Bonding device

Abstract

The utility model belongs to the technical field of semiconductor material processing, and particularly relates to a bonding device which comprises a bonding chamber. A pressure head is arranged in the bonding chamber and comprises a rigid part and an elastic part which are combined with each other; the combination surface of the rigid part and the elastic part is a plane; a convex surface is arranged on the opposite surface of the combination surface of the elastic part and the rigid part; the protruding face is configured to be an inclined face which is provided with a protruding high point and inclines towards the periphery from the protruding high point. And the convex surface is a contact surface in contact with the laminated material. The method is used for solving the problem that bubbles are easily generated on a bonding surface during bonding.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor material processing, and in particular, relates to a bonding device. Background Art

[0002] In the field of semiconductor material processing, material bonding technology has become the main development direction, and the constantly updated advanced processing processes have increasingly higher requirements for bonding quality.

[0003] The existing bonding technology mainly uses a method of pressing the materials to be bonded directly from top to bottom, but this method of direct pressure bonding may cause problems such as bubbles at the bonding interface.

[0004] In the existing technology, there is an attempt to solve the above problem by using inclined bonding method. The principle of inclined bonding is to create a certain inclination angle between the materials to be bonded. During bonding, the bonding force is gradually applied to the bonding surface from the inclination angle to achieve force diffusion from point to surface, thereby driving out the bubbles on the bonding surface.

[0005] However, the problem is that some bonding materials are thin and brittle. The bonding force is first applied at the edge, which can easily cause the thin and brittle bonding material to break due to uneven force on the material. Utility Model Content

[0006] The purpose of the utility model is to provide a bonding device for solving the above technical problems.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] A bonding device is provided, comprising: a bonding chamber;

[0009] A pressing head is arranged in the bonding chamber, and the pressing head includes a rigid part and an elastic part combined with each other;

[0010] The joint surface between the rigid part and the elastic part is a plane;

[0011] The surface opposite to the joint surface of the elastic part and the rigid part has a convex surface;

[0012] The convex surface is configured to have a convex high point and inclined surfaces inclined from the convex high point to the surrounding areas;

[0013] The convex surface is a contact surface that contacts the laminated material.

[0014] Furthermore, a pressure rod is provided in the bonding chamber;

[0015] One end of the pressure rod is connected to the pressure rod driving part;

[0016] The other end of the pressure rod is connected to the pressure head rigid part.

[0017] Furthermore, a support platform is provided in the bonding chamber;

[0018] The support platform is used for supporting the stacked materials.

[0019] Furthermore, the stacked material includes wafers stacked up and down.

[0020] Furthermore, the cross section of the pressure head is circular.

[0021] Further, the indenter elastic portion includes a regular surface with a thickness denoted as K;

[0022] A convex surface with a thickness of H is provided on the regular surface.

[0023] Furthermore, the K value is 10-100 μm.

[0024] Furthermore, the H value is 20-80 μm.

[0025] Furthermore, the elastic part is made of one of silicone rubber, fluororubber and polytetrafluoroethylene. The material can meet the dust-free requirement during bonding, and the elastic deformation can also meet the bonding requirement.

[0026] Furthermore, the rigid part is made of metal;

[0027] A circulation channel is provided in the rigid part, and the circulation channel is filled with a temperature control medium for adjusting the temperature of the pressure head.

[0028] Beneficial effects of the utility model:

[0029] By setting a micron-level elastic raised surface on the pressure head, when bonding, the raised points of the raised surface first contact the laminated material and gradually press down until the elastic surface and the laminated material are completely in contact, achieving gradual pressing from point to surface, driving out bubbles in the bonding surface, and improving the bonding quality. Since the raised height of the raised surface is limited and it is made of elastic material, even thin and brittle materials will not be crushed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the bonding device of the utility model;

[0031] Figure 2 It is a schematic diagram of an implementation method of the elastic part of the pressure head of the utility model;

[0032] Figure 3 It is a schematic diagram of another embodiment of the elastic part of the pressure head of the utility model;

[0033] Figure 4 It is a schematic diagram of another embodiment of the elastic part of the pressure head of the utility model;

[0034] Figure 5 It is a schematic diagram of the dimensions of the elastic part of the pressure head in several feasible implementation modes of the utility model;

[0035] Figure 6 It is a schematic diagram of the pressure head pressurization process of several feasible implementation modes of the utility model;

[0036] In the figure: 1. pressure rod; 2. rigid part; 3. elastic part; 4. lamination material; 5. pressure rod driving part; 6. support platform; 7. bonding chamber. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0038] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0041] See also Figure 1 This embodiment provides a bonding device, including: a bonding chamber 7, a pressure head is arranged in the bonding chamber 7, and further, a pressure rod 1 is arranged in the bonding chamber 7, one end of the pressure rod 1 is connected to the pressure rod driving part 5, and the other end of the pressure rod 1 is connected to the pressure head rigid part 2. Further, a support platform 6 is arranged in the bonding chamber 7, and the support platform 6 is used to support the stacking material 4, and the stacking material 4 can be a wafer stacked up and down.

[0042] During operation, the pressure rod driving unit 5 drives the pressure rod 1 to drive the pressure head to press the laminated material 4 located on the support platform 6, so that the laminated material 4 is pressed and bonded.

[0043] See also Figure 2-4 The pressure head includes a rigid part 2 and an elastic part 3 combined with each other, the combination surface of the rigid part 2 and the elastic part 3 is a plane, and the opposite surface of the combination surface of the elastic part 3 and the rigid part 2 has a convex surface, and the convex surface is configured to have a convex high point and an inclined surface inclined from the convex high point to the surrounding areas. The surface from the convex high point to the edge of the pressure head can be an inclined plane or a curved surface, and the convex surface is the contact surface in contact with the laminated material 4.

[0044] See also Figure 5 The elastic part 3 of the indenter includes a regular surface with a thickness of K and a convex surface with a thickness of H on the regular surface, wherein the K value is 10-100 μm and the H value is 20-80 μm. Furthermore, the elastic part 3 is made of one of silicone rubber, fluororubber and polytetrafluoroethylene, which can meet the dust-free requirements during bonding, and the elastic deformation can also meet the bonding requirements.

[0045] See also Figure 6 When bonding, the raised high point on the raised surface of the elastic part 3 first contacts the laminated material 4, and is gradually pressed down until the elastic surface is completely in contact with the laminated material, achieving gradual pressing from point to surface, which is conducive to driving out bubbles in the bonding surface and improving the bonding quality. Since the raised height of the raised surface is limited and it is made of elastic material, even thin and brittle materials will not be crushed.

[0046] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A bonding device, characterized in that: include: Bonding chamber; A pressing head is arranged in the bonding chamber, and the pressing head includes a rigid part and an elastic part combined with each other; The joint surface between the rigid part and the elastic part is a plane; The surface opposite to the joint surface of the elastic part and the rigid part has a convex surface; The convex surface is configured to have a convex high point and inclined surfaces inclined from the convex high point to the surrounding areas; The convex surface is a contact surface that contacts the laminated material.

2. The bonding device according to claim 1, characterized in that: A pressure rod is also provided in the bonding chamber; One end of the pressure rod is connected to the pressure rod driving part; The other end of the pressure rod is connected to the pressure head rigid part.

3. The bonding device according to claim 1, characterized in that: The bonding chamber is also provided with a support platform; The support platform is used for supporting the stacked materials.

4. The bonding device according to any one of claims 1 to 3, characterized in that: The stacking material includes wafers stacked in an upper and lower alignment.

5. The bonding device according to any one of claims 1 to 3, characterized in that: The cross section of the pressure head is circular.

6. The bonding device according to claim 1, characterized in that: The indenter elastic portion includes a regular surface with a thickness denoted as K; A convex surface with a thickness of H is provided on the regular surface.

7. The bonding device according to claim 6, characterized in that: The K value is 10-100 μm.

8. The bonding device according to claim 6, characterized in that: The H value is 20-80 μm.

9. The bonding device according to claim 1, characterized in that: The elastic part is made of one of silicone rubber, fluororubber and polytetrafluoroethylene.

10. The bonding device according to claim 1, characterized in that: The rigid part is made of metal; A circulation channel is arranged in the rigid part.

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