Trimming device for BGA (Ball Grid Array) packaging substrate

Abstract

The utility model relates to a BGA packaging substrate trimming device, and relates to the technical field of substrate machining, the BGA packaging substrate trimming device comprises a workbench, a grinding machine arranged on the workbench and a rotary conveying belt used for conveying a packaging substrate, a conveying blade of the rotary conveying belt is provided with a clamping assembly used for clamping the packaging substrate, and the conveying blade is provided with a clamping assembly used for clamping the packaging substrate. A control assembly used for controlling the position of the grinding machine is arranged on the workbench. The method has the effect of improving the trimming efficiency of the packaging substrate.

Description

Technical Field

[0001] The present application relates to the field of substrate processing technology, and in particular to a trimming device for a BGA package substrate. Background Art

[0002] The packaging substrate is Substrate (SUB for short). The substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of the packaged product, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. The packaging substrate should belong to the interdisciplinary technology, which involves knowledge of electronics, physics, chemical engineering, etc.

[0003] The Chinese utility model patent with authorization announcement number CN207087961U is a trimming device for a high-density BGA packaging substrate, including a base, a scale column and an anti-slip belt. A scale column is provided on the right side of the base and a scale is provided on the surface of the scale column. A No. 1 metal rod is connected to the top of the scale column and the No. 1 metal rod is rotatably connected to the No. 2 metal rod through a spherical connecting device. One end of the No. 2 metal rod is fixedly connected to a motor, and the motor is fixedly connected to a cutting blade. An anti-slip belt is provided on the surface of the base, and fixing devices are provided on both sides of the anti-slip belt.

[0004] When trimming the packaging substrate, the trimming device can only trim one packaging substrate at a time. After the trimming is completed, the device needs to be stopped to replace the packaging substrate, which affects the trimming efficiency of the packaging substrate. Utility Model Content

[0005] In order to improve the problem of low efficiency in trimming a packaging substrate, the present application provides a trimming device for a BGA packaging substrate.

[0006] The present application provides a BGA package substrate trimming device that adopts the following technical solution:

[0007] A trimming device for a BGA package substrate comprises a workbench, a grinder arranged on the workbench and a rotary conveyor belt for conveying the package substrate, wherein a clamping assembly for clamping the package substrate is arranged on the conveying blades of the rotary conveyor belt, and a control assembly for controlling the position of the grinder is arranged on the workbench.

[0008] Furthermore, the clamping assembly includes a clamping seat, a circumferential limiter and a height limiter, and the clamping seat is provided with a receiving groove for receiving the packaging substrate.

[0009] Furthermore, the height limiting member includes a push plate and a spring arranged in the accommodating groove, the push plate slides in the vertical direction, the spring is arranged between the push plate and the bottom of the accommodating groove, one end of the spring is fixedly connected to the bottom of the push plate, and the other end of the spring is fixedly connected to the bottom of the accommodating groove.

[0010] Furthermore, two groups of circumferential limit members are provided, and the two groups of circumferential limit members are symmetrically arranged around the clamping seat. The circumferential limit members include a pressure plate, a bolt, a first nut and a second nut. A waist-shaped groove for the bolt to pass through is provided on the side wall of the clamping seat. One end of the bolt is fixedly connected to the pressure plate, and the other end of the bolt extends out of the clamping seat. The first nut and the second nut are both threadedly connected to the bolt, and the side wall of the clamping seat is clamped in the middle by the first nut and the second nut.

[0011] Furthermore, the clamping seat is detachably connected to the conveying blade of the rotary conveyor belt through a connecting component, and the connecting component includes a connecting block and a connecting seat, the connecting block is fixedly connected to the bottom of the clamping seat, the connecting seat is fixedly connected to the top wall of the conveying blade of the rotary conveyor belt, and the connecting seat is provided with a slot for inserting the connecting block.

[0012] Furthermore, the control component includes a support frame and a lifting cylinder, the lifting cylinder is arranged on the support frame, and the grinder and the piston of the lifting cylinder are fixedly connected.

[0013] In summary, the present application includes at least one of the following beneficial technical effects:

[0014] 1. When positioning the package substrate in the clamping seat, first place the chip package substrate to be processed into the receiving groove, and then rotate the first nut and the second nut so that the two pressing plates are clamped on the two opposite side walls of the package substrate, thereby achieving the positioning of the package substrate;

[0015] 2. When trimming the packaging substrate, first place a number of connection blocks with clamping seats for the packaging substrate in the slots of the connection seats of the rotary conveyor belt conveyor blades in sequence, and use the rotary conveyor belt to transport the clamping seats. When the clamping seats move under the grinding head of the grinder, use the lifting cylinder to push the grinding head of the grinder to contact the packaging substrate, so as to trim the packaging substrate;

[0016] 3. The height of the package substrate exposed from the top wall of the clamping seat is adjusted by using a spring and a push plate, so as to position package substrates of different specifications and sizes, thereby achieving a good trimming effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1It is a schematic diagram of the overall structure of a trimming device for a BGA packaging substrate in an embodiment of the present application.

[0018] Figure 2 It is a schematic diagram of the overall structure of the clamping assembly in the embodiment of the present application.

[0019] Explanation of the accompanying drawings: 1. Workbench; 2. Grinder; 3. Rotating conveyor belt; 4. Clamping assembly; 41. Clamping seat; 42. Circumferential limiter; 421. Pressure plate; 422. Bolt; 423. First nut; 424. Second nut; 43. Height limiter; 431. Push plate; 432. Spring; 5. Control assembly; 51. Support frame; 52. Lifting cylinder; 6. Connecting assembly; 61. Connecting block; 62. Connecting seat; 7. Receiving groove; 8. Waist-shaped groove; 9. Bracket; 10. Slot. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-2 This application is described in further detail.

[0021] The embodiment of the present application discloses a trimming device for a BGA packaging substrate.

[0022] Reference Figure 1 A trimming device for a BGA package substrate comprises a workbench 1, a grinder 2 arranged on the workbench 1, and a rotary conveyor belt 3 for conveying the package substrate. The rotary conveyor belt 3 is supported on the workbench 1 by a bracket 9. A clamping component 4 for clamping the package substrate is arranged on the conveying blades of the rotary conveyor belt 3. A control component 5 for controlling the position of the grinder 2 is arranged on the workbench 1; the control component 5 comprises a support frame 51 and a lifting cylinder 52. The support frame 51 is fixedly connected to the workbench 1, the lifting cylinder 52 is arranged on the support frame 51, and the pistons of the grinder 2 and the lifting cylinder 52 are fixedly connected.

[0023] Reference Figure 2The clamping assembly 4 includes a clamping seat 41, a circumferential limiter 42 and a height limiter 43. The clamping seat 41 is provided with a receiving groove 7 for receiving the package substrate; the height limiter 43 includes a push plate 431 and a spring 432 arranged in the receiving groove 7. The push plate 431 slides in the vertical direction. The spring 432 is arranged between the push plate 431 and the bottom of the receiving groove 7. One end of the spring 432 is fixedly connected to the bottom of the push plate 431, and the other end of the spring 432 is fixedly connected to the bottom of the receiving groove 7. The peripheral wall of the push plate 431 fits the peripheral wall of the receiving groove 7; the circumferential limiter 42 is provided with two groups, and the two groups of circumferential limiters are provided with two groups of circumferential limiters. The limiting member 42 is symmetrically arranged around the clamping seat 41. The circumferential limiting member 42 includes a pressure plate 421, a bolt 422, a first nut 423 and a second nut 424. A waist-shaped groove 8 is provided on the side wall of the clamping seat 41 for the bolt 422 to pass through. The length direction of the waist-shaped groove 8 is parallel to the moving direction of the push plate 431. One end of the bolt 422 is fixedly connected to the pressure plate 421, and the other end of the bolt 422 extends out of the clamping seat 41. The first nut 423 and the second nut 424 are both threadedly connected to the bolt 422, and the side wall of the clamping seat 41 is clamped in the middle by the first nut 423 and the second nut 424.

[0024] The clamping seat 41 is detachably connected to the conveying blades of the rotary conveyor belt 3 through the connecting component 6. The connecting component 6 includes a connecting block 61 and a connecting seat 62. In the present embodiment, the connecting block 61 is configured as a square block. The connecting block 61 is fixedly connected to the bottom of the clamping seat 41. The connecting seat 62 is fixedly connected to the top wall of the conveying blades of the rotary conveyor belt 3. A slot 10 is provided on the connecting seat 62 for inserting the connecting block 61. The slot 10 is configured as a square groove.

[0025] The spring 432 and the push plate 431 are used to adjust the height of the package substrate exposed from the top wall of the clamping seat 41, so as to position the package substrates of different specifications and sizes, thereby achieving a good trimming effect.

[0026] When trimming the packaging substrate, first, place several connecting blocks 61 of the clamping seats 41 with the packaging substrates in sequence in the slots 10 of the connecting seats 62 of the conveying blades of the rotary conveyor belt 3, and use the rotary conveyor belt 3 to transfer the clamping seats 41. When the clamping seats 41 move under the grinding head of the grinder 2, the lifting cylinder 52 is used to push the grinding head of the grinder 2 to contact the packaging substrate, thereby achieving trimming of the packaging substrate. When the trimming of the packaging substrate is completed, the entire clamping seat 41 can be removed from the conveying blades of the rotary conveyor belt 3, and the clamping seat 41 with the untrimmed packaging substrate can be replaced, thereby improving the trimming efficiency.

[0027] When positioning the packaging substrate in the clamping seat 41, first place the chip packaging substrate to be processed into the receiving groove 7, and then rotate the first nut 423 and the second nut 424 so that the two pressure plates 421 are clamped on the two opposite side walls of the packaging substrate, thereby achieving the positioning of the packaging substrate.

[0028] The implementation principle of a trimming device for a BGA package substrate in an embodiment of the present application is as follows: when trimming the package substrate, firstly, a plurality of connection blocks 61 of clamping seats 41 with package substrates positioned thereon are sequentially placed in the slots 10 of the connection seats 62 of the conveying blades of the rotary conveyor belt 3, and the clamping seats 41 are transferred by the rotary conveyor belt 3. When the clamping seats 41 are moved under the grinding head of the grinder 2, the grinding head of the grinder 2 is pushed by the lifting cylinder 52 to contact the package substrate, thereby trimming the package substrate. When the trimming of the package substrate is completed, the entire clamping seat 41 can be removed from the conveying blades of the rotary conveyor belt 3, and the clamping seat 41 with the untrimmed package substrates can be replaced, thereby improving the trimming efficiency.

[0029] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A BGA package substrate trimming device, characterized in that: The invention comprises a workbench (1), a grinder (2) arranged on the workbench (1), and a rotary conveyor belt (3) for conveying a packaging substrate, wherein a clamping component (4) for clamping the packaging substrate is arranged on the conveying blades of the rotary conveyor belt (3), and a control component (5) for controlling the position of the grinder (2) is arranged on the workbench (1).

2. The edge trimming device for a BGA package substrate according to claim 1, characterized in that: The clamping assembly (4) comprises a clamping seat (41), a circumferential limiting member (42) and a height limiting member (43); the clamping seat (41) is provided with a receiving groove (7) for receiving the packaging substrate.

3. The trimming device for a BGA package substrate according to claim 2, characterized in that: The height limiting member (43) comprises a push plate (431) and a spring (432) arranged in the receiving groove (7); the push plate (431) slides in the vertical direction; the spring (432) is arranged between the push plate (431) and the bottom of the receiving groove (7); one end of the spring (432) is fixedly connected to the bottom of the push plate (431); and the other end of the spring (432) is fixedly connected to the bottom of the receiving groove (7).

4. The trimming device for a BGA package substrate according to claim 2, characterized in that: The circumferential limit members (42) are provided in two groups, and the two groups of circumferential limit members (42) are symmetrically arranged around the clamping seat (41). The circumferential limit members (42) include a pressure plate (421), a bolt (422), a first nut (423) and a second nut (424). A waist-shaped groove (8) for the bolt (422) to pass through is provided on the side wall of the clamping seat (41). One end of the bolt (422) is fixedly connected to the pressure plate (421), and the other end of the bolt (422) extends out of the clamping seat (41). The first nut (423) and the second nut (424) are both threadedly connected to the bolt (422), and the side wall of the clamping seat (41) is clamped in the middle by the first nut (423) and the second nut (424).

5. The trimming device for a BGA package substrate according to claim 2, characterized in that: The clamping seat (41) is detachably connected to the conveying blade of the rotary conveyor belt (3) through a connecting assembly (6); the connecting assembly (6) comprises a connecting block (61) and a connecting seat (62); the connecting block (61) is fixedly connected to the bottom of the clamping seat (41); the connecting seat (62) is fixedly connected to the top wall of the conveying blade of the rotary conveyor belt (3); and a slot (10) for inserting the connecting block (61) is provided on the connecting seat (62).

6. The trimming device for a BGA package substrate according to claim 1, characterized in that: The control component (5) comprises a support frame (51) and a lifting cylinder (52); the lifting cylinder (52) is arranged on the support frame (51); the grinder (2) and the piston of the lifting cylinder (52) are fixedly connected.

Images