Automatic analyzing and adding equipment for electroplating solution

Abstract

The utility model relates to the technical field of electroplating liquid cleaning and adding equipment, and discloses electroplating liquid automatic analyzing and adding equipment, which comprises an electroplating liquid storage pool, an isolation plate is arranged on the inner side of the electroplating liquid storage pool, and the interior of the electroplating liquid storage pool is divided into an electroplating liquid storage area and a filtering and purifying area by the isolation plate. According to the electroplating device, electroplating liquid can be guided by arranging the liquid guide part, the impurity coarse screening box is matched with the impurity filter screen coarse screening and the secondary filter plate to carry out secondary multi-layer filtering on residual impurities in the electroplating liquid, and the impurity guide-out part can scrape the impurities subjected to coarse screening into the impurity waste storage hopper, so that the impurities are not easy to remain; and the material adding part is used for supplementing and adding materials in a targeted manner, so that the device is excellent in electroplating liquid impurity cleaning and removing capacity, simple in later cleaning, capable of accurately measuring and automatically adding, and good in production quality and stability.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating solution cleaning and adding equipment, in particular to an electroplating solution automatic analysis and adding equipment. Background Art

[0002] With the rapid development of the electroplating industry, the quality and stability of electroplating have an increasingly important impact on product quality and production efficiency. Electroplating liquid is used in the electroplating production line. Defoaming agents and other agents are added to the electroplating liquid according to actual needs to form an electroplating mixed liquid. The electroplating mixed liquid can expand the metal current density and increase the antioxidant stability of the solution. After repeated use, a large amount of metal impurities are likely to remain in the liquid for a long time. At the same time, the addition and metering of the electroplating liquid should be controlled in the electroplating process. While ensuring a continuous supply of liquid, excessive liquid replenishment should be avoided. The electroplating liquid needs to be dosed and supplemented and impurities cleaned.

[0003] When using traditional electroplating solutions, it is usually easy to cause an imbalance in the proportion of components due to large-scale use, which in turn affects the quality of electroplating and the stability of working operation. After long-term use, the existing electroplating solution has a large amount of impurities precipitated inside it. The impurity filtering capacity of the electroplating solution is relatively insufficient, and it is inconvenient to filter and remove impurities. The cost of directly replacing the electroplating solution is high. In addition, due to the large number of impurities in the electroplating solution, the proportion of the electroplating solution in the electroplating tank is unevenly distributed, which affects the accurate analysis and judgment of the analysis device. The subsequent adjustment of the proportion of the electroplating solution is prone to imbalance, affecting normal construction and production, and the stability and quality of electroplating are insufficient. For this reason, we propose an automatic analysis and addition equipment for electroplating solution to solve the above problems Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the utility model provides an automatic analysis and addition equipment for electroplating solution, which has the advantages of excellent cleaning and removal of impurities in the electroplating solution, simple post-cleaning, accurate measurement and automatic addition, good production quality and stability, etc. It solves the problem that impurities in the existing electroplating solution are difficult to remove after long-term use, which easily causes an imbalance in the addition of component proportions, and insufficient stability and quality.

[0006] (II) Technical solution

[0007] In order to realize the above-mentioned circulation diversion and filtration structure, the plating solution has good diversion and filtration effect, and the component analysis is accurate, the automatic matching addition is automatic, and the production quality and stability are good, the utility model provides the following technical solutions: an automatic analysis and addition device for electroplating solution, comprising an electroplating solution storage tank, the inner side of which is provided with an isolation plate;

[0008] The isolation plate divides the interior of the electroplating liquid storage tank into an electroplating liquid storage area and a filtering and purification area. A liquid guide and an impurity coarse screening box are provided on the top of the isolation plate. The liquid guide is connected to the impurity coarse screening box. An impurity outlet component is provided inside the impurity coarse screening box.

[0009] A plurality of secondary filter plates are stacked inside the filtration and purification area, a filter outlet is provided on the isolation plate, a component analyzer is provided on the filter outlet, a load-bearing mounting frame is provided on the side of the top of the electroplating liquid storage tank, and a plurality of material adding components are provided on the load-bearing mounting frame;

[0010] Among them, the two ends of the liquid guide are respectively located in the electroplating liquid storage area and the filtration and purification area, the liquid guide is connected to the impurity coarse screening box, the side of the impurity coarse screening box is provided with an impurity waste storage hopper, and the impurity coarse screening box is provided with an impurity filter net inside.

[0011] Preferably, the height of the isolation plate is lower than the top of the electroplating solution storage tank, the impurity coarse screening box is arranged on the top of the isolation plate, and the impurity filter screen is arranged in a semicircular shape.

[0012] Preferably, the liquid guide member includes a U-shaped guide pipe and an auxiliary guide pump, the U-shaped guide pipe is arranged on the isolation plate, the two ends of the U-shaped guide pipe are respectively located in the electroplating liquid storage area and the filtration and purification area, one end of the U-shaped guide pipe passes through the bottom of the secondary filter plate, the U-shaped guide pipe is connected to both sides of the impurity coarse screening box, the auxiliary guide pump is arranged on the electroplating liquid storage tank, and the output end of the auxiliary guide pump is connected to the U-shaped guide pipe.

[0013] Preferably, the impurity extraction component includes a driving motor and a driving scraper member, the driving motor is arranged on the outside of the impurity coarse screening box, the driving scraper member is rotatably connected to the inside of the impurity coarse screening box, the rotating shaft of the driving scraper member extends out of the impurity coarse screening box and is connected to the output end of the driving motor, and the driving scraper member matches the inner side of the impurity filter net.

[0014] Preferably, an impurity discharge port is provided on the outer side of the impurity coarse screening box, the impurity waste storage bucket corresponds to the position of the impurity discharge port, the ground of the impurity discharge port is higher than the axis of the driving scraper member, and the scraper of the driving scraper member is an elastic rubber scraper.

[0015] Preferably, the supporting mounting frame includes a mounting supporting plate and a supporting tray, the mounting supporting plate is mounted on the side of the top of the electroplating liquid storage tank, the supporting tray is equidistantly arranged on the mounting supporting plate, the supporting tray passes through the upper and lower sides of the mounting supporting plate, the material adding component is adapted to be loaded on the supporting tray, and the bottom of the material adding component extends out of the bottom of the supporting tray.

[0016] Preferably, the material adding component includes a storage barrel, a discharge pipe and an electronic control valve, the storage barrel is placed equidistantly on the top of the supporting mounting frame, the discharge pipe is arranged at the bottom of the storage barrel, the discharge pipe is connected to the bottom of the storage barrel, and the electronic control valve is arranged on the discharge pipe.

[0017] Preferably, an auxiliary receiving tube is provided at the bottom of the liquid guide member, the auxiliary receiving tube is located inside the electroplating liquid storage area, and a plurality of feed holes are provided on the auxiliary receiving tube.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model provides an automatic analysis and addition device for electroplating solution, which has the following beneficial effects:

[0020] 1. The automatic analysis and addition equipment for electroplating liquid can divide the interior of the electroplating liquid storage tank into an electroplating liquid storage area and a filtering and purifying area through a partition plate inside the electroplating liquid storage tank. The liquid guide can absorb and guide the electroplating liquid in the electroplating liquid storage area to the filtering and purifying area. The impurity coarse screening box cooperates with the impurity filter net to perform coarse screening. The secondary filter plate in the filtering and purifying area performs multi-layer filtration on the electroplating liquid to complete the secondary filtration. After the electroplating liquid overflows, it will flow back to the electroplating liquid storage area through the filter outlet to play a purification and filtration role. During the coarse screening process, the impurity guide component can clean the coarse screen impurities, and guide the impurities from the impurity coarse screening box to the impurity waste storage bucket to play an impurity filtering and collecting role. Impurities are not easy to remain, and the filtration quality and efficiency remain stable, so that the device has excellent electroplating liquid impurity cleaning and removal capabilities, and the later cleaning is simple.

[0021] 2. The automatic analysis and addition equipment for electroplating solution is equipped with a component analyzer at the filter outlet. The component analyzer can intuitively detect the component data of the filtered electroplating solution. When the component analyzer detects an imbalance in the component ratio, the material adding component can carry out targeted material supplementation to achieve automatic and precise addition, so that the device can accurately measure and automatically add, and the production quality and stability are good. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a frontal perspective schematic diagram of the structure of the utility model;

[0023] Figure 2 This is a front view cross-sectional schematic diagram of the structure of the utility model;

[0024] Figure 3 It is a top-down perspective schematic diagram of the structure of the utility model;

[0025] Figure 4 It is a side perspective schematic diagram of the structure of the utility model;

[0026] Figure 5 This is a frontal perspective schematic diagram of the connection structure between the liquid guide member and the auxiliary receiving tube of the utility model;

[0027] Figure 6 It is a bottom-up stereoscopic schematic diagram of the connection structure between the liquid guide member and the auxiliary receiving tube of the utility model.

[0028] In the figure: 1. Plating liquid storage tank; 2. Isolation plate; 3. Liquid guide member; 31. U-shaped guide pipe; 32. Auxiliary guide pump; 4. Secondary filter plate; 5. Filter outlet; 6. Component analyzer; 7. Load-bearing mounting frame; 71. Mounting load-bearing plate; 72. Load-bearing tray; 8. Material adding component; 81. Storage barrel; 82. Feeding pipe; 83. Electronic control valve; 9. Auxiliary receiving pipe; 10. Feeding hole; 11. Impurity coarse screening box; 12. Impurity extraction component; 121. Driving motor; 122. Driving scraper member; 13. Impurity waste storage bucket; 14. Impurity filter net. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 6 , an automatic analysis and addition device for electroplating solution, comprising an electroplating solution storage tank 1, an isolation plate 2 is provided inside the electroplating solution storage tank 1;

[0031] The isolation plate 2 divides the interior of the electroplating liquid storage tank 1 into an electroplating liquid storage area and a filtering and purification area. A liquid guide 3 and an impurity coarse screening box 11 are provided on the top of the isolation plate 2. The liquid guide 3 is connected to the impurity coarse screening box 11. An impurity outlet component 12 is provided inside the impurity coarse screening box 11.

[0032] A plurality of secondary filter plates 4 are stacked inside the filtration and purification area, a filter outlet 5 is provided on the isolation plate 2, a component analyzer 6 is provided on the filter outlet 5, a load-bearing mounting frame 7 is provided on the side of the top of the electroplating liquid storage tank 1, and a plurality of material adding components 8 are provided on the load-bearing mounting frame 7;

[0033] The two ends of the liquid guide 3 are respectively located in the electroplating liquid storage area and the filtration and purification area, the liquid guide 3 is connected to the impurity coarse screening box 11, the side of the impurity coarse screening box 11 is provided with an impurity waste storage hopper 13, and the impurity coarse screening box 11 is provided with an impurity filter screen 14;

[0034] The beneficial effects to be expressed by this scheme are as follows: the interior of the electroplating liquid storage tank 1 is divided into an electroplating liquid storage area and a filtration and purification area by the isolation plate 2 inside the electroplating liquid storage tank 1, and the liquid guide member 3 can absorb and guide the electroplating liquid in the electroplating liquid storage area to the filtration and purification area, and the impurity coarse screening box 11 cooperates with the impurity filter net 14 to perform coarse screening, and then the secondary filter plate 4 in the filtration and purification area performs multi-layer filtration on the electroplating liquid to complete the secondary filtration, and after the electroplating liquid overflows, it flows back to the electroplating liquid storage area through the filter outlet 5, which plays a role in purification and filtration. During the coarse screening process, the impurity outlet component 1 can be used to remove the impurity. 2. Clean the coarse screen impurities and guide the impurities from the impurity coarse screen box 11 to the impurity waste storage bucket 13, which plays the role of impurity filtering and collection. Impurities are not easy to remain, and the filtering quality and efficiency remain stable. The filtered electroplating liquid is intuitively tested for component data by the component analyzer 6. When the component analyzer 6 detects an imbalance in the component ratio, the material adding component 8 can be used to supplement the material in a targeted manner to achieve automatic and precise addition, so that the device has excellent impurity cleaning and removal capabilities for the electroplating liquid, simple post-cleaning, and can be accurately measured and automatically added, with good production quality and stability.

[0035] Furthermore, the height of the isolation plate 2 is lower than the top of the electroplating solution storage tank 1, the impurity coarse screening box 11 is arranged on the top of the isolation plate 2, and the impurity filter screen 14 is arranged in a semicircular shape;

[0036] By arranging the isolation plate 2 below the electroplating liquid storage tank 1, the electroplating liquid is not easy to overflow the electroplating liquid storage tank 1 after being purified and filtered, and can directly flow back to the electroplating liquid storage area, which has good practicality.

[0037] Further, the liquid guide member 3 includes a U-shaped guide pipe 31 and an auxiliary guide pump 32, the U-shaped guide pipe 31 is arranged on the isolation plate 2, the two ends of the U-shaped guide pipe 31 are respectively located in the electroplating liquid storage area and the filtration and purification area, one end of the U-shaped guide pipe 31 penetrates to the bottom of the secondary filter plate 4, the U-shaped guide pipe 31 is connected to both sides of the impurity coarse screening box 11, the auxiliary guide pump 32 is arranged on the electroplating liquid storage tank 1, and the output end of the auxiliary guide pump 32 is connected to the U-shaped guide pipe 31;

[0038] By setting up the liquid guide member 3 including a U-shaped guide tube 31 and an auxiliary guide pump 32, the U-shaped guide tube 31 can absorb and guide the plating liquid in the plating liquid storage area to the filtration and purification area. The bottom of one end of the U-shaped guide tube 31 is located at the bottom of the secondary filter plate 4. The secondary filter plate 4 in the filtration and purification area performs multi-layer filtration on the impurities remaining in the plating liquid. The auxiliary guide pump 32 plays an auxiliary boosting and diversion role, and has good practicality.

[0039] Furthermore, the impurity export component 12 includes a driving motor 121 and a driving scraper 122. The driving motor 121 is arranged on the outside of the impurity coarse screening box 11. The driving scraper 122 is rotatably connected to the inside of the impurity coarse screening box 11. The rotating shaft of the driving scraper 122 extends out of the impurity coarse screening box 11 and is connected to the output end of the driving motor 121. The driving scraper 122 matches the inner side of the impurity filter 14.

[0040] By arranging the two ends of the U-shaped guide tube 31 to be located in the plating liquid storage area and the filtration and purification area respectively, the plating liquid diversion and filtration effect is stable, and the two auxiliary diversion pumps 32 have the same diversion direction, and the plating liquid can be diverted at the same time. The plating liquid circulation diversion is stable, and the plating liquid is always in a flowing state during the diversion and purification, and impurities are not easy to accumulate. The quality of the plating liquid remains uniform and stable.

[0041] Furthermore, an impurity discharge port is provided on the outer side of the impurity coarse screening box 11, and the impurity waste storage bucket 13 corresponds to the position of the impurity discharge port. The ground of the impurity discharge port is higher than the axis of the driving scraper member 122, and the scraper of the driving scraper member 122 is an elastic rubber scraper;

[0042] By setting the bottom of the filter outlet 5 higher than the secondary filter plate 4, the electroplating liquid is filtered by the secondary filter plate 4 and then discharged from the filter outlet 5, and the filtering and diversion is stable.

[0043] Further, the load-bearing mounting frame 7 includes a mounting load-bearing plate 71 and a load-bearing tray 72. The mounting load-bearing plate 71 is mounted on the side of the top of the electroplating solution storage tank 1. The load-bearing tray 72 is equidistantly arranged on the mounting load-bearing plate 71. The load-bearing tray 72 passes through the upper and lower sides of the mounting load-bearing plate 71. The material adding component 8 is adapted to be loaded on the load-bearing tray 72. The bottom of the material adding component 8 extends out of the bottom of the load-bearing tray 72.

[0044] By setting up a load-bearing mounting frame 7 including a mounting load-bearing plate 71 and a load-bearing tray 72, the mounting load-bearing plate 71 can be stably supported and installed on the top of the electroplating liquid storage tank 1, and the load-bearing tray 72 is snap-fitted and installed on the mounting load-bearing plate 71, so that the load-bearing tray 72 can adaptively carry and position the material adding component 8. The material adding component 8 is convenient to install, simple to assemble and disassemble, and has excellent adaptability and installability.

[0045] Furthermore, the material adding component 8 includes a storage barrel 81, a feed pipe 82 and an electronic control valve 83. The storage barrel 81 is placed at an equal distance on the top of the supporting mounting frame 7, the feed pipe 82 is arranged at the bottom of the storage barrel 81, the feed pipe 82 is connected to the bottom of the storage barrel 81, and the electronic control valve 83 is arranged on the feed pipe 82;

[0046] By setting up the material adding component 8 including the storage barrel 81, the discharge pipe 82 and the electronic control valve 83, the storage barrel 81 plays a role in material storage, and multiple storage barrels 81 store different materials. The discharge pipe 82 plays a role in material discharge. The electronic control valve 83 can electronically control the discharge on and off and the flow rate. The discharge is accurate and stable, and the switch control effect is good.

[0047] Furthermore, an auxiliary receiving tube 9 is provided at the bottom of the liquid guide member 3, and the auxiliary receiving tube 9 is located inside the electroplating liquid storage area, and a plurality of feed holes 10 are provided on the auxiliary receiving tube 9;

[0048] By setting up the auxiliary receiving tube 9, the liquid guide member 3 can be assisted in guiding and discharging materials. The feed holes 10 are evenly arranged on the auxiliary receiving tube 9, so that the liquid guide member 3 can be guided through different feed holes 10 when guiding and drawing materials, so that the plating liquid in the plating liquid storage area can be guided from different areas to the auxiliary receiving tube 9 for purification and filtration circulation, and the plating liquid has better uniformity.

[0049] It should be noted that the various devices in this application are common devices in the market, and can be selected according to specific needs during specific use. The circuit connection relationship of each device belongs to a simple series and parallel connection circuit. There is no innovation in the circuit connection. Those skilled in the art can easily implement it. It belongs to the existing technology and will not be elaborated.

[0050] Working principle: An isolation plate 2 is provided inside the electroplating liquid storage tank 1, and the isolation plate 2 divides the inside of the electroplating liquid storage tank 1 into an electroplating liquid storage area and a filtering and purifying area. The electroplating liquid is injected into the electroplating liquid storage area as a whole, which plays a role in storage and electroplating operations. The filtering and purifying area plays a role in filtering and reflux of the electroplating liquid, and can perform purification and filtration. The liquid guide 3 can absorb and guide the electroplating liquid in the electroplating liquid storage area to the filtering and purifying area.

[0051] The liquid guide member 3 draws the plating liquid in the plating liquid storage area into the diversion process, and the impurity coarse screening box 11 can perform coarse screening. The impurity filter 14 in the impurity coarse screening box 11 can quickly and coarsely screen the impurities in the plating liquid during the diversion process, and then the second-dried and filtered plating liquid is introduced into the filtration purification area. After the secondary filter plate 4 in the filtration purification area performs multi-layer filtration on the impurities remaining in the plating liquid, the plating liquid overflows from the top of the secondary filter plate 4, and then flows back to the plating liquid storage area through the filter outlet 5 on the isolation plate 2, which plays a purification and filtering role. The plating liquid as a whole can flow and filter, impurities are not easy to accumulate, and the quality of the plating liquid always remains stable;

[0052] An impurity extraction component 12 is provided in the impurity coarse screening box 11. The impurity extraction component 12 includes a driving motor 121 and a driving scraper 122. The driving motor 121 can drive the driving scraper 122 to rotate. After the impurity filter 14 performs coarse screening on the electroplating solution, the impurities remaining on the impurity filter 14 can be cleaned and scraped away by the driving scraper 122. The scraped impurities are guided from the impurity discharge port of the impurity coarse screening box 11 to the impurity waste storage hopper 13, which plays the role of impurity filtering and collecting, so that impurities are not easy to remain during the circulating filtering process of the device, the filtering quality and efficiency remain stable, and the impurities in the electroplating solution are always kept in a state of less.

[0053] The metal residue in the plating liquid during filtration is small, and the component data can be intuitively detected by the component analyzer 6. The support mounting frame 7 is installed on the top of the plating liquid storage tank 1. A plurality of material adding components 8 are provided on the top of the support mounting frame 7, which can store different materials respectively. When the component analyzer 6 detects that the component ratio is unbalanced, the material adding component 8 can carry out targeted material supplementation and addition to achieve automated and precise addition, which has good practicality, and makes the device excellent in the ability to clean and remove impurities in the plating liquid. The later cleaning is simple, and it can be accurately measured and automatically added, with good production quality and stability, which solves the problem that the existing electroplating liquid purification and filtration capacity is insufficient, which easily leads to poor accuracy of instrument analysis, imbalance in component ratio addition, and insufficient electroplating stability and quality.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic analysis and addition device for electroplating solution, comprising an electroplating solution storage tank (1), characterized in that: An isolation plate (2) is provided on the inner side of the electroplating solution storage tank (1); The isolation plate (2) divides the interior of the electroplating liquid storage tank (1) into an electroplating liquid storage area and a filtering and purification area. A liquid guide member (3) and an impurity coarse screening box (11) are provided on the top of the isolation plate (2). The liquid guide member (3) is connected to the impurity coarse screening box (11). An impurity outlet component (12) is provided inside the impurity coarse screening box (11). A plurality of secondary filter plates (4) are stacked and arranged inside the filtration and purification zone, a filter outlet (5) is provided on the isolation plate (2), a component analyzer (6) is provided on the filter outlet (5), a load-bearing mounting frame (7) is provided on the side of the top of the electroplating liquid storage tank (1), and a plurality of material adding components (8) are provided on the load-bearing mounting frame (7); The two ends of the liquid guide member (3) are respectively located in the electroplating liquid storage area and the filtering and purification area, the liquid guide member (3) is connected to the impurity coarse screening box (11), the side of the impurity coarse screening box (11) is provided with an impurity waste storage hopper (13), and the impurity coarse screening box (11) is provided with an impurity filter screen (14) inside.

2. The automatic analysis and addition device for electroplating solution according to claim 1, characterized in that: The height of the isolation plate (2) is lower than the top of the electroplating solution storage tank (1), the impurity coarse screening box (11) is arranged on the top of the isolation plate (2), and the impurity filter screen (14) is arranged in a semicircular shape.

3. The automatic analysis and addition device for electroplating solution according to claim 1, characterized in that: The liquid guide member (3) comprises a U-shaped guide pipe (31) and an auxiliary guide pump (32); the U-shaped guide pipe (31) is arranged on the isolation plate (2); the two ends of the U-shaped guide pipe (31) are respectively located in the electroplating liquid storage area and the filtering and purification area; one end of the U-shaped guide pipe (31) passes through the bottom of the secondary filter plate (4); the U-shaped guide pipe (31) is connected to both sides of the impurity coarse screening box (11); the auxiliary guide pump (32) is arranged on the electroplating liquid storage tank (1); and the output end of the auxiliary guide pump (32) is connected to the U-shaped guide pipe (31).

4. The automatic analysis and addition device for electroplating solution according to claim 1, characterized in that: The impurity extraction component (12) comprises a driving motor (121) and a driving scraper component (122); the driving motor (121) is arranged on the outside of the impurity coarse screening box (11); the driving scraper component (122) is rotatably connected to the inside of the impurity coarse screening box (11); the rotating shaft of the driving scraper component (122) extends out of the impurity coarse screening box (11) and is connected to the output end of the driving motor (121); the driving scraper component (122) matches the inner side of the impurity filter screen (14).

5. The automatic analysis and addition device for electroplating solution according to claim 4, characterized in that: An impurity discharge port is provided on the outer side of the impurity coarse screening box (11), and the impurity waste storage bucket (13) corresponds to the position of the impurity discharge port. The ground of the impurity discharge port is higher than the axis of the driving scraper member (122), and the scraper of the driving scraper member (122) is an elastic rubber scraper.

6. The automatic analysis and addition equipment for electroplating solution according to claim 1, characterized in that: The load-bearing mounting frame (7) comprises a mounting support plate (71) and a support tray (72), wherein the mounting support plate (71) is mounted on the side of the top of the electroplating liquid storage tank (1), and the support tray (72) is arranged on the mounting support plate (71) at an equal distance, and the support tray (72) passes through the upper and lower sides of the mounting support plate (71), and the material adding component (8) is adapted to be loaded on the support tray (72), and the bottom of the material adding component (8) extends out of the bottom of the support tray (72).

7. The automatic analysis and addition equipment for electroplating solution according to claim 1, characterized in that: The material adding component (8) comprises a material storage barrel (81), a material discharge pipe (82) and an electronic control valve (83); the material storage barrel (81) is placed at an equal distance on the top of the supporting mounting frame (7); the material discharge pipe (82) is arranged at the bottom of the material storage barrel (81); the material discharge pipe (82) is connected to the bottom of the material storage barrel (81); and the electronic control valve (83) is arranged on the material discharge pipe (82).

8. The automatic analysis and addition device for electroplating solution according to claim 1, characterized in that: An auxiliary receiving tube (9) is provided at the bottom of the liquid guide member (3), the auxiliary receiving tube (9) is located inside the electroplating liquid storage area, and a plurality of feed holes (10) are provided on the auxiliary receiving tube (9).

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