Vapor chamber

Abstract

A vapor chamber comprises a first plate body, a second plate body, a capillary structure and a first capillary thin layer. The second plate body is arranged below the first plate body. A closed cavity is formed by the first plate body and the second plate body. The capillary structure is located in the cavity. The capillary structure comprises at least one powder column and at least one powder strip. The at least one strip has a first surface and a second surface opposite to each other. The first surface faces the first plate body or the second plate body, and at least one strip is provided with a plurality of first grooves which are recessed from the first surface to the second surface. The first capillary thin layer is arranged between the second plate body and the capillary structure.

Description

Technical Field

[0001] The invention relates to a temperature balancing plate, in particular to a temperature balancing plate for vermicelli with grooves. Background Art

[0002] In electronic products, a vapor chamber is a common heat dissipation device that is often used in the field of heat dissipation. A known vapor chamber is combined with a surface of a heat source. The known vapor chamber has an upper plate body and a lower plate body. The upper plate body and the lower plate body are combined to form a cavity, and the cavity can be used to fill a working liquid; thereby, the heat source can heat the working liquid and vaporize the working liquid. The gaseous working liquid evaporates to the side away from the heat source, releases heat, and then condenses, taking away the heat of the heat source to achieve the purpose of heat dissipation.

[0003] The existing temperature-averaging plate is mainly composed of upper and lower plates with good thermal conductivity, which are sealed and welded to form a vacuum cavity, and the cavity contains powder columns and powder strip structures connected by capillary tissue. However, the powder strip structure of this temperature-averaging plate has no air guide holes on the side, so effective steam conduction cannot be carried out on the side of the powder strip structure, resulting in excessive internal steam flow resistance and poor vacuum degassing effect.

[0004] This type of traditional capillary structure design has been increasingly unable to meet usage requirements. Therefore, how to further improve the air conduction capacity on the existing capillary structure has become the research and development focus of various companies. Utility Model Content

[0005] In view of this, an object of the present invention is to provide a temperature homogenizing plate that can solve the above problems.

[0006] One method of the present invention is to provide a temperature equalizing plate, which includes a first plate body, a second plate body, a capillary structure and a first capillary thin layer. The second plate body is arranged below the first plate body. The first plate body and the second plate body form a closed cavity. The capillary structure is located in the cavity. The capillary structure includes at least one powder column and at least one powder strip. At least one powder strip has a first surface and a second surface opposite to each other. The first surface faces the first plate body or the second plate body, and at least one powder strip has a plurality of first grooves that are recessed from the first surface to the second surface. The first capillary thin layer is arranged between the second plate body and the capillary structure.

[0007] According to one or more embodiments of the present invention, the cross-sectional shape of each first groove is a polygon or each first groove has a curved surface.

[0008] According to one or more embodiments of the present invention, the first grooves are communicated with each other.

[0009] According to one or more embodiments of the present invention, at least one vermicelli has a plurality of second grooves recessed from the second surface toward the first surface.

[0010] According to one or more embodiments of the present invention, the second grooves are communicated with each other.

[0011] According to one or more embodiments of the present invention, the cross-sectional shape of each second groove is a polygon or each second groove has a curved surface.

[0012] According to one or more embodiments of the present invention, the first grooves are substantially symmetrically arranged with respect to the second grooves.

[0013] According to one or more embodiments of the present invention, the temperature homogenizing plate further includes a second capillary layer disposed between the first plate body and the capillary structure.

[0014] According to one or more embodiments of the present invention, the first plate has a third surface facing the capillary structure, and the third surface has a capillary feature.

[0015] According to one or more embodiments of the present invention, the second plate has a third surface facing the capillary structure, and a fourth surface has a capillary feature.

[0016] Another embodiment of the present invention is to provide a temperature equalizing plate, which includes a first plate body, a second plate body, a capillary structure and a first capillary thin layer. The second plate body is arranged below the first plate body. The first plate body and the second plate body form a closed cavity. The capillary structure is located in the cavity. The capillary structure includes at least one powder column and at least one powder strip. The at least one powder strip has a first side surface and a second side surface opposite to each other, and the first side surface and the second side surface each extend along the long side of the at least one powder strip, and the at least one powder strip has a plurality of holes extending from the first side surface to the second side surface. The first capillary thin layer is arranged between the second plate body and the capillary structure.

[0017] According to one or more embodiments of the present invention, the cross-sectional shape of the holes is circular, polygonal or irregular.

[0018] According to one or more embodiments of the present invention, the temperature homogenizing plate further includes a second capillary layer disposed between the first plate body and the capillary structure.

[0019] According to one or more embodiments of the present invention, the first plate has a first surface facing the capillary structure, and the first surface has a capillary feature.

[0020] According to one or more embodiments of the present invention, the second plate has a second surface facing the capillary structure, and the second surface has a capillary feature. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understood, the following are the descriptions of the accompanying drawings:

[0022] Figure 1A cross-sectional schematic diagram of a temperature homogenizing plate according to an embodiment of the present invention is shown.

[0023] Figure 2 A schematic diagram showing the internal capillary structure of a temperature homogenizing plate according to an embodiment of the present invention.

[0024] Figure 3 The temperature absorbing plate of an embodiment of the present invention is shown along the Figure 2 Schematic diagram of the cross section along line 3-3.

[0025] Figure 4 A schematic diagram showing the internal capillary structure of a temperature homogenizing plate of a comparative example.

[0026] Figure 5 The temperature balancing plate of the comparative example is shown as follows Figure 4 Schematic cross-sectional view along line 5-5.

[0027] Fig. 6A , Figure 6B , Figure 6C , Fig.6D , Fig. 6E , Fig. 6F , Figure 6G and Figure 6H A schematic diagram showing a portion of a vapor chamber according to various embodiments of the present invention.

[0028] Fig. 7A , Fig. 8A and Fig. 9A A schematic diagram showing a portion of a temperature vapor chamber according to another embodiment of the present invention.

[0029] Figure 7B , Figure 8B and Fig. 9B They are Fig. 7A , Fig. 8A and Fig. 9A Side view of the Chinese vermicelli.

[0030] Description of Reference Numerals

[0031] 10: Temperature balancing board,

[0032] 110: first plate,

[0033] 112: Surface,

[0034] 120: Second plate,

[0035] 122: Surface,

[0036] 130: Cavity,

[0037] 140: Capillary structure,

[0038] 142: Powder column,

[0039] 144: Vermicelli,

[0040] 144a: Vermicelli,

[0041] 144b: Vermicelli,

[0042] 144c: vermicelli,

[0043] 144d: Vermicelli,

[0044] 144e: Vermicelli,

[0045] 144f: vermicelli,

[0046] 144g: vermicelli,

[0047] 144h: Vermicelli,

[0048] 144i: Vermicelli,

[0049] 144j: vermicelli,

[0050] 144k: vermicelli,

[0051] 1441: First surface,

[0052] 1442: Second surface,

[0053] 1443: First groove,

[0054] 1445: Second groove,

[0055] 150: First capillary layer,

[0056] 160: Second capillary layer,

[0057] 40: Temperature balancing board,

[0058] 440: capillary structure,

[0059] 442: Powder column,

[0060] 444: Vermicelli,

[0061] 3-3: Line,

[0062] 5-5: Line. DETAILED DESCRIPTION

[0063] In order to make the description of the content of the new invention more detailed and complete, the following is an illustrative description of the implementation method and specific examples of the new invention; however, this is not the only form of implementing or using the specific examples of the new invention. The various embodiments disclosed below can be combined or replaced with each other in beneficial situations, and other embodiments can be added to one embodiment without further recording or description.

[0064] In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, embodiments of the present invention can be practiced without these specific details. In other cases, well-known structures and devices are only schematically shown in the figures to simplify the drawings.

[0065] The manufacturing of the temperature-averaging plate is to sinter an open cavity filled with a metal capillary structure material at high temperature, sinter the capillary structure on the surface of the cavity, and then weld and seal the cavity with a metal cover or another cavity, and inject a cooling working fluid (such as water or alcohol) into the cavity and evacuate it. When one side of the temperature-averaging plate is heated, the working fluid stored in the pores of the capillary structure quickly vaporizes and transfers the heat to the other side of the temperature-averaging plate. After the heat of the water vapor is absorbed, the water vapor condenses into liquid and returns to the evaporation site through the capillary structure under the action of capillary force. This is repeated, relying on the gas-liquid conversion of the cooling working fluid to achieve heat transfer and diffusion.

[0066] Figure 1 FIG. 2 is a cross-sectional schematic diagram of a temperature equalizing plate according to an embodiment of the present invention. Figure 1 As shown, the temperature plate 10 includes a first plate body 110, a second plate body 120, a capillary structure 140 and a first capillary thin layer 150. Specifically, the second plate body 120 is disposed below the first plate body 110, and the first plate body 110 and the second plate body 120 form a closed cavity 130. The periphery of the first plate body 110 and the periphery of the second plate body 120 are flatly connected to each other, and no fixing holes or other components are set. In some embodiments, the material of the first plate body 110 and the second plate body 120 is pure copper or copper alloy.

[0067] In some embodiments, the first plate 110 has a surface 112 facing the capillary structure 140, and the surface 112 has a capillary feature (not shown). That is, the surface 112 of the first plate 110 has a rough surface structure, such as a continuous concave-convex surface structure or a discontinuous concave-convex surface structure, and the maximum height roughness (Rymax) of the rough surface structure ranges from several microns to several centimeters. This rough surface structure can be regarded as a capillary structure feature. This capillary feature is, for example, obtained by mechanical processing, such as computer numerical control (CNC) milling technology, sandblasting or stamping; or, chemical processing, such as electroplating or etching; or, physical grinding, but the present disclosure is not limited thereto.

[0068] In some embodiments, the second plate 120 has a surface 122 facing the capillary structure 140, and the surface 122 has a capillary feature (not shown). That is, the surface 122 of the second plate 120 has a rough surface structure, such as a continuous concave-convex surface structure or a discontinuous concave-convex surface structure, and the maximum height roughness (Rymax) of the rough surface structure ranges from several microns to several centimeters. This rough surface structure can be regarded as a capillary structure feature. This capillary feature is, for example, obtained by mechanical processing, such as computer numerical control (CNC) milling technology, sandblasting or stamping; or, chemical processing, such as electroplating or etching; or, physical grinding, but the present disclosure is not limited thereto.

[0069] Figure 2 A schematic diagram showing the internal capillary structure of a temperature homogenizing plate according to an embodiment of the present invention is shown. Figure 1 and Figure 2 , the capillary structure 140 is located in the cavity 130. In more detail, the capillary structure 140 is distributed on the inner surface of the first plate 110 or the second plate 120, wherein the inner surface refers to the surface of the first plate 110 and the second plate 120 facing each other. The capillary structure includes at least one powder column 142 and at least one powder strip 144. The powder strip 144 has a first surface 1441 and a second surface 1442 opposite to each other, the first surface 1441 faces the first plate 110 or the second plate 120, and the powder strip 144 has a plurality of first grooves 1443 recessed from the first surface 1441 toward the second surface 1442. In some embodiments, the powder column 142 and the powder strip 144 included in the capillary structure 140 are sintered using metal powder of the same or similar material as the first plate 110 and the second plate 120. In some embodiments, the first grooves 1443 can be formed on the powder strip 144 by etching, laser, stamping or other suitable processes.

[0070] Please go back Figure 1 In some embodiments, the first capillary layer 150 is disposed between the first plate 110 and the capillary structure 140. The first capillary layer 150 may be a copper mesh microstructure or a copper fiber paper. The first capillary layer 150 is in direct contact with the first plate 110 and the capillary structure 140. The first capillary layer 150 may connect a single layer or multiple layers of copper mesh to each other in a diffusion bonding manner and is tightly bonded to the first plate 110. For example, the average pore size of the first capillary layer 150 may be about 50 microns to about 100 microns. In some embodiments, the first capillary layer 150 is disposed in the cavity 130 and completely covers the surface 112 of the first plate 110.

[0071] Continue reading Figure 1 In some embodiments, the temperature homogenizing plate 10 further includes a second capillary layer 160 disposed between the second plate body 120 and the capillary structure 140. The second capillary layer 160 may be a copper mesh microstructure or copper fiber paper. The second capillary layer 160 is in direct contact with the second plate body 120 and the capillary structure 140. The second capillary layer 160 may connect a single layer or multiple layers of copper mesh to each other in a diffusion bonding manner and be tightly bonded to the second plate body 120. For example, the average pore size of the second capillary layer 160 may be about 50 microns to about 100 microns. In some embodiments, the second capillary layer 160 is disposed in the cavity 130 and completely covers the surface 122 of the second plate body 120.

[0072] Figure 3 The temperature absorbing plate of an embodiment of the present invention is shown along the Figure 2 Schematic diagram of the cross section along line 3-3. Figure 3 As shown, since the powder strip 144 of the present invention has a plurality of grooves 143, when steam flows inside, the grooves 143 of the powder strip 144 provide a path for the steam to be conducted in the lateral direction, thereby further improving the air conduction capacity of the temperature vapor chamber 10. The "lateral direction" mentioned here summarizes the direction of the long sides of all non-parallel powder strips 144.

[0073] Figure 4 A schematic diagram showing the internal capillary structure of a temperature homogenizing plate of a comparative example. Figure 5 The temperature balancing plate of the comparative example is shown as follows Figure 4 Schematic cross-sectional view along line 5-5. In contrast, the conventional capillary structure 440 includes powder columns 442 and powder strips 444, and the powder strips 444 do not have a groove design. When the conventional temperature-averaging plate 40 is conducting steam, the steam on both sides of the powder strips 444 can only flow along the long sides of the powder strips 444, which results in a slow steam conduction rate and poor heat dissipation capacity of the temperature-averaging plate 40.

[0074] Next, other exemplary features of the powder strips 144 in the novel capillary structure 140 will be described. Fig. 6A , Figure 6B , Figure 6C and Fig.6D Schematic diagrams showing a portion of a heat spreader of various embodiments of the present invention. In some embodiments, the cross-sectional shape of each first groove 1443 is a polygon or each first groove has a curved surface. For example, the cross-sectional shape of the first groove 1443 of the powder strip 144a of the internal capillary structure of the heat spreader 10 can be rectangular or square, such as Fig. 6A As another example, the cross-sectional shape of the first groove 1443 of the powder strip 144b of the internal capillary structure of the temperature uniform plate 10 can be a trapezoid, such as Figure 6BAs another example, the first groove 1443 of the powder strip 144c of the internal capillary structure of the temperature uniform plate 10 has a curved surface profile, such as Figure 6C As another example, the cross-sectional shape of the first groove 1443 of the powder strip 144d of the internal capillary structure of the temperature uniform plate 10 can be a triangle, such as Fig.6D It is understandable that the cross-sectional shape of the first groove 1443 can be other irregular shapes. Such a design can not only improve the air conduction capacity of the temperature vapor chamber, but also has the effect of guiding condensed water from a remote end to the heat source end.

[0075] Fig. 6E A schematic diagram showing a portion of a temperature evaporating plate according to another embodiment of the present invention is shown. In some embodiments, the plurality of first grooves 1443 of the powder strips 144e of the internal capillary structure of the temperature evaporating plate 10 are connected to each other, such as Fig. 6E shown.

[0076] FIG. 6F to FIG. 6H Schematic diagram showing a portion of a temperature evaporating plate of another embodiment of the present invention. In some embodiments, the powder strips 144f of the internal capillary structure of the temperature evaporating plate 10 further have a plurality of second grooves 1445 that are recessed from the second surface 1442 toward the first surface 1441, such as FIG. 6F to FIG. 6H As shown. That is, the vermicelli 144f has a plurality of first grooves 1443 that are recessed from the first surface 1441 toward the second surface 1442 and a plurality of second grooves 1445 that are recessed from the second surface 1442 toward the first surface 1441, but there is still a continuous portion 1444 between the first grooves 1443 and the second grooves 1445. In other words, the vermicelli 144f includes a continuous portion 1444, a plurality of protruding portions toward the first plate body 110, and a plurality of protruding portions toward the second plate body 120. It can be understood that the cross-sectional shape of each first groove 1443 and each second groove 1445 can independently be a polygon or each second groove has a curved surface profile, wherein the cross-sectional shape can be a rectangle, square, trapezoid, triangle or other irregular shape. In the embodiment in which the vermicelli has a plurality of second grooves 1445, the plurality of first grooves 1443 and the plurality of second grooves 1445 of the vermicelli 144f are symmetrically arranged, such as Fig. 6F As shown. In other words, the cross-sectional shape and position of each first groove 1443 can be set corresponding to the cross-sectional shape and position of each second groove 1445. In other variations, the multiple first grooves 1443 of the powder strip 144f can also be set asymmetrically with the multiple second grooves 1445 (not shown). In other words, the cross-sectional shape and position of each first groove 1443 can be set non-correspondingly with the cross-sectional shape and position of each second groove 1445. In some embodiments, these second grooves 1445 can be formed on the powder strip by etching, laser, stamping or other suitable processes.

[0077] In the embodiment where the vermicelli has a plurality of second grooves 1445, the second grooves 1445 are connected to each other, and the plurality of first grooves 1443 and the second grooves 1445 are disposed opposite to each other on the continuous portion 1444. Figure 6G As shown, the plurality of first grooves 1443 of the powder strip 144g of the internal capillary structure of the temperature homogenizing plate 10 are interconnected, and the plurality of second grooves 1445 of the powder strip 144g are also interconnected, and the first grooves 1443 are symmetrically arranged with the second grooves 1445 on the continuous portion 1444. Figure 6H As shown, the multiple first grooves 1443 of the powder strip 144h of the internal capillary structure of the temperature uniform plate 10 are interconnected, and the multiple second grooves 1445 of the powder strip 144h are also interconnected, and the first groove 1443 is asymmetrically arranged with the second groove 1445 on the continuous part 1444.

[0078] FIG. 6F to FIG. 6H The design of the temperature equalizing plate 10 is particularly suitable for the situation where there are heat sources above and below the first plate body 110 and the second plate body 120 of the temperature equalizing plate 10. That is to say, in the situation where there are heat sources above and below the first plate body 110 and the second plate body 120 of the temperature equalizing plate 10, the design of the vermicelli 144 in the capillary structure 140 having the first groove 1443 and the second groove 1445 on opposite sides of the continuous part 1444 has a better heat dissipation effect. In more detail, when the first plate body 110 and the second plate body 120 of the temperature equalizing plate 10 are in contact with the heat source, the condensed water at the end farther from the heat source will be horizontally diverted from the continuous part 1444 to a position close to the heat source through the capillary action of the protruding parts on both sides of the first groove 1443 and / or the second groove 1445. In addition to improving the air conduction capacity of the temperature equalizing plate, such a design also improves the efficiency of diverting condensed water from the remote end to the heat source end.

[0079] Fig. 7A , Fig. 8A and Fig. 9A A schematic diagram showing a portion of a temperature vapor chamber according to another embodiment of the present invention. Figure 7B , Figure 8B and Fig. 9B They are Fig. 7A , Fig. 8A and Fig. 9A In another embodiment, the vermicelli may have a first side 1446 and a second side 1447 opposite to each other, the first side 1446 and the second side 1447 each extending along a long side of the vermicelli, and the vermicelli has a plurality of holes 1448 extending from the first side 1446 to the second side 1447. In many embodiments, the cross-sectional shape of the holes 1448 is circular, polygonal, or irregular.

[0080] like Fig. 7A and Figure 7B As shown in FIG. 1 , the cross-sectional shape of the hole 1448 of the powder strip 144i of the internal capillary structure of the temperature uniform plate 10 is circular. Fig. 8A and Figure 8B As shown in FIG. 1 , the cross-sectional shape of the hole 1448 of the powder strip 144j of the internal capillary structure of the temperature uniform plate 10 is a triangle. Fig. 9A and Fig. 9B As shown, the cross-sectional shape of the hole 1448 of the vermicelli 144k of the internal capillary structure of the temperature homogenizing plate 10 is a square. However, the present disclosure is not limited thereto, and the cross-sectional shape of the hole 1448 of the vermicelli can also be a rectangle, trapezoid, ellipse or other irregular shapes.

[0081] It can be understood that when the first plate body 110 and / or the second plate body 120 of the temperature equalizing plate 10 contacts the heat source, the condensed water at the end farther from the heat source will be horizontally guided from the first capillary layer 150 to a position close to the heat source through capillary action, and then vertically guided to the capillary structure 140 for heat dissipation.

[0082] In summary, the novel temperature evaporating plate processes the powder strips in the capillary structure so that the powder strips have a plurality of groove designs. These grooves provide more flow paths for the steam in the lateral direction, thereby reducing the resistance of the steam transfer inside the cavity, improving the degassing efficiency of the vacuum process, and reducing the residual non-condensable gas (NCG). In addition, this design can also improve the internal steam flow circulation efficiency of the temperature evaporating plate when it is used, so as to increase the heat exchange efficiency of the temperature evaporating plate.

[0083] Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

Claims

1. A temperature homogenizing plate, wherein: Include: A first plate: A second plate body is disposed below the first plate body, wherein the first plate body and the second plate body form a closed cavity; a capillary structure located in the cavity, the capillary structure comprising at least one powder column and at least one powder bar, wherein the at least one powder bar has a first surface and a second surface opposite to each other, the first surface faces the first plate or the second plate, and the at least one powder bar has a plurality of first grooves sunken from the first surface toward the second surface; and A first capillary layer is disposed between the second plate and the capillary structure.

2. The temperature vapor chamber according to claim 1, wherein: A cross-sectional shape of each of the first grooves is a polygon or each of the first grooves has a curved surface.

3. The temperature vapor chamber according to claim 1, wherein: The first grooves are communicated with each other.

4. The temperature vapor chamber according to claim 1, wherein: The at least one vermicelli has a plurality of second grooves recessed from the second surface toward the first surface.

5. The temperature homogenizing plate according to claim 4, wherein: The second grooves are communicated with each other.

6. The temperature homogenizing plate according to claim 4, wherein: A cross-sectional shape of each of the second grooves is a polygon or each of the second grooves has a curved surface.

7. The temperature vapor chamber according to claim 4, wherein: The first grooves are substantially symmetrically arranged with respect to the second grooves.

8. The temperature vapor chamber according to claim 1, wherein: It also includes a second capillary thin layer disposed between the first plate and the capillary structure.

9. The temperature vapor chamber according to claim 1, wherein: The first plate has a third surface facing the capillary structure, and the third surface has a capillary feature.

10. The temperature vapor chamber according to claim 1, wherein: The second plate has a fourth surface facing the capillary structure, and the fourth surface has a capillary feature.

11. A temperature homogenizing plate, wherein: Include: A first plate: A second plate body is disposed below the first plate body, wherein the first plate body and the second plate body form a closed cavity; a capillary structure located in the cavity, the capillary structure comprising at least one powder column and at least one powder strip, wherein the at least one powder strip has a first side and a second side opposite to each other, the first side and the second side each extending along a long side of the at least one powder strip, and the at least one powder strip has a plurality of holes extending from the first side to the second side; and A first capillary layer is disposed between the second plate and the capillary structure.

12. The temperature vapor chamber according to claim 11, wherein: A cross-sectional shape of the holes is a circle, a polygon or an irregular shape.

13. The temperature vapor chamber according to claim 11, wherein: It also includes a second capillary thin layer disposed between the first plate and the capillary structure.

14. The temperature vapor chamber according to claim 11, wherein: The first plate has a first surface facing the capillary structure, and the first surface has a capillary feature.

15. The temperature vapor chamber according to claim 11, wherein: The second plate has a second surface facing the capillary structure, and the second surface has a capillary feature.

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