Stripping device for wafer
By using a vacuum adsorption disc driven by horizontal movement and lifting mechanisms in wafer production, the problems of difficulty and cost of air jaw clamping in the prior art are solved, and a stable and economical wafer is achieved. Peeling process.
Patent Information
- Application Number
- CN202323429576.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-15
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-15
AI Technical Summary
In the prior art, when using a robotic arm to drive the air claw to clamp the wafer, the power of the air claw needs to be precisely controlled. If the power is too small, it cannot be clamped firmly, and the power is too large, it is easy to clamp and break, and the air claw needs to be extended into the slit to grab. This results in high cost and complex operation.
Using a device including a horizontal movement mechanism, a lifting mechanism, a horizontal telescopic mechanism and a vacuum adsorption disk, the side of the wafer is grasped through the vacuum adsorption disk, and the horizontal movement mechanism and hydraulic cylinder are used to drive the vacuum adsorption disk to approach the wafer, simplifying the grasping. The process is taken and costs are reduced.
A more stable wafer grab is achieved, reducing operational difficulty and equipment costs, and improving the stability and safety of grabbing through the array distribution of vacuum adsorption discs and the silicone cushion layer.
Smart Images
Figure CN222261008U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer production, in particular to a stripping device for wafers. Background Art
[0002] Wafers are made by cutting silicon rods into slices, usually using wire saws. When the silicon rods are cut with wire saws, the wafers are cut out in a state where they are completely bonded to the slicing base. Therefore, it is necessary to peel the wafers from the slicing base to make them singular. In the prior art, usually a robotic arm drives an air gripper to clamp the wafer and take it out, but this method requires precise control of the force of the air gripper. If the force is too small, the wafer cannot be clamped firmly, and if the force is too large, the wafer is easily crushed. Therefore, a more precise mechanism is required, which is more expensive. In addition, after the wafers are sawed by wire saws, the gaps between adjacent wafers are small. If the air gripper wants to grab the wafer, one side of the air gripper needs to extend between the grabbed wafer and the adjacent wafer. Therefore, the gripping end of the air gripper needs to be very thin, and precise control is required to accurately extend into the slit. Utility Model Content
[0003] In order to solve the above-mentioned deficiencies in the prior art, the utility model provides a wafer peeling device.
[0004] In order to achieve the above technical effects, the utility model adopts the following scheme:
[0005] A wafer peeling device, characterized in that it comprises a horizontal moving mechanism, a lifting mechanism, a horizontal telescopic mechanism, a support frame and a vacuum adsorption plate;
[0006] The lower end of the lifting mechanism is installed on the horizontal moving mechanism for movement, the telescopic rear end of the horizontal telescopic mechanism is rotatably installed on the upper end of the lifting mechanism, the vacuum adsorption plate is installed on the horizontal telescopic mechanism through a support frame, the orientation of the vacuum adsorption plate is consistent with the extension direction of the horizontal telescopic mechanism, and the vacuum adsorption plate is connected to a vacuum generator.
[0007] According to a preferred technical solution, the number of the vacuum adsorption plates is at least three, and the at least three vacuum adsorption plates are arranged in an array on the same vertical plane.
[0008] According to a preferred technical solution, a silica gel pad is provided on the surface of the vacuum adsorption plate.
[0009] A preferred technical solution is that the horizontal moving mechanism includes a horizontally arranged first guide rail, a sliding seat is provided on the first guide rail for sliding cooperation, a wire hole is penetrated through the sliding seat along the sliding direction, a lead screw is passed through the wire hole, both ends of the lead screw are rotatably mounted on the first guide rail, the lead screw is driven to rotate by a first motor, and the lower end of the lifting mechanism is fixedly mounted on the sliding seat.
[0010] A preferred technical solution is that the lifting mechanism includes a base located below and a top plate located above, the base is installed on a horizontal moving mechanism to slide, the telescopic rear end of the horizontal telescopic mechanism is installed on the top plate to rotate, at least three array-distributed hydraulic cylinders are provided between the base and the top plate, the hydraulic cylinders are vertically installed on the base, and the upper end of the hydraulic cylinder is fixedly connected to the lower end of the top plate.
[0011] A preferred technical solution is that the horizontal telescopic mechanism includes a horizontally arranged beam, one end of which is rotatably mounted on the upper end of the lifting mechanism and driven to rotate by a second motor, a second guide rail is provided on the beam along its length direction, a moving trolley is slidably provided on the second guide rail, the moving trolley is driven to slide by a cylinder fixedly mounted on the beam, and the support frame is fixedly mounted on the moving trolley.
[0012] Compared with the prior art, the beneficial effects are:
[0013] The utility model has a simple structure and is easy to use. It drives the vacuum adsorption plate to approach the wafer through the horizontal moving mechanism, the lifting mechanism and the horizontal telescopic mechanism, approaches from one side of the wafer, and grasps the side of the wafer by the vacuum adsorption plate, which reduces the difficulty of grasping. The utility model has a simple structure and reduces the cost of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of the utility model.
[0015] Figure numerals: 1. first guide rail; 2. sliding seat; 3. screw; 4. base; 5. hydraulic cylinder; 6. top plate; 7. second motor; 8. crossbeam; 9. second guide rail; 10. moving trolley; 11. cylinder; 12. support frame; 13. vacuum adsorption plate; 14. silicone pad. DETAILED DESCRIPTION
[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0017] A wafer peeling device, characterized in that it comprises a horizontal moving mechanism, a lifting mechanism, a horizontal telescopic mechanism, a support frame 12 and a vacuum adsorption plate 13;
[0018] The lower end of the lifting mechanism is installed on the horizontal moving mechanism and moves in the horizontal direction. The telescopic rear end of the horizontal telescopic mechanism is rotatably installed on the upper end of the lifting mechanism. The vacuum adsorption disk 13 is installed on the horizontal telescopic mechanism through the support frame 12. The telescopic mechanism drives the vacuum adsorption disk 13 to move in the horizontal direction and perpendicular to the moving direction of the horizontal moving mechanism. The orientation of the vacuum adsorption disk 13 is consistent with the extension direction of the horizontal telescopic mechanism. The vacuum adsorption disk 13 is connected to a vacuum generator.
[0019] Since the silicon rod is usually cut while lying flat, the cut wafer is in a sideways state. The vacuum adsorption plate 13 is driven to approach the wafer from one side through the horizontal moving mechanism, the lifting mechanism and the horizontal telescopic mechanism, and the wafer is grasped by the side of the wafer through the vacuum adsorption plate 13, which reduces the difficulty of grasping, and has a simple structure and reduces the cost of the device.
[0020] According to a preferred technical solution, the number of the vacuum adsorption plates 13 is at least three, and at least three vacuum adsorption plates 13 are arranged in an array on the same vertical plane.
[0021] At least three vacuum adsorption plates 13 are distributed in an array and can make surface contact with the wafer, so that the wafer can be grasped more stably.
[0022] According to a preferred technical solution, a silicone pad layer 14 is provided on the surface of the vacuum adsorption disk 13. The silicone pad layer 14 is arranged on the contact surface between the vacuum adsorption disk 13 and the wafer, and the silicone pad has small holes that do not affect the adsorption of the vacuum adsorption disk 13.
[0023] A preferred technical solution is that the horizontal moving mechanism includes a horizontally arranged first guide rail 1, a sliding seat 2 is slidably provided on the first guide rail 1, a wire hole is penetrated through the sliding direction on the sliding seat 2, a lead screw 3 is passed through the wire hole, both ends of the lead screw 3 are rotatably installed on the first guide rail 1, the lead screw 3 is driven to rotate by a first motor, and the output shaft of the first motor is fixedly connected to the lead screw 3 through a coupling, and the lower end of the lifting mechanism is fixedly installed on the sliding seat 2.
[0024] The first motor drives the lead screw 3 to rotate, thereby driving the sliding seat 2 to move carrying the lifting mechanism.
[0025] A preferred technical solution, the lifting mechanism includes a base 4 located below and a top plate 6 located above, the base 4 is installed on a horizontal moving mechanism to slide, the base 4 is fixedly installed on a sliding seat 2, the telescopic rear end of the horizontal telescopic mechanism is installed on the top plate 6 to rotate, at least three array-distributed hydraulic cylinders 5 are provided between the base 4 and the top plate 6, the hydraulic cylinder 5 is vertically installed on the base 4, the upper end of the hydraulic cylinder 5 is fixedly connected to the lower end of the top plate 6, and at least three arrays of hydraulic cylinders 5 can stably support the top plate 6.
[0026] The top plate 6 is driven by the hydraulic cylinder 5 to move vertically, thereby lifting and lowering the vacuum adsorption plate 13 with the horizontal telescopic mechanism.
[0027] The preferred technical solution is that the horizontal telescopic mechanism includes a horizontally arranged crossbeam 8, one end of the crossbeam 8 is rotatably installed at the upper end of the lifting mechanism, and is driven to rotate by a second motor 7, a rotating column is fixedly provided at the lower end of the crossbeam 8, and the lower end of the rotating column is installed on the top plate 6 through a bearing structure for rotation, the second motor 7 is vertically installed at the lower end of the top plate 6, and the output shaft of the second motor 7 passes through the top plate 6 and is fixedly connected to the lower end of the rotating column to drive the rotating column to rotate, a second guide rail 9 is provided on the crossbeam 8 along its length direction, and a moving trolley 10 is slidably provided on the second guide rail 9, and the moving trolley 10 is driven to slide by a cylinder 11 fixedly installed on the crossbeam 8, the cylinder 11 is horizontally installed on the crossbeam 8, and the telescopic rod of the cylinder 11 extends horizontally into and is fixedly connected to the moving trolley 10, and the support frame 12 is fixedly installed on the moving trolley 10.
[0028] In the description of the present utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model.
[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0030] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.
Claims
1. A wafer peeling device, characterized in that: It comprises a horizontal moving mechanism, a lifting mechanism, a horizontal telescopic mechanism, a support frame (12) and a vacuum adsorption plate (13); The lower end of the lifting mechanism is mounted on a horizontal moving mechanism for movement, the telescopic rear end of the horizontal telescopic mechanism is rotatably mounted on the upper end of the lifting mechanism, the vacuum adsorption plate (13) is mounted on the horizontal telescopic mechanism via a support frame (12), the orientation of the vacuum adsorption plate (13) is consistent with the extension direction of the horizontal telescopic mechanism, and the vacuum adsorption plate (13) is connected to a vacuum generator.
2. A wafer peeling device as claimed in claim 1, characterized in that: The number of the vacuum adsorption plates (13) is at least three, and the at least three vacuum adsorption plates (13) are arranged in an array on the same vertical plane.
3. A wafer peeling device as claimed in claim 1, characterized in that: A silica gel cushion layer (14) is provided on the surface of the vacuum adsorption disk (13).
4. A wafer peeling device as claimed in claim 1, characterized in that: The horizontal moving mechanism comprises a first guide rail (1) arranged horizontally, a sliding seat (2) being provided on the first guide rail (1) for sliding cooperation, a thread hole being provided on the sliding seat (2) along the sliding direction, a lead screw (3) being passed through the thread hole, both ends of the lead screw (3) being rotatably mounted on the first guide rail (1), the lead screw (3) being driven to rotate by a first motor, and the lower end of the lifting mechanism being fixedly mounted on the sliding seat (2).
5. The wafer peeling device according to claim 1, characterized in that: The lifting mechanism comprises a base (4) located at the bottom and a top plate (6) located at the top, the base (4) is mounted on a horizontal moving mechanism for sliding, the telescopic rear end of the horizontal telescopic mechanism is mounted on the top plate (6) for rotation, at least three hydraulic cylinders (5) distributed in an array are arranged between the base (4) and the top plate (6), the hydraulic cylinder (5) is vertically mounted on the base (4), and the upper end of the hydraulic cylinder (5) is fixedly connected to the lower end of the top plate (6).
6. The wafer peeling device according to claim 1, characterized in that: The horizontal telescopic mechanism comprises a horizontally arranged crossbeam (8), one end of which is rotatably mounted on the upper end of the lifting mechanism and driven to rotate by a second motor (7), a second guide rail (9) is provided on the crossbeam (8) along its length direction, a moving trolley (10) is slidably arranged on the second guide rail (9), the moving trolley (10) is driven to slide by a cylinder (11) fixedly mounted on the crossbeam (8), and the support frame (12) is fixedly mounted on the moving trolley (10).