Semiconductor packaging structure and high-temperature ceramic tube shell packaging device thereof

Abstract

The utility model discloses a semiconductor packaging structure and a high-temperature ceramic tube shell packaging device thereof, and the high-temperature ceramic tube shell packaging device comprises a ceramic upper cover which is provided with a first sealing ring; the ceramic tube shell is provided with a second sealing ring; the carrier plate is provided with at least two positioning cavities and a limiting groove, the positioning cavities are used for containing the ceramic upper cover, the limiting groove is used for limiting the position of the ceramic tube shell covering the ceramic upper cover, and the limiting groove and the positioning cavities are arranged in a matched mode so that the first sealing ring and the second sealing ring can make aligned contact; the cover plate is arranged above the carrier plate; the first end of the connecting piece abuts against the ceramic tube shell, and the second end of the connecting piece penetrates through the cover plate and is fixedly connected with the cover plate. The device not only can eliminate errors caused by manual operation, but also can realize batch operation of ceramic packaging, and can reduce position deviation occurring in the sintering process of the ceramic upper cover so as to improve the packaging effect of the ceramic upper cover and the ceramic tube shell.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, and more specifically, to a high-temperature ceramic tube shell packaging device and also to a semiconductor packaging structure including the high-temperature ceramic tube shell packaging device. Background Art

[0002] In the application fields of aviation, aerospace, underwater operations, etc., electronic components need to work under relatively extreme conditions (such as high temperature, high humidity, vacuum, high pressure, etc.). Traditional non-hermetic packaging (plastic packaging) uses epoxy resin to wrap the chip, which has weak ability to resist external stress and is very easy to fail in a short period of time under these extreme conditions. Therefore, better packaging processes and packaging materials are needed to ensure the normal operation and reliability of components, which also puts higher demands and challenges on hermetic packaging.

[0003] In the existing technology, ceramic packaging can provide high reliability and sealing performance, and has the characteristics of good insulation performance, low dielectric constant, high frequency performance, and stable chemical properties. It is often used in RF power devices. The ceramic packaging structure consists of two parts: a ceramic shell and a ceramic cover. The main ceramic packaging materials currently used are aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), and beryllium oxide (BeO). Based on the different materials used for airtight packaging, different materials have different packaging methods. The main packaging methods include fusion welding, brazing, and glue sealing.

[0004] Among them, during the brazing operation of ceramic packaging, the ceramic cover and the ceramic shell are generally installed manually. If there is no corresponding packaging fixture to assist in positioning and apply appropriate pressure, the ceramic cover may easily shift in position, or the eutectic metal between the ceramic cover and the ceramic shell may not be fully fused, resulting in insufficient strength or poor airtightness of the packaged product, thereby reducing the product yield.

[0005] In summary, how to eliminate the errors caused by manual operation and realize the batch operation of ceramic packaging is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0006] In view of this, the purpose of the utility model is to provide a high-temperature ceramic tube shell packaging device, which can not only eliminate the errors caused by manual operation, but also realize batch operation of ceramic packaging, and reduce the position deviation occurring during the sintering process of the ceramic upper cover, so as to improve the packaging effect of the ceramic upper cover and the ceramic tube shell.

[0007] Another object of the utility model is to provide a semiconductor packaging structure including the above-mentioned high temperature ceramic tube shell packaging device.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A high temperature ceramic tube shell packaging device, comprising:

[0010] A ceramic upper cover provided with a first sealing ring;

[0011] A ceramic tube shell provided with a second sealing ring;

[0012] A carrier plate, which is provided with at least two positioning cavities and limiting grooves, wherein the positioning cavity is used to accommodate the ceramic upper cover, and the limiting groove is used to limit the position of the ceramic tube shell covered on the ceramic upper cover, and the limiting groove is arranged in cooperation with the positioning cavity so that the first sealing ring and the second sealing ring are aligned and contacted;

[0013] A cover plate, which is arranged above the carrier plate;

[0014] A connecting member, a first end of which abuts against the ceramic tube shell, and a second end of which passes through the cover plate and is fixedly connected to the cover plate.

[0015] In one embodiment, the second end is provided with a threaded structure, the cover plate is provided with a through hole, the threaded structure passes through the through hole and is inserted into the counterweight, and the threaded structure is locked on the cover plate by a nut.

[0016] In one embodiment, the same ceramic tube shell abuts against two symmetrically distributed first ends.

[0017] In one embodiment, a spring is sleeved on the outer periphery of the connecting member, one end of the spring abuts against the cover plate, and the other end of the spring abuts against the first end.

[0018] In one embodiment, the first end is a crown head structure.

[0019] In one embodiment, the carrier plate and the cover plate are detachably connected.

[0020] In one embodiment, the carrier plate is provided with a plurality of positioning posts, and the cover plate is provided with positioning holes corresponding to the positions of the positioning posts.

[0021] In one embodiment, the surfaces of the first sealing ring and the second sealing ring are both provided with a gold-plated layer, and a gold-tin solder sheet is provided between the first sealing ring and the second sealing ring.

[0022] In one embodiment, the plurality of positioning cavities on the carrier are distributed in a matrix.

[0023] A semiconductor packaging structure comprises any one of the high-temperature ceramic shell packaging devices described above.

[0024] When using the high-temperature ceramic tube shell packaging device provided by the utility model, first, multiple ceramic upper covers can be placed upside down in the positioning cavity of the carrier plate; then, multiple ceramic tube shells are placed upside down on the ceramic upper cover, and the carrier plate has a limit groove for limiting the positioning of the multiple ceramic tube shells, and can ensure that the second sealing ring of the ceramic tube shell and the first sealing ring of the ceramic upper cover are fully aligned and in contact; then, multiple connectors are passed through the cover plate and fixedly connected to the cover plate; then, the cover plate assembled with the connectors is installed above the carrier plate assembled with the ceramic upper cover and the ceramic tube shell, so as to realize the preliminary assembly operation of the high-temperature ceramic tube shell packaging device; finally, the assembled high-temperature ceramic tube shell packaging device is placed in a high-temperature, vacuum and nitrogen-filled environment, and the solder sheet prefabricated on the first sealing ring of the ceramic upper cover is melted and undergoes a eutectic reaction with the solder sheet on the second sealing ring of the ceramic tube shell, so that the ceramic upper cover and the ceramic tube shell are combined, and finally the sealing operation is completed.

[0025] The device adopts structures such as positioning cavities and limit grooves, which can effectively eliminate errors caused by manual operation. Moreover, the connecting piece can resist the ceramic tube shell to reduce the position deviation that occurs during the sintering process of the ceramic upper cover. In addition, the device can perform capping operations on multiple ceramic upper covers and ceramic tube shells at the same time to perform batch operations and improve the efficiency of the capping operation.

[0026] In summary, the high-temperature ceramic tube shell packaging device provided by the utility model can not only eliminate the errors caused by manual operation, but also realize batch operation of ceramic packaging, and can reduce the position deviation occurring during the sintering process of the ceramic upper cover, so as to improve the packaging effect of the ceramic upper cover and the ceramic tube shell.

[0027] In addition, the utility model also provides a semiconductor packaging structure including the above-mentioned high-temperature ceramic tube shell packaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the structure of the carrier provided by the utility model;

[0030] Figure 2 is a structural schematic diagram of the cover plate;

[0031] Figure 3 is a schematic diagram of the structure of the connecting piece;

[0032] Figure 4 is a schematic diagram of the structure of the counterweight;

[0033] Figure 5 It is a schematic diagram of the structure of the ceramic upper cover;

[0034] Figure 6 It is a schematic diagram of the structure of the gold-tin solder sheet;

[0035] Figure 7 It is a structural schematic diagram of a ceramic tube shell;

[0036] Figure 8 It is the structural diagram of the spring;

[0037] Fig. 9 An exploded view of a high temperature ceramic tube package device;

[0038] Fig.10 It is a structural schematic diagram of the ceramic upper cover being installed on the carrier board;

[0039] Fig.11 It is a structural schematic diagram of the ceramic tube shell being installed on the ceramic upper cover;

[0040] Fig.12 It is a schematic diagram of the structure of installing the counterweight block and the connecting parts to the cover plate;

[0041] Fig.13 Schematic diagram of the assembly of the carrier plate and the cover plate.

[0042] Reference numerals:

[0043] 1-ceramic upper cover; 11-first sealing ring; 2-ceramic tube shell; 21-second sealing ring; 3-carrier plate; 31-positioning cavity; 32-limiting groove; 33-positioning column; 4-cover plate; 41-positioning hole; 5-connector; 51-threaded structure; 52-crown head structure; 6-counterweight block; 7-spring; 8-nut, 9-gold-tin solder sheet. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0045] The core of the utility model is to provide a high-temperature ceramic tube shell packaging device, which can not only eliminate the error of manual operation, but also realize the batch operation of ceramic packaging, and can reduce the position deviation during the sintering process of the ceramic upper cover, so as to improve the packaging effect of the ceramic upper cover and the ceramic tube shell. Another core of the utility model is to provide a semiconductor packaging structure including the above-mentioned high-temperature ceramic tube shell packaging device.

[0046] Please refer to Figures 1 to 12 .

[0047] This specific embodiment provides a high temperature ceramic tube shell packaging device, including:

[0048] A ceramic upper cover 1, which is provided with a first sealing ring 11;

[0049] A ceramic tube shell 2, which is provided with a second sealing ring 21;

[0050] The carrier plate 3 is provided with at least two positioning cavities 31 and limiting grooves 32. The positioning cavity 31 is used to accommodate the ceramic upper cover 1. The limiting grooves 32 are used to limit the position of the ceramic tube shell 2 covered on the ceramic upper cover 1. The limiting grooves 32 are arranged in cooperation with the positioning cavity 31 so that the first sealing ring 11 and the second sealing ring 21 are aligned and contacted;

[0051] A cover plate 4, which is arranged above the carrier plate 3;

[0052] The first end of the connecting member 5 abuts against the ceramic tube shell 2 , and the second end of the connecting member 5 passes through the cover plate 4 and is fixedly connected to the cover plate 4 .

[0053] It should be noted that the limiting groove 32 is arranged in cooperation with the positioning cavity 31 so that the first sealing ring 11 and the second sealing ring 21 are aligned and contacted. It can mean that after the ceramic upper cover 1 is placed in the positioning cavity 31, the ceramic tube shell 2 is placed on the ceramic upper cover 1. During the placement of the ceramic tube shell 2, the limiting groove 32 can effectively limit the position of the ceramic tube shell 2, eliminate errors caused by manual operation, and ensure that the first sealing ring 11 of the ceramic upper cover 1 and the second sealing ring 21 of the ceramic tube shell 2 are aligned and contacted, thereby ensuring that subsequent brazing is carried out accurately.

[0054] That is, after the ceramic upper cover 1 and the ceramic tube shell 2 are placed, the solder sheets of the first sealing ring 11 and the second sealing ring 21 can be aligned and contacted (the first sealing ring 11 and the second sealing ring 21 are concave and convex matched), and the device is placed in a furnace and heated to a temperature higher than the eutectic melting point to complete the packaging operation. In addition, the first end of the connector 5 is in contact with the ceramic tube shell 2, which helps to press the ceramic tube shell 2 and reduce the position deviation of the ceramic upper cover 1 during the sintering process.

[0055] In actual use, the shape, structure, size, material, position, etc. of the ceramic upper cover 1, the ceramic tube shell 2, the carrier plate 3, the cover plate 4 and the connector 5 can be determined according to actual conditions and actual needs.

[0056] When using the high temperature ceramic tube shell packaging device provided by the utility model (structure as Figures 1 to 9 As shown in the figure, first, multiple ceramic upper covers 1 can be placed upside down in the positioning cavity 31 of the carrier 3; then, multiple ceramic tube shells 2 are placed upside down on the ceramic upper cover 1, and the carrier 3 has a limiting groove 32 for limiting the positioning of the multiple ceramic tube shells 2, and can ensure that the second sealing ring 21 of the ceramic tube shell 2 and the first sealing ring 11 of the ceramic upper cover 1 are fully aligned and contacted; then, multiple connecting members 5 are passed through the cover plate 4 and fixedly connected to the cover plate 4; then, the cover plate 4 equipped with the connecting members 5 is installed above the carrier 3 equipped with the ceramic upper cover 1 and the ceramic tube shell 2, so as to realize the preliminary assembly operation of the high-temperature ceramic tube shell packaging device; finally, the assembled high-temperature ceramic tube shell packaging device is placed in a high-temperature, vacuum and nitrogen-filled environment, and the solder sheet on the first sealing ring 11 prefabricated on the ceramic upper cover 1 is melted and undergoes a eutectic reaction with the solder sheet on the second sealing ring 21 of the ceramic tube shell 2, so that the ceramic upper cover 1 and the ceramic tube shell 2 are combined, and finally the capping operation is completed.

[0057] The device adopts structures such as a positioning cavity 31 and a limiting groove 32, which can effectively eliminate errors caused by manual operation. Moreover, the connecting piece 5 can abut against the ceramic tube shell 2 to reduce the position deviation that occurs during the sintering process of the ceramic upper cover 1. In addition, the device can perform capping operations on multiple ceramic upper covers 1 and ceramic tube shells 2 at the same time to perform batch operations and improve the efficiency of the capping operation.

[0058] In summary, the high-temperature ceramic tube shell packaging device provided by the utility model can not only eliminate the errors caused by manual operation, but also realize batch operation of ceramic packaging, and can reduce the position deviation occurring during the sintering process of the ceramic upper cover 1, so as to improve the packaging effect of the ceramic upper cover 1 and the ceramic tube shell 2.

[0059] In one embodiment, the structure is as Figure 4 As shown, the second end is provided with a threaded structure 51 , the cover plate 4 is provided with a through hole, the threaded structure 51 passes through the through hole and is inserted into the counterweight 6 , and the threaded structure 51 is locked on the cover plate 4 by a nut 8 .

[0060] It should be noted that the connector 5 can be set as a counterweight screw, and the counterweight block 6 can be set as a ring structure assembled on the counterweight screw. During the assembly process, the first end of the counterweight screw can be abutted against the ceramic tube shell 2, and a threaded structure 51 can be set at the second end of the counterweight screw. The threaded structure 51 passes through the cover plate 4 and is inserted into the counterweight block 6. Finally, the threaded structure 51 is locked by the nut 8, so that the counterweight block 6 is installed between the cover plate 4 and the nut 8. By fixing the position of the counterweight block 6 and the counterweight screw by the nut 8, a counterweight can be provided for the ceramic upper cover 1 and the ceramic tube shell 2 during sintering, so as to avoid the ceramic upper cover 1 from moving during the sintering process.

[0061] In one embodiment, the same ceramic tube shell 2 is abutted against two symmetrically distributed first ends. That is, each ceramic tube shell 2 is abutted by two connecting members 5 (weight screws) to ensure uniform force on the ceramic tube shell 2, and each weight screw is provided with a weight block 6 to press the ceramic tube shell 2 through the weight screw and the weight block 6 to prevent the ceramic upper cover 1 from displacement during the sintering process.

[0062] It should be noted that the pressing force applied to the ceramic tube shell 2 should not be too large, so as to avoid pressure loss or deformation of the ceramic tube shell 2, and the pressing force applied to the ceramic tube shell 2 should not be too small, so as to avoid failure to press the ceramic tube shell 2 when packaging the ceramic tube shell 2 and the ceramic upper cover 1, so that the ceramic upper cover 1 still deforms. The weight of the two counterweights 6 and the two counterweight screws can be in the range of 100g-110g in total, so that the pressing force applied to the ceramic tube shell 2 is moderate, which helps to improve the packaging effect of the ceramic tube shell 2 and the ceramic upper cover 1.

[0063] In one embodiment, a spring 7 is sleeved on the outer periphery of the connecting member 5, one end of the spring 7 abuts against the cover plate 4, and the other end of the spring 7 abuts against the first end, and the structure is as follows: Fig. 9 shown.

[0064] It should be noted that the counterweight block 6 can be fixed in position by the nut 8, and the gravity of the counterweight block 6 and the counterweight screw and the telescopic force of the spring 7 can provide counterweight for the ceramic upper cover 1 and the ceramic tube shell 2 to prevent the ceramic upper cover 1 from being displaced during the sintering process. In addition, when the cover plate 4 is uneven, the spring 7 at a lower position can provide an upward elastic force for the cover plate 4 to keep the cover plate 4 level, so that the force on each ceramic tube shell 2 is more uniform.

[0065] In one embodiment, the first end is a crown head structure 52, the structure of which is as follows: Figure 3 As shown, the contact between the first end and the ceramic tube shell 2 is made into multi-point contact, so as to increase the contact reliability between the first end and the ceramic tube shell 2.

[0066] In one embodiment, the carrier plate 3 and the cover plate 4 are detachably connected. When one of the carrier plate 3 or the cover plate 4 is damaged, the damaged part can be replaced by disassembly, and the new part can continue to be used in combination with other undamaged parts to increase the service life of the device and reduce the maintenance cost of the device.

[0067] In one embodiment, a plurality of positioning posts 33 are provided on the carrier plate 3, and the structure is as follows: Figure 1 As shown, the cover plate 4 is provided with a positioning hole 41 at a position corresponding to the positioning column 33, and the structure is as follows Figure 2 For example, positioning posts 33 may be provided at the four corners and the middle of the carrier plate 3, and positioning holes 41 may be provided at the four corners and the middle of the cover plate 4. By correspondingly engaging the positioning posts 33 and the positioning holes 41, the carrier plate 3 and the cover plate 4 can be fixedly connected, and the carrier plate 3 and the cover plate 4 can be easily separated.

[0068] In one embodiment, the surfaces of the first sealing ring 11 and the second sealing ring 21 are both provided with a gold-plated layer, and a gold-tin solder sheet 9 is provided between the first sealing ring 11 and the second sealing ring 21 .

[0069] It should be noted that the gold-tin alloy solder sheet has excellent mechanical properties, and has unique wettability and oxidation resistance, and can achieve flux-free sealing and eliminate flux pollution. When the ceramic upper cover 1 and the ceramic tube shell 2 are brazed, no complicated machine is required. The packaging operation can be completed by placing the ceramic upper cover 1 and the ceramic tube shell 2 in place and then putting them in a furnace and heating them to a temperature higher than the eutectic melting point, that is, the gold-plated layer of the first sealing ring 11, the gold-tin solder sheet 9 and the gold-plated layer of the second sealing ring 21 can be soldered without flux.

[0070] In one embodiment, the plurality of positioning cavities 31 on the carrier plate 3 are distributed in a matrix, for example, Figure 2 As shown, six positioning cavities 31 are provided to simultaneously perform packaging operations on six ceramic upper covers 1 and ceramic tube shells 2, thereby effectively improving the packaging operation efficiency.

[0071] In order to further illustrate the use method of the high temperature ceramic tube shell packaging device provided by the utility model, an example is given below to illustrate it.

[0072] Step 1, placing the ceramic upper cover 1: placing multiple ceramic upper covers 1 upside down in the positioning cavity 31 of the carrier 3, the structure is as follows Fig.10 As shown;

[0073] Step 2, placing the ceramic tube shell 2: placing multiple ceramic tube shells 2 upside down on the ceramic upper cover 1 of step 1, the carrier 3 has a limiting groove 32 for limiting and positioning the positions of the multiple ceramic tube shells 2, and can ensure that the second sealing ring 21 of the ceramic tube shell 2 and the first sealing ring 11 of the ceramic upper cover 1 are fully in contact, the structure is as follows Fig.11 As shown;

[0074] Step 3, assemble the connector 5 (i.e., the counterweight screw): install multiple counterweight screws on the cover plate 4 through the through holes, and connect them to the cover plate 4 through the nut 8, wherein the outer periphery of the counterweight screw is sleeved with a spring 7 to provide a downward pressure on the ceramic tube shell 2, and it is also possible not to add the spring 7, and only the gravity of the counterweight screw and the counterweight block 6 is used to provide the counterweight force on the ceramic tube shell 2. If the spring 7 is added, the elastic force of the compressed spring 7 can be used to provide a downward force on the ceramic tube shell 2 equivalent to the counterweight, and the forces of each spring 7 on each ceramic tube shell 2 are independent of each other and do not interfere with each other. The structure is as follows: Fig.12 As shown;

[0075] Step 4, placing the cover plate 4: The cover plate 4 assembled with the counterweight screw in step 3 is placed on the carrier plate 3 assembled with the ceramic upper cover 1 and the ceramic tube shell 2 through the positioning column 33. The structure is as follows: Fig.13 As shown;

[0076] Step 5, sintering: Under high temperature, vacuum and nitrogen environment, the gold-tin solder sheet 9 prefabricated on the first seal of the ceramic upper cover 1 melts and undergoes a eutectic reaction with the Au-Sn alloy solder sheet on the second sealing ring 21 of the ceramic tube shell 2, so that the ceramic upper cover 1 and the ceramic tube shell 2 are combined together to complete the sealing operation.

[0077] The device adds a counterweight to the inverted ceramic tube shell 2. During the capping operation, due to the presence of the positioning cavity 31 and the limiting groove 32, the ceramic upper cover 1 and the ceramic tube shell 2 can be accurately docked and placed, thereby avoiding errors caused by manual placement. During the high-temperature heating process of the solder sheet melting and spreading, it is not easy to deviate, thereby improving the yield rate of the package.

[0078] In addition to the above-mentioned high-temperature ceramic tube shell packaging device, the present invention also provides a semiconductor packaging structure including the high-temperature ceramic tube shell packaging device disclosed in the above-mentioned embodiment. For the structures of other parts of the semiconductor packaging structure, please refer to the prior art and will not be described in detail herein.

[0079] It should be noted that, in the first sealing ring 11 and the second sealing ring 21 mentioned in the present invention, the first and the second are only used to distinguish the difference in position, and there is no distinction in order.

[0080] In addition, it should be noted that the directions or positional relationships indicated by "above" and "below" in the present invention are based on the directions or positional relationships shown in the accompanying drawings and are only for the purpose of simplifying the description and facilitating understanding. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0081] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other. Any combination of all embodiments provided by the utility model is within the protection scope of this utility model and will not be described in detail here.

[0082] The semiconductor packaging structure and high-temperature ceramic shell packaging device provided by the utility model are introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A high temperature ceramic tube package device, characterized in that: include: A ceramic upper cover (1) provided with a first sealing ring (11); A ceramic tube shell (2) provided with a second sealing ring (21); A carrier plate (3) provided with at least two positioning cavities (31) and limiting grooves (32), wherein the positioning cavity (31) is used to accommodate the ceramic upper cover (1), and the limiting grooves (32) are used to limit the position of the ceramic tube shell (2) covered on the ceramic upper cover (1), and the limiting grooves (32) are arranged in cooperation with the positioning cavity (31) so that the first sealing ring (11) and the second sealing ring (21) are aligned and in contact; A cover plate (4) disposed above the carrier plate (3); A connecting member (5), a first end of which abuts against the ceramic tube shell (2), and a second end of which passes through the cover plate (4) and is fixedly connected to the cover plate (4).

2. The high temperature ceramic tube package device according to claim 1, characterized in that: The second end is provided with a threaded structure (51), the cover plate (4) is provided with a through hole, the threaded structure (51) passes through the through hole and is inserted into the counterweight (6), and the threaded structure (51) is locked on the cover plate (4) by a nut (8).

3. The high temperature ceramic tube package device according to claim 2, characterized in that: The same ceramic tube shell (2) abuts against two symmetrically distributed first ends.

4. The high temperature ceramic tube package device according to claim 3, characterized in that: A spring (7) is sleeved on the outer periphery of the connecting member (5), one end of the spring (7) abuts against the cover plate (4), and the other end of the spring (7) abuts against the first end.

5. The high temperature ceramic tube package device according to claim 2, characterized in that: The first end is a crown head structure (52).

6. The high temperature ceramic tube package device according to any one of claims 1 to 5, characterized in that: The carrier plate (3) and the cover plate (4) are detachably connected.

7. The high temperature ceramic tube package device according to claim 6, characterized in that: The carrier plate (3) is provided with a plurality of positioning posts (33), and the cover plate (4) is provided with positioning holes (41) at positions corresponding to the positioning posts (33).

8. The high temperature ceramic tube package device according to any one of claims 1 to 5, characterized in that: The surfaces of the first sealing ring (11) and the second sealing ring (21) are both provided with a gold-plated layer, and a gold-tin solder sheet (9) is provided between the first sealing ring (11) and the second sealing ring (21).

9. The high temperature ceramic tube package device according to any one of claims 1 to 5, characterized in that: The plurality of positioning cavities (31) on the carrier plate (3) are distributed in a matrix.

10. A semiconductor packaging structure, characterized in that: A high temperature ceramic tube package device comprising any one of claims 1 to 9.

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