Chip surface printing detection equipment

By designing chip surface printing and testing equipment, and using column cameras and light sensors for automated inspection, the problem of inefficient production caused by manual observation is solved, and a fast and accurate detection effect is achieved.

CN222280515UActive Publication Date: 2024-12-31SUZHOU XIANGQI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420705345.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-08
Publication Date
2024-12-31
Estimated Expiration
2034-04-08

AI Technical Summary

Technical Problem

In the prior art, chip surface printing inspection requires manual observation of the naked eye, resulting in low production efficiency, consume a lot of manpower and time, and easy to misjudgment, resulting in reduced production efficiency.

Method used

A chip surface printing and detection equipment was designed, using column cameras, light sensors and fill lights to quickly detect the chip surface through high-frequency cameras, and the telescopic cylinders and sliding structures are used to achieve lifting and lowering of the material box rising platform, combined with light sensor control The inspection process improves detection efficiency and accuracy.

Benefits of technology

It realizes rapid and accurate detection of chip surface printing, improves production efficiency, reduces manual intervention, reduces misjudgment rate, and improves the level of detection automation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides chip surface printing detection equipment which comprises an equipment base, a stand column camera is fixedly connected to the surface of one side of the equipment base, an L-shaped mounting block is fixedly connected to the surface of the middle section of the stand column camera, and a detection position frame is fixedly connected to the surface of the other end of the L-shaped mounting block. And a light supplementing lamp is installed on the surface of the lower end of the detection position frame, a light sensor is arranged on the portion, below the L-shaped installation block, of one side of the stand column camera, and a material box lifting platform is installed above the equipment base, so that the problems that printing bad materials need to be observed with naked eyes, the production efficiency is low, time and energy consumption of operators is large, and the working efficiency is high are solved. The problem that the production efficiency is reduced directly due to the fact that labor and time are greatly consumed in the process and misjudgment is easily caused by manual observation in the prior art is solved.
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Description

Technical Field

[0001] The utility model mainly relates to the field of electronic component detection, and in particular to a chip surface printing detection device. Background Art

[0002] At present, in the process of semiconductor packaging, there is a step near the end of the process that requires printing specific labels or QR codes and other data on the fully packaged chip. Since the chip size is generally small, the chip may be misplaced in the tray for various reasons, resulting in the offset of the printing position. In some cases, the quality of laser printing is not up to standard, the color is too light, etc. Therefore, there will be a manual confirmation process after the printing is completed, which can not only select the defective materials with incorrect printing, but also need to check the front and back of the tray after printing.

[0003] In the existing process, it is necessary to observe bad printing materials with the naked eye, which leads to low production efficiency and consumes a lot of operator time and energy. This process is very time-consuming and human observation is prone to misjudgment, which directly leads to reduced production efficiency. In order to overcome the existing problem of low efficiency caused by using manpower to judge bad materials, the equipment developed by this technology can detect defective products through observation with visual equipment. Utility Model Content

[0004] 1. Technical problems to be solved by the utility model:

[0005] The utility model provides a chip surface printing detection device to solve the problem that bad printing materials need to be observed with the naked eye, production efficiency is low, and the operator's time and energy are consumed greatly. This process consumes a lot of manpower time, and manual observation is prone to misjudgment, which directly leads to the problem of reduced production efficiency.

[0006] 2. Technical solution:

[0007] In order to achieve the above-mentioned purpose, the technical solution provided by the utility model is: a chip surface printing detection equipment, including an equipment base, a column camera is fixedly connected to the surface of one side of the equipment base, an "L"-shaped mounting block is fixedly connected to the middle surface of the column camera, a detection position frame is fixedly connected to the other end surface of the "L"-shaped mounting block, a fill light is installed on the lower end surface of the detection position frame, a light sensor is arranged on the surface below the "L"-shaped mounting block on one side of the column camera, and a material box lifting platform is installed above the equipment base.

[0008] Furthermore, the detection position frame is fixedly connected to the surface of the column camera through an "L"-shaped mounting block, the chip box is placed above the material box lifting platform, and the fill light is arranged around the bottom of the detection position frame.

[0009] Furthermore, the column camera includes a mounting column, a nut groove is provided on the inner surface of the mounting column, a "U"-shaped frame is provided on the surface of the nut groove, a high-frequency camera is installed on the other end surface of the "U"-shaped frame, a sliding nut is provided on the surface of the nut groove, and a fixing screw is threadedly connected between the "U"-shaped frame and the sliding nut.

[0010] Furthermore, two high-frequency cameras are installed on the other side surface of the "U"-shaped frame, and the "U"-shaped frame and the high-frequency cameras are installed on the surface of the nut slide groove through a fixing screw to form a sliding structure.

[0011] Furthermore, the material box lifting platform includes a supporting slide 1, the surface of the supporting slide 1 is movably connected to a supporting frame 1, the top surface of the supporting frame 1 is movably connected to a material placement plate, the lower end surface of the other side of the material placement plate is provided with a supporting slide 2, the surface of the supporting slide 2 is movably connected to a supporting frame 2, a telescopic cylinder is provided on one side of the supporting frame 2, and the surface of the supporting frame 1 is slidably connected to a sliding block.

[0012] Furthermore, the telescopic cylinder is movably connected to the surface of the sliding block, a connecting shaft is provided at the overlapping portion between the support frame 1 and the support frame 2, a chip box is placed on the surface of the material placement plate, and the chip box is located below the high-frequency camera. The telescopic cylinder receives a start signal through a light sensor, and the material placement plate forms a lifting structure above the equipment base through the telescopic cylinder.

[0013] 3. Beneficial effects:

[0014] The utility model has a reasonable design. When performing chip surface detection, a chip material box is placed on the surface of the material placement plate in the material box lifting platform, and materials in the same box can be placed. The switch on the positive end face of the equipment base is pressed, and the telescopic cylinder is started, driving the sliding block to slide on the surface of the support frame one, driving the support frame two and the first end of the support frame one to slide on the surface of the support slideway two and the first surface of the support slideway one, so that the support frame one and the support frame two move the material placement plate and the chip material box upward, fix the material placement plate and the chip material box in the specified position, and quickly detect the chip surface in the chip material box through the high-frequency camera in the column camera, thereby achieving the purpose of improving production efficiency.

[0015] At the same time, the fixed relationship between the "U"-shaped frame and the nut slide groove can be released by controlling the tightness of the fixing screw, so as to adjust the height of the "U"-shaped frame and the high-frequency camera on the surface of the mounting column, thereby controlling the detection distance between the high-frequency camera and the chip material box, achieving the purpose of controlling the detection range, and at the same time, the fill light under the detection position frame can be started to achieve the effect of fill light. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 This is a three-dimensional schematic diagram of the pillar camera of the utility model;

[0018] Figure 3 It is a plane schematic diagram of the pillar camera of the utility model;

[0019] Figure 4 This is a schematic diagram of the material box lifting platform of the utility model;

[0020] Figure 5 It is a schematic diagram of a supporting slideway of the utility model.

[0021] Reference numerals:

[0022] 1. Equipment base; 2. Column camera; 201. Mounting column; 202. Nut slide; 203. "U"-shaped frame; 204. High-frequency camera; 205. Sliding nut; 206. Fixed screw; 3. "L"-shaped mounting block; 4. Detection position frame; 5. Fill light; 6. Light sensor; 7. Material box lifting platform; 701. Support slide 1; 702. Support frame 1; 703. Material placement plate; 704. Support slide 2; 705. Support frame 2; 706. Telescopic cylinder; 707. Sliding block. DETAILED DESCRIPTION

[0023] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0027] See attached Figure 1-5 , including a device base 1, a column camera 2 is fixedly connected to the surface of one side of the device base 1, an "L"-shaped mounting block 3 is fixedly connected to the middle surface of the column camera 2, a detection position frame 4 is fixedly connected to the surface of the other end of the "L"-shaped mounting block 3, a fill light 5 is installed on the lower end surface of the detection position frame 4, a light sensor 6 is arranged on the surface below the "L"-shaped mounting block 3 on one side of the column camera 2, a material box rising platform 7 is installed above the device base 1, the detection position frame 4 is fixedly connected to the surface of the column camera 2 through the "L"-shaped mounting block 3, a chip material box is placed above the material box rising platform 7, and the fill light 5 is arranged around the bottom of the detection position frame 4. The device quickly detects the chip material box through the column camera 2 and the material box rising platform 7.

[0028] The column camera 2 includes a mounting column 201, a nut groove 202 is arranged on the inner surface of the mounting column 201, a "U"-shaped frame 203 is arranged on the surface of the nut groove 202, a high-frequency camera 204 is installed on the other end surface of the "U"-shaped frame 203, a sliding nut 205 is arranged on the surface of the nut groove 202, a fixing screw 206 is threadedly connected between the "U"-shaped frame 203 and the sliding nut 205, two high-frequency cameras 204 are installed on the other side surface of the "U"-shaped frame 203, the "U"-shaped frame 203 and the high-frequency camera 204 are installed on the surface of the nut groove 202 by the fixing screw 206, and form a sliding structure.

[0029] In this embodiment, the fixed relationship between the "U"-shaped frame 203 and the nut slide groove 202 can be released by controlling the tightness of the fixing screw 206, thereby adjusting the height of the "U"-shaped frame 203 and the high-frequency camera 204 on the surface of the mounting column 201, thereby controlling the detection distance between the high-frequency camera 204 and the chip box, achieving the purpose of controlling the detection range, and at the same time, the fill light 5 below the detection position frame 4 can be started to achieve the effect of fill light.

[0030] The material box lifting platform 7 includes a support slide 701, and the surface of the support slide 701 is movably connected to a support frame 702, and the top surface of the support frame 702 is movably connected to a material placement plate 703, and the lower end surface of the other side of the material placement plate 703 is provided with a support slide 704, and the surface of the support slide 704 is movably connected to a support frame 2 705, and a telescopic cylinder 706 is provided on one side of the support frame 2 705, and a sliding block 707 is slidably connected to the surface of the support frame 1 702, and the telescopic cylinder 706 is movably connected to the surface of the sliding block 707, and a connecting shaft is provided at the overlapping position between the support frame 1 702 and the support frame 2 705, and a chip material box is placed on the surface of the material placement plate 703, and the chip material box is located below the high-frequency camera 204, and the telescopic cylinder 706 receives a start signal through the optical sensor 6, and the material placement plate 703 forms a lifting structure above the equipment base 1 through the telescopic cylinder 706.

[0031] In this embodiment, when performing chip surface detection, a chip box is placed on the surface of the material placement plate 703 in the box lifting platform 7, and a total of 15 boxes of materials can be placed. The switch on the front end face of the equipment base 1 is pressed, and the telescopic cylinder 706 is started, driving the sliding block 707 to slide on the surface of the support frame 1 702, driving the support frame 2 705 and one end of the support frame 1 702 to slide on the surfaces of the support slide 2 704 and the support slide 1 701, so that the support frame 1 702 and the support frame 2 705 move the material placement plate 703 and the chip box upward, and fix the material placement plate 703 and the chip box at a specified position. The high-frequency camera 204 in the column camera 2 is used to quickly detect the chip surface in the chip box, thereby achieving the purpose of improving production efficiency.

[0032] It should be noted that the optical sensor 6 transmits the signal to the PLC and the software in the computer, and the software determines and transmits the signal to the PLC to control the telescopic cylinder 706.

[0033] The above-described embodiments only express a certain implementation method of the utility model, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the patent of the utility model shall be based on the attached claims.

Claims

1. A chip surface printing detection device, characterized in that The invention comprises an equipment base (1), a column camera (2) is fixedly connected to a surface of one side of the equipment base (1), an "L"-shaped mounting block (3) is fixedly connected to a surface of a middle section of the column camera (2), a detection position frame (4) is fixedly connected to a surface of the other end of the "L"-shaped mounting block (3), a fill light (5) is installed on the lower surface of the detection position frame (4), a light sensor (6) is arranged on a surface below the "L"-shaped mounting block (3) on one side of the column camera (2), and a material box lifting platform (7) is installed above the equipment base (1).

2. A chip surface printing detection device according to claim 1, characterized in that: The detection position frame (4) is fixedly connected to the surface of the column camera (2) via an "L"-shaped mounting block (3); the chip material box is placed above the material box lifting platform (7); and the fill light (5) is arranged around the bottom of the detection position frame (4).

3. The chip surface printing detection device according to claim 1, characterized in that: The column camera (2) comprises a mounting column (201), a nut slot (202) is arranged on the inner surface of the mounting column (201), a "U"-shaped frame (203) is arranged on the surface of the nut slot (202), a high-frequency camera (204) is mounted on the other end surface of the "U"-shaped frame (203), a sliding nut (205) is arranged on the surface of the nut slot (202), and a fixing screw (206) is threadedly connected between the "U"-shaped frame (203) and the sliding nut (205).

4. A chip surface printing detection device according to claim 3, characterized in that: Two high-frequency cameras (204) are installed on the other side surface of the "U"-shaped frame (203). The "U"-shaped frame (203) and the high-frequency cameras (204) are installed on the surface of the nut slide groove (202) via a fixing screw (206) to form a sliding structure.

5. The chip surface printing detection device according to claim 1, characterized in that: The material box lifting platform (7) includes a support slide 1 (701), the surface of the support slide 1 (701) is movably connected to a support frame 1 (702), the top surface of the support frame 1 (702) is movably connected to a material placement plate (703), the lower end surface of the other side of the material placement plate (703) is provided with a support slide 2 (704), the surface of the support slide 2 (704) is movably connected to a support frame 2 (705), a telescopic cylinder (706) is provided on one side of the support frame 2 (705), and the surface of the support frame 1 (702) is slidably connected to a sliding block (707).

6. A chip surface printing detection device according to claim 5, characterized in that: The telescopic cylinder (706) is movably connected to the surface of the sliding block (707), a connecting shaft is provided at the overlapping portion between the support frame 1 (702) and the support frame 2 (705), a chip material box is placed on the surface of the material placement plate (703), and the chip material box is located below the high-frequency camera (204).