Thin substrate baking carrier

Abstract

The utility model discloses a thin substrate baking carrier which comprises a bracket, containing cavities are formed in the surface of the bracket at equal intervals, a pressing cover is arranged above the bracket, the pressing cover is connected with the bracket in a sleeved mode, the containing cavities are used for containing thin substrates, and the bracket and the pressing cover are matched to clamp and fix the thin substrates in the containing cavities. A jacking device is arranged below the bracket, and the jacking device is used for demolding of the thin substrate in the containing cavity. According to the thin substrate baking carrier, the containing cavity is used for containing a thin substrate, the bracket is matched with the gland, the thin substrate can be stably clamped, displacement or damage in the baking process is reduced, due to the design of the jacking device, the thin substrate can be easily demolded after baking is completed, the production efficiency is greatly improved, the operation difficulty is reduced, and the practicability is high. The bottom plate and the ejector block are arranged below the bracket, and the bracket is attached to the bottom plate, so that the whole jacking device can be quickly jacked up, and the jacking efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic component processing, and more specifically, to a thin substrate baking carrier. Background Art

[0002] In the processing of electronic components, thin substrates, as an important component, need to go through processes such as baking to ensure their stability and performance. However, in the traditional baking method, since some substrates are thin, they are prone to deformation under high temperature conditions during the baking process, such as bending and warping, which leads to waste of materials or even scrapping. In addition, the baked thin substrates are not easy for workers to demold, which affects the processing efficiency and cannot meet the use requirements. Utility Model Content

[0003] 1. Technical issues to be solved

[0004] In view of the traditional baking method existing in the prior art, the substrate is relatively thin, and during the baking process, it is easy to deform under high temperature conditions, such as bending and warping, which leads to waste of materials or even scrapping. In addition, the thin substrate after baking is not convenient for workers to demould, which affects the processing efficiency and cannot meet the use requirements. The purpose of the utility model is to provide a thin substrate baking carrier, which can realize a cavity for placing the thin substrate. The cooperation of the bracket and the pressure cover can realize stable clamping of the thin substrate and reduce displacement or damage during the baking process. The design of the lifting device enables the thin substrate to be easily demoulded after baking, greatly improving the production efficiency and reducing the difficulty of operation. A bottom plate and a top block are arranged under the bracket. The bracket is fitted with the bottom plate, so that the lifting device can be quickly lifted up and the lifting efficiency is improved.

[0005] 2. Technical solution

[0006] To solve the above problems, the utility model adopts the following technical solutions.

[0007] A thin substrate baking carrier comprises a bracket, wherein cavities are arranged at equal intervals on the surface of the bracket, a pressure cover is arranged above the bracket, the pressure cover is sleeved with the bracket, the cavity is used to place a thin substrate, the bracket and the pressure cover cooperate to clamp and fix the thin substrate in the cavity, and a lifting device is arranged below the bracket, the lifting device is used to demould the thin substrate in the cavity.

[0008] Preferably, the lifting device includes a spring, a contact block, a moving rod and a support block, the spring is fixedly connected to the bottom of the bracket, the bottom of the spring is fixedly connected to the contact block, the top of the contact block is fixedly connected to the moving rod, the moving rod is sleeved with the spring, the moving rod is slidably connected to the bracket, the top of the moving rod is fixedly connected to the support block, and the support block is located in a surface groove of the bracket.

[0009] Preferably, the surface of the support block is provided with wear-resistant particles.

[0010] Preferably, a bottom plate is provided below the bracket, a top block is fixedly connected to the top of the bottom plate, and the top block corresponds to the contact block.

[0011] Preferably, guide rods are fixedly connected to the tops of both sides of the base plate, and guide grooves are arranged at the bottoms of both sides of the bracket, and the guide rods correspond to the guide grooves.

[0012] Preferably, fixing rods are fixedly connected to both sides of the bracket.

[0013] 3. Beneficial effects

[0014] Compared with the prior art, the advantages of the present invention are:

[0015] Through the cooperation of the bracket and the pressure cover, the thin substrate can be stably clamped, reducing displacement or damage during the baking process.

[0016] The design of the lifting device allows the thin substrate to be easily demoulded after baking, which greatly improves production efficiency and reduces operation difficulty.

[0017] By arranging a bottom plate and a top block under the bracket and fitting the bracket and the bottom plate together, the jacking device can be completely jacked up quickly, thereby improving the jacking efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall external structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall internal structure of the utility model;

[0020] Figure 3 For this utility model Figure 2 Schematic diagram of the local enlarged structure at point A.

[0021] Description of the numbers in the figure:

[0022] 1. Bracket; 2. Receiving cavity; 3. Pressure cover; 4. Lifting device; 41. Spring; 42. Contact block; 43. Moving rod; 44. Support block; 5. Fixed rod; 6. Bottom plate; 7. Lifting block; 8. Guide rod; 9. Guide groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1:

[0025] See also Figure 1-3 The utility model provides a technical solution: a thin substrate baking carrier, including a bracket 1, a surface of the bracket 1 is provided with cavities 2 at equal intervals, a pressure cover 3 is provided above the bracket 1, the pressure cover 3 is sleeved with the bracket 1, the cavity 2 is used to place the thin substrate, the bracket 1 and the pressure cover 3 cooperate to clamp and fix the thin substrate in the cavity 2, and a lifting device 4 is provided below the bracket 1, and the lifting device 4 is used to demould the thin substrate in the cavity 2. The cavity 2 is used to place the thin substrate, and the cooperation between the bracket 1 and the pressure cover 3 can achieve stable clamping of the thin substrate, reduce displacement or damage during the baking process, and the design of the lifting device 4 enables the thin substrate to be easily demoulded after baking, which greatly improves production efficiency and reduces operation difficulty.

[0026] The lifting device 4 includes a spring 41, a contact block 42, a moving rod 43 and a support block 44. The spring 41 is fixedly connected to the bottom of the bracket 1. The bottom of the spring 41 is fixedly connected to the contact block 42. The top of the contact block 42 is fixedly connected to the moving rod 43. The moving rod 43 is sleeved with the spring 41. The moving rod 43 is slidably connected to the bracket 1. The top of the moving rod 43 is fixedly connected to the support block 44. The support block 44 is located in the surface groove of the bracket 1. The lifting device 4 is provided. When it is necessary to lift the thin substrate in the cavity 2, the contact block 42 is withdrawn upward to drive the moving rod 43 to move upward, the spring 41 is squeezed, and the support block 44 is driven to move upward, so that the thin substrate in the cavity 2 can be lifted.

[0027] The surface of the support block 44 is provided with wear-resistant particles, which increase the overall friction and improve the overall stability.

[0028] The bottom plate 6 is arranged below the bracket 1, and the top block 7 is fixedly connected to the top of the bottom plate 6, and the top block 7 corresponds to the contact block 42. The bottom plate 6 and the top block 7 are arranged below the bracket 1, and the bracket 1 is fitted with the bottom plate 6, and the top block 7 contacts the contact block 42 and squeezes, so that the jacking device 4 can be quickly jacked up, thereby improving the jacking efficiency.

[0029] Among them, the top of both sides of the bottom plate 6 is fixedly connected with a guide rod 8, and the bottom of both sides of the bracket 1 is provided with a guide groove 9, and the guide rod 8 corresponds to the guide groove 9. The guide rod 8 and the guide groove 9 are provided to improve the fitting accuracy between the bracket 1 and the bottom plate 6.

[0030] Among them, fixing rods 5 are fixedly connected to both sides of the bracket 1, so that the staff can take the bracket 1 conveniently.

[0031] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited to it. Any technician familiar with the technical field within the technical scope disclosed by the utility model and any equivalent replacement or change based on the technical solution and improved concept of the utility model shall be included in the protection scope of the utility model.

Claims

1. A thin substrate baking carrier, comprising a bracket (1), characterized in that: The surface of the bracket (1) is provided with cavities (2) at equal intervals, a pressure cover (3) is provided above the bracket (1), the pressure cover (3) is sleeved with the bracket (1), the cavity (2) is used to place a thin substrate, the bracket (1) and the pressure cover (3) cooperate to clamp and fix the thin substrate in the cavity (2), and a lifting device (4) is provided below the bracket (1), the lifting device (4) is used to demould the thin substrate in the cavity (2).

2. The thin substrate baking carrier according to claim 1, characterized in that: The lifting device (4) comprises a spring (41), a contact block (42), a moving rod (43) and a support block (44); the spring (41) is fixedly connected to the bottom of the bracket (1); the bottom of the spring (41) is fixedly connected to the contact block (42); the top of the contact block (42) is fixedly connected to the moving rod (43); the moving rod (43) is sleeved with the spring (41); the moving rod (43) is slidably connected to the bracket (1); the top of the moving rod (43) is fixedly connected to the support block (44); and the support block (44) is located in a surface groove of the bracket (1).

3. The thin substrate baking carrier according to claim 2, characterized in that: The surface of the support block (44) is provided with wear-resistant particles.

4. The thin substrate baking carrier according to claim 2, characterized in that: A bottom plate (6) is provided below the bracket (1), a top block (7) is fixedly connected to the top of the bottom plate (6), and the top block (7) corresponds to the contact block (42).

5. The thin substrate baking carrier according to claim 4, characterized in that: The tops of both sides of the bottom plate (6) are fixedly connected with guide rods (8), and the bottoms of both sides of the bracket (1) are provided with guide grooves (9), and the guide rods (8) correspond to the guide grooves (9).

6. The thin substrate baking carrier according to claim 1, characterized in that: Fixed rods (5) are fixedly connected to both sides of the bracket (1).

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