The present invention provides a
simulation method for a
retaining ring structure in a chemical mechanical
polishing process, comprising constructing a CFD model of the chemical mechanical
polishing process, dividing a fluid region into discrete grids, wherein the grids are non-
repetitive control volumes, and within each control volume, using a
momentum equation, a
continuity equation, and a VOF model to control the motion of the
polishing liquid fluid, and a DPM model to control the motion of the
abrasive, integrating the
momentum equation, the
continuity equation, and the VOF model for each control volume to obtain a discrete equation, solving the discrete equation to obtain
simulation data, the
simulation data including
abrasive motion data, plotting the
abrasive distribution and the abrasive aggregation state on the polishing pad and / or the
wafer edge based on the abrasive motion data, and having the beneficial effects of visualizing the polishing liquid / abrasive flow through a
finite element method, helping to understand the influence of the
retaining ring on the polishing liquid flow, providing a
retaining ring structure improvement to solve
wafer edge over-polishing, conforming to actual production processes, and having high simulation accuracy.