Power device aging test drawer unit

By adopting contact aging method and thermal insulation board protection design in chip aging testing equipment, the problems of high costs and line damage in the existing technology are solved, and efficient batch aging testing and protection effects are achieved.

CN222280763UActive Publication Date: 2024-12-31WUXI ZHONGSHENGHE SEMICON EQUIP CO LTD
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Patent Information

Application Number
CN202420860491.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-24
Publication Date
2024-12-31
Estimated Expiration
2034-04-24

AI Technical Summary

Technical Problem

Existing chip aging testing equipment has high production costs, low space utilization and damage to the circuit and PCB board, especially the contactless aging method causes excessive damage to the entire circuit and PCB board.

Method used

A power device aging test drawer unit is designed, using a contact aging method, providing directional heat through the heat sink and heat insulation board of the aging base, protecting the circuit and PCB board, and simultaneously implementing batch aging test.

Benefits of technology

It improves the testing capacity, reduces production costs, protects the structure and life of the lines and PCB boards, and achieves efficient batch aging testing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a power device aging test drawer unit, the power device aging test drawer unit is a double-sided structure, the power device aging test drawer unit comprises a tray used for loading a power device, the tray is clamped between an upper cover assembly and an aging base, the aging base is in close contact with the power device, and the power device is arranged on the aging base. The upper cover assembly is used for connecting a power device and a driving unit. According to the utility model, the power devices are arranged on the tray, then the tray is arranged in the aging base and the upper cover assembly, the aging base provides an aging environment for the power devices, and the power devices are electrified through the upper cover assembly, so that the batch aging test of products is realized, and the test productivity is extremely high; the heat sink arranged on the aging base is tightly attached to the power device, and the heat insulation plate is arranged, so that damage to the circuit and the PCB caused by heat dissipation is avoided.
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Description

Technical Field

[0001] The utility model relates to the technical field related to chip aging test, in particular to a power device aging test drawer unit. Background Art

[0002] The current aging methods are basically non-contact, and the product is installed in the socket and then placed in a temperature chamber for aging. In the existing technology, each product corresponds to a socket, which has high production costs, low space utilization, and low production capacity of the entire equipment.

[0003] In the prior art, the sockets, circuits and PCB aging boards connected to the product are all aged at the same temperature in a temperature chamber, which causes great damage to the entire circuit and PCB board. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art. The utility model proposes a power device aging test drawer unit, which uses a contact aging method to directly control the heat sink temperature to age the product, and sets isolation measures to ensure the life and structure of the circuit and PCB board, while realizing batch aging testing.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a power device aging test drawer unit, the power device aging test drawer unit is a double-sided structure, including a tray for loading power devices, the tray is clamped between the upper cover assembly and the aging base, the aging base is in close contact with the power device, and the upper cover assembly is used to connect the power device and the drive unit.

[0006] Furthermore, the aging base is a double-sided structure, including a heating PCB board, a heat sink and a heat insulation board, the heat sink is attached to one side of the heating PCB board, and the heat insulation board presses and fixes the heat sink to one side of the heating PCB board.

[0007] Furthermore, the heat insulation board is a hollow structure, the heat sink can be embedded in the hollow area of ​​the heat insulation board, and the thickness of the heat sink is the same as the thickness of the heat insulation board.

[0008] Furthermore, the aging base also includes an end plate and a tail plate, and the end plate and the tail plate are fixedly arranged at both ends along the length direction of the heating PCB board to provide energy for the heating PCB board.

[0009] Furthermore, the upper cover assembly includes a probe seat, and a plurality of probes are fixedly arranged throughout the thickness direction of the probe seat, and the positions of the probes correspond to the positions of the power devices loaded on the tray; an upper cover PCB board is fixedly arranged on the outer side of the probe seat, and the upper cover PCB board is used to connect with the drive unit.

[0010] Furthermore, a plurality of rubber strips are fixedly arranged on the side of the probe seat facing the heat sink, and the probe seat is fixed to the outer side of the heat insulation board.

[0011] Compared with the prior art, the beneficial effects of the utility model include:

[0012] 1) By arranging the power devices on the tray, and then placing the tray in the aging base and the upper cover assembly, the aging base provides an aging environment for the power devices, and the upper cover assembly energizes the power devices to achieve batch aging testing of the products, with extremely high testing capacity;

[0013] 2) The heat sink set on the aging base is close to the power device, and a heat insulation board is set to prevent heat from escaping and causing damage to the circuit and PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The disclosure of the present invention is described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them:

[0015] Figure 1 The exploded structure of the power device aging test drawer unit is schematically shown;

[0016] Figure 2 Schematic showing the exploded structure of the aged base;

[0017] Figure 3 The cross-sectional structure of the upper cover assembly is schematically shown;

[0018] Figure 4 The application scenario of the power device aging test drawer unit is schematically shown.

[0019] Numbers in the figure: 1-upper cover assembly, 2-tray, 3-aging base, 4-heating PCB board, 5-heat sink, 6-insulation board, 7-end plate, 8-tail plate, 9-probe seat, 10-upper cover PCB board, 11-rubber strip. DETAILED DESCRIPTION

[0020] It is easy to understand that according to the technical solution of the utility model, without changing the essential spirit of the utility model, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the utility model, and should not be regarded as the entirety of the utility model or as a limitation or restriction to the technical solution of the utility model.

[0021] Figure 1The exploded structure of a power device aging test drawer unit is schematically shown. A power device aging test drawer unit such as Figure 1 As shown, the aforementioned power device aging test drawer unit is a double-sided structure, including a tray 2 for loading power devices, the tray 2 is clamped between the upper cover assembly 1 and the aging base 3, the aging base 3 is in close contact with the power device, and is used to provide directionally heated power devices, the upper cover assembly 1 is connected to the power device on the one hand, and is connected to the drive unit on the other hand to energize the power device, and under the premise that the aging environment is provided by the aging base 3, the power device is energized to achieve product aging testing.

[0022] The structure of the tray 2 is described in detail below. The tray 2 is a square symmetrical structure as a whole, and a plurality of embedding grooves for placing power devices are opened in the middle area of ​​the tray 2, and the embedding grooves to the edges of the tray 2 are used to adapt to the length of the power device terminals, so that the power devices can be placed in the tray 2 in a certain arrangement.

[0023] Figure 2 Schematic showing the exploded structure of the aged base, combined with Figure 2 The structure of the aging base 3 is described in detail. The aging base 3 is also a double-sided structure, including a heating PCB board 4, a heat sink 5 and a heat insulation board 6. Based on the aforementioned heating PCB board 4, both sides are attached with heat sinks 5. The width of the heat sink 5 is the same as the total width of the embedding groove of the aforementioned tray 2 for placing power devices, so that the heat sink 5 can accurately provide an aging environment for the power devices. The heat insulation boards 6 located on both sides of the heating PCB board 4 press the heat sink 5 onto the heating PCB board 4, and the heat sink 5 and the heating PCB board 4 are fixed as a whole by the heat insulation boards 6 located on both sides of the heating PCB board 4.

[0024] It is worth mentioning that the aforementioned insulation board 6 is a hollow structure, and the heat sink 5 can be embedded in the hollow area of ​​the insulation board 6, and the thickness of the heat sink 5 is the same as the thickness of the insulation board 6, so that the heat sink 5 can be embedded in the hollow area of ​​the insulation board 6, and when the heat sink 5 and the insulation board 6 are fixed as one, the heights of the two are the same, which is convenient for fixing the tray 2 in the aging base 3 and the upper cover assembly 1.

[0025] The aforementioned aging base 3 also includes an end plate 7 and a tail plate 8, which are fixedly arranged at both ends along the length direction of the heating PCB board 4, and terminals for supplying power to the heating PCB board 4 are arranged on the end plate 7.

[0026] Figure 3 The schematic diagram shows the cross-sectional structure of the upper cover assembly, combined with Figure 3The structure of the upper cover assembly 1 is described in detail. The upper cover assembly 1 includes a probe seat 9, and a plurality of probes are fixedly arranged in the thickness direction of the probe seat 9. The positions of the probes correspond to the positions of the power devices loaded on the tray 2. An upper cover PCB board 10 is fixedly arranged on the outer side of the probe seat 9. One end of the probe contacts the upper cover PCB board 10, and the other end contacts the power device, so that the power device is connected to the upper cover PCB board 10, which is convenient for the test process. The upper cover PCB board 10 is connected to the drive unit to carry out the test process of the power device.

[0027] A plurality of rubber pressure strips 11 are fixedly disposed on the side of the probe seat 9 facing the heat sink 5 . The probe seat 9 is fixed to the outer side of the heat insulation board 6 for pressing the power device.

[0028] like Figure 4 As shown, in actual application, the power device is placed in the embedded groove on the tray 2, and then the tray 2 is placed on the aging base 3, the bottom surface of the power device is in contact with the heat sink 5, and the upper cover is covered. The upper cover PCB board 10 is connected to the product through the probe, and the power device is pressed by the pressure strip. After the assembly of the power device aging test drawer unit is completed, the power device aging test drawer unit is vertically inserted into the guide rail. In this process, the upper cover PCB board 10 and the heating PCB board 4 are connected to the driving unit, so as to supply power to the power device and the heating PCB board 4. The heating PCB board 4 generates heat and transfers heat to the heat sink 5. In this way, the power device in contact with the heat sink 5 can be heated up, thereby providing an aging environment for the power device and realizing the aging test of the power device.

[0029] The technical scope of the present invention is not limited to the contents described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A power device aging test drawer unit, characterized in that: The power device aging test drawer unit is a double-sided structure, comprising a tray (2) for loading power devices, the tray (2) being sandwiched between an upper cover assembly (1) and an aging base (3), the aging base (3) being in close contact with the power device, and the upper cover assembly (1) being used to connect the power device and the drive unit.

2. The power device aging test drawer unit according to claim 1, characterized in that: The aging base (3) is a double-sided structure, comprising a heating PCB board (4), a heat sink (5) and a heat insulation board (6), wherein the heat sink (5) is attached to one side of the heating PCB board (4), and the heat insulation board (6) presses and fixes the heat sink (5) to one side of the heating PCB board (4).

3. The power device aging test drawer unit according to claim 2, characterized in that: The heat insulation board (6) is a hollow structure, the heat sink (5) can be embedded in the hollow area of ​​the heat insulation board (6), and the thickness of the heat sink (5) is the same as the thickness of the heat insulation board (6).

4. The power device aging test drawer unit according to claim 2, characterized in that: The aging base (3) further comprises an end plate (7) and a tail plate (8), wherein the end plate (7) and the tail plate (8) are fixedly arranged at two ends along the length direction of the heating PCB board (4) and are used to supply energy to the heating PCB board (4).

5. The power device aging test drawer unit according to claim 2, characterized in that: The upper cover assembly (1) comprises a probe seat (9), and a plurality of probes are fixedly arranged in the thickness direction of the probe seat (9), and the positions of the probes correspond to the positions of the power devices loaded on the tray (2); an upper cover PCB board (10) is fixedly arranged on the outer side of the probe seat (9), and the upper cover PCB board (10) is used to connect with the drive unit.

6. The power device aging test drawer unit according to claim 5, characterized in that: A plurality of rubber strips (11) are fixedly arranged on the side of the probe seat (9) facing the heat sink (5), and the probe seat (9) is fixed on the outer side of the heat insulation board (6).