Low-power-consumption integrated monitoring device integrating vibration and acoustic emission

Abstract

The utility model relates to a low-power-consumption integrated monitoring device integrating vibration and acoustic emission. The low-power-consumption integrated monitoring device is mainly used for monitoring vibration and acoustic emission signals of production facilities and mechanical equipment in an industrial environment in real time. The device integrates a vibration acquisition module, an acoustic emission acquisition module, an MCU controller, a power supply module, a memory and a communication module. The vibration acquisition module and the acoustic emission acquisition module convert signals through an analog-digital converter and transmit the signals to the MCU controller for synchronous processing. The device further comprises an intelligent awakening mechanism, a low-power-consumption design and a dustproof and waterproof protective shell. Through the integrated design, the device remarkably reduces the cost, reduces the size, improves the accuracy and reliability of monitoring and alarming, is convenient for field installation and maintenance, and realizes synchronous acquisition and remote monitoring of vibration and acoustic emission data.

Description

Technical Field

[0001] The utility model relates to the field of online monitoring equipment, in particular to a low-power integrated monitoring device integrating vibration and acoustic emission, which is used for real-time monitoring and analysis of vibration and acoustic emission signals in equipment. This device is mainly used in industrial environments, such as production facilities, mechanical equipment, etc., for monitoring and early warning of potential equipment failures and performance degradation. Background Art

[0002] Acoustic emission monitoring focuses more on subtle changes and damage inside the material, while vibration monitoring focuses on evaluating the operating status and fault diagnosis of mechanical equipment. Both are important predictive maintenance tools that can help detect problems in advance and prevent failures.

[0003] However, in traditional industrial monitoring systems, vibration monitoring and acoustic emission monitoring are often carried out separately. This separate monitoring method mainly uses separate acquisition and processing chips, resulting in high equipment costs. Furthermore, the separate arrangement leads to inconvenient on-site installation and difficulty in subsequent maintenance. In addition, due to the dispersion of data sources, it is difficult to effectively inter-verify and comprehensively analyze vibration and acoustic emission data, which to a certain extent limits the accuracy and reliability of the monitoring system. Utility Model Content

[0004] In order to solve these problems, the utility model provides a low-power integrated monitoring device integrating vibration and acoustic emission, which is used to monitor and analyze the vibration and acoustic emission signals in the equipment in real time. The device includes: a vibration acquisition module, an acoustic emission acquisition module, a microcontroller unit (MCU controller for short), a power module, a memory and a communication module;

[0005] The vibration acquisition module includes a vibration sensor and a first analog-to-digital converter (first ADC). The vibration sensor is responsible for capturing the vibration signal of the monitored device and converting it into an analog vibration signal. The first ADC converts the analog vibration signal into a digital vibration signal and transmits it to the first communication interface of the MCU controller for processing.

[0006] The acoustic emission acquisition module includes an acoustic emission sensor and a second analog-to-digital converter (second ADC). The acoustic emission sensor is responsible for capturing the acoustic emission signal of the monitored equipment and converting it into an analog acoustic emission signal. The second ADC converts the analog acoustic emission signal into a digital acoustic emission signal and transmits it to the second communication interface of the MCU controller for processing.

[0007] The MCU controller, after being awakened by the awakening mechanism, controls the power module through the pin to turn on the power of the acoustic emission acquisition module, the power of the memory and the communication module, and then synchronously processes the data of the vibration module and the acoustic emission module. The processed data is stored in the memory and sent to the server and the external device through the communication module;

[0008] The power module supplies power to the MCU controller, the vibration collection module, the acoustic emission collection module, the memory and the communication module;

[0009] The memory is connected to the MCU controller via the third communication interface of the MCU controller and is used to store processed data;

[0010] The communication module is connected to the MCU controller via the fourth communication interface of the MCU controller, and is used to send processed data to an external device or server and receive control instructions from an external device.

[0011] Optionally, the wake-up mechanism of the MCU controller includes timer wake-up, vibration threshold trigger wake-up and button wake-up;

[0012] The timer wake-up mechanism causes the monitoring device to enter a dormant state after each data collection. During this period, the MCU controller controls the power module to turn off unnecessary power, the device enters a dormant state, and the low-power vibration collection module continues to supply power. After the dormant timer ends, the system is awakened and resumes collection;

[0013] The vibration threshold trigger mechanism, the analog vibration signal output by the vibration sensor is connected to the pin of the MCU controller, when the vibration signal exceeds the threshold, the MCU controller is awakened and starts collecting;

[0014] The key wake-up mechanism allows an external key to wake up the MCU controller through a GPIO signal and start acquisition.

[0015] Optionally, the MCU controller can actively enter a sleep state. Before entering the sleep state, the power module can be controlled through a pin to turn off the non-essential power supply, including: the power supply of the acoustic emission acquisition module, the ADC power supply of the vibration acquisition module, the memory power supply and the power supply of the communication module. Then the MCU controller actively enters a sleep state, and the entire device enters a low power consumption mode.

[0016] Optionally, the MCU controller is further equipped with a clock module for performing data synchronization processing to ensure the timing consistency of the acoustic emission data and the vibration data.

[0017] Optionally, the communication module supports wireless communication protocols, including but not limited to Wi-Fi, Bluetooth, Lora or 4G, to achieve remote monitoring.

[0018] Optionally, the data storage module is a non-volatile memory capable of retaining data in the event of a power outage.

[0019] Optionally, the vibration collection module, the acoustic emission collection module, the MCU controller, the power module, the memory and the communication module are all arranged in the same protective shell, and the shell has dustproof and waterproof properties to enhance the anti-electromagnetic interference properties and durability of the equipment.

[0020] Optionally, the protective shell is provided with a strong magnet at the bottom, which can be directly magnetically attracted to the surface of the object to be measured. At the same time, a screw mounting hole is provided at the bottom of the protective shell, which can be fixed with screws; the vibration sensor is installed inside the protective shell and is completely sealed with curing glue to form a relatively rigid structure; the acoustic emission sensor has a spring structure on the top, which can enable the acoustic emission sensor to maintain a fixed pressure.

[0021] Optionally, the low-power integrated monitoring device integrating vibration and acoustic emission, the system operation includes the following process:

[0022] The device starts after power-on, and the MCU controller starts to configure the operating parameters;

[0023] The system turns on the first ADC power supply and the acoustic emission acquisition module power supply in sequence;

[0024] The MCU controller starts to collect acoustic emission signals and vibration signals simultaneously;

[0025] The MCU controller turns on the memory power supply to save the collected data to the local memory;

[0026] The MCU controller turns on the power of the communication module and sends data to the server and external devices through the communication module;

[0027] The MCU controller turns off the memory power supply, the communication module power supply, the acoustic emission acquisition module power supply and the first ADC power supply in sequence;

[0028] The MCU controller configures the sleep wake-up timer. After configuring the sleep wake-up timer, it enters sleep mode until it is awakened by any of the wake-up mechanisms including the timer, vibration threshold trigger wake-up, or key wake-up. After the MCU is awakened, it starts a new round of acquisition process.

[0029] Through the above technical solutions, it can be known that the utility model provides a low-power integrated monitoring device integrating vibration and acoustic emission. The vibration acquisition module and the acoustic emission acquisition module use the same MCU controller at the same time, which can greatly reduce the cost of the device, greatly reduce the volume, and facilitate on-site installation and later maintenance; at the same time, the vibration data and the acoustic emission data have the same timing and can verify each other. In addition, the intelligent wake-up mechanism and low-power design can make the device more suitable for long-term online monitoring while ensuring the accuracy and reliability of the monitoring alarm. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A principle block diagram of a low-power integrated monitoring device integrating vibration and acoustic emission provided for a specific implementation of the utility model;

[0032] Figure 2 for Figure 1 A detailed structural diagram of the low-power integrated monitoring device integrating vibration and acoustic emission;

[0033] Figure 3 A schematic diagram of the operation flow of a low-power integrated monitoring device system for integrating vibration and acoustic emission provided by the embodiment shown in FIG. 1 or FIG. 2 is provided for a specific implementation of the utility model. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] Figure 1 The principle block diagram of a low-power integrated monitoring device for vibration and acoustic emission provided by the embodiment of the utility model is as follows: Figure 1As shown, the low-power integrated monitoring device for integrated vibration and acoustic emission of this embodiment includes: a vibration acquisition module, an acoustic emission acquisition module, a microcontroller unit (MCU controller for short), a power module, a memory and a communication module;

[0036] The vibration acquisition module includes a vibration sensor and a first analog-to-digital converter (first ADC). The vibration sensor is responsible for capturing the vibration signal of the monitored device and converting it into an analog vibration signal. The first ADC converts the analog vibration signal into a digital vibration signal and transmits it to the first communication interface of the MCU controller for processing.

[0037] The acoustic emission acquisition module includes an acoustic emission sensor and a second analog-to-digital converter (second ADC). The acoustic emission sensor is responsible for capturing the acoustic emission signal of the monitored equipment and converting it into an analog acoustic emission signal. The second ADC converts the analog acoustic emission signal into a digital acoustic emission signal and transmits it to the second communication interface of the MCU controller for processing.

[0038] The MCU controller, after being awakened by the awakening mechanism, controls the power module through the pin to turn on the power of the acoustic emission acquisition module, the power of the memory and the communication module, and then synchronously processes the data of the vibration module and the acoustic emission module. The processed data is stored in the memory and sent to the server and the external device through the communication module;

[0039] The power module supplies power to the MCU controller, the vibration collection module, the acoustic emission collection module, the memory and the communication module;

[0040] The memory is connected to the MCU controller via the third communication interface of the MCU controller and is used to store processed data;

[0041] The communication module is connected to the MCU controller via the fourth communication interface of the MCU controller, and is used to send processed data to an external device or server and receive control instructions from an external device.

[0042] It can be understood that, in this embodiment, the vibration sensor is a device that converts macroscopic mechanical vibration motion into electrical motion, monitors the overall motion of the object being measured, and has a low vibration frequency. Specifically, it may include a displacement sensor, a velocity sensor, and an acceleration sensor. For example, the acceleration sensor in this embodiment converts the acceleration value into an electric charge, and the output charge amount is proportional to the acceleration of the vibrating particle. The unit of sensitivity is pC / m / s2; and the acoustic emission sensor is a device that converts microscopic changes inside the material, such as high-frequency sound waves caused by crack formation and expansion, material friction or other forms of internal displacement and deformation, into electrical motion. It measures the velocity of the vibrating particles on the coupling surface and focuses on detecting tiny sound wave changes inside the material, which is used for early detection of material or structure damage. For example, the voltage output by the acoustic emission sensor in this embodiment is proportional to the velocity of the vibrating particles on the coupling surface, and the unit of sensitivity is mV / m / s.

[0043] In specific applications, the wake-up mechanism of the MCU controller includes timer wake-up, vibration threshold trigger wake-up and button wake-up;

[0044] The timer wake-up mechanism causes the monitoring device to enter a dormant state after each data collection. During this period, the MCU controller controls the power module to turn off unnecessary power, the device enters a dormant state, and the low-power vibration collection module continues to supply power. After the dormant timer ends, the system is awakened and resumes collection;

[0045] The vibration threshold trigger mechanism, the analog vibration signal output by the vibration sensor is connected to the pin of the MCU controller, when the vibration signal exceeds the threshold, the MCU controller is awakened and starts collecting;

[0046] The key wake-up mechanism allows an external key to wake up the MCU controller through a GPIO signal and start acquisition.

[0047] It should be noted that the vibration sensor is powered for a long time. For example, the power supply of the vibration collector in this embodiment is only a small part of the overall power supply of the system. The vibration sensor is used to monitor physical vibration in real time and output analog voltage signals.

[0048] In a specific application, the MCU controller can actively enter a sleep state. Before entering the sleep state, the power module can be controlled through a pin to turn off the non-essential power supply, including: the power supply of the acoustic emission acquisition module, the ADC power supply of the vibration acquisition module, the memory power supply and the power supply of the communication module. Then the MCU controller actively enters a sleep state, and the entire device enters a low power consumption mode.

[0049] In specific applications, the MCU controller is further equipped with a clock module to perform data synchronization processing to ensure the timing consistency of acoustic emission data and vibration data.

[0050] In a specific application, the communication module supports wireless communication protocols, including but not limited to Wi-Fi, Bluetooth, Lora or 4G, to achieve remote monitoring.

[0051] In a specific application, the data storage module is a non-volatile memory that can retain data in the event of a power outage.

[0052] In a specific application, the vibration collection module, the acoustic emission collection module, the MCU controller, the power module, the memory and the communication module are all arranged in the same protective shell, and the shell has dustproof and waterproof properties to enhance the anti-electromagnetic interference properties and durability of the equipment.

[0053] In specific applications, such as Figure 2 As shown, the low-power integrated monitoring device integrating vibration and acoustic emission described in this embodiment

[0054] The bottom of the protective shell is provided with a strong magnet, which can be directly magnetically attracted to the surface of the object to be measured. At the same time, a screw installation hole is provided at the bottom of the protective shell, which can be fixed with screws;

[0055] The vibration sensor is mounted on the PCB back plate using rigid glue, and the cavity formed by the PCB back plate and the shell is glued with silica gel;

[0056] For example, the rigid glue in this embodiment may preferably be industrial grade 603 rigid glue, and the silicone in this embodiment may preferably be 704 or 706 silicone;

[0057] The acoustic emission sensor also includes a spring, a retaining spring, and a telescopic rod. The telescopic rod integrated with the acoustic emission sensor passes through the spring and extends into the housing, and is limited by the retaining spring, so that after the acoustic emission sensor and the housing are installed, the acoustic emission sensor maintains a fixed pressure under the compression of the spring;

[0058] In a specific application, the MCU controller, the memory, the communication module, the first ADC and the second ADC may be integrated on an integrated board;

[0059] For example, the communication module in this embodiment may preferably be a 4G module, and the 4G module may send data to an external device or a server through a 4G antenna to send processed data and receive control instructions from an external device.

[0060] In a specific application, the low-power integrated monitoring device integrating vibration and acoustic emission, the system operation includes the following process:

[0061] The device starts after power-on, and the MCU controller starts to configure the operating parameters;

[0062] The system turns on the first ADC power supply and the acoustic emission acquisition module power supply in sequence;

[0063] The MCU controller starts to collect acoustic emission signals and vibration signals simultaneously;

[0064] The MCU controller turns on the memory power supply to save the collected data to the local memory;

[0065] The MCU controller turns on the power of the communication module and sends data to the server and external devices through the communication module;

[0066] The MCU controller turns off the memory power supply, the communication module power supply, the acoustic emission acquisition module power supply and the first ADC power supply in sequence;

[0067] The MCU controller configures the sleep wake-up timer. After configuring the sleep wake-up timer, it enters sleep mode until it is awakened by any of the wake-up mechanisms including the timer, vibration threshold trigger wake-up, or key wake-up. After the MCU is awakened, it starts a new round of acquisition process.

Claims

1. A low-power integrated monitoring device integrating vibration and acoustic emission, used for real-time monitoring and analysis of vibration and acoustic emission signals in equipment, characterized in that: The device includes: a vibration collection module, an acoustic emission collection module, an MCU controller, a power module, a memory and a communication module; The vibration acquisition module includes a vibration sensor and a first analog-to-digital converter (first ADC). The vibration sensor is responsible for capturing the vibration signal of the monitored device and converting it into an analog vibration signal. The first ADC converts the analog vibration signal into a digital vibration signal and transmits it to the first communication interface of the MCU controller for processing. The acoustic emission acquisition module includes an acoustic emission sensor and a second analog-to-digital converter (second ADC). The acoustic emission sensor is responsible for capturing the acoustic emission signal of the monitored equipment and converting it into an analog acoustic emission signal. The second ADC converts the analog acoustic emission signal into a digital acoustic emission signal and transmits it to the second communication interface of the MCU controller for processing. The MCU controller, after being awakened by the awakening mechanism, controls the power module through the pin to turn on the power of the acoustic emission acquisition module, the power of the memory and the communication module, and then synchronously processes the data of the vibration module and the acoustic emission module. The processed data is stored in the memory and sent to the server and the external device through the communication module; The power module supplies power to the MCU controller, the vibration collection module, the acoustic emission collection module, the memory and the communication module; The memory is connected to the MCU controller via the third communication interface of the MCU controller and is used to store processed data; The communication module is connected to the MCU controller via the fourth communication interface of the MCU controller, and is used to send processed data to an external device or server and receive control instructions from an external device.

2. A low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The wake-up mechanism of the MCU controller includes timer wake-up, vibration threshold trigger wake-up and button wake-up; The timer wake-up mechanism causes the monitoring device to enter a dormant state after each data collection. During this period, the MCU controller controls the power module to turn off the power of the acoustic emission collection module, the ADC power of the vibration collection module, the memory power, and the power of the communication module. The device enters a dormant state, and the low-power vibration collection module continues to be powered. After the dormant timer ends, the system is awakened and resumes collection; The vibration threshold trigger mechanism, the analog vibration signal output by the vibration sensor is connected to the pin of the MCU controller, when the vibration signal exceeds the threshold, the MCU controller is awakened and starts collecting; The key wake-up mechanism allows an external key to wake up the MCU controller through a GPIO signal and start acquisition.

3. A low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The MCU controller can actively enter the sleep state. Before entering the sleep state, the power module can be controlled through the pin to turn off the power of the acoustic emission acquisition module, the ADC power of the vibration acquisition module, the memory power and the communication module. Then the MCU controller actively enters the sleep state, and the entire device enters the low power consumption mode.

4. The low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The MCU controller is further equipped with a clock module for performing data synchronization processing to ensure the timing consistency of the acoustic emission data and the vibration data.

5. The low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The communication module supports wireless communication protocols, including but not limited to Wi-Fi, Bluetooth, Lora or 4G, to achieve remote monitoring.

6. The low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The data storage module is a non-volatile memory that can retain data in the event of a power outage.

7. The low-power integrated monitoring device integrating vibration and acoustic emission according to claim 1, characterized in that: The vibration acquisition module, the acoustic emission acquisition module, the MCU controller, the power module, the memory and the communication module are all arranged in the same protective shell, and the shell has dustproof and waterproof properties to enhance the anti-electromagnetic interference properties and durability of the equipment; a strong magnet is arranged at the bottom of the protective shell, which can be directly magnetically attracted to the surface of the object to be measured, and a screw mounting port is arranged at the bottom of the protective shell, which can be fixed with screws; the vibration sensor is installed in the protective shell and is completely sealed with curing glue to form a relatively rigid structure; the top of the acoustic emission sensor has a spring structure, which can keep the acoustic emission sensor at a fixed pressure.

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