Structure capable of realizing wafer clamping and overturning

Abstract

The utility model relates to the technical field of wafer transmission, in particular to a structure capable of realizing wafer clamping and overturning. Comprising a fixed frame; the clamping device is arranged on the fixing frame and comprises a left side clamping tooth fixing plate and a right side clamping tooth fixing plate, the left side clamping tooth fixing plate and the right side clamping tooth fixing plate can be arranged between frame bodies of the fixing frame in the mode of moving close to each other or away from each other in the axis direction of a rotating shaft, and dirty wafer clamping teeth and clean wafer clamping teeth are arranged on the opposite sides of the left side clamping tooth fixing plate and the right side clamping tooth fixing plate; the turnover device is arranged on the fixed frame; and the rotating mechanism is arranged on the right side of the fixed frame, and the output end of the rotating mechanism extends into the frame body of the fixed frame to be connected with the right overturning plate and used for driving the right overturning plate to rotate. According to the utility model, the dirty wafer before cleaning and the clean wafer after cleaning are separately clamped and overturned, and the dirty wafer before cleaning is prevented from being left on pollutants on the clamping teeth to influence the clean wafer after cleaning.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transmission, and in particular to a structure capable of realizing wafer clamping and flipping. Background Art

[0002] At present, mainstream semiconductor cleaning equipment is mainly divided into two categories: single-wafer equipment and tank equipment. With the continuous growth of domestic 12-inch wafer production capacity, the demand for 12-inch wafer cleaning equipment in wafer factories is also increasing. The existing wafer flipping mechanism fails to distinguish between the wafer before cleaning and the wafer after cleaning. During the wafer flipping process, the contaminants left on the clamping teeth of the wafer before cleaning will affect the wafer after cleaning, and the cleaning effect of the wafer cannot be guaranteed. Utility Model Content

[0003] The purpose of the utility model is to provide a structure that can realize wafer clamping and flipping, so as to solve the above technical problems;

[0004] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0005] A structure capable of realizing wafer clamping and flipping, comprising:

[0006] Fixed frame;

[0007] The clamping device is arranged on the fixed frame and comprises:

[0008] The left clamping teeth fixing plate and the right clamping teeth fixing plate are arranged between the frames of the fixed frame so as to move toward or away from each other along the axial direction of a rotating shaft, and the first wafer clamping teeth and the second wafer clamping teeth are arranged on opposite sides of the left clamping teeth fixing plate and the right clamping teeth fixing plate;

[0009] A left driving mechanism is disposed on the left side of the fixed frame and connected to the left clamping tooth fixing plate to drive the left clamping tooth fixing plate to move;

[0010] A right driving mechanism is disposed on the right side of the fixed frame and connected to the right clamping tooth fixing plate to drive the right clamping tooth fixing plate to move;

[0011] The turning device is arranged on the fixed frame and comprises:

[0012] The left flip plate and the right flip plate are rotatably arranged between the frames of the fixed frame along the rotation axis, the left flip plate and the right flip plate are connected by a connecting rod, the left clamping tooth fixing plate is connected to the left flip plate, and the right clamping tooth fixing plate is connected to the right flip plate;

[0013] The rotating mechanism is arranged on the right side of the fixed frame, and the output end of the rotating mechanism extends into the frame body of the fixed frame and is connected to the right flip plate to drive the right flip plate to rotate.

[0014] Preferably, the fixed frame comprises:

[0015] Left side fixed bottom plate;

[0016] A left side support plate, arranged on the left side fixed bottom plate;

[0017] A left side plate is arranged on the left fixed bottom plate and connected to the right side of the left support plate, the left driving mechanism is connected to the left side of the left side plate, and the output end of the left driving mechanism passes through the left side plate and is connected to the left clamping tooth fixing plate;

[0018] A right fixed bottom plate, arranged corresponding to the left fixed bottom plate;

[0019] A right side support plate, arranged on the right side fixed bottom plate;

[0020] A right side plate is arranged on the right side fixed bottom plate and connected to the left side of the right side supporting plate, the right side driving mechanism is connected to the right side of the right side plate, and the output end of the right side driving mechanism passes through the right side plate and is connected to the right clamping tooth fixing plate;

[0021] A crossbeam connecting the upper end of the left side plate and the upper end of the right side plate;

[0022] A fixing plate, arranged on the right side of the right fixing bottom plate and connected to the right side supporting plate;

[0023] The reducer fixing plate is arranged on the right side of the fixing plate, and the rotating mechanism is arranged on the reducer fixing plate.

[0024] Preferably, the left-side driving mechanism comprises:

[0025] A left telescopic rod, wherein a first end of the left telescopic rod is connected to a left side of the left clamping tooth fixing plate, and a second end of the left telescopic rod is connected to a right side surface of the fixing frame;

[0026] A left linear bearing is sleeved on the outside of the left telescopic rod and is arranged in the left linear bearing mounting hole of the left flip plate;

[0027] A left cylinder is arranged on the left side of the fixed frame, and a left magnetic sensor is arranged on the left cylinder to sense the clamping position and the loosening position of the left cylinder;

[0028] A left cylinder connecting plate, connected to the piston rod of the left cylinder;

[0029] A left top screw, a first end of which is connected to the left cylinder connecting plate;

[0030] A left central shaft, wherein a first end of the left central shaft is connected to a second end of the left top screw;

[0031] A left roller bearing, disposed at the second end of the left central shaft;

[0032] A left locking nut, wherein the left roller bearing is locked in the roller bearing mounting hole of the left clamping tooth fixing plate through the left locking nut;

[0033] A left pressure cover, arranged on the left clamping tooth fixing plate and located on the left side of the left roller bearing;

[0034] A left-side positioning telescopic rod, a first end of which is connected to the left-side cylinder connecting plate;

[0035] The left-side positioning linear bearing is sleeved on the second end of the left-side positioning telescopic rod, and the left-side positioning linear bearing is arranged on the left-side flip plate.

[0036] Preferably, the right-side driving mechanism comprises:

[0037] A right telescopic rod, wherein a first end of the right telescopic rod is connected to the right side of the right clamping tooth fixing plate, and a second end of the right telescopic rod is connected to the right inner side surface of the fixing frame;

[0038] A right linear bearing, which is sleeved on the outside of the right telescopic rod and is arranged in the right linear bearing mounting hole of the right flip plate;

[0039] A right cylinder is arranged on the right side of the fixed frame, and a right magnetic sensor is arranged on the right cylinder to sense the clamping position and the loosening position of the right cylinder;

[0040] A right cylinder connecting plate, connected to the piston rod of the right cylinder;

[0041] A right side top screw, a first end of which is connected to the right side cylinder connecting plate;

[0042] A right central shaft, wherein a first end of the right central shaft is connected to a second end of the right top screw;

[0043] a right roller bearing, disposed at the second end of the right central shaft;

[0044] A right locking nut, wherein the right roller bearing is locked in the roller bearing mounting hole of the right clamping tooth fixing plate through the right locking nut;

[0045] A right side pressure cover is arranged on the right side clamping tooth fixing plate and is located on the right side of the right side roller bearing;

[0046] A right-side positioning telescopic rod, wherein a first end of the right-side positioning telescopic rod is connected to the right-side cylinder connecting plate;

[0047] The right side positioning linear bearing is sleeved on the second end of the right side positioning telescopic rod, and the right side positioning linear bearing is arranged on the right side flip plate.

[0048] Preferably, the first wafer clamping teeth are longitudinally arranged at the rear side of the left clamping tooth fixing plate and the right clamping tooth fixing plate, and the second wafer clamping teeth are longitudinally arranged at the front side of the left clamping tooth fixing plate and the right clamping tooth fixing plate.

[0049] Preferably, the first wafer clamping teeth and the second wafer clamping teeth are both made of resin material, the openings of the first wafer clamping teeth and the second wafer clamping teeth are arranged in a "V" shape, and there is a set height difference between the first wafer clamping teeth and the second wafer clamping teeth in the height direction.

[0050] Preferably, the rotating mechanism comprises:

[0051] A reducer, arranged on the reducer fixing plate;

[0052] A servo motor, wherein the output shaft of the servo motor is connected to the reducer;

[0053] A transmission rotating block connected to the output shaft of the reducer;

[0054] An expansion sleeve, arranged in the inner hole of the transmission rotating block;

[0055] An expansion sleeve is wedged into the expansion sleeve ring, and the expansion sleeve and the transmission rotating block are tightened by the expansion sleeve ring;

[0056] A transmission connecting plate, a first end of which is connected to the transmission rotating block;

[0057] A driven rotating block connected to the second end of the transmission connecting plate;

[0058] A first roller bearing support block is disposed on the right side surface of the fixed frame;

[0059] A first roller bearing is disposed in a bearing hole of the first roller bearing support block;

[0060] A right rotating shaft, wherein a first end of the right rotating shaft passes through an inner hole of the first roller bearing, is disposed in the first roller bearing support block and is connected to the driven rotating block, and a second end of the right rotating shaft is connected to the right flip plate;

[0061] A first locking nut is disposed on the first roller bearing support block to limit the first roller bearing.

[0062] Preferably, the rotating mechanism further includes:

[0063] A second roller bearing support block is disposed on the left side surface of the fixed frame;

[0064] A second roller bearing is disposed in a bearing hole of the second roller bearing support block;

[0065] A left rotating shaft, wherein a first end of the left rotating shaft passes through an inner hole of the second roller bearing and is disposed in the second roller bearing support block, and a second end of the left rotating shaft is connected to the left flip plate;

[0066] A second locking nut is disposed on the second roller bearing support block to limit the second roller bearing.

[0067] Preferably, it also includes,

[0068] A photoelectric sensor is arranged on the fixed frame to sense the rotation position of the flip device, and the photoelectric sensor includes a wafer receiving position sensor before cleaning, a wafer transmission position sensor before cleaning, a wafer receiving position sensor after cleaning, a wafer transmission position sensor after cleaning, a first limit position sensor, a second limit position sensor and an origin position sensor;

[0069] A first sensor sensing piece and a second sensor sensing piece are disposed on the left rotation axis, and the photoelectric sensor determines the rotation angle of the flip device based on the positions of the first sensor sensing piece and the second sensor sensing piece.

[0070] Preferably, it also includes,

[0071] An upper sensor is arranged on the upper side of the fixed frame through an upper sensor bracket;

[0072] A side sensor is arranged on the front side of the fixed frame through a side sensor bracket;

[0073] A first reflective plate, disposed on the lower rear side of the right flip plate;

[0074] A second reflector is disposed on the upper front side of the right flip plate, wherein the first reflector and the second reflector are symmetrically disposed about the rotation axis;

[0075] A third reflective plate, disposed on the upper rear side of the right flip plate;

[0076] A fourth reflector is disposed on the front lower side of the right flip plate, and the third reflector and the fourth reflector are symmetrically arranged about the rotation axis;

[0077] After the flip device rotates a certain angle, the light emitted from the emitting end of the side sensor is incident on the first reflector and the second reflector, and the first reflector and the second reflector reflect the light back to the receiving end of the side sensor; the light emitted from the emitting end of the upper sensor is incident on the third reflector and the fourth reflector, and the third reflector and the fourth reflector reflect the light back to the receiving end of the upper sensor.

[0078] The beneficial effects of the utility model are as follows: due to the adoption of the above technical scheme, the utility model arranges two pairs of clamping teeth on the clamping and flipping mechanism to separately clamp the dirty wafers and the clean wafers, thereby realizing the separate clamping and flipping of the dirty wafers before cleaning and the clean wafers after cleaning, which can avoid the contaminants left on the clamping teeth of the dirty wafers before cleaning from affecting the clean wafers after cleaning, thereby ensuring the cleaning effect of the machine on the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1 This is a schematic diagram of a structure that can realize wafer clamping and flipping in an embodiment of the utility model;

[0080] Figure 2 This is a schematic diagram of a fixed frame structure in an embodiment of the utility model;

[0081] Figure 3 This is a schematic diagram of the structure of the clamping device in the embodiment of the utility model;

[0082] Figure 4 It is a partial enlarged view of the right roller bearing in the embodiment of the utility model;

[0083] Figure 5 This is a schematic diagram of the structure of the flipping device in the embodiment of the utility model;

[0084] Figure 6 This is a partial enlarged view of the transmission rotating block in the embodiment of the utility model;

[0085] Figure 7 This is a partial enlarged view of the right rotating shaft in the embodiment of the utility model;

[0086] Figure 8 This is a partial enlarged view of the left rotating shaft in the embodiment of the utility model;

[0087] Fig. 9 This is a schematic diagram of the movement of the structure that can achieve wafer clamping and flipping in the embodiment of the utility model;

[0088] Fig.10 Schematic diagram of the height difference between the first wafer clamping teeth and the second wafer clamping teeth in the embodiment of the utility model;

[0089] Fig.11It is a partially enlarged schematic diagram of the height difference between the first wafer clamping teeth and the second wafer clamping teeth in the embodiment of the utility model;

[0090] Fig.12 It is a schematic diagram of a wafer after cleaning passing through the clamping teeth gap of the first wafer clamping teeth in the embodiment of the utility model;

[0091] Fig.13 It is a partial enlarged schematic diagram of a wafer after cleaning passing through the clamping tooth gap of the first wafer clamping teeth in the embodiment of the utility model;

[0092] Fig.14 This is a schematic diagram of the location of the photoelectric sensor in the embodiment of the utility model;

[0093] Fig.15 A schematic diagram of the steps of a wafer clamping and flipping method in an embodiment of the utility model;

[0094] Fig.16 It is a schematic diagram of the layout of the clamping and flipping device in the embodiment of the utility model;

[0095] Fig.17 This is a schematic diagram of the clamping and flipping device in the embodiment of the utility model in the standby position;

[0096] Fig.18 A side view of the clamping and flipping device in the embodiment of the utility model in the standby position;

[0097] Fig.19 This is a schematic diagram of a wafer before cleaning clamped by a clamping and flipping device in an embodiment of the utility model;

[0098] Fig. 20 A side view of a wafer before cleaning clamped by a clamping and flipping device in an embodiment of the utility model;

[0099] Fig.21 This is a schematic diagram of the wafer transfer position of the clamping and flipping device before cleaning in an embodiment of the utility model;

[0100] Fig. 22 It is a side view of the wafer transfer position of the clamping and flipping device in the embodiment of the utility model before cleaning;

[0101] Fig.23 This is a schematic diagram of the wafer clamping teeth being loosened downward before cleaning in the embodiment of the utility model;

[0102] Fig.24 This is a side view of the wafer clamping teeth being loosened downwards before cleaning in the embodiment of the utility model;

[0103] Fig.25 This is a schematic diagram of the clamping and flipping device returning to the standby position in the embodiment of the utility model;

[0104] Fig.26 A side view of the clamping and flipping device returning to the standby position in the embodiment of the utility model;

[0105] Fig. 27 This is a schematic diagram of the clamping and flipping device in the embodiment of the utility model rotating 270 degrees counterclockwise;

[0106] Fig.28 It is a side view of the clamping and flipping device in the embodiment of the utility model rotated 270 degrees counterclockwise;

[0107] Fig.29 This is a schematic diagram of a wafer after cleaning clamped by a clamping and flipping device in an embodiment of the utility model;

[0108] Fig.30 This is a side view of a wafer after being clamped and cleaned by a clamping and flipping device in an embodiment of the utility model;

[0109] Fig.31 This is a schematic diagram of the wafer transfer position after cleaning of the clamping and flipping device in the embodiment of the utility model;

[0110] Fig.32 It is a side view of the clamping and flipping device in the embodiment of the utility model at the wafer transfer position after cleaning;

[0111] Fig.33 A schematic diagram of a wafer after cleaning is released by a clamping and flipping device in an embodiment of the utility model;

[0112] Fig.34 A side view of a wafer after the cleaning is released by the clamping and flipping device in the embodiment of the utility model;

[0113] Fig.35 This is a schematic diagram of the clamping and flipping device returning to the standby position in the embodiment of the utility model;

[0114] Fig.36 It is a side view of the clamping and flipping device in the embodiment of the utility model returning to the standby position.

[0115] In the accompanying drawings: 1. Fixed frame; 101. Left fixed bottom plate; 102. Left support plate; 103. Left plate; 104. Right fixed bottom plate; 105. Right support plate; 106. Right plate; 107. Crossbeam; 108. Fixed plate; 109. Reducer fixed plate; 110. Upper sensor; 111. Upper sensor bracket; 112. Side sensor; 113. Side sensor bracket; 2. Clamping device; 201. Left clamping tooth fixing plate; 202. Right clamping tooth fixing plate; 203. First wafer clamping tooth; 204. Second wafer clamping tooth; 205. Left driving mechanism; 206. Right driving mechanism; 207. Left telescopic rod; 208. Left Linear bearing; 209, left cylinder; 210, left cylinder connecting plate; 211, left top screw; 212, left center axis; 213, left positioning telescopic rod; 214, left positioning linear bearing; 215, right telescopic rod; 216, right linear bearing; 217, right cylinder; 218, right cylinder connecting plate; 219, right top screw; 220, right center axis; 221, right roller bearing; 222, right locking nut; 223, right gland; 224, right positioning telescopic rod; 225, right positioning linear bearing; 226, left linear bearing mounting hole; 227, right linear bearing mounting hole; 3, flip device; 301, left flip Plate; 302, right flip plate; 303, connecting rod; 304, rotating mechanism; 305, reducer; 306, servo motor; 307, transmission rotating block; 308, expansion ring; 309, expansion sleeve; 310, transmission connecting plate; 311, driven rotating block; 312, first roller bearing support block; 313, first roller bearing; 314, right rotating shaft; 315, first locking nut; 316, second roller bearing support block; 317, second roller bearing; 318, left rotating shaft; 319, second locking nut; 320, photoelectric sensor; 321, first sensor sensing sheet; 322, second sensor sensing sheet; 323, first reflector; 324. Second reflector; 325. Third reflector; 326. Fourth reflector; 41. Wafer receiving position sensor before cleaning; 42. Wafer transmission position sensor before cleaning; 43. Wafer receiving position sensor after cleaning; 44. Wafer transmission position sensor after cleaning; 45. First limit position sensor; 46. Second limit position sensor; 47. Origin position sensor; 51. Wafer before cleaning; 52. Wafer after cleaning; 61. Clamping and flipping equipment; 62. Wafer transmission device; 63. Wafer storage station; 64. Wafer carrier; 65. First wafer transfer mechanism; 66. Second wafer transfer mechanism; 67. Trough cleaning area robot. DETAILED DESCRIPTION

[0116] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0117] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0118] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0119] A structure that can realize wafer clamping and flipping, such as Figures 1 to 9 As shown, including,

[0120] Fixed frame 1;

[0121] The clamping device 2 is arranged on the fixed frame 1 and comprises:

[0122] The left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202 can be arranged between the frames of the fixed frame 1 so as to move toward or away from each other along the axial direction of a rotating shaft, and the left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202 are provided with a first wafer clamping tooth 203 and a second wafer clamping tooth 204 on opposite sides thereof;

[0123] The left driving mechanism 205 is disposed on the left side of the fixed frame 1 and connected to the left clamping tooth fixing plate 201 to drive the left clamping tooth fixing plate 201 to move;

[0124] The right driving mechanism 206 is disposed on the right side of the fixed frame 1 and connected to the right clamping tooth fixing plate 202 to drive the right clamping tooth fixing plate 202 to move;

[0125] The turning device 3 is arranged on the fixed frame 1 and includes:

[0126] The left flip plate 301 and the right flip plate 302 are rotatably arranged between the frames of the fixed frame 1 along the rotation axis. The left flip plate 301 and the right flip plate 302 are connected by a connecting rod 303. The left clamping tooth fixing plate 201 is connected to the left flip plate 301, and the right clamping tooth fixing plate 202 is connected to the right flip plate 302.

[0127] The rotating mechanism 304 is disposed on the right side of the fixed frame 1 , and the output end of the rotating mechanism 304 extends into the frame body of the fixed frame 1 and is connected to the right flip plate 302 to drive the right flip plate 302 to rotate.

[0128] Specifically, the existing wafer flipping mechanisms do not distinguish between dirty wafers before cleaning and clean wafers after cleaning, so they cannot meet the current needs of 12-inch cassette-less tank cleaning equipment. In order to solve the problem that the clean wafer after cleaning is contaminated by the dirty wafer before cleaning, the utility model provides a structure that can realize wafer clamping and flipping.

[0129] The utility model is applied to the equipment front end module (EFEM) equipment, and realizes the separate clamping and flipping of the wafer before cleaning and the wafer after cleaning by arranging two pairs of clamping teeth on the clamping and flipping mechanism, one pair of which is used for clamping and flipping the wafer before cleaning, and the other pair of which is used for clamping and flipping the wafer after cleaning. The structure can prevent the contaminants left on the clamping teeth of the wafer before cleaning from affecting the wafer after cleaning, and ensure the cleaning effect of the machine on the wafer.

[0130] In a preferred embodiment, the fixed frame 1 comprises:

[0131] Left fixed bottom plate 101;

[0132] The left supporting plate 102 is arranged on the left fixed bottom plate 101;

[0133] The left side plate 103 is arranged on the left fixed bottom plate 101 and connected to the right side of the left support plate 102. The left driving mechanism 205 is connected to the left side of the left side plate 103. The output end of the left driving mechanism 205 passes through the left side plate 103 and is connected to the left clamping tooth fixing plate 201.

[0134] The right fixed bottom plate 104 is arranged corresponding to the left fixed bottom plate 101;

[0135] The right side support plate 105 is arranged on the right side fixed bottom plate 104;

[0136] The right side plate 106 is arranged on the right side fixed bottom plate 104 and connected to the left side of the right side supporting plate 105. The right side driving mechanism 206 is connected to the right side of the right side plate 106. The output end of the right side driving mechanism 206 passes through the right side plate 106 and is connected to the right clamping tooth fixing plate 202.

[0137] A crossbeam 107 connecting the upper end of the left side plate 103 and the upper end of the right side plate 106;

[0138] A fixing plate 108 is disposed on the right side of the right fixing base plate 104 and connected to the right side of the right supporting plate 105;

[0139] The speed reducer fixing plate 109 is disposed on the right side of the fixing plate 108 , and the rotating mechanism 304 is disposed on the speed reducer fixing plate 109 .

[0140] Specifically, the fixed frame 1 is composed of a left side plate 103, a left fixed bottom plate 101, a left support plate 102, a side sensor bracket 113, a side sensor 112, a right fixed bottom plate 104, a reducer fixed plate 109, a fixed plate 108, a right support plate 105, a right side plate 106, a crossbeam 107, an upper sensor bracket 111, and an upper sensor 110. Its structure and assembly relationship are as follows: Figure 2 shown.

[0141] In a preferred embodiment, the left side driving mechanism 205 includes:

[0142] A left telescopic rod 207, wherein a first end of the left telescopic rod 207 is connected to the left side of the left clamping tooth fixing plate 201, and a second end of the left telescopic rod 207 is connected to the right side surface of the fixing frame 1;

[0143] The left linear bearing 208 is sleeved on the outside of the left telescopic rod 207 and is arranged in the left linear bearing mounting hole 226 of the left flip plate 301;

[0144] The left cylinder 209 is arranged on the left side of the fixed frame 1. The left cylinder 209 is provided with a left magnetic sensor to sense the left cylinder 209 in the clamping position and the loosening position on the left side.

[0145] The left cylinder connecting plate 210 is connected to the piston rod of the left cylinder 209;

[0146] A left top screw 211, a first end of which is connected to a left cylinder connecting plate 210;

[0147] A left central shaft 212, wherein a first end of the left central shaft 212 is connected to a second end of the left top screw 211;

[0148] A left roller bearing, disposed at the second end of the left central shaft 212;

[0149] The left locking nut is used to lock the left roller bearing in the roller bearing mounting hole of the left clamping tooth fixing plate 201;

[0150] The left gland is arranged on the left clamping tooth fixing plate 201 and is located on the left side of the left roller bearing;

[0151] A left-side positioning telescopic rod 213, a first end of which is connected to the left-side cylinder connecting plate 210;

[0152] The left-side positioning linear bearing 214 is sleeved on the second end of the left-side positioning telescopic rod 213 , and the left-side positioning linear bearing 214 is disposed on the left-side flip plate 301 .

[0153] Specifically, the clamping device 2 of the utility model is composed of a first wafer clamping tooth 203, a second wafer clamping tooth 204, a right clamping tooth fixing plate 202, a left clamping tooth fixing plate 201, a left linear bearing 208, a left telescopic rod 207, a left central axis 212, a left top screw 211, a left cylinder 209, a left cylinder connecting plate 210, a left positioning telescopic rod 213, a left positioning linear bearing 214, a left pressure cover, a left locking nut, a left roller bearing, a right linear bearing 216, a right telescopic rod 215, a right central axis 220, a right top screw 219, a right cylinder 217, a right cylinder connecting plate 218, a right positioning telescopic rod 224, a right positioning linear bearing 225, a right pressure cover 223, a right locking nut 222, and a right roller bearing 221. The structure of the clamping device 2 is as follows: Figure 3 shown.

[0154] Specifically, the first wafer clamping tooth 203 on the left and the second wafer clamping tooth 204 on the left are fixed on the left clamping tooth fixing plate 201, and the left side is equipped with 4 left telescopic rods 207, which are fixed in 4 mounting holes on the left clamping tooth fixing plate 201, and 4 left linear bearings 208 are sleeved on the 4 left telescopic rods 207, and the 4 left linear bearings 208 are fixed on the left flip plate 301, the left top screw 211 is screwed into the threaded hole at one end of the left central axis 212, and is fixed to the left cylinder connecting plate 210 together with the piston rod of the left cylinder 209 and 2 left positioning telescopic rods 213, the 2 left positioning linear bearings 214 are sleeved on the 2 left positioning telescopic rods 213 and fixed on the left flip plate 301, the left roller bearing is installed on the left central axis 212, and is locked with the left locking nut, installed in the mounting hole on the left clamping tooth fixing plate 201, and is fixed to the left clamping tooth fixing plate 201 with the left pressure cover.

[0155] Specifically, the left cylinder 209 drives the left cylinder connecting plate 210 to carry out telescopic movement with the left central axis 212, the left clamping tooth fixing plate 201, the left first wafer clamping tooth 203, the left second wafer clamping tooth 204, the left telescopic rod 207, the left gland, the left roller bearing, and the left locking nut. At the same time, the left cylinder connecting plate 210 carries the left positioning telescopic rod 213 to perform telescopic movement on the left positioning linear bearing 214.

[0156] In a preferred embodiment, the right side driving mechanism 206 includes:

[0157] A right telescopic rod 215, wherein a first end of the right telescopic rod 215 is connected to the right side of the right clamping tooth fixing plate 202, and a second end of the right telescopic rod 215 is connected to the right inner side surface of the fixing frame 1;

[0158] The right linear bearing 216 is sleeved on the outer side of the right telescopic rod 215 and is disposed in the right linear bearing mounting hole 227 of the right flip plate 302;

[0159] The right cylinder 217 is arranged on the right side of the fixed frame 1. The right cylinder 217 is provided with a right magnetic sensor to sense the right cylinder 217 in position to the clamping position and the loosening position on the right side.

[0160] The right cylinder connecting plate 218 is connected to the piston rod of the right cylinder 217;

[0161] A right top screw 219, a first end of which is connected to a right cylinder connecting plate 218;

[0162] A right central shaft 220, wherein a first end of the right central shaft 220 is connected to a second end of the right top screw 219;

[0163] The right roller bearing 221 is disposed at the second end of the right central shaft 220;

[0164] The right locking nut 222, the right roller bearing 221 is locked in the roller bearing installation hole of the right clamping tooth fixing plate 202 through the right locking nut 222;

[0165] The right pressure cover 223 is provided on the right clamping tooth fixing plate 202 and is located on the right side of the right roller bearing 221;

[0166] A right positioning telescopic rod 224, a first end of which is connected to the right cylinder connecting plate 218;

[0167] The right positioning linear bearing 225 is sleeved on the second end of the right positioning telescopic rod 224 , and the right positioning linear bearing 225 is disposed on the right flip plate 302 .

[0168] Specifically, the first wafer clamping tooth 203 on the right and the second wafer clamping tooth 204 on the right are fixed on the right clamping tooth fixing plate 202, the four right telescopic rods 215 are fixed in the four mounting holes on the right clamping tooth fixing plate 202, and the four right linear bearings 216 are sleeved on the four right telescopic rods 215, the four right linear bearings 216 are fixed on the right flip plate 302, the right top screw 219 is screwed into the threaded hole of the right center shaft 220, and is fixed to the right cylinder connecting plate 218 together with the piston rod of the right cylinder 217 and the two right positioning telescopic rods 224, the two right positioning linear bearings 225 are sleeved on the two right positioning telescopic rods 224 and fixed on the right flip plate 302, the right roller bearing 221 is installed on the right center shaft 220, and is locked with the right locking nut 222, installed in the mounting hole on the right clamping tooth fixing plate 202, and is fixed to the right clamping tooth fixing plate 202 with the right pressure cover 223.

[0169] Specifically, the right cylinder 217 drives the right cylinder connecting plate 218 to perform telescopic motion with the right central shaft 220, the right clamping tooth fixing plate 202, the right first wafer clamping tooth 203, the right second wafer clamping tooth 204, the right telescopic rod 215, the right pressure cover 223, the right roller bearing 221, and the right locking nut 222. At the same time, the right cylinder connecting plate 218 performs telescopic motion with the right positioning telescopic rod 224 in the right positioning linear bearing 225.

[0170] In the utility model, the left cylinder 209 and the right cylinder 217 are double-acting cylinders. Since the air inlet and outlet of the left cylinder 209 and the right cylinder 217 are the same air pipe, the telescopic action of the left side is synchronized with the telescopic action of the right side, that is, when the left side extends forward, the right side also extends forward, and when the left side retracts, the right side also retracts, so that the left and right clamping teeth can realize the clamping and loosening action of the wafer.

[0171] In a preferred embodiment, the first wafer clamping teeth 203 are longitudinally arranged at the rear side of the left clamping tooth fixing plate 201 and the right clamping tooth fixing plate 202, and the second wafer clamping teeth 204 are longitudinally arranged at the front side of the left clamping tooth fixing plate 201 and the right clamping tooth fixing plate 202.

[0172] In a preferred embodiment, the first wafer clamping tooth 203 and the second wafer clamping tooth 204 are both made of resin material, the openings of the first wafer clamping tooth 203 and the second wafer clamping tooth 204 are arranged in a "V" shape, and there is a set height difference between the first wafer clamping tooth 203 and the second wafer clamping tooth 204 in the height direction.

[0173] Specifically, two left magnetic sensors are arranged on the left cylinder 209, and two right magnetic sensors are arranged on the right cylinder 217. The left magnetic sensors and the right magnetic sensors are used to detect whether the clamping position and the loosening position of the left cylinder 209 and the right cylinder 217 are in place, respectively, so as to ensure that the wafer is clamped and does not fall. At the same time, the first wafer clamping teeth 203 and the second wafer clamping teeth 204 are made of resin material, which can provide a certain buffer when clamping the wafer to avoid deformation or crushing of the wafer clamp. The utility model has 25 first wafer clamping teeth 203 and 25 second wafer clamping teeth 204, which can clamp and flip 25 wafers at the same time. The prior art can only clamp and flip 4 wafers at a time. Compared with the prior art, it takes 7 consecutive actions to clamp and flip 25 wafers, so the efficiency of the utility model mechanism is significantly higher than that of the prior art.

[0174] The 25 clamping teeth on the first wafer clamping teeth 203 and the second wafer clamping teeth 204 are all in a V-shaped shape and have a self-positioning function, thereby ensuring that the distance between each wafer is substantially consistent.

[0175] There is a set height difference between the first wafer clamping tooth 203 and the second wafer clamping tooth 204 in the height direction. In the utility model, the height difference is 5 mm. By setting the height difference, when the first wafer clamping tooth 203 or the second wafer clamping tooth 204 clamps the wafer, the wafer just passes through the two clamping tooth gaps of the adjacent wafer clamping tooth 11, which can avoid interference between the wafer and the adjacent wafer clamping tooth 11.

[0176] For example Figures 10 to 13 As shown, when the second wafer clamping teeth 204 clamp the cleaned wafer 52, the cleaned wafer 52 will pass through the clamping teeth gap of the first wafer clamping teeth 203 on the other side, thereby avoiding interference.

[0177] In a preferred embodiment, the rotating mechanism 304 includes:

[0178] The reducer 305 is arranged on the reducer fixing plate 109;

[0179] A servo motor 306, wherein the output shaft of the servo motor 306 is connected to the reducer 305;

[0180] The transmission rotating block 307 is connected to the output shaft of the reducer 305;

[0181] The expansion sleeve 308 is arranged in the inner hole of the transmission rotating block 307;

[0182] The expansion sleeve 309 is wedged into the expansion sleeve ring 308, and the expansion sleeve 309 and the transmission rotating block 307 are tightened by the expansion sleeve ring 308;

[0183] A transmission connecting plate 310, a first end of the transmission connecting plate 310 is connected to the transmission rotating block 307;

[0184] A driven rotating block 311 connected to the second end of the transmission connecting plate 310;

[0185] The first roller bearing support block 312 is disposed on the right side surface of the fixed frame 1;

[0186] A first roller bearing 313 is disposed in a bearing hole of the first roller bearing support block 312;

[0187] The right rotating shaft 314, the first end of which passes through the inner hole of the first roller bearing 313 and is disposed in the first roller bearing support block 312 to connect with the driven rotating block 311, and the second end of which is connected with the right flip plate 302;

[0188] The first locking nut 315 is disposed on the first roller bearing support block 312 to limit the first roller bearing 313 .

[0189] Specifically, the flip device 3 is composed of a left flip plate 301, a photoelectric sensor 320, a connecting rod 303, a first reflector 323, a second reflector 324, a third reflector 325, a fourth reflector 326, a right flip plate 302, a transmission connecting plate 310, a reducer 305, a servo motor 306, a clamping sleeve 309, a clamping ring 308, a transmission rotating block 307, a first roller bearing 313, a driven rotating block 311, a first locking nut 315, a first roller bearing support block 312, a right rotating shaft 314, a left rotating shaft 318, a second roller bearing 317, a second roller bearing support block 316, a second locking nut 319, a first sensor sensing sheet 321, and a second sensor sensing sheet 322.

[0190] Specifically, the two connecting rods 303 are respectively fixed between the left flip plate 301 and the right flip plate 302, the servo motor 306 is installed on the reducer 305, the reducer 305 is fixed on the reducer fixing plate 109, the expansion ring 308 is installed in the inner hole of the transmission rotating block 307, the expansion sleeve 309 is wedged into the expansion ring 308, and the expansion ring 308 is wedged to expand the expansion sleeve 309 and the transmission rotating block 307 at the same time. They are respectively fixed on the transmission rotating block 307 and the driven rotating block 311, and the two first roller bearings 313 are respectively installed in the bearing holes on both sides of the first roller bearing support block 312. The first roller bearing support block 312 is fixed on the right side plate 106. The right rotating shaft 314 passes through the inner holes of the two first roller bearings 313 and is installed in the first roller bearing support block 312 and fixed on the right flip plate 302. The first locking nut 315 limits the first roller bearing 313.

[0191] In a preferred embodiment, the rotating mechanism 304 further includes:

[0192] The second roller bearing support block 316 is disposed on the left side surface of the fixed frame 1;

[0193] The second roller bearing 317 is disposed in the bearing hole of the second roller bearing support block 316;

[0194] A left rotating shaft 318, wherein a first end of the left rotating shaft 318 passes through an inner hole of the second roller bearing 317 and is disposed in the second roller bearing support block 316, and a second end of the left rotating shaft 318 is connected to the left flip plate 301;

[0195] The second locking nut 319 is disposed on the second roller bearing support block 316 to limit the second roller bearing 317 .

[0196] Specifically, the two second roller bearings 317 are respectively installed in the bearing holes on both sides of the second roller bearing support block 316, the second roller bearing support block 316 is fixed on the left side plate 103, the left side rotating shaft 318 passes through the inner holes of the two second roller bearings 317, is installed in the second side roller bearing support block and is fixed on the left flip plate 301, and the second locking nut 319 limits the second roller bearing 317.

[0197] Specifically, the servo motor 306 drives the output shaft of the reducer 305 to rotate, and the rotational motion is transmitted to the right rotating shaft 314 by the transmission rotating block 307, the transmission connecting plate 310, and the driven rotating block 311. The right rotating shaft 314 drives the right flip plate 302, the connecting rod 303, the left flip plate 301, the left rotating shaft 318, the first sensor sensing plate 321, and the second sensor sensing plate 322 to rotate together.

[0198] Since the four left linear bearings 208 and the four right linear bearings 216 are respectively installed in the four positioning holes of the left flip plate 301 and the right flip plate 302, when the left flip plate 301 and the right flip plate 302 rotate, the first wafer clamping tooth 203, the second wafer clamping tooth 204, the left clamping tooth fixing plate 201, the left linear bearing 208, the left telescopic rod 207 and the first wafer clamping tooth 203, the second wafer clamping tooth 204, the right clamping tooth fixing plate 202, the right linear bearing 216, and the right telescopic rod 215 on the left will be driven to rotate together, so that the left and right support tooth angles can be changed.

[0199] In a preferred embodiment, it also includes:

[0200] The photoelectric sensor 320 is arranged on the fixed frame 1 to sense the rotation position of the flip device 3. The photoelectric sensor 320 includes a wafer receiving position sensor 41 before cleaning, a wafer transmission position sensor 42 before cleaning, a wafer receiving position sensor 43 after cleaning, a wafer transmission position sensor 44 after cleaning, a first limit position sensor 45, a second limit position sensor 46 and an origin position sensor 47;

[0201] The first sensor sheet 321 and the second sensor sheet 322 are disposed on the left rotation shaft 318 . The photoelectric sensor 320 determines the rotation angle of the flip device 3 based on the positions of the first sensor sheet 321 and the second sensor sheet 322 .

[0202] Specifically, the photoelectric sensors 320 are fixed on the left side plate 103 through brackets. There are a total of 7 photoelectric sensors 320, namely, four position sensors, namely, a wafer receiving position sensor 41 before cleaning, a wafer transmission position sensor 42 before cleaning, a wafer receiving position sensor 43 after cleaning, and a wafer transmission position sensor 44 after cleaning; two limit sensors, namely, a first limit position sensor 45 and a second limit position sensor 46; and an origin position sensor 47.

[0203] The wafer receiving position before cleaning is the initial standby position, at which the first wafer clamping teeth 203 correspond to the forward extension direction of the external wafer transmission device;

[0204] The wafer transfer position before cleaning is the position reached after the flip device 3 rotates 90 degrees clockwise, at which time the first wafer clamping teeth 203 face the first wafer transfer mechanism 65 below, and the first wafer transfer mechanism 65 receives the wafer before cleaning and sends it to the cleaning area for cleaning;

[0205] The cleaned wafer receiving position is the position reached by the flip mechanism rotating 270 degrees counterclockwise from the initial position, at which the second wafer clamping teeth 204 face the second wafer transfer mechanism 66 below to receive the cleaned wafer sent by the second wafer transfer mechanism 66;

[0206] The cleaned wafer transfer position is the position where the flip mechanism rotates 90 degrees clockwise from the cleaned wafer receiving position, at which time the second wafer clamping teeth correspond to the forward extension direction of the external wafer transfer device, and the cleaned wafer is received by the wafer transfer device and placed in the wafer carrier for storage;

[0207] The first limit position is the limit position to which the flip device 3 can rotate clockwise from the standby position, which is 180 degrees;

[0208] The second limit position is the limit position to which the flip device 3 can rotate counterclockwise from the standby position, which is 270 degrees.

[0209] The origin position is the standby position of the flip device 3, which is the same as the wafer receiving position before cleaning.

[0210] In addition, the mechanism of the utility model is used to separate the wafer before cleaning and the wafer after cleaning. According to the process, the clockwise direction of 0 to 90 degrees is used for the wafer before cleaning, and the counterclockwise direction of 180 to 270 degrees is used for the wafer after cleaning.

[0211] In a preferred embodiment, it also includes:

[0212] An upper sensor 110 is disposed on the upper side of the fixed frame 1 through an upper sensor bracket 111;

[0213] A side sensor 112 is provided on the front side of the fixed frame 1 through a side sensor bracket 113;

[0214] A first reflective plate 323, disposed at the rear lower side of the right flip plate 302;

[0215] The second reflector 324 is disposed on the front upper side of the right flip plate 302, and the first reflector 323 and the second reflector 324 are symmetrically arranged about the rotation axis;

[0216] A third reflective plate 325 is disposed on the upper rear side of the right flip plate 302;

[0217] The fourth reflector 326 is disposed on the front lower side of the right flip plate 302, and the third reflector 325 and the fourth reflector 326 are symmetrically disposed about the rotation axis;

[0218] After the flip device 3 rotates a certain angle, the light emitted from the emitting end of the side sensor 112 is incident on the first reflector 323 and the second reflector 324, and the first reflector 323 and the second reflector 324 reflect the light back to the receiving end of the side sensor 112; the light emitted from the emitting end of the upper sensor 110 is incident on the third reflector 325 and the fourth reflector 326, and the third reflector 325 and the fourth reflector 326 reflect the light back to the receiving end of the upper sensor 110.

[0219] Specifically, the first reflector 323, the second reflector 324, the third reflector 325, and the fourth reflector 326 are respectively fixed on the four sides of the right flip plate 302, wherein the first reflector 323 and the second reflector 324 are obliquely symmetrical about the rotation axis, and the third reflector 325 and the fourth reflector 326 are obliquely symmetrical about the rotation axis. When the flip device 3 rotates 180 degrees, the emitting end of the upper sensor 110 emits light to the third reflector 325 and the fourth reflector 326, and the third reflector 325 and the fourth reflector 326 reflect the received light to the receiving end of the upper sensor 110, and the emitting end of the side sensor 112 emits light to the first reflector 323 and the second reflector 324, and the first reflector 323 and the second reflector 324 reflect the received light to the receiving end of the side sensor 112.

[0220] The utility model also provides a method for realizing wafer clamping and flipping, which is applied to a structure capable of realizing wafer clamping and flipping, and includes:

[0221] Step S1, the flip device 3 is in the wafer receiving position before cleaning, and the external wafer transfer device 62 delivers the wafer 51 before cleaning into the middle of the first wafer clamping teeth 203;

[0222] Step S2, the left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202 are synchronously moved close to each other along the axis direction of the rotating shaft, and the first wafer clamping teeth 203 clamp the wafer 51 before cleaning;

[0223] Step S3, the flip device 3 drives the wafer 51 before cleaning to rotate counterclockwise to the wafer transfer position before cleaning, the external first wafer transfer mechanism 65 receives the wafer 51 before cleaning, the left clamping tooth fixing plate 201 and the right clamping tooth fixing plate 202 move away synchronously along the axis direction of the rotating shaft, the first wafer clamping teeth 203 release the wafer 51 before cleaning, and the first wafer transfer mechanism 65 delivers the wafer 51 before cleaning to the cleaning area for cleaning;

[0224] Step S4, the flipping device 3 rotates clockwise back to the wafer receiving position before cleaning, and the cleaned wafer 52 is obtained after the cleaning of the pre-cleaned wafer 51 is completed, and the external second wafer transfer mechanism 66 clamps the cleaned wafer 52;

[0225] Step S5, the flipping device 3 rotates counterclockwise to the cleaned wafer receiving position, and the second wafer transfer mechanism 66 delivers the cleaned wafer 52 to the middle of the second wafer clamping teeth 204;

[0226] Step S6, the left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202 move synchronously close to each other along the axis direction of the rotating shaft, and the second wafer clamping teeth 204 clamp the cleaned wafer 52;

[0227] Step S7, the flip device 3 rotates clockwise to the cleaned wafer transfer position, the wafer transfer device 62 extends forward to receive the cleaned wafer 52, the left clamping tooth fixing plate 201 and the right clamping tooth fixing plate 202 move away synchronously along the axis direction of the rotating shaft, the second wafer clamping teeth 204 are released, and the wafer transfer device 62 receives the cleaned wafer 52 and puts it into the wafer carrier 64;

[0228] Step S8, the flipping device 3 continues to rotate clockwise and returns to the wafer receiving position before cleaning.

[0229] Specific embodiment 1: The clamping and flipping device 61 of the utility model is mainly used on the equipment front end module (EFEM). The structure of the clamping and flipping device 61 adopts the clamping and flipping structure in the above embodiment. The structure layout diagram of the EFEM is as follows: Fig.12 As shown, it mainly includes a wafer transfer device 62 (WTU), a wafer storage station 63 (FIMS), a wafer carrier 64 (FOUP), a first wafer transfer mechanism 65 (Loader pusher in this embodiment), a second wafer transfer mechanism 66 (Unloader pusher in this embodiment); a tank cleaning area robot 67 (Robot); the specific working process of the clamping and flipping device of the utility model is as follows:

[0230] Step 1, the clamping and flipping device 61 is in the standby position, the wafer clamping teeth are in the loose state, and the first sensor sensing sheet 321 is located at the wafer receiving position before cleaning (WTU Dirty position); Fig.13 , Fig.14 As shown,

[0231] Step 2, the wafer transfer device 62 takes out 25 wafers 51 before cleaning from the wafer carrier 64 on the wafer storage station 63, rotates to the station direction of the clamping and flipping device 61, and extends forward to the middle of the first wafer clamping teeth 203 on the clamping and flipping device 61;

[0232] Step 3, the first wafer clamping teeth 203 on the clamping and flipping device 61 clamp the 25 pre-cleaned wafers 51 on the wafer transfer device 62; Fig.15 , Fig.16 As shown;

[0233] Step 4, the first wafer clamping teeth 203 on the clamping and flipping device 61 rotate the clamped 25 pre-cleaned wafers 51 counterclockwise by 90 degrees, and the first sensor sensing sheet 321 is located at the wafer transfer position before cleaning (Loader pusher Dirty position); Fig.17 , Fig.18 As shown;

[0234] Step 5, the first wafer transfer mechanism 65 moves from its standby position to the bottom of the clamping and flipping device and rises to receive the 25 wafers 51 before cleaning on the first wafer clamping teeth 203, and the first wafer clamping teeth 203 are released; Fig.19 , Fig. 20 As shown;

[0235] Step 6, the first wafer transfer mechanism 65 returns to the standby position with the received 25 wafers before cleaning, and the tank cleaning area robot 67 clamps the 25 wafers before cleaning 51 on the first wafer transfer mechanism 65 and sends them to the cleaning area for cleaning;

[0236] Step 7, the first wafer clamping teeth 203 on the clamping and flipping device 61 rotate 90 degrees clockwise to return to the standby position, and the first sensor plate 321 is located at the wafer receiving position before cleaning; Fig.21 , Fig. 22 As shown;

[0237] Step 8, the tank cleaning area robot 67 places the 25 cleaned wafers 52 on the second wafer transfer mechanism 66;

[0238] Step 9, the second wafer clamping teeth 204 on the clamping and flipping device 61 rotate counterclockwise by 270 degrees, the wafer clamping teeth are in a loose state, and the second sensor sensing sheet 322 is located at the wafer receiving position after cleaning (Unloader pusher Clean position); Fig.23 , Fig.24 As shown;

[0239] Step 10, the second wafer transfer mechanism 66 moves the received 25 cleaned wafers 52 from its standby position to the bottom of the clamping and flipping device 61 and rises to the middle of the second wafer clamping teeth 204;

[0240] Step 11, the second wafer clamping teeth 204 on the clamping and flipping device 61 clamp the 25 cleaned wafers 52 on the cleaned wafer 52 transfer mechanism; Fig.25 , Fig.26 As shown;

[0241] Step 12, the second wafer clamping teeth 204 on the clamping and flipping device 61 rotate the clamped 25 cleaned wafers 52 90 degrees clockwise, and the first sensor sensing sheet 321 is located at the cleaned wafer transfer position (WTU Clean position); Fig. 27 , Fig.28 As shown;

[0242] Step 13, the wafer transfer device 62 extends from its standby position to the middle of the second wafer clamping teeth 204 on the clamping and flipping device to hold the 25 cleaned wafers 52 on the second wafer clamping teeth 204;

[0243] Step 14, the second wafer clamping teeth 204 are released, and the wafer transfer device 62 delivers the received 25 cleaned wafers 52 to the wafer carrier 64; Fig.29 , Fig.30 As shown;

[0244] Step 15, the wafer clamping teeth on the clamping and flipping device 61 rotate 180 degrees clockwise and return to the standby position, and the first sensor sensing sheet 321 is located at the wafer receiving position before cleaning; Fig.31 , Fig.32 shown.

[0245] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

[0246] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A structure capable of realizing wafer clamping and flipping, characterized in that: include, Fixed frame (1); A clamping device (2) is arranged on the fixed frame (1). include, The left clamping tooth fixing plate (201) and the right clamping tooth fixing plate (202) are arranged between the frames of the fixed frame (1) so as to move toward or away from each other along the axial direction of a rotating shaft, and the left clamping tooth fixing plate (201) and the right clamping tooth fixing plate (202) are provided with a first wafer clamping tooth (203) and a second wafer clamping tooth (204) on opposite sides thereof; A left-side driving mechanism (205) is disposed on the left side of the fixed frame (1) and is connected to the left-side clamping tooth fixing plate (201) to drive the left-side clamping tooth fixing plate (201) to move; A right side driving mechanism (206) is arranged on the right side of the fixed frame (1), connected to the right side clamping tooth fixing plate (202) to drive the right side clamping tooth fixing plate (202) to move; The turning device (3) is arranged on the fixed frame (1). include, The left flip plate (301) and the right flip plate (302) are rotatably arranged between the frames of the fixed frame (1) along the rotation axis; the left flip plate (301) and the right flip plate (302) are connected via a connecting rod (303); the left clamping tooth fixing plate (201) is connected to the left flip plate (301); and the right clamping tooth fixing plate (202) is connected to the right flip plate (302); The rotating mechanism (304) is arranged on the right side of the fixed frame (1); the output end of the rotating mechanism (304) extends into the frame body of the fixed frame (1) and is connected to the right flip plate (302) to drive the right flip plate (302) to rotate.

2. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: The fixed frame (1) comprises: Left fixed bottom plate (101); A left side supporting plate (102) is arranged on the left side fixed bottom plate (101); A left side plate (103) is arranged on the left side fixed bottom plate (101) and connected to the right side of the left side support plate (102); the left side driving mechanism (205) is connected to the left side of the left side plate (103); and the output end of the left side driving mechanism (205) passes through the left side plate (103) and is connected to the left side clamping tooth fixing plate (201); A right fixed bottom plate (104) is arranged corresponding to the left fixed bottom plate (101); A right side supporting plate (105) is arranged on the right side fixed bottom plate (104); The right side plate (106) is arranged on the right side fixed bottom plate (104) and connected to the left side of the right side support plate (105); the right side driving mechanism (206) is connected to the right side of the right side plate (106); and the output end of the right side driving mechanism (206) passes through the right side plate (106) and is connected to the right side clamping tooth fixing plate (202); A crossbeam (107) connecting the upper end of the left side plate (103) and the upper end of the right side plate (106); A fixing plate (108), arranged on the right side of the right fixing bottom plate (104) and connected to the right side of the right supporting plate (105); The reducer fixing plate (109) is arranged on the right side of the fixing plate (108), and the rotating mechanism (304) is arranged on the reducer fixing plate (109).

3. The structure capable of realizing wafer clamping and flipping according to claim 1 is characterized in that: The left side driving mechanism (205) comprises: A left telescopic rod (207), wherein a first end of the left telescopic rod (207) is connected to the left side of the left clamping tooth fixing plate (201), and a second end of the left telescopic rod (207) is connected to the right side surface of the fixing frame (1); A left linear bearing (208), sleeved on the outside of the left telescopic rod (207), and arranged in a left linear bearing mounting hole (226) of the left flip plate (301); A left cylinder (209) is arranged on the left side of the fixed frame (1), and a left magnetic sensor is arranged on the left cylinder (209) to sense the left clamping position and the loosening position of the left cylinder (209); A left cylinder connecting plate (210) connected to the piston rod of the left cylinder (209); A left top screw (211), a first end of the left top screw (211) being connected to the left cylinder connecting plate (210); A left central axis (212), wherein a first end of the left central axis (212) is connected to a second end of the left top screw (211); A left roller bearing, arranged at the second end of the left central axis (212); A left locking nut, wherein the left roller bearing is locked in the roller bearing installation hole of the left clamping tooth fixing plate (201) through the left locking nut; A left-side pressure cover, arranged on the left-side clamping tooth fixing plate (201) and located on the left side of the left-side roller bearing; A left-side positioning telescopic rod (213), wherein a first end of the left-side positioning telescopic rod (213) is connected to the left-side cylinder connecting plate (210); The left-side positioning linear bearing (214) is sleeved on the second end of the left-side positioning telescopic rod (213), and the left-side positioning linear bearing (214) is arranged on the left-side flip plate (301).

4. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: The right side driving mechanism (206) comprises: A right telescopic rod (215), wherein a first end of the right telescopic rod (215) is connected to the right side of the right clamping tooth fixing plate (202), and a second end of the right telescopic rod (215) is connected to the right inner side surface of the fixing frame (1); A right linear bearing (216), which is sleeved on the outside of the right telescopic rod (215) and is arranged in a right linear bearing mounting hole (227) of the right flip plate (302); A right side cylinder (217) is arranged on the right side surface of the fixed frame (1); a right side magnetic sensor is arranged on the right side cylinder (217) to sense the right side clamping position and the right side release position of the right side cylinder (217); A right cylinder connecting plate (218) connected to the piston rod of the right cylinder (217); A right side top screw (219), wherein a first end of the right side top screw (219) is connected to the right side cylinder connecting plate (218); A right central shaft (220), wherein a first end of the right central shaft (220) is connected to a second end of the right top screw (219); A right roller bearing (221) is arranged at the second end of the right central shaft (220); A right locking nut (222), wherein the right roller bearing (221) is locked in the roller bearing installation hole of the right clamping tooth fixing plate (202) through the right locking nut (222); A right side pressure cover (223) is arranged on the right side clamping tooth fixing plate (202) and is located on the right side of the right side roller bearing (221); A right-side positioning telescopic rod (224), wherein a first end of the right-side positioning telescopic rod (224) is connected to the right-side cylinder connecting plate (218); The right side positioning linear bearing (225) is sleeved on the second end of the right side positioning telescopic rod (224), and the right side positioning linear bearing (225) is arranged on the right side flip plate (302).

5. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: The first wafer clamping teeth (203) are arranged longitudinally on the rear side of the left clamping teeth fixing plate (201) and the right clamping teeth fixing plate (202), and the second wafer clamping teeth (204) are arranged longitudinally on the front side of the left clamping teeth fixing plate (201) and the right clamping teeth fixing plate (202).

6. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: The first wafer clamping teeth (203) and the second wafer clamping teeth (204) are both made of resin material, the openings of the first wafer clamping teeth (203) and the second wafer clamping teeth (204) are arranged in a "V" shape, and there is a set height difference between the first wafer clamping teeth (203) and the second wafer clamping teeth (204) in the height direction.

7. The structure capable of realizing wafer clamping and flipping according to claim 2, characterized in that: The rotating mechanism (304) comprises: A reducer (305) is arranged on the reducer fixing plate (109); A servo motor (306), wherein an output shaft of the servo motor (306) is connected to the reducer (305); A transmission rotating block (307) connected to the output shaft of the reducer (305); An expansion sleeve (308) is arranged in the inner hole of the transmission rotating block (307); The expansion sleeve (309) is wedged into the expansion sleeve ring (308), and the expansion sleeve (309) and the transmission rotating block (307) are tightened by the expansion sleeve ring (308); A transmission connecting plate (310), wherein a first end of the transmission connecting plate (310) is connected to the transmission rotating block (307); A driven rotating block (311) connected to the second end of the transmission connecting plate (310); A first roller bearing support block (312) is arranged on the right side surface of the fixed frame (1); A first roller bearing (313) is disposed in a bearing hole of the first roller bearing support block (312); a right rotating shaft (314), wherein a first end of the right rotating shaft (314) passes through an inner hole of the first roller bearing (313), is disposed in the first roller bearing support block (312), and is connected to the driven rotating block (311); and a second end of the right rotating shaft (314) is connected to the right flip plate (302); A first locking nut (315) is provided on the first roller bearing support block (312) to limit the position of the first roller bearing (313).

8. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: The rotating mechanism (304) further includes: A second roller bearing support block (316) is disposed on the left side surface of the fixed frame (1); A second roller bearing (317) is disposed in a bearing hole of the second roller bearing support block (316); a left-side rotating shaft (318), wherein a first end of the left-side rotating shaft (318) passes through an inner hole of the second roller bearing (317) and is disposed in the second roller bearing support block (316), and a second end of the left-side rotating shaft (318) is connected to the left-side flip plate (301); A second locking nut (319) is provided on the second roller bearing support block (316) to limit the position of the second roller bearing (317).

9. The structure capable of realizing wafer clamping and flipping according to claim 8, characterized in that: Also includes, A photoelectric sensor (320) is arranged on the fixed frame (1) to sense the rotation position of the flip device (3), the photoelectric sensor (320) comprising a wafer receiving position sensor (41) before cleaning, a wafer transmission position sensor (42) before cleaning, a wafer receiving position sensor (43) after cleaning, a wafer transmission position sensor (44) after cleaning, a first limit position sensor (45), a second limit position sensor (46) and an origin position sensor (47); A first sensor sensing piece (321) and a second sensor sensing piece (322) are arranged on the left rotation axis (318), and the photoelectric sensor (320) determines the rotation angle of the flipping device (3) based on the positions of the first sensor sensing piece (321) and the second sensor sensing piece (322).

10. The structure capable of realizing wafer clamping and flipping according to claim 1, characterized in that: Also includes, An upper sensor (110) is arranged on the upper side of the fixed frame (1) via an upper sensor bracket (111); A side sensor (112) is arranged on the front side of the fixed frame (1) via a side sensor bracket (113); A first reflective plate (323) is disposed on the rear lower side of the right flip plate (302); A second reflective plate (324) is arranged on the upper front side of the right flip plate (302), wherein the first reflective plate (323) and the second reflective plate (324) are arranged symmetrically about the rotation axis; A third reflective plate (325) is disposed on the upper rear side of the right flip plate (302); A fourth reflector (326) is disposed on the front lower side of the right flip plate (302), and the third reflector (325) and the fourth reflector (326) are symmetrically disposed about the rotation axis; After the flip device (3) rotates a certain angle, the light emitted from the emitting end of the side sensor (112) is incident on the first reflector (323) and the second reflector (324), and the first reflector (323) and the second reflector (324) reflect the light back to the receiving end of the side sensor (112); the light emitted from the emitting end of the upper sensor (110) is incident on the third reflector (325) and the fourth reflector (326), and the third reflector (325) and the fourth reflector (326) reflect the light back to the receiving end of the upper sensor (110).

Images