Integrated circuit chip processing equipment

Abstract

The utility model discloses integrated circuit chip processing equipment, and relates to the technical field of integrated circuit chip processing equipment.The integrated circuit chip processing equipment comprises an integrated circuit chip placing rack, when the integrated circuit chip processing equipment is used, the integrated circuit chip processing equipment is firstly placed at a proper position, then a chip needing to be processed is placed on the upper side of a net-shaped sponge mat, then an exhaust fan is started, and the integrated circuit chip placing rack is placed on the net-shaped sponge mat; the suction fan can suck out air in the vacuum inner cavity through the air guide pipe, so that negative pressure can be generated in the vacuum inner cavity, the chip on the upper side of the net-shaped sponge cushion can be adsorbed and fixed, and the possibility that the chip is damaged by the clamp can be reduced due to the fact that the chip is fixed in an adsorption mode. The machining effect of the device can be further improved, then the chips can be machined through the machining device body, when the chips of different sizes need to be machined, a motor can be started at the moment, the motor drives a threaded rod to rotate, and the threaded rod drives a threaded rod fixing frame to move towards the middle side of an adsorption cavity along a threaded rod fixing frame sliding groove.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip processing equipment, in particular to an integrated circuit chip processing equipment. Background Art

[0002] An integrated circuit chip is a device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) on a small semiconductor wafer. It has the advantages of small size, high performance, and low power consumption, and is widely used in computers, communications, consumer electronics, automobiles, and other fields. With the continuous development of science and technology, the performance of integrated circuit chips is also constantly improving, and its application field is also constantly expanding. Integrated circuit chips have become an important cornerstone of the modern information society and are of great significance to promoting economic development and social progress. Therefore, an integrated circuit chip processing device has emerged. However, some existing integrated circuit chip processing devices usually use a clamp to fix the chip when processing the chip, which may damage the chip surface and may reduce the processing effect of the device. Therefore, a person skilled in the art provides an integrated circuit chip processing device to solve the problems raised in the above background technology. Utility Model Content

[0003] The purpose of the utility model is to provide an integrated circuit chip processing device to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] An integrated circuit chip processing device comprises an integrated circuit chip placement rack; a plurality of adsorption chambers are arranged inside the front and rear ends of the upper surface of the integrated circuit chip placement rack, a mesh sponge pad is arranged on the upper side of the adsorption chamber, and a vacuum cavity is arranged on the lower side of the adsorption chamber; a vacuum cavity air inlet pipe is arranged on the front side of the vacuum cavity, and a vacuum cavity air inlet pipe control valve is arranged at the front end of the upper middle of the vacuum cavity air inlet pipe; an exhaust fan is arranged at the lower middle end of the rear side of the integrated circuit chip placement rack, air guide ducts are arranged at the left and right ends of the upper middle of the exhaust fan, and an exhaust fan fixing frame is arranged on the lower side of the exhaust fan; a motor fixing frame is arranged in the middle of the integrated circuit chip placement rack, and the motor fixing frame A plurality of motors are arranged in the middle of the front and rear sides; a threaded rod is arranged in the middle of the front side of the motor, and a threaded rod fixing frame is arranged in the middle of the outer side of the threaded rod; a plurality of threaded rod fixing frame slide grooves are arranged on the upper and lower sides of the threaded rod fixing frame, and a movable cross bar is arranged at the upper and lower ends in the middle of the front side of the threaded rod fixing frame, and an adsorption chamber adjustment plate is arranged on the front side of the movable cross bar; dust removal fans are arranged at the upper ends of the left and right sides of the integrated circuit chip placement rack, and a plurality of feed ports are arranged in the middle of the upper side of the dust removal fan; a dust removal fan fixing frame is arranged on the lower side of the dust removal fan; a processing device body is arranged on the upper side of the integrated circuit chip placement rack, and a processing device body cover plate is arranged on the front side of the processing device body.

[0006] Preferably, dust removal fans are provided at the upper ends of the left and right sides of the integrated circuit chip placement rack, and a plurality of feed ports are provided in the middle of the upper side of the dust removal fan; a dust removal fan fixing frame is provided on the lower side of the dust removal fan; a processing device body is provided on the upper side of the integrated circuit chip placement rack, and a processing device body cover is provided on the front side of the processing device body.

[0007] Compared with the prior art, the beneficial effects of the utility model are:

[0008] 1. First, place the device in a suitable position, and then place the chip to be processed on the upper side of the mesh sponge pad, and then start the exhaust fan. The exhaust fan will draw out the air inside the vacuum cavity through the air duct, so that negative pressure can be generated inside the vacuum cavity, and then the chip on the upper side of the mesh sponge pad can be adsorbed and fixed. Because it is fixed by adsorption, the possibility of the chip being damaged by the fixture can be reduced, and the processing effect of the device can be improved. Then the chip can be processed through the processing device body. When chips of different sizes need to be processed, the motor can be started at this time. The motor will drive the threaded rod to rotate, and the threaded rod will drive the threaded rod fixing frame to move along the threaded rod fixing frame slide groove to the middle side of the adsorption chamber, and the threaded rod fixing frame will drive the movable cross bar to move to the middle side of the adsorption chamber, thereby driving the adsorption chamber adjustment plate to the middle of the adsorption chamber. Move sideways, and turn off the motor after the adsorption chamber adjustment plate moves to a suitable position. Then, the adsorption force inside the adsorption chamber can be adjusted, so that not only can the device adapt to chips of different sizes, but also the device can provide suitable adsorption force for these chips, avoiding the situation that the chip is damaged or cannot be completely fixed due to excessive or insufficient adsorption force. After the chip processing is completed, the vacuum cavity air inlet pipe control valve can be turned, and then the outside air will enter the vacuum cavity through the vacuum cavity air inlet pipe, and then the chip can be taken away; the device fixes the chip by adsorption, thereby reducing the possibility of the chip being damaged by the fixture, and the adsorption force inside the adsorption chamber can be adjusted by starting the motor, so that the device can adapt to chips of different sizes and provide suitable adsorption force for these chips.

[0009] 2. The device is provided with a dust removal fan, which can be turned on when or before processing the chip, so as to absorb the dust inside the processing device body, thereby providing a good processing environment for processing the chip, and further improving the processing effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 The figure is a schematic diagram of the structure of an integrated circuit chip processing device.

[0011] Figure 2 This is a schematic diagram of the internal structure of an integrated circuit chip processing equipment.

[0012] Figure 3 The present invention is a side plan view schematic diagram of an integrated circuit chip placement rack in an integrated circuit chip processing device.

[0013] Figure 4 This is a schematic diagram of the enlarged structure of point A in an integrated circuit chip processing device.

[0014] In the figure: 1-integrated circuit chip placement rack, 2-adsorption chamber, 3-mesh sponge pad, 4-vacuum inner chamber, 5-vacuum inner chamber air inlet pipe, 6-vacuum inner chamber air inlet pipe control valve, 7-air duct, 8-exhaust fan, 9-exhaust fan fixing frame, 10-motor fixing frame, 11-motor, 12-threaded rod, 13-threaded rod fixing frame, 14-threaded rod fixing frame slide, 15-movable cross bar, 16-adsorption chamber adjustment plate, 17-dust removal fan, 18-feeding port, 19-dust removal fan fixing frame, 20-processing device main body cover plate, 21-processing device main body. DETAILED DESCRIPTION

[0015] See also Figures 1 to 4 In the embodiment of the utility model, an integrated circuit chip processing equipment comprises an integrated circuit chip placement rack 1; a plurality of adsorption chambers 2 are arranged inside the front and rear ends of the upper surface of the integrated circuit chip placement rack 1, a mesh sponge pad 3 is arranged on the upper side of the adsorption chamber 2, and a vacuum cavity 4 is arranged on the lower side of the adsorption chamber 2; a vacuum cavity air inlet pipe 5 is arranged on the front side of the vacuum cavity 4, and a vacuum cavity air inlet pipe control valve 6 is arranged on the front end of the upper middle of the vacuum cavity air inlet pipe 5; an exhaust fan 8 is arranged on the lower middle end of the rear side of the integrated circuit chip placement rack 1, air guide ducts 7 are arranged on the left and right ends of the upper middle of the exhaust fan 8, and an exhaust fan fixing rack 9 is arranged on the lower side of the exhaust fan 8; a motor fixing rack 10 is arranged in the middle of the inner part of the integrated circuit chip placement rack 1, and the front and rear ends of the motor fixing rack 10 are arranged on the left and right ends of the upper middle of the exhaust fan 8. A plurality of motors 11 are arranged in the middle of the side; a threaded rod 12 is arranged in the middle of the front side of the motor 11, and a threaded rod fixing frame 13 is arranged in the middle of the outer side of the threaded rod 12; a plurality of threaded rod fixing frame slide grooves 14 are arranged on the upper and lower sides of the threaded rod fixing frame 13, and a movable cross bar 15 is arranged at the upper and lower ends of the middle of the front side of the threaded rod fixing frame 13, and an adsorption chamber adjustment plate 16 is arranged on the front side of the movable cross bar 15; dust removal fans 17 are arranged on the upper ends of the left and right sides of the integrated circuit chip placement rack 1, and a plurality of feed ports 18 are arranged in the middle of the upper side of the dust removal fan 17; a dust removal fan fixing frame 19 is arranged on the lower side of the dust removal fan 17; a processing device body 21 is arranged on the upper side of the integrated circuit chip placement rack 1, and a processing device body cover plate 20 is arranged on the front side of the processing device body 21.

[0016] The working principle of the utility model is as follows: when in use, the device is first placed in a suitable position, and then the chip to be processed is placed on the upper side of the mesh sponge pad 3, and then the exhaust fan 8 is started. The exhaust fan 8 will draw out the air inside the vacuum cavity 4 through the air duct 7, so that negative pressure can be generated inside the vacuum cavity 4, and then the chip on the upper side of the mesh sponge pad 3 can be adsorbed and fixed. Because it is fixed by adsorption, the possibility of the chip being damaged by the fixture can be reduced, and then the processing effect of the device can be improved. Then the chip can be processed by the processing device body 21. When chips of different sizes need to be processed, the motor 11 can be started at this time, and the motor 11 will drive the threaded rod 12 to rotate, and the threaded rod 12 will drive the threaded rod fixing frame 13 to move along the threaded rod fixing frame slide groove 14 toward the middle side of the adsorption chamber 2. The threaded rod fixing frame 13 will drive the movable cross bar 15 to move toward the middle side of the adsorption chamber 2, thereby driving the adsorption chamber adjustment plate 16 to move toward the middle side of the adsorption chamber 2. After the adsorption chamber adjustment plate 16 moves to a suitable position, the motor 1 is turned off. 1, and then the size of the adsorption force inside the adsorption chamber 2 can be adjusted, so that not only the device can adapt to chips of different sizes, but also the device can provide appropriate adsorption force for these chips, avoiding the situation where the chip is damaged or cannot be completely fixed due to excessive or insufficient adsorption force. After the chip processing is completed, the vacuum cavity air inlet pipe control valve 6 can be turned, and then the outside air will enter the vacuum cavity 4 through the vacuum cavity air inlet pipe 5, and then the chip can be taken away; the device fixes the chip by adsorption, thereby reducing the possibility of the chip being damaged by the fixture, and the size of the adsorption force inside the adsorption chamber 2 can be adjusted by starting the motor 11, so that the device can adapt to chips of different sizes and provide appropriate adsorption force for these chips; the device is provided with a dust removal fan 17, which can be turned on when or before processing the chip, so that the dust inside the processing device body 21 can be adsorbed, thereby providing a good processing environment for processing the chip, and thereby improving the processing effect of the device.

[0017] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An integrated circuit chip processing device, comprising an integrated circuit chip placement rack (1) and an adsorption chamber (2), characterized in that: A plurality of adsorption chambers (2) are provided inside the front and rear ends of the upper surface of the integrated circuit chip placement rack (1); a mesh sponge pad (3) is provided inside the upper side of the adsorption chamber (2); a vacuum inner chamber (4) is provided at the lower side of the adsorption chamber (2); a vacuum inner chamber air intake pipe (5) is provided at the front side of the vacuum inner chamber (4); a vacuum inner chamber air intake pipe control valve (6) is provided at the upper middle front end of the vacuum inner chamber air intake pipe (5); an exhaust fan (8) is provided at the lower middle end of the rear side of the integrated circuit chip placement rack (1); air guide pipes (7) are provided at the left and right ends of the upper middle of the exhaust fan (8); and an exhaust fan fixing frame (9) is provided at the lower side of the exhaust fan (8).

2. The integrated circuit chip processing equipment according to claim 1, characterized in that: A motor fixing frame (10) is provided in the middle of the integrated circuit chip placement frame (1), and a plurality of motors (11) are provided in the middle of the front and rear sides of the motor fixing frame (10).

3. The integrated circuit chip processing equipment according to claim 2, characterized in that: A threaded rod (12) is provided in the middle of the front side of the motor (11), and a threaded rod fixing frame (13) is provided in the middle of the outer side of the threaded rod (12).

4. The integrated circuit chip processing equipment according to claim 3, characterized in that: A plurality of threaded rod fixing frame slide grooves (14) are provided on the upper and lower sides of the threaded rod fixing frame (13); movable cross bars (15) are provided at the upper and lower ends of the middle of the front side of the threaded rod fixing frame (13); and an adsorption chamber adjustment plate (16) is provided on the front side of the movable cross bar (15).

5. The integrated circuit chip processing equipment according to claim 1, characterized in that: Dust removal fans (17) are provided at the upper ends of the left and right sides of the integrated circuit chip placement rack (1), and a plurality of feed ports (18) are provided in the middle of the upper side of the dust removal fans (17).

6. The integrated circuit chip processing equipment according to claim 5, characterized in that: A dust removal fan fixing frame (19) is provided on the lower side of the dust removal fan (17).

7. The integrated circuit chip processing equipment according to claim 1, characterized in that: A processing device body (21) is provided on the upper side of the integrated circuit chip placement rack (1), and a processing device body cover plate (20) is provided on the front side of the processing device body (21).

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