Bearing and fixing device suitable for semiconductor wafers of different specifications
By designing a semiconductor wafer bearing fixture with a rotating shaft and gear system, the problem that traditional placement frames cannot adapt to different specifications of wafers is solved, effectively placement and fixing of different specifications of wafers is achieved, and space utilization is improved.
Patent Information
- Application Number
- CN202421092094.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2024-12-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional semiconductor chip placing racks can only adapt to one size chip, resulting in the inability to make full use of space on the placing racks, and multiple placing racks take up more space and cannot adapt to chips of different specifications.
A load-bearing fixing device including a disc, an adjustment arm, a driven gear and a gear disc is designed. The angle adjustment between the adjustment arm and the disc and the spacing adjustment of the strut placement plate are achieved through the rotating shaft and the gear system, which is suitable for different specifications. chips.
It realizes effective placement and fixation of chips of different specifications, improves the utilization rate of the placement rack and saves space.
Smart Images
Figure CN222281971U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to the technical field of semiconductor wafer carrying and fixing, in particular to a carrying and fixing device suitable for semiconductor wafers of different specifications. Background Art
[0002] Semiconductors are materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors are materials whose electrical conductivity can be controlled, ranging from that of insulators to conductors.
[0003] At present, when traditional wafers are stored after processing, they are usually placed on specified racks, which can effectively facilitate differentiation. However, when placing wafers on the racks, they can only place wafers of one size. After the wafers on the racks are transferred, the racks are in an idle state. In this way, the racks cannot be fully utilized, and a large number of racks will take up more space.
[0004] In view of the above situation, we provide a bearing and fixing device suitable for semiconductor wafers of different specifications. In this device, multiple adjustment arms are installed on the edge of the wafer through a rotating shaft, and mounting holes are also opened on the adjusting arms, so that the support rod can be placed in different positions. A driven gear is arranged at the bottom of the rotating shaft, and the driven gear cooperates with the gear plate. In this way, when the driving gear rotates on the driven gear plate, multiple driven gears can be rotated at the same time, thereby adjusting the angle between the adjusting arm and the disc, so that the placement plate on the support rod can carry and fix wafers of different specifications. Utility Model Content
[0005] The purpose of the utility model is to provide a bearing and fixing device suitable for semiconductor chips of different specifications. In this device, the angle adjustment between the adjusting arm and the disc can be achieved through the cooperation between the toothed disc and the driven gear. At the same time, different mounting holes can be selected through the support frame, so that the placement plate can also effectively place and fix chips of different specifications; so as to solve the problems of the above-mentioned background technology.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A bearing and fixing device suitable for semiconductor wafers of different specifications comprises a disc; a groove is provided on the edge of the disc, wherein an adjusting arm is movably installed in the groove through a rotating shaft, and a plurality of adjusting arms are provided; the adjusting arm is arranged in an arc shape; a plurality of mounting holes are provided on the adjusting arm for facilitating the installation of a support rod; wherein the mounting holes are arranged in the form of countersunk holes; and a plurality of placement plates are integrally provided on one side of the support rod.
[0008] As a further technical solution of the utility model, the rotating shaft extends to the outside of the disc and is fixedly mounted with a driven gear.
[0009] As a further technical solution of the utility model, a toothed disc is mounted on the bottom of the disc; the teeth on the edge of the toothed disc mesh with the driven gear; the toothed disc is also provided with teeth inside, which cooperate with the driving gear.
[0010] As a further technical solution of the utility model, the driving gear is fixedly mounted on the output shaft of the driving motor; and the bottom of the disc is fixedly mounted on the frame.
[0011] As a further technical solution of the utility model, the mounting holes and the support rods are detachable, and the placement plates on the support rods are in a rectangular array.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] When the utility model is used, by installing the bottoms of the plurality of support rods on the mounting holes at the same position of the adjustment arm, the spacing between the placement plates on the plurality of support rods can be adjusted, and wafers of different specifications can be placed;
[0014] The utility model has a driven gear at the bottom of the rotating shaft connected to the adjusting arm, the interior of the plurality of driven gears cooperates with the toothed disc, the center of the toothed disc cooperates with the driving gear, and the driving gear is installed on the output shaft of the driving motor, so that the toothed disc is driven to rotate by the rotating gear, and the toothed disc drives the plurality of driven gears to rotate at the same time, effectively ensuring that the plurality of adjusting arms can adjust the distance between the plurality of adjusting arms and the disc at the same time;
[0015] The utility model, in the device, can meet the bearing requirements of the wafer by adjusting the support rod and the mounting hole, and can also adjust the angle between the adjustment arm and the disc by cooperating between the toothed disc and the driven gear, so as to meet the bearing and fixation requirements of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0017] Figure 2 This utility model Figure 1 Schematic diagram of the bottom structure.
[0018] Figure 3 This utility model Figure 1 Top view of the .
[0019] Figure 4 This utility model Figure 1 Side view of.
[0020] In the figure: 1-disc, 2-adjusting arm, 3-mounting hole, 4-support rod, 5-placing plate, 6-rotating shaft, 7-driven gear, 8-toothed disc, 9-driving gear. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] See also Figure 1-4 In an embodiment of the utility model, a bearing and fixing device suitable for semiconductor wafers of different specifications includes a disc 1; a groove is provided on the edge of the disc 1, wherein an adjusting arm 2 is movably installed in the groove through a rotating shaft 6, and a plurality of adjusting arms 2 are provided; the adjusting arm 2 is arranged in an arc shape; a plurality of mounting holes 3 for facilitating the installation of a support rod 4 are provided on the adjusting arm 2; wherein the mounting holes 3 are arranged in a countersunk shape; a plurality of placement plates 5 are integrally provided on one side of the support rod 4.
[0023] Specifically, the rotating shaft 6 extends to the outside of the disc 1 and is fixedly mounted with a driven gear 7 .
[0024] By adopting the above technical solution, when in use, by mounting the bottoms of the plurality of support rods 4 on the mounting holes 3 at the same position of the adjustment arm 2, the spacing between the placement plates 5 on the plurality of support rods 4 can be adjusted, and wafers of different specifications can be placed;
[0025] A toothed disc 8 is also mounted on the bottom of the disc 1 ; the teeth on the edge of the toothed disc 8 mesh with the driven gear 7 ; the toothed disc 8 is also provided with teeth inside, which cooperate with the driving gear 9 .
[0026] In this embodiment, the driving gear 9 is fixedly mounted on the output shaft of the driving motor; and the bottom of the disc 1 is fixedly mounted on the frame.
[0027] By adopting the above technical solution, a driven gear 7 is provided at the bottom of the rotating shaft 6 connected to the adjusting arm 2, and the interiors of the multiple driven gears 7 cooperate with the toothed disc 8, and the center of the toothed disc 8 cooperates with the driving gear 9, and the driving gear 9 is installed on the output shaft of the driving motor. In this way, by rotating the gear 9 to drive the toothed disc 8 to rotate, the toothed disc 8 drives the multiple driven gears 7 to rotate at the same time, thereby effectively ensuring that the multiple adjusting arms 2 can adjust the distance between themselves and the disc 1 at the same time.
[0028] In this embodiment, the mounting holes 3 and the support rods 4 are detachable, and the placement plates 5 on the support rods 4 are in a rectangular array.
[0029] By adopting the above technical solution, in this device, the load-bearing requirements of the chip can be met by adjusting the support rod 4 and the mounting hole 3. The angle between the adjustment arm 2 and the disc 1 can also be adjusted through the cooperation between the toothed disk 8 and the driven gear 7 to meet the load-bearing fixation of the chip.
[0030] The working principle of the utility model is: when in use, by installing the bottoms of multiple support rods 4 on the mounting holes 3 at the same position of the adjustment arm 2, the spacing between the placement plates 5 on the multiple support rods 4 can be adjusted, and wafers of different specifications can be placed;
[0031] A driven gear 7 is provided at the bottom of the rotating shaft 6 connected to the adjusting arm 2, and the interiors of the multiple driven gears 7 cooperate with the toothed disc 8, and the center of the toothed disc 8 cooperates with the driving gear 9, and the driving gear 9 is installed on the output shaft of the driving motor. In this way, the toothed disc 8 is driven by the rotating gear 9 to rotate, and the toothed disc 8 drives the multiple driven gears 7 to rotate at the same time, which effectively ensures that the multiple adjusting arms 2 can adjust the spacing between them and the disc 1 at the same time;
[0032] In this device, the load-bearing requirements of the chip are met by adjusting the support rod 4 and the mounting hole 3. The angle between the adjustment arm 2 and the disc 1 can be adjusted through the cooperation between the toothed disk 8 and the driven gear 7 to meet the load-bearing fixation of the chip.
[0033] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
[0034] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A supporting and fixing device suitable for semiconductor wafers of different specifications, characterized in that: The invention comprises a disc (1); a groove is provided on the edge of the disc (1); an adjusting arm (2) is movably mounted in the groove via a rotating shaft (6); a plurality of adjusting arms (2) are provided; the adjusting arm (2) is arranged in an arc shape; a plurality of mounting holes (3) are provided on the adjusting arm (2) for facilitating the mounting of a support rod (4); the mounting holes (3) are arranged in the form of countersunk holes; and a plurality of placement plates (5) are integrally provided on one side of the support rod (4).
2. The supporting and fixing device for semiconductor wafers of different specifications according to claim 1 is characterized in that: The rotating shaft (6) extends to the outside of the disc (1) and is fixedly mounted with a driven gear (7).
3. The supporting and fixing device for semiconductor wafers of different specifications according to claim 1 is characterized in that: A toothed disc (8) is also mounted on the bottom of the circular disc (1); teeth on the edge of the toothed disc (8) mesh with the driven gear (7); teeth are also arranged inside the toothed disc (8), and the teeth cooperate with the driving gear (9).
4. The supporting and fixing device for semiconductor wafers of different specifications according to claim 3 is characterized in that: The driving gear (9) is fixedly mounted on the output shaft of the driving motor; the bottom of the disc (1) is fixedly mounted on the frame.
5. The supporting and fixing device for semiconductor wafers of different specifications according to claim 4, characterized in that: The mounting holes (3) and the support rods (4) are detachable, and the placement plates (5) on the support rods (4) are in a rectangular array.