Silicon wafer sorting testboard

By designing an automated sorting and testing organization, the problems of low manual loading and unloading efficiency and cumbersome testing steps in the silicon wafer sorting test test bench are solved, and the automated sorting and measurement of silicon wafers are realized, which improves the testing efficiency and reduces the silicon wafers. Risk of damage.

CN222267906UActive Publication Date: 2024-12-31JIANGSU HUAMUSONG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202420099309.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-16
Publication Date
2024-12-31
Estimated Expiration
2034-01-16

AI Technical Summary

Technical Problem

The existing silicon wafer sorting test bench requires manual loading and unloading, which is inefficient and is prone to bumps. The test steps are cumbersome, resulting in inconvenient use.

Method used

A silicon wafer sorting test bench including a sorting mechanism and a testing mechanism is designed. The silicon wafer sorting test bench is used to automatically load and unload the silicon wafer by using a 12V dual-axis stepper motor, sliding rod, gear, suction cup and cylinder, and through the detection ring, knob, The reading board and detection block automatically measure the radius and thickness of the silicon wafer and store it in a classified manner.

Benefits of technology

It realizes automatic sorting and measurement of silicon wafers, improves testing efficiency, reduces the risk of silicon wafer damage, and makes detection of radius and thickness more convenient.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a silicon wafer sorting testboard, which relates to the technical field of silicon wafer testing and comprises a supporting table, the top of the supporting table is fixedly connected with a supporting frame, the bottom of one side of the supporting frame is fixedly connected with a sorting mechanism, and one side of the top of the supporting table is in lap joint with a silicon wafer disc. The middle of the top of the supporting table is fixedly connected with a testing mechanism, the other side of the top of the supporting table is fixedly connected with a storage box, the sorting mechanism comprises a first sliding rod, and the top of the first sliding rod is fixedly connected with the bottom of one side of the supporting frame. According to the utility model, through the arrangement of the detection mechanism, when a silicon wafer is tested, only a knob needs to be rotated, then the numerical value of the scale pointed by the reading plate is read, the radius of the silicon wafer can be obtained after calculation, the detection block is pressed down to the surface of the silicon wafer, then the downward movement degree of the detection block is obtained according to the scale II, and the thickness of the silicon wafer can be obtained after calculation; the radius and thickness detection is more convenient, and the device is more convenient to use.
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Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer testing, in particular to a silicon wafer sorting test bench. Background Art

[0002] Silicon wafers are important materials for making integrated circuits. Various semiconductor devices can be made by photolithography, ion implantation and other methods. Chips made of silicon wafers have amazing computing power. The development of science and technology continues to promote the development of semiconductors. The development of automation and computer technologies has reduced the cost of high-tech products such as silicon wafers to a very low level. This has made silicon wafers widely used in aerospace, industry, agriculture, and national defense. When silicon wafers are produced, they need to be sorted and tested. For this purpose, a silicon wafer sorting test bench is proposed.

[0003] However, when the existing silicon wafer sorting test bench performs classification tests on silicon wafers, manual loading and unloading of silicon wafers is still required. The manual picking method is inefficient and can easily cause the silicon wafers to be bumped during the loading and unloading process, which is inconvenient to use. At the same time, when testing the radius length and thickness of silicon wafers, the operating steps of the existing sorting test bench are relatively cumbersome, resulting in low test efficiency and certain inconveniences. Utility Model Content

[0004] The utility model provides a silicon wafer sorting test bench to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A silicon wafer sorting test bench comprises a support table, the top of the support table is fixedly connected to a support frame, the bottom of one side of the support frame is fixedly connected to a sorting mechanism, one side of the top of the support table is overlapped with a silicon wafer disk, the middle of the top of the support table is fixedly connected to a testing mechanism, and the other side of the top of the support table is fixedly connected to a storage box.

[0007] A further improvement of the technical solution of the utility model is that the sorting mechanism includes a sliding rod, the top of the sliding rod is fixedly connected to the bottom of one side of the support frame, racks are fixedly connected on both sides of the bottom of the inner cavity of the sliding rod, a gear is meshed on the surface of the rack, and a 12V dual-axis stepper motor is fixedly connected to one side of the gear.

[0008] A further improvement of the technical solution of the utility model is that: a sliding block is fixedly connected to the bottom of the 12V dual-axis stepper motor, a sliding rod 2 is fixedly connected to the bottom of the sliding block, one end of the sliding rod 2 is fixedly connected to motor 2, one end of the rotating shaft of motor 2 is fixedly connected to threaded rod 1, a driving block is threadedly connected to the surface of the middle part of threaded rod 1, one end of the threaded rod 1 is rotatably connected to one side of the inner cavity of sliding rod 2, and the bottom of the driving block is fixedly connected to a cylinder.

[0009] A further improvement of the technical solution of the utility model is that: the bottom of the cylinder is fixedly connected to an air suction chamber, the bottom of the air suction chamber is fixedly connected to a suction cup, one side of the inner cavity of the air suction chamber is fixedly connected to an air suction hose, one end of the air suction hose is fixedly connected to a blower, and the bottom of the blower is fixedly connected to one end of the top of the sliding rod.

[0010] A further improvement of the technical solution of the utility model is that the testing mechanism includes a mounting plate, the bottom of the mounting plate is fixedly connected to the middle of the top of the support platform, the top of the mounting plate is fixedly connected to a detection ring, and the internal thread of the detection ring is connected to a threaded rod 2.

[0011] A further improvement of the technical solution of the utility model is that one end of the threaded rod 2 is fixedly connected to a knob, the other end of the threaded rod 2 is rotatably connected to a detection plate, both ends of the detection plate close to one side of the threaded rod 2 are fixedly connected to fixing rods, and one end of the fixing rod is fixedly connected to a reading plate.

[0012] A further improvement of the technical solution of the utility model is that a scale is arranged below the reading plate, a guide rod is fixedly connected to the top of the detection plate, and a fixing plate is fixedly connected to the upper end of the guide rod.

[0013] A further improvement of the technical solution of the utility model is that: the top of the fixed plate is fixedly connected to a motor three, one end of the rotating shaft of the motor three is fixedly connected to a threaded rod three, the surface of the threaded rod three is threadedly connected to a drive plate, the bottom of the drive plate is fixedly connected to a detection block, and the surface of the guide rod is provided with a scale two.

[0014] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0015] The utility model provides a sorting test table for silicon wafers. Through the arrangement of a sorting mechanism, when silicon wafers are sorted, under the action of a suction cup, the silicon wafers in a silicon wafer tray can be taken into the testing mechanism. After the test is finished, the silicon wafers are taken from the testing mechanism into a storage box, and classified and stored according to test data, so that there is no need for manual loading and unloading, and the loading and unloading are more accurate and efficient. At the same time, the silicon wafers are not easily bumped. At the same time, the arrangement of the detection mechanism enables it to test the silicon wafer by only turning a knob, and then reading the value of the scale indicated by the reading plate, and then obtaining the radius of the silicon wafer after calculation, and then pressing the detection block down to the surface of the silicon wafer, and then obtaining the downward movement degree of the detection block according to the scale, and then obtaining the thickness of the silicon wafer after calculation, so that the detection of the radius and thickness is more convenient and more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 It is a side sectional structural schematic diagram of the utility model;

[0018] Figure 3 This is a schematic diagram of the test mechanism structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the sorting mechanism of the utility model;

[0020] Figure 5 For the utility model Figure 3 A is an enlarged structural diagram;

[0021] Figure 6 For the utility model Figure 4 Enlarged structural diagram at point B.

[0022] In the figure: 1. support table; 2. support frame; 3. sorting mechanism; 31. sliding rod one; 32. rack; 33. gear; 34. 12V dual-axis stepper motor; 35. sliding block; 36. sliding rod two; 37. motor two; 38. threaded rod one; 39. drive block; 310. cylinder; 311. suction chamber; 312. suction cup; 313. suction hose; 314. blower; 4. silicon wafer disk; 5. testing mechanism; 51. mounting disk; 52. detection ring; 53. threaded rod two; 54. knob; 55. detection plate; 56. fixing rod; 57. reading plate; 58. scale; 59. guide rod; 510. fixing plate; 511. motor three; 512. threaded rod three; 513. drive plate; 514. detection block; 515. scale two; 6. storage box. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the embodiments:

[0024] Example 1

[0025] like Figure 1-6 As shown, the utility model provides a silicon wafer sorting test bench, including a support table 1, a support frame 2 is fixedly connected to the top of the support table 1, a sorting mechanism 3 is fixedly connected to the bottom of one side of the support frame 2, a silicon wafer disk 4 is overlapped on one side of the top of the support table 1, a testing mechanism 5 is fixedly connected to the middle of the top of the support table 1, and a storage box 6 is fixedly connected to the other side of the top of the support table 1. The sorting mechanism 3 includes a sliding rod 31, the top of the sliding rod 31 is fixedly connected to the bottom of one side of the support frame 2, racks 32 are fixedly connected to both sides of the bottom of the inner cavity of the sliding rod 31, a gear 33 is meshed on the surface of the rack 32, a 12V dual-axis stepper motor 34 is fixedly connected to one side of the gear 33, and a sliding gear 33 is fixedly connected to the bottom of the 12V dual-axis stepper motor 34. Block 35, the bottom of the sliding block 35 is fixedly connected with a sliding rod 2 36, one end of the sliding rod 2 36 is fixedly connected with a motor 2 37, one end of the rotating shaft of the motor 2 37 is fixedly connected with a threaded rod 1 38, the surface of the middle part of the threaded rod 1 38 is threadedly connected with a driving block 39, one end of the threaded rod 1 38 is rotatably connected to one side of the inner cavity of the sliding rod 2 36, the bottom of the driving block 39 is fixedly connected with a cylinder 310, the bottom of the cylinder 310 is fixedly connected with an air suction chamber 311, the bottom of the air suction chamber 311 is fixedly connected with a suction cup 312, one side of the inner cavity of the air suction chamber 311 is fixedly connected with an air suction hose 313, one end of the air suction hose 313 is fixedly connected with a blower 314, and the bottom of the blower 314 is fixedly connected to one end of the top of the sliding rod 2 36.

[0026] In this embodiment, the silicon wafer disk 4 is placed on one side of the top of the support platform 1, and then the storage box 6 is placed on the other side of the top of the support platform 1, and then the 12V dual-axis stepper motor 34 is started. Under the action of the rotation of the rotating shaft of the 12V dual-axis stepper motor 34, the gears 33 at both ends of the output shaft rotate along the rack 32, so that the sliding block 35 slides in the sliding rod 1 31 and drives the suction cup 312 to move, and the left and right positions of the suction cups are adjusted. Then the motor 2 37 is started. Under the action of the motor 2 37, the threaded rod 1 38 rotates so that the driving block 39 drives the suction cup 312 to move, and the front and rear positions of the suction cup 312 are adjusted. When it is adjusted to above the silicon wafer, the cylinder 310 is started. Under the action of the cylinder 310, the suction cup 312 moves down and contacts the surface of the silicon wafer. Then, under the action of the blower 314, the suction cup 312 sucks up the silicon wafer, and the position of the suction cup is adjusted again. After the silicon wafer is placed in the detection ring 52, it is detected.

[0027] Example 2

[0028] like Figure 1-6As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the testing mechanism 5 includes a mounting plate 51, the bottom of the mounting plate 51 is fixedly connected to the middle of the top of the support platform 1, the top of the mounting plate 51 is fixedly connected to a detection ring 52, the internal thread of the detection ring 52 is connected to a threaded rod 53, one end of the threaded rod 53 is fixedly connected to a knob 54, the other end of the threaded rod 53 is rotatably connected to a detection plate 55, the two ends of the detection plate 55 close to the side of the threaded rod 53 are fixedly connected to fixing rods 56, and one end of the fixing rod 56 is fixedly connected to a reading plate 57.

[0029] In this embodiment, by rotating the two knobs 54 at the same time, under the action of the knobs 54, the threaded rod 53 is rotated to drive the detection plate 55 to approach the silicon wafer in the detection ring 52. At the same time, the detection plate 55 drives the reading plate 57 to move synchronously during the movement. When the detection plate 55 contacts the surface of the silicon wafer, the displacement length of the reading plate 57 is read through the scale 58, and then the radius length of the silicon wafer can be obtained through calculation.

[0030] Example 3

[0031] like Figure 1-6 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, a scale 58 is provided below the reading plate 57, a guide rod 59 is fixedly connected to the top of the detection plate 55, a fixing plate 510 is fixedly connected to the upper end of the guide rod 59, a motor three 511 is fixedly connected to the top of the fixing plate 510, a threaded rod three 512 is fixedly connected to one end of the rotating shaft of the motor three 511, a driving plate 513 is threadedly connected to the surface of the threaded rod three 512, a detection block 514 is fixedly connected to the bottom of the driving plate 513, and a scale two 515 is provided on the surface of the guide rod 59.

[0032] In this embodiment, by subsequently starting the motor three 511, under the action of the motor three 511, the threaded rod three 512 rotates to make the driving plate 513 drive the detection block 514 to move downward, and when the detection block 514 contacts the top of the silicon wafer, the downward movement amplitude of the detection block 514 can be obtained through the scale two 515 set on the surface of the guide rod 59, and then after recalculation, the thickness of the silicon wafer can be obtained, making the thickness and radius detection of the silicon wafer more convenient, and then according to the radius and thickness of the silicon wafer, it can be classified and placed in the storage box 6 through the sorting mechanism 3 to complete the sorting and testing.

[0033] The following is a detailed description of the working principle of the silicon wafer sorting test bench.

[0034] like Figure 1-6As shown, when the silicon wafer is sorted and tested, the silicon wafer plate 4 is first placed on one side of the top of the support platform 1, and then the storage box 6 is placed on the other side of the top of the support platform 1, and then the 12V dual-axis stepper motor 34 is started. Under the action of the rotation of the rotating shaft of the 12V dual-axis stepper motor 34, the gear 33 rotates along the rack 32, so that the sliding block 35 slides in the sliding rod 1 31 and drives the suction cup 312 to move, and the left and right positions of the suction cup are adjusted. Then the motor 2 37 is started. Under the action of the motor 2 37, the threaded rod 1 38 rotates to make the driving block 39 drive the suction cup 312 to move, and the front and rear positions of the suction cup 312 are adjusted. When it is adjusted to above the silicon wafer, the cylinder 310 is started. Under the action of the cylinder 310, the suction cup 312 moves down and contacts the surface of the silicon wafer. Then, under the action of the blower 314, the suction cup 312 sucks up the silicon wafer, and the position of the suction cup is adjusted again. After the silicon wafer is placed in the detection ring 52, the suction cup is rotated at the same time. The two knobs 54, under the action of the knobs 54, make the threaded rod 2 53 rotate to drive the detection plate 55 to approach the silicon wafer in the detection ring 52. At the same time, the detection plate 55 drives the reading plate 57 to move synchronously during the movement. When the detection plate 55 contacts the surface of the silicon wafer, the displacement length of the reading plate 57 is read through the scale 58. Then, after calculation, the radius length of the silicon wafer can be obtained. Then, the motor 3 511 is started. Under the action of the motor 3 511, the threaded rod 3 512 rotates to make the driving plate 513 drive the detection block 514 to move downward. When the detection block 514 contacts the top of the silicon wafer, the downward movement amplitude of the detection block 514 can be obtained through the scale 2 515 set on the surface of the guide rod 59. Then, after calculation again, the thickness of the silicon wafer can be obtained, making the thickness and radius detection of the silicon wafer more convenient. Then, according to the radius and thickness of the silicon wafer, it can be classified and placed in the storage box 6 through the sorting mechanism 3 to complete the sorting and testing.

[0035] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A silicon wafer sorting test station, comprising a support station (1), characterized in that: The top of the support platform (1) is fixedly connected to a support frame (2), the bottom of one side of the support frame (2) is fixedly connected to a sorting mechanism (3), one side of the top of the support platform (1) is overlapped with a silicon wafer disk (4), the middle of the top of the support platform (1) is fixedly connected to a testing mechanism (5), and the other side of the top of the support platform (1) is fixedly connected to a storage box (6).

2. The silicon wafer sorting test bench according to claim 1, characterized in that: The sorting mechanism (3) comprises a sliding rod (31), the top of which is fixedly connected to the bottom of one side of the support frame (2), racks (32) are fixedly connected to both sides of the bottom of the inner cavity of the sliding rod (31), a gear (33) is meshed on the surface of the rack (32), and a 12V dual-axis stepping motor (34) is fixedly connected to one side of the gear (33).

3. The silicon wafer sorting test bench according to claim 2, characterized in that: The bottom of the 12V dual-axis stepper motor (34) is fixedly connected to a sliding block (35), the bottom of the sliding block (35) is fixedly connected to a sliding rod 2 (36), one end of the sliding rod 2 (36) is fixedly connected to a motor 2 (37), one end of the rotating shaft of the motor 2 (37) is fixedly connected to a threaded rod 1 (38), the surface of the middle part of the threaded rod 1 (38) is threadedly connected to a driving block (39), one end of the threaded rod 1 (38) is rotatably connected to one side of the inner cavity of the sliding rod 2 (36), and the bottom of the driving block (39) is fixedly connected to a cylinder (310).

4. The silicon wafer sorting test bench according to claim 3, characterized in that: The bottom of the cylinder (310) is fixedly connected to an air suction chamber (311), the bottom of the air suction chamber (311) is fixedly connected to a suction cup (312), one side of the inner cavity of the air suction chamber (311) is fixedly connected to an air suction hose (313), one end of the air suction hose (313) is fixedly connected to a blower (314), and the bottom of the blower (314) is fixedly connected to one end of the top of the second sliding rod (36).

5. The silicon wafer sorting test bench according to claim 1, characterized in that: The testing mechanism (5) comprises a mounting plate (51), the bottom of which is fixedly connected to the middle of the top of the support platform (1), the top of which is fixedly connected to a detection ring (52), and the internal thread of the detection ring (52) is connected to a threaded rod 2 (53).

6. The silicon wafer sorting test station according to claim 5, characterized in that: One end of the second threaded rod (53) is fixedly connected to a knob (54), and the other end of the second threaded rod (53) is rotatably connected to a detection plate (55). Both ends of the detection plate (55) close to one side of the second threaded rod (53) are fixedly connected to fixing rods (56), and one end of the fixing rod (56) is fixedly connected to a reading plate (57).

7. The silicon wafer sorting test station according to claim 6, characterized in that: A scale (58) is provided below the reading plate (57), a guide rod (59) is fixedly connected to the top of the detection plate (55), and a fixing plate (510) is fixedly connected to the upper end of the guide rod (59).

8. The silicon wafer sorting test station according to claim 7, characterized in that: The top of the fixed plate (510) is fixedly connected to a motor three (511), one end of the rotating shaft of the motor three (511) is fixedly connected to a threaded rod three (512), the surface of the threaded rod three (512) is threadedly connected to a driving plate (513), the bottom of the driving plate (513) is fixedly connected to a detection block (514), and the surface of the guide rod (59) is provided with a scale two (515).