Packaging structure
The packaging structure with metal support pillars and plates addresses the issue of substrate area occupation, allowing for increased component integration and miniaturization by connecting electrodes through support structures.
Patent Information
- Application Number
- CN202420971067.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-07
AI Technical Summary
Existing packaging structures occupy a large area of the substrate, limiting the integration of additional electronic components and increasing the package volume, which hinders miniaturization.
A packaging structure that includes metal support pillars and plates arranged above a chip, with electrodes of electronic components connected through these supports, allowing for integration of more components on a limited substrate area.
Reduces the occupied substrate area and overall volume, facilitating integration and miniaturization by enabling more electronic components to be stacked above the chip.
Smart Images
Figure CN222261044U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging, in particular to a packaging structure. Background Art
[0002] In the prior art, chips and other electronic components are directly arranged on the surface of the substrate, occupying a large area of the substrate. If more electronic components are added, the area of the substrate must be further increased, resulting in a large package volume that cannot accommodate the integration of more electronic components. Utility Model Content
[0003] The utility model aims to overcome the problem of large packaging volume of the existing packaging structure and provides a packaging structure.
[0004] In order to achieve the above object, the utility model provides a packaging structure, including:
[0005] substrate;
[0006] A chip is located on the surface of the substrate;
[0007] A metal support structure, the metal support structure comprising at least two metal support pillars and a metal support plate corresponding to each metal support pillar, the metal support pillars are located on the surface of the substrate, and the metal support plate is located on the surface of the corresponding metal support pillar and is laterally arranged above the chip;
[0008] A first electronic component, wherein different electrodes of the first electronic component are respectively located on different surfaces of the metal support plates and are respectively electrically connected to the substrate through corresponding metal support columns.
[0009] As an implementation method, the metal support structure is at least one group, and each group of metal support structures corresponds to at least one first electronic component.
[0010] As an implementable embodiment, the number of metal support columns and the number of metal support plates of the metal support structure correspond to the number of electrodes of the first electronic component.
[0011] As an implementation method, the metal support structures are arranged in sequence along the length direction of the chip.
[0012] As an implementation method, the metal support structures are arranged in sequence along the width direction of the chip.
[0013] As an implementation method, the at least two metal support pillars are located on the same side of the chip.
[0014] As an implementation method, there is a gap between the metal support structure and the chip.
[0015] As an implementable embodiment, it also includes:
[0016] A plastic sealing body located on the surface of the substrate and used to plastic seal the chip, the metal support structure and the first electronic component;
[0017] A metal shielding layer is located on the surface of the plastic package body.
[0018] As an implementable embodiment, it also includes:
[0019] A metal retaining wall arranged around the chip;
[0020] A metal cover plate located on the surface of the metal retaining wall and between the metal support plate and the chip;
[0021] The metal retaining wall has an opening, and the side wall of the metal shielding layer covers the opening so as to form a closed space for accommodating the chip together with the metal retaining wall and the metal cover plate.
[0022] Beneficial effects of the utility model:
[0023] The utility model discloses a packaging structure, in which a metal support plate is arranged above a chip through a metal support column, and electrodes of a first electronic component are arranged on different surfaces of the metal support plate, and are electrically connected to the substrate through different metal support columns. The electronic components are arranged above the chip, so that more electronic components can be integrated on a limited substrate surface area. The occupied area of the substrate and the overall volume are reduced, which is conducive to integration and miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a packaging schematic diagram provided by the embodiment to illustrate the technical problem;
[0025] Figure 2-5 A schematic diagram of a packaging structure provided for some embodiments of the utility model;
[0026] Figure 6-7 A schematic diagram of the preparation process of a packaging structure is provided for some embodiments of the utility model. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] The technical terms or scientific terms used in this application should be understood by those skilled in the art in the ordinary sense. The terms "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, the meaning of "multiple" is two or more. The directional terms such as "left", "right", "upper" and "lower" are defined relative to the orientation of the schematic placement of the chip stack package in the accompanying drawings. It should be understood that these directional terms are relative concepts, which are used for description and clarification relative to, and they can change accordingly according to the change of the orientation of the chip stack package. It should be noted that the terms "including" and "having" and their variations involved in this application are intended to cover non-exclusive inclusions.
[0029] In this application document, unless otherwise clearly specified and limited, the terms "connected", "connection", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] After research, see Figure 1 , provides a packaging structure, Figure 1 (a) is a schematic diagram of the side view position of each part in the packaging structure. Figure 1 (b) is a schematic diagram of the top view of (a), including a substrate 10, a chip 20, a first electronic component 30, a second electronic component 40, a plastic package 50 and a coating layer 60. It can be seen that the chip 20, the first electronic component 30 and the second electronic component 40 are all located on the surface of the substrate 10, occupying a large area of the substrate. If further electronic components are added, the area of the substrate must be further increased, resulting in a large package volume that cannot accommodate the integration of more electronic components.
[0031] See also Figure 2 and Figure 3 , Figure 2 (a) is a schematic diagram of the side view position of various parts in the packaging structure provided by some embodiments of the utility model, Figure 2 (b) is a schematic diagram of the top view of (a). Figure 3 (a) is a schematic diagram of the side view position of various parts in the packaging structure provided by some embodiments of the utility model, Figure 3 (b) is a schematic diagram of the top view of (a). Some embodiments of the utility model provide a packaging structure, including: a substrate 100; a chip 210, located on the surface of the substrate 100; a metal support structure 300, the metal support structure 300 includes at least two metal support columns 310 and a metal support plate 320 corresponding to each metal support column 310, the metal support column 310 is located on the surface of the substrate, the metal support plate 320 is located on the surface of the corresponding metal support column 310 and is laterally arranged above the chip 210; a first electronic component 220, different electrodes of the first electronic component 220 are respectively located on different surfaces of the metal support plate 320 and are respectively electrically connected to the substrate 100 through different metal support columns 310.
[0032] In some embodiments of the utility model, the metal support plate 320 is arranged above the chip 210 through the metal support column 310, and the electrodes of the first electronic component 220 are arranged on different surfaces of the metal support plate 320, and are electrically connected to the substrate 100 through different metal support columns 310. The electronic components are arranged above the chip 210, so that more electronic components can be integrated on the limited surface of the substrate 100. The occupied area of the substrate 100 and the overall volume are reduced, which is conducive to integration and miniaturization.
[0033] In some embodiments, the substrate 220 may be a printed circuit board (PCB) or a ceramic substrate, or a substrate for wafer level packaging (WLP), etc. In some embodiments, the chip 210 may be a logic chip or a memory chip.
[0034] In some embodiments, see Figure 2 , the metal support structures 300 may be arranged in sequence along the width direction of the chip 210. In some embodiments, see Figure 3 , the metal support structure 300 can be arranged in sequence along the length direction of the chip. In some embodiments, the at least two metal support pillars 310 included in the metal support structure 300 can be located on the same side of the chip 210; however, in other embodiments, the at least two metal support pillars 310 can also be located on opposite sides of the chip 210, for example, see Figure 2, at least two metal support columns 310 are located on the left side of the chip 210, but can also be located on the left and right sides of the chip 210 respectively. In some embodiments, the plurality of metal support structures 310 are parallel to each other. In some embodiments, the metal support column 310 and the metal support plate 320 are integrally formed or fixedly connected. In some embodiments, there is a gap between the metal support structure 300 and the chip 210, and the metal support structure 300 and the chip 210 are filled with a plastic packaging material; in other embodiments, the metal support structure 300 and the chip 210 may also be in contact with each other without affecting the electrical connection of the first electronic component 220.
[0035] In some embodiments, the number of metal support columns and the number of metal support columns included in the metal support structure can be set according to the number of electrodes of the first electronic component 220, and the number of the metal support columns 310 and the number of the metal support plates 320 are the same as the number of electrodes of the first electronic component 220. That is, when the first electronic component 220 has two electrodes, the metal support structure 300 includes two corresponding metal support columns 310 and two corresponding metal support plates 320. For details, see Figures 2 to 6 The two electrodes of the first electronic component 220 are respectively located on the surfaces of the two metal support plates 320, so as to be arranged above the chip 210, and electrically connected to the substrate 100 through different metal support pillars 310. It should be noted that because it is blocked by the plastic packaging material, Figure 3 (a) and Figure 5 (a) in FIG. 1 does not show the metal support plate 310 .
[0036] In some embodiments, the metal support structure 300 is at least one group, each group of metal support structures 300 corresponds to at least one first electronic component 220, and each group of metal support structures 300 includes at least two metal support columns 310 and corresponding two metal support plates 320. Figure 2 and Figure 3 , a set of metal support structures 300 are provided, and two first electronic components 220 are provided above the chip 210 through a set of metal support structures 300, for example, see Figure 5 and Figure 6 , two groups of metal support structures 300 are provided, and a total of four first electronic components 220 are provided above the chip through the two groups of metal support structures.
[0037] In some embodiments, the first electronic component 220 may be an active component or a passive component, the active component may be a MOSFET, etc., and the passive component may be a resistor, a capacitor, an inductor, etc. In some embodiments, the packaging structure may further include a second electronic component 230 located on the surface of the substrate 100. In some embodiments, the second electronic component 230 may be an active component or a passive component, the active component may be a MOSFET, etc., and the passive component may be a resistor, a capacitor, an inductor, etc.
[0038] In some embodiments, the packaging structure further includes: a plastic packaging body 400 located on the surface of the substrate 100 and packaging the chip 210 , the metal support structure 300 and the first electronic component 220 ; and a metal shielding layer 600 located on the surface of the plastic packaging body 400 .
[0039] In some embodiments, see Figure 4 and Figure 5 , Figure 4 (a) is a schematic diagram of the side view position of various parts in the packaging structure provided by some embodiments of the utility model, Figure 4 (b) is a schematic diagram of the top view of (a). Figure 5 (a) is a schematic diagram of the side view position of various parts in the packaging structure provided by some embodiments of the utility model, Figure 5 (b) in the figure is a schematic diagram of the top view of (a). It can be seen that the packaging structure also includes: a metal retaining wall 510 arranged around the chip 210; a metal cover plate 520 located on the surface of the metal retaining wall 510 and between the metal support structure 300 and the chip 210; wherein the metal retaining wall 510 has an opening 511, which serves as a channel for subsequent plastic encapsulation material to enter the metal retaining wall 510 to perform plastic encapsulation on the chip 210, and the side wall of the metal shielding layer 600 can cover the opening 511, and the metal retaining wall 510 and the metal cover plate 520 constitute a chip shielding structure 500, so that a closed space for accommodating the chip 210 is formed together with the side wall of the metal shielding layer 600. In one embodiment, the metal retaining wall 510 and the metal cover plate 520 can be formed in one piece or fixedly connected. In some embodiments, there is a gap between the chip shielding structure 500 and the metal support structure 300 and the gap is subsequently filled with molding compound, and there is a gap between the chip shielding structure 500 and the chip 210 and the gap is subsequently filled with molding compound.
[0040] In some embodiments, see Figure 4In (a), the metal cover plate side 511 at the opening 511 and the substrate side 101 at the opening 511 are on the same vertical plane, or the metal cover plate side 521 at the opening 511 may exceed the substrate side 101 at the opening 511, see Figure 5 In (a), the side wall of the metal shielding layer 600 can cover the opening 511 , thereby forming a closed space for accommodating the chip 210 together with the metal retaining wall 510 and the metal cover plate 520 .
[0041] In some embodiments, see Figure 4 and Figure 5 , showing a schematic diagram of the metal retaining wall 510 having an opening 511 on the right side, the metal retaining wall 510, the metal cover plate 520 and the side wall 610 of the metal shielding layer form a closed space. It should be noted that Figure 4 and Figure 5 In the example shown, except for the opening 511 on the right side, the chip is surrounded by a metal retaining wall 510. In order to show the position of the chip 210, only the solid part on the left side of the metal retaining wall 510 is shown. However, in other embodiments, the position of the opening 511 can also be adjusted, for example, Figure 4 On the premise of setting the metal support structure 300 in (a), the metal retaining wall 510 can also only retain the solid part on the left side of the chip 210 to support the metal cover plate 520, and the metal retaining wall 510, the metal cover plate 520, and the side wall 610 of the metal shielding layer form a closed space to accommodate the chip 210.
[0042] Accordingly, see Figure 6 This embodiment also provides a method for preparing a packaging structure, including:
[0043] See also Figure 6 In (a), a substrate 100 is provided; and a chip 210 is disposed on a surface of the substrate 100.
[0044] See also Figure 6(b) in the embodiment, a metal support structure 300 is disposed on the surface of the substrate 100; the metal support structure 300 includes at least two metal support columns 310 and a metal support plate 320 corresponding to each metal support column 310, the metal support column 310 is located on the surface of the substrate 100, and the metal support plate 320 is located on the surface of the corresponding metal support column 310 and is laterally disposed above the chip 210. In one embodiment, at least one group of metal support structures 300 can be disposed on the surface of the substrate 100 according to design requirements. In one embodiment, the metal support structure 300 can be disposed on the surface of the substrate 100 by welding. In one embodiment, the metal support column 310 and the metal support plate 320 can be integrally formed or fixedly connected. In one embodiment, the metal support column 310 can be formed on the surface of the substrate 100 first, and then the metal support plate 320 can be formed on the surface of the metal retaining wall 510 to achieve the metal support structure 300 being disposed on the surface of the substrate 100.
[0045] See also Figure 6 In (c), different electrodes of the first electronic component 220 are respectively arranged on different surfaces of the metal support plate 320, so that they are electrically connected to the substrate through different metal support columns 310; in one embodiment, when at least one group of metal support structures 300 are arranged on the surface of the substrate 100, each group of metal support structures 300 corresponds to at least one first electronic component 220; in one embodiment, at least one second electronic component 220 can also be arranged on the surface of the substrate.
[0046] See also Figure 6 In (d), a plastic encapsulation material is filled on the surface of the substrate 100 and between the metal support structure 300 and the chip to form a plastic encapsulation body 400. In one embodiment, after the plastic encapsulation body 400 is formed, a metal shielding layer 600 may be formed on the surface of the plastic encapsulation body 400.
[0047] Accordingly, see Figure 7 This embodiment also provides a method for preparing a packaging structure, including:
[0048] See also Figure 7 In (a), a substrate 100 is provided; and a chip 210 is disposed on a surface of the substrate 100.
[0049] See also Figure 7(b) in the embodiment also includes: arranging a chip shielding structure 500 on the surface of the substrate 100, wherein the chip shielding structure 500 includes: a metal retaining wall 510 arranged around the chip 210; and a metal cover plate 520 located on the surface of the metal retaining wall 510; wherein the metal retaining wall 520 has an opening 511, and the opening 511 will be covered by a side wall 610 of a metal shielding layer formed later, and the metal retaining wall 520, the metal cover plate 520 and the side wall 610 of the metal shielding layer form a closed space for accommodating the chip 210. In one embodiment, the chip shielding structure 500 can be arranged on the surface of the substrate 100 by welding. In one embodiment, the metal retaining wall 510 and the metal cover plate 520 can be integrally formed or fixedly connected. In one embodiment, the metal retaining wall 510 can be formed on the surface of the substrate 100 first, and then the metal cover plate 520 can be formed on the surface of the metal retaining wall 510, so as to realize that the chip shielding structure 500 is arranged on the surface of the substrate 100.
[0050] See also Figure 7 In (c), a metal support structure 300 is disposed on the surface of the substrate 100; the metal support structure 300 includes at least two metal support columns 310 and a metal support plate 320 corresponding to each metal support column 310, the metal support columns 310 are located on the surface of the substrate 100, the metal support plate 320 is located on the surface of the corresponding metal support columns 310 and is laterally disposed above the metal cover plate 520, so that the metal cover plate 520 is located between the metal support plate 520 and the chip 210.
[0051] See also Figure 7 In (d), different electrodes of the first electronic component 220 are respectively disposed on different surfaces of the metal support plate 310 , and are electrically connected to the substrate 100 through different metal support pillars 320 .
[0052] See also Figure 7 In (e), a plastic encapsulation material is filled on the surface of the substrate 100, between the metal support structure 300 and the chip shielding structure 500, and between the chip shielding structure 500 and the chip 210 to form a plastic encapsulation body 400. The plastic encapsulation material can be filled between the chip shielding structure 500 and the chip 210 through the opening 511. In one embodiment, after the plastic encapsulation body 400 is formed, a metal shielding layer 600 can be formed on the surface of the plastic encapsulation body 400, and the side wall 610 of the metal shielding layer covers the opening 511.
[0053] Although the utility model has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.
Claims
1. A packaging structure, characterized in that: include: substrate; A chip is located on the surface of the substrate; A metal support structure, the metal support structure comprising at least two metal support pillars and a metal support plate corresponding to each metal support pillar, the metal support pillars are located on the surface of the substrate, and the metal support plate is located on the surface of the corresponding metal support pillar and is laterally arranged above the chip; A first electronic component, wherein different electrodes of the first electronic component are respectively located on different surfaces of the metal support plates and are respectively electrically connected to the substrate through corresponding metal support columns.
2. The packaging structure according to claim 1, characterized in that: The metal support structure is at least one group, and each group of metal support structures corresponds to at least one first electronic component.
3. The packaging structure according to claim 1, characterized in that: The number of metal support columns and the number of metal support plates of the metal support structure correspond to the number of electrodes of the first electronic component.
4. The packaging structure according to claim 1, characterized in that: The metal support structures are arranged in sequence along the length direction of the chip.
5. The packaging structure according to claim 1, characterized in that: The metal support structures are arranged in sequence along the width direction of the chip.
6. The packaging structure according to claim 4 or 5, characterized in that: The at least two metal support pillars are located on the same side of the chip.
7. The packaging structure according to claim 1, characterized in that: There is a space between the metal support structure and the chip.
8. The packaging structure according to claim 1, characterized in that: Also includes: A plastic sealing body located on the surface of the substrate and used to plastic seal the chip, the metal support structure and the first electronic component; A metal shielding layer is located on the surface of the plastic package body.
9. The packaging structure according to claim 8, characterized in that: Also includes: A metal retaining wall arranged around the chip; A metal cover plate located on the surface of the metal retaining wall and between the metal support plate and the chip; The metal retaining wall has an opening, and the side wall of the metal shielding layer covers the opening so as to form a closed space for accommodating the chip together with the metal retaining wall and the metal cover plate.
10. The packaging structure according to claim 1, characterized in that: Also includes: A second electronic component is located on the surface of the substrate.