Packaging structure with hollow substrate

Abstract

The utility model relates to a packaging structure with a hollow substrate. The packaging structure with the hollow substrate comprises the components of the substrate which is internally provided with a through hole which penetrates through the substrate along a first direction; at least part of the bridging chip is located in the through hole; the first chip structure is located on the top surface of the substrate, the first chip structure comprises a first functional chip and a height compensation layer located on the surface, away from the bridging chip, of the first functional chip, and the first functional chip is electrically connected with the bridging chip and the substrate; and the second chip structure is positioned on the top surface of the substrate, the second chip structure comprises a second functional chip, the second functional chip is electrically connected with the bridging chip and the substrate, the first chip structure and the second chip structure are arranged along a second direction, and the height of the first chip structure is equal to that of the second chip structure. According to the utility model, the functional chips with different heights are electrically connected with the bridging chips, and the limitation of the heights of the functional chips on multi-chip packaging is broken through.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure with a hollow substrate. Background Art

[0002] As various technical industries have higher and higher requirements for the integration and electrical performance of semiconductor devices, packaging technology also needs to be adaptively developed and innovated. A multi-chip stacked packaging structure is a packaging structure in which multiple functional chips are arranged on a packaging substrate. In order to reduce the size of the packaging structure, it is usually necessary to set a through hole on the packaging substrate at the bottom of the packaging structure so that at least part of the bridge chip used to electrically connect the functional chip to the packaging substrate can be located in the through hole. Moreover, setting a through hole in the packaging substrate can also enhance the heat dissipation effect of the packaging structure and ensure that the packaging structure can operate continuously and stably. However, in a multi-chip packaging structure, it is necessary to ensure that the heights of the multiple functional chips are consistent in order to electrically connect the multiple functional chips to the bridge chip. This limits the applicability of packaging functional chips of different heights, which is not conducive to the improvement of the performance of the packaging structure and the expansion of functions.

[0003] Therefore, how to avoid breaking the limitations of functional chips of different heights on multi-chip packaging, thereby improving the performance of the packaging structure and expanding the functions of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a packaging structure with a hollow substrate to solve the problem that functional chips of different heights cannot be electrically connected to a bridge chip, thereby improving the performance of the packaging structure and expanding the function of the packaging structure.

[0005] According to some embodiments, the utility model provides a packaging structure with a hollow substrate, including:

[0006] A substrate, wherein the substrate has a through hole penetrating the substrate along a first direction, wherein the first direction is perpendicular to a top surface of the substrate;

[0007] a bridge chip, at least partially located in the through hole;

[0008] A first chip structure, located on the top surface of the substrate, the first chip structure comprising a first function chip and a height compensation layer located on a surface of the first function chip away from the bridge chip, the first function chip electrically connecting the bridge chip and the substrate;

[0009] A second chip structure is located on the top surface of the substrate, the second chip structure includes a second functional chip, the second functional chip is electrically connected to the bridge chip and the substrate, the first chip structure and the second chip structure are arranged along a second direction, the height of the first chip structure is equal to the height of the second chip structure, and the second direction is parallel to the top surface of the substrate.

[0010] In some embodiments, the first function chip includes a first chip body and a first conductive connection column located on a surface of the first chip body facing the substrate;

[0011] The second functional chip includes a second chip body and a second conductive connecting column located on the surface of the second chip body facing the substrate, and the sum of the heights of the height compensation layer, the first chip body and the first conductive connecting column along the first direction is equal to the sum of the heights of the second chip body and the second conductive connecting column along the first direction.

[0012] In some embodiments, it also includes:

[0013] A first heat dissipation cover, wherein the first heat dissipation cover covers a surface of the height compensation layer away from the first functional chip and a surface of the second functional chip away from the substrate.

[0014] In some embodiments, it also includes:

[0015] A plastic encapsulation layer is used to encapsulate the first chip structure, the second chip structure and the bridge core, and the surface of the plastic encapsulation layer facing away from the substrate is flush with the surface of the height compensation layer facing away from the first functional chip and the surface of the second functional chip facing away from the substrate.

[0016] In some embodiments, it also includes:

[0017] The second heat dissipation cover is located in the through hole and covers the surface of the bridge chip away from the first functional chip, and the side wall of the second heat dissipation cover is in contact with and connected to the side wall of the through hole.

[0018] In some embodiments, a size of the second heat dissipation cover is the same as a size of the through hole, and a size of the bridge chip is smaller than a size of the through hole.

[0019] In some embodiments, the through hole includes a first through hole and a second through hole located below the first through hole along the first direction and connected to the first through hole, the inner diameter of the second through hole is larger than the inner diameter of the first through hole, and the bridge chip is located in the first through hole; the packaging structure with a hollow substrate also includes:

[0020] The second heat dissipation cover is located in the second through hole and covers the surface of the bridge chip facing away from the first functional chip.

[0021] In some embodiments, the surface of the second heat dissipation cover facing away from the bridge chip is flush with the bottom surface of the substrate; or,

[0022] The second heat dissipation cover is entirely located in the second through hole, and along the first direction, there is a gap between a surface of the second heat dissipation cover facing away from the bridge chip and a bottom surface of the substrate.

[0023] In some embodiments, it also includes:

[0024] A supporting structure, located on a surface of the bridge chip facing the first function chip and the second function chip;

[0025] a third conductive connection column, located on a surface of the bridge chip facing the first function chip, and the third conductive connection column penetrates the support structure along the first direction, and the third conductive connection column electrically connects the bridge chip and the first function chip;

[0026] A fourth conductive connection column is located on a surface of the bridge chip facing the second function chip, and the fourth conductive connection column penetrates the support structure along the first direction, and the fourth conductive connection column electrically connects the bridge chip and the second function chip.

[0027] In some embodiments, the support structure includes an insulating support mesh, a filling glue filled in the insulating support mesh, and a first through hole and a second through hole both passing through the insulating support mesh, the third conductive connecting column is located in the first through hole, and the fourth conductive connecting column is located in the second through hole.

[0028] In some embodiments, the support structure further includes thermally conductive particles filled in the insulating support mesh, and the thermally conductive particles are evenly distributed in the insulating support mesh.

[0029] The packaging structure with a hollow substrate provided by the utility model realizes multi-chip packaging by arranging a first chip structure including a first functional chip and a second chip structure including a second functional chip on the top surface of the substrate, thereby improving the integration of the packaging structure. At the same time, by arranging a height compensation layer on the side of the first functional chip away from the substrate, the height of the first chip structure is equal to the height of the second chip structure, that is, the sum of the height of the first functional chip and the height of the height compensation layer is equal to the height of the second functional chip, so that the first functional chip and the second functional chip after height compensation can be electrically connected to the bridge chip at the same time, realizing the electrical connection between functional chips of different heights and the bridge chip, breaking the limitation of the height of the functional chip on the multi-chip packaging, thereby improving the performance of the packaging structure and expanding the function of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Attached Figure 1 It is a cross-sectional schematic diagram of a packaging structure with a hollow substrate in a specific implementation mode of the utility model;

[0031] Attached Figure 2 It is a cross-sectional schematic diagram of another packaging structure with a hollow substrate in a specific implementation manner of the utility model;

[0032] Attached Figure 3A and attached Figure 3B It is a cross-sectional schematic diagram of another packaging structure with a hollow substrate in a specific implementation manner of the utility model;

[0033] Attached Figure 4 It is a structural schematic diagram of a specific embodiment of the utility model after forming the first chip structure and the second chip structure on the carrier;

[0034] Attached Figure 5 It is a schematic diagram of the structure of a specific embodiment of the utility model after a third conductive connecting column and a fourth conductive connecting column are formed in the support structure;

[0035] Attached Figure 6 It is a structural schematic diagram of a specific embodiment of the utility model after the first chip structure and the second chip structure are electrically connected to the bridge chip;

[0036] Attached Figure 7 It is a schematic diagram of the structure of a specific implementation method of the utility model after the plastic sealing layer is formed. DETAILED DESCRIPTION

[0037] The specific implementation of the packaging structure with a hollow substrate provided by the utility model is described in detail below with reference to the accompanying drawings.

[0038] This specific embodiment provides a packaging structure with a hollow substrate, Figure 1FIG. 1 is a cross-sectional schematic diagram of a packaging structure with a hollow substrate in a specific embodiment of the present utility model. Figure 1 As shown, the packaging structure with a hollow substrate includes:

[0039] A substrate 10, wherein the substrate 10 has a through hole 18 penetrating the substrate 10 along a first direction D1, wherein the first direction D1 is perpendicular to a top surface of the substrate 10;

[0040] The bridge chip 11 is at least partially located in the through hole 18;

[0041] A first chip structure, located on the top surface of the substrate 10, the first chip structure comprising a first function chip 12 and a height compensation layer 14 located on a surface of the first function chip 12 away from the bridge chip 11, the first function chip 12 electrically connecting the bridge chip 11 and the substrate 10;

[0042] The second chip structure is located on the top surface of the substrate 10, and the second chip structure includes a second functional chip 13, and the second functional chip 13 is electrically connected to the bridge chip 11 and the substrate 10. The first chip structure and the second chip structure are arranged along a second direction D2, and the height of the first chip structure is equal to the height of the second chip structure. The second direction D2 is parallel to the top surface of the substrate 10.

[0043] Specifically, the substrate 10 may be a printed circuit board. The substrate 10 includes a top surface and a bottom surface relatively distributed along the first direction D1, and a circuit layer located in the substrate 10. The first chip structure and the second chip structure are both located on the top surface of the substrate 10 along the first direction D1, and a lead solder ball 24 is provided on the bottom surface of the substrate 10. The lead solder ball 24 is electrically connected to the circuit layer in the substrate 10, and is used to lead out the signal in the first chip structure and the signal in the second chip structure through the circuit layer or to transmit a control signal to the first chip structure and the second chip structure through the circuit layer. In an example, the first function chip 12 and the second function chip 13 are both flip-chip mounted on the top surface of the substrate 10, and are both electrically connected to the circuit layer in the substrate 10. The height of the first function chip 12 along the first direction D1 is less than the height of the second function chip 13 along the first direction D1, the height compensation layer 14 is mounted on the surface of the first function chip 12 along the first direction D1 away from the substrate 10, and the sum of the height of the first function chip 12 along the first direction D1 and the height of the height compensation layer 14 along the first direction D1 is equal to the height of the second function chip 13 along the first direction D1. The substrate 10 has the through hole 18 penetrating the substrate 10 along the first direction D1, thereby forming a hollow substrate structure. In one example, the bridge chip 11 is entirely located in the through hole 18 to further reduce the size of the package structure with the hollow substrate. In another example, a portion of the bridge chip 11 is located in the through hole 18, and the other portion protrudes from the top surface of the substrate 10 along the first direction D1, thereby simplifying the connection operation of the bridge chip 11 with the first function chip 12 and the second function chip 13.

[0044] In this specific embodiment, by setting the height compensation layer 14 on the side of the first function chip 12 away from the substrate 10, it does not affect the electrical connection between the first function chip 12 and the substrate 10 and the bridge chip 11, and can also compensate for the height of the first function chip 12, so that the surface of the height compensation layer 14 away from the substrate 10 is flush with the surface of the second function chip 13 away from the substrate 10, and the surface of the first function chip 12 facing the substrate 10 is flush with the surface of the second function chip 13 facing the substrate 10, so that the first function chip and the second function chip after height compensation can be electrically connected to the bridge chip at the same time, realizing the electrical connection between function chips of different heights and the bridge chip, breaking the limitation of the height of the function chip on the multi-chip package, thereby improving the performance of the packaging structure and expanding the function of the packaging structure.

[0045] In some embodiments, the first function chip 12 includes a first chip body 121 and a first conductive connection column 122 located on a surface of the first chip body 121 facing the substrate;

[0046] The second functional chip 13 includes a second chip body 131 and a second conductive connecting column 132 located on the surface of the second chip body 131 facing the substrate 10, and the sum of the heights of the height compensation layer 14, the first chip body 121 and the first conductive connecting column 122 along the first direction D1 is equal to the sum of the heights of the second chip body 131 and the second conductive connecting column 132 along the first direction D1.

[0047] Specifically, since the wiring density of the surface of the first chip body 121 facing the substrate 10 is different from the wiring density of the surface of the second chip body 131 facing the substrate 10, the height of the first conductive connection column 122 along the first direction D1 is different from the height of the second conductive connection column 132 along the first direction D1. For example, if the wiring density of the surface of the first chip body 121 facing the substrate 10 is greater than the wiring density of the surface of the second chip body 131 facing the substrate 10, the height of the first conductive connection column 122 along the first direction D1 is less than the height of the second conductive connection column 132 along the first direction D1. In this specific embodiment, the height of the height compensation layer 14 along the first direction D1 can be adjusted so that the sum of the heights of the height compensation layer 14, the first chip body 121 and the first conductive connecting column 122 along the first direction D1 is equal to the sum of the heights of the second chip body 131 and the second conductive connecting column 132 along the first direction D1. This allows functional chips of different heights to be electrically connected to the bridge chip at the same time without changing the structure of the functional chips (such as the first functional chip and the second functional chip), thereby helping to simplify the manufacturing process of the packaging structure with the hollow substrate.

[0048] In order to further enhance the heat dissipation performance of the packaging structure with a hollow substrate, in some embodiments, the packaging structure with a hollow substrate further includes:

[0049] The first heat dissipation cover 16 covers a surface of the height compensation layer 14 away from the first function chip 12 and a surface of the second function chip 13 away from the substrate 10 .

[0050] In one example, the height compensation layer 14 is a metal height compensation layer, so that the height compensation layer 14 can not only be used to perform height compensation for the first functional chip 12, but also dissipate heat for the first functional chip, thereby further enhancing the heat dissipation performance of the packaging structure with a hollow substrate.

[0051] In another example, the height compensation layer 14 is an insulating height compensation layer, so that the height compensation layer 14 can not only be used to perform height compensation on the first functional chip 12, but also can effectively protect the first functional chip 12 and prevent the subsequent mounting and grinding of the first heat dissipation cover 16 from causing damage to the first functional chip 12.

[0052] In some embodiments, the packaging structure with a hollow substrate further includes:

[0053] The plastic encapsulation layer 15 encapsulates the first chip structure, the second chip structure and the bridge core 11, and the surface of the plastic encapsulation layer 15 away from the substrate 10 is flush with the surface of the height compensation layer 14 away from the first functional chip 12 and the surface of the second functional chip 13 away from the substrate 10. In one example, the material of the plastic encapsulation layer 15 is an epoxy resin molding compound. By encapsulating the first functional chip 12, the second functional chip 13 and the height compensation layer 14 with the plastic encapsulation layer 15, the height compensation layer 14 can be protected and supported, thereby further improving the stability of the packaging structure with the hollow substrate.

[0054] Attached Figure 2 FIG. 1 is a cross-sectional schematic diagram of another packaging structure with a hollow substrate in a specific embodiment of the present invention. Figure 2 As shown, the packaging structure with a hollow substrate further includes:

[0055] The second heat dissipation cover 20 is located in the through hole 18 and covers the surface of the bridge chip 11 facing away from the first functional chip 12 . The side wall of the second heat dissipation cover 20 is in contact with the side wall of the through hole 18 .

[0056] In some embodiments, the size of the second heat dissipation cover 20 is the same as the size of the through hole 18 , and the size of the bridge chip 11 is smaller than the size of the through hole 18 .

[0057] Specifically, if Figure 2As shown, the second heat dissipation cover 20 is also provided on the surface of the bridge chip 11 away from the plastic sealing layer 15 to enhance the heat dissipation effect of the bridge chip 11. The side wall of the second heat dissipation cover 20 is in contact with the side wall of the through hole 18, that is, the second heat dissipation cover 20 is embedded in the through hole 18 and closes the through hole 18, so that the second heat dissipation cover 20 not only has a heat dissipation effect, but also can protect the side of the bridge chip 11. The size of the second heat dissipation cover 20 (for example, the width of the second heat dissipation cover 20 along the second direction D2) is the same as the size of the through hole 18 (for example, the width of the through hole 18 along the second direction D2), and the size of the bridge chip 11 (for example, the width of the bridge chip 11 along the second direction D2) is smaller than the size of the through hole 18 (for example, the width of the through hole 18 along the second direction D2), so that the operation of installing the bridge chip 11 to the through hole 18 can be simplified, and the side of the bridge chip 11 can be better protected. Moreover, the size of the second heat dissipation cover 20 is the same as that of the through hole 18 , and the size of the bridge chip 11 is smaller than that of the through hole 18 , so as to facilitate installation of the bridge chip 11 in the through hole 18 and plastic packaging of the bridge chip 11 .

[0058] Attached Figure 3A and attached Figure 3B It is a cross-sectional schematic diagram of another packaging structure with a hollow substrate in a specific implementation mode of the utility model, wherein: Figure 3B Yes Figure 3A , so as to clearly illustrate the structure of the through hole 18 in the substrate 10. In other embodiments, such as Figure 3A and Figure 3B As shown, the through hole 18 includes a first through hole 181 and a second through hole 182 located below the first through hole 181 along the first direction D1 and connected to the first through hole 181, the inner diameter of the second through hole 182 is greater than the inner diameter of the first through hole 181, and the bridge chip 11 is located in the first through hole 181; the packaging structure with a hollow substrate also includes:

[0059] The second heat dissipation cover 20 is located in the second through hole 182 and covers the surface of the bridge chip 11 facing away from the first function chip 12 .

[0060] Specifically, if Figure 3A and Figure 3BAs shown, the through hole 18 includes the first through hole 181 and the second through hole 182 which are interconnected, the bridge chip 11 is installed in the first through hole 181, and the bottom surface of the bridge chip 11 (i.e., the surface of the bridge chip 11 facing away from the first functional chip 12) is flush with the top surface of the second through hole 182 (i.e., the surface of the second through hole 182 facing the first through hole 181). The inner diameter of the second through hole 182 is larger than the inner diameter of the first through hole 181, so that a step-like structure is formed at the connection between the first through hole 181 and the second through hole 182, and the second heat dissipation cover 20 is placed on the table of the step-like structure, so that the second heat dissipation cover 20 can not only be firmly embedded in the substrate 10, improving the stability of the connection between the second heat dissipation cover 20 and the substrate 10, but also effectively dissipating the heat of the bridge chip 11 while protecting the side of the bridge chip 11.

[0061] In some embodiments, the surface of the second heat dissipation cover 20 facing away from the bridge chip 11 is flush with the bottom surface of the substrate 10; or,

[0062] The second heat dissipation cover 20 is entirely located in the second through hole 182, and along the first direction D1, there is a gap between the surface of the second heat dissipation cover 20 that is away from the bridge chip 11 and the bottom surface of the substrate 10. With the above structure, the second heat dissipation cover 20 can be entirely embedded in the through hole 18 without protruding from the substrate 10, thereby avoiding increasing the size of the packaging structure with the hollow substrate.

[0063] In some embodiments, the packaging structure with a hollow substrate further includes:

[0064] A support structure 19 is located on a surface of the bridge chip 11 facing the first function chip 12 and the second function chip 13;

[0065] A third conductive connection column 21 is located on the surface of the bridge chip 11 facing the first function chip 12, and the third conductive connection column 21 penetrates the support structure 19 along the first direction D1, and the third conductive connection column electrically connects the bridge chip 11 and the first function chip 12;

[0066] The fourth conductive connecting column 22 is located on the surface of the bridge chip 11 facing the second function chip 13 , and the fourth conductive connecting column 22 penetrates the support structure 19 along the first direction D1 . The fourth conductive connecting column 22 electrically connects the bridge chip 11 and the second function chip 13 .

[0067] For example, the packaging structure with a hollow substrate also includes the first functional chip 12 including the first chip body 121 and a plurality of first conductive connection pillars 122 located on the surface of the first chip body 121 facing the substrate 10, and the plurality of first conductive connection pillars 122 are arranged at intervals along the second direction D2. A portion of the first conductive connection pillars 122 electrically connect the first chip body 121 with the substrate 10, and another portion of the first conductive connection pillars 122 electrically connect the first chip body 121 with the third conductive connection pillars 21, and the third conductive connection pillars 21 penetrate the support structure 19 and are electrically connected to the bridge chip 11. The second functional chip 13 includes the second chip body 131 and a plurality of second conductive connection pillars 132 located on the surface of the second chip body 131 facing the substrate 10, and the plurality of second conductive connection pillars 132 are arranged at intervals along the second direction D2. A portion of the second conductive connection pillars 132 electrically connects the second chip body 131 and the substrate 10, and another portion of the second conductive connection pillars 132 electrically connects the second chip body 131 and the fourth conductive connection pillars 22, and the fourth conductive connection pillars 22 penetrate the support structure 19 and are electrically connected to the bridge chip 11. The support structure 19 can support the third conductive connection pillars 21 and the fourth conductive connection pillars 22, thereby improving the stability of the electrical connection between the first function chip 12 and the second function chip 13 and the bridge chip 11, and suppressing the deformation of the third conductive connection pillars 21 and the fourth conductive connection pillars 22.

[0068] In some embodiments, the support structure 19 includes an insulating support mesh, a filling glue filled in the insulating support mesh, and a first through hole and a second through hole both passing through the insulating support mesh, the third conductive connecting column 21 is located in the first through hole, and the fourth conductive connecting column 22 is located in the second through hole.

[0069] Specifically, by setting the supporting structure 19 including the insulating support mesh between the bridge chip 11 and the first functional chip 12 and the second functional chip 13, and filling the filling glue in the insulating support mesh, the connection strength between the insulating support mesh and the plastic sealing layer 15 and the bridge chip 11 can be enhanced, and the plastic sealing layer 15 and the third conductive connecting column 21 and the fourth conductive connecting column 22 can be synergistically supported by the insulating support mesh and the filling glue, and the supporting performance of the insulating support mesh is not affected by the state of the filling glue and the filling uniformity, thereby effectively improving the overall stability of the packaging structure with a hollow substrate. By setting the first through hole and the second through hole that penetrate the insulating support mesh along the first direction D1 in the insulating support mesh, and placing the third conductive connection column 21 in the first through hole, and placing the fourth conductive connection column 22 in the second through hole, not only can the third conductive connection column 21 and the fourth conductive connection column 22 be protected by the support structure 19, but the deformation of the third conductive connection column and the fourth conductive connection column can be reduced through the support of the support structure 19, and the deformation of the third conductive connection column can be limited by the first through hole, and the deformation of the fourth conductive connection column can be limited by the second through hole. The third conductive connection column and the fourth conductive connection column can also be isolated by the insulating support mesh and the filling glue, thereby avoiding problems such as bridging and reducing the probability of packaging abnormalities in the packaging structure with a hollow substrate during manufacturing and use.

[0070] In some embodiments, the support structure 19 further includes thermally conductive particles filled in the insulating support mesh, and the thermally conductive particles are evenly distributed in the insulating support mesh.

[0071] Specifically, when the first function chip 12 and the second function chip 13 are mounted on the substrate 10, since the thermal expansion coefficients of the first function chip 12 and the second function chip 13 are different from those of the substrate 10, the stress generated by the temperature change during mounting will be applied to the welding points on the third conductive connecting column and the fourth conductive connecting column, and the welding points are supported by the support structure 19 to avoid the welding points from being broken when the first function chip 12 and the second function chip 13 are mounted. Moreover, by adding the thermal conductive particles to the insulating support mesh, and absorbing and dispersing the heat generated during the mounting of the functional chips by the evenly distributed thermal conductive particles, the welding points are reduced or even prevented from being broken.

[0072] For example, if Figure 1 , Figure 2 and Figure 3A , Figure 3B The packaging structure with a hollow substrate shown in the figure can be formed by the following steps: first, the first function chip 12 and the second function chip 13 covered with the height compensation layer 14 are mounted on the carrier 40 through a release film, the first function chip 12 includes the first chip body 121 and a first conductive connection column 122 located on the surface of the first chip body 121, the second function chip 13 includes the second chip body 131 and a second conductive connection column 132 located on the surface of the second chip body 131, the first function chip 12 and the height compensation layer 14 are used together as the first chip structure, and the second function chip 13 is used as the second chip structure, as shown in FIG. Figure 4 shown.

[0073] Next, the insulating support mesh is placed in a container containing the liquid filling glue, so that the insulating support mesh is completely immersed in the liquid filling glue. After the liquid filling glue fills all the pores in the insulating support mesh, the insulating support mesh is taken out from the container to form an initial support structure including the insulating support mesh and the liquid filling glue. The initial support structure is heat-treated to solidify the liquid filling glue to form the support structure 19 including the insulating support mesh and the solid filling glue. By soaking the insulating support mesh in the liquid filling glue, the filling glue can fully fill the pores in the insulating support mesh, avoiding the air being enclosed by the flow of the liquid filling glue, thereby effectively avoiding the formation of holes in the solidified filling glue, and further improving the support performance of the support structure 19. The support structure 19 is mounted on the surface of the bridge chip 11, and a first through hole and a second through hole as well as a third conductive connecting column 21 located in the first through hole and a fourth conductive connecting column 22 located in the second through hole are formed in the support structure. Figure 5 shown.

[0074] Afterwards, the first chip structure is connected to the bridge chip 11 and the second chip structure is connected to the bridge chip 11, that is, a part of the first conductive connection pillars 122 are electrically connected to the third conductive connection pillars 21, and a part of the second conductive connection pillars 132 are electrically connected to the fourth conductive connection pillars 22. Next, the bridge chip 11 is placed in the through hole 18 in the substrate 10, and the first function chip 12 and the second function chip 13 are mounted on the substrate 10, that is, another part of the first conductive connection pillars 122 are electrically connected to the substrate 10, and another part of the second conductive connection pillars 132 are electrically connected to the substrate 10, and the second heat dissipation cover plate 20 is mounted on the surface of the bridge chip 11 away from the first chip structure and the second chip structure, as shown in FIG. Figure 6 After removing the carrier board 40 and the release film, the plastic encapsulation layer 15 is formed to encapsulate the first chip structure, the second chip structure and the bridge chip 11, and the lead solder balls 24 are formed on the bottom surface of the substrate 10, as shown. Figure 7 Next, the first heat dissipation cover plate 16 is mounted on the surface of the first chip structure and the second chip structure away from the substrate 10, and the Figure 1 The structure shown.

[0075] The packaging structure with a hollow substrate provided in this specific embodiment realizes multi-chip packaging by arranging a first chip structure including a first functional chip and a second chip structure including a second functional chip on the top surface of the substrate, thereby improving the integration of the packaging structure. At the same time, by arranging a height compensation layer on the side of the first functional chip away from the substrate, the height of the first chip structure is equal to the height of the second chip structure, that is, the sum of the height of the first functional chip and the height of the height compensation layer is equal to the height of the second functional chip, so that the first functional chip and the second functional chip after height compensation can be electrically connected to the bridge chip at the same time, realizing the electrical connection between functional chips of different heights and the bridge chip, breaking the limitation of the height of the functional chip on the multi-chip packaging, thereby improving the performance of the packaging structure and expanding the function of the packaging structure.

[0076] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure with a hollow substrate, characterized in that: include: A substrate, wherein the substrate has a through hole penetrating the substrate along a first direction, wherein the first direction is perpendicular to a top surface of the substrate; a bridge chip, at least partially located in the through hole; A first chip structure, located on the top surface of the substrate, the first chip structure comprising a first function chip and a height compensation layer located on a surface of the first function chip away from the bridge chip, the first function chip electrically connecting the bridge chip and the substrate; A second chip structure is located on the top surface of the substrate, the second chip structure includes a second functional chip, the second functional chip is electrically connected to the bridge chip and the substrate, the first chip structure and the second chip structure are arranged along a second direction, the height of the first chip structure is equal to the height of the second chip structure, and the second direction is parallel to the top surface of the substrate.

2. The packaging structure with a hollow substrate according to claim 1, characterized in that: The first function chip comprises a first chip body and a first conductive connection column located on a surface of the first chip body facing the substrate; The second functional chip includes a second chip body and a second conductive connecting column located on the surface of the second chip body facing the substrate, and the sum of the heights of the height compensation layer, the first chip body and the first conductive connecting column along the first direction is equal to the sum of the heights of the second chip body and the second conductive connecting column along the first direction.

3. The packaging structure with a hollow substrate according to claim 1, characterized in that: Also includes: A first heat dissipation cover, wherein the first heat dissipation cover covers a surface of the height compensation layer away from the first functional chip and a surface of the second functional chip away from the substrate.

4. The packaging structure with a hollow substrate according to claim 1, characterized in that: Also includes: A plastic encapsulation layer is used to encapsulate the first chip structure, the second chip structure and the bridge chip, and a surface of the plastic encapsulation layer away from the substrate is flush with a surface of the height compensation layer away from the first functional chip and a surface of the second functional chip away from the substrate.

5. The packaging structure with a hollow substrate according to claim 1, characterized in that: Also includes: The second heat dissipation cover is located in the through hole and covers the surface of the bridge chip away from the first functional chip, and the side wall of the second heat dissipation cover is in contact with and connected to the side wall of the through hole.

6. The packaging structure with a hollow substrate according to claim 5, characterized in that: The size of the second heat dissipation cover is the same as that of the through hole, and the size of the bridge chip is smaller than that of the through hole.

7. The packaging structure with a hollow substrate according to claim 1, characterized in that: The through hole includes a first through hole and a second through hole located below the first through hole along the first direction and connected to the first through hole, the inner diameter of the second through hole is larger than the inner diameter of the first through hole, and the bridge chip is located in the first through hole; the packaging structure with a hollow substrate also includes: The second heat dissipation cover is located in the second through hole and covers the surface of the bridge chip facing away from the first functional chip.

8. The packaging structure with a hollow substrate according to claim 7, characterized in that: The surface of the second heat dissipation cover facing away from the bridge chip is flush with the bottom surface of the substrate; or, The second heat dissipation cover is entirely located in the second through hole, and along the first direction, there is a gap between a surface of the second heat dissipation cover facing away from the bridge chip and a bottom surface of the substrate.

9. The packaging structure with a hollow substrate according to claim 1, characterized in that: Also includes: A supporting structure, located on a surface of the bridge chip facing the first function chip and the second function chip; a third conductive connection column, located on a surface of the bridge chip facing the first function chip, and the third conductive connection column penetrates the support structure along the first direction, and the third conductive connection column electrically connects the bridge chip and the first function chip; A fourth conductive connection column is located on a surface of the bridge chip facing the second function chip, and the fourth conductive connection column penetrates the support structure along the first direction, and the fourth conductive connection column electrically connects the bridge chip and the second function chip.

10. The packaging structure with a hollow substrate according to claim 9, characterized in that: The support structure includes an insulating support mesh, a filling glue filled in the insulating support mesh, and a first through hole and a second through hole both passing through the insulating support mesh. The third conductive connecting column is located in the first through hole, and the fourth conductive connecting column is located in the second through hole.

11. The packaging structure with a hollow substrate according to claim 10, characterized in that: The support structure further includes heat-conducting particles filled in the insulating support mesh, and the heat-conducting particles are evenly distributed in the insulating support mesh.

Images