1), and the auxiliary structure (4) comprises a fixing plate (41), one side of the fixing plate (41) is fixedly connected to the machine body (1), one side of the fixing plate (41) is fixedly connected to a positioning column (42), and the cross section of the positioning column (42) is "T"-shaped; a side of the fixing plate (41) away from the machine body (1) is fixedly connected to an elastic line (43), an end of the elastic line (43) away from the fixing plate (41) is fixedly connected to a cleaning brush (44), and the upper surface of the cleaning brush (44) is fixedly connected to a connecting rope (45).

6. The wafer flatness detection device according to claim 5, characterized in that: The arc surface of the positioning column (42) is provided with a positioning groove (46).

7. The wafer flatness detection device according to claim 5, characterized in that: The cleaning brush (44) is specifically made of pig bristle.

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