Packaging device

Abstract

The utility model discloses a packaging device, and relates to the composite tube detection technology field, the packaging device comprises a pedestal and a packaging cover plate, the middle part of the pedestal is provided with a placing groove, the upper end and the lower end of the placing groove are both provided with arc-shaped grooves, the placing groove is internally provided with a chip main body, the edge of the upper surface of the chip main body is integrally provided with a convex block, and the convex block is internally provided with an arc-shaped groove. The base is provided with a protruding block, the protruding block is connected with one end of the gold thread, the other end of the gold thread is connected with the pin, the pin is arranged on the edge of the base, the packaging cover plate covers the base, and a pressing composite plate is installed in the middle of the lower surface of the packaging cover plate. According to the utility model, the chip main body is clamped in the base through the placing groove, the arc-shaped groove is arranged at the edge of the placing groove, so that the chip main body can be conveniently taken out of the placing groove, the chip main body cannot be damaged in the taking-out process, the gold wire is arranged in the wiring groove, and the gold wire can be protected to a certain extent through the arrangement of the wiring groove; the gold thread is prevented from being pressed by the packaging cover plate, and the service life of the gold thread is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a packaging device. Background Art

[0002] Chip packaging is the shell used to install semiconductor integrated circuit chips. It has the functions of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. Chip packaging is a bridge between the internal world of the chip and the external circuit. The contacts of the chip are connected to the pins of the package shell with wires, and the pins are connected to other devices through wires on the printed circuit board.

[0003] The existing chip is stuck inside the base, and the chip and the pin are connected by gold wires. When the packaging cover is covered on the substrate, the gold wires will be squeezed, shortening the service life of the gold wires. In addition, the packaging cover directly covers the chip. When the device is hit, the impact force is easily transmitted to the chip through the packaging cover, causing damage to the internal circuit of the chip. For this reason, a packaging device is urgently needed. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a packaging device to solve the problem that the existing chip is stuck inside the base, the chip and the pin are connected by gold wire, and the packaging cover plate covers the substrate, which will cause squeezing of the gold wire and shorten the service life of the gold wire. In addition, the packaging cover plate directly covers the chip. When the device is hit, the impact force is easily transmitted to the chip through the packaging cover plate, causing damage to the internal circuit of the chip.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a packaging device, comprising a base and a packaging cover plate, a placement groove is opened in the middle of the base, and arc grooves are arranged at the upper and lower ends of the placement groove, a chip body is arranged inside the placement groove, a bump is integrally arranged on the upper surface edge of the chip body, and the bump is connected to one end of a gold wire, and the other end of the gold wire is connected to a pin, and the pin is arranged at the edge of the base;

[0006] The packaging cover plate covers the top of the base, and a pressing composite plate is installed in the middle of the lower surface of the packaging cover plate. The pressing composite plate includes a stainless steel sheet, an elastic plate and a rubber pad. The elastic plate is fixed to the lower surface of the stainless steel sheet, and the rubber pad is glued to the lower surface of the elastic plate.

[0007] Preferably, the placement groove and the chip body are arranged to form a semi-enclosed structure, and the depth of the placement groove is greater than the thickness of the chip body.

[0008] Preferably, a wiring groove is provided on the upper surface of the base, and two ends of the wiring groove are respectively connected to the placement groove and the pin installation groove.

[0009] Preferably, the bump is connected to the pin via a gold wire, and one end of the pin is welded inside the pin mounting groove.

[0010] Preferably, positioning blocks are provided on both the front and rear sides of the pressing composite plate, and the positioning blocks are fixed to the lower surface of the packaging cover plate, and the upper surface of the base is provided with positioning grooves matched with the positioning blocks.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model clamps the chip body inside the base through the placement groove, and the edge of the placement groove is provided with an arc groove, which is convenient for taking the chip body out of the placement groove, and the chip body will not be damaged during the removal process. The gold wire is arranged inside the routing groove, and the arrangement of the routing groove can protect the gold wire to a certain extent, prevent the gold wire from being pressed by the packaging cover plate, and extend the service life of the gold wire;

[0013] 2. In the utility model, the packaging cover plate covers the top of the base. Since the depth of the placement groove is greater than the thickness of the chip body, the pressing composite plate will not over-press the chip body while pressing against the upper surface of the chip body. The pressing composite plate is composed of a stainless steel sheet, an elastic plate and a rubber pad. The stainless steel sheet enhances the puncture resistance of the chip body, and the elastic plate and the rubber pad enhance the impact resistance of the chip body. When the device is impacted, the elastic plate provides buffering to protect the chip body.

[0014] 3. The utility model is advantageous for aligning the package cover plate with the base by providing the positioning block and the positioning groove, so that the package cover plate is evenly covered on the upper surface of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the top view structure of the base of the utility model;

[0017] Figure 3 This is a schematic diagram of the three-dimensional structure of the packaging cover plate of the utility model;

[0018] Figure 4 For the utility model Figure 2 Enlarged structural diagram at A in the middle.

[0019] In the figure: 1. base; 2. placement groove; 3. chip body; 4. arc groove; 5. bump; 6. gold wire; 7. pin; 8. wiring groove; 9. pin mounting groove; 10. package cover; 11. positioning block; 12. positioning groove; 13. pressing composite board; 1301. stainless steel sheet; 1302. elastic plate; 1301. rubber pad. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0021] The following describes an embodiment of the utility model based on its overall structure.

[0022] See also Figure 1-4 A packaging device includes a base 1 and a packaging cover plate 10. A placement groove 2 is opened in the middle of the base 1, and arc grooves 4 are set at the upper and lower ends of the placement groove 2. A chip body 3 is set inside the placement groove 2. The placement groove 2 and the chip body 3 are set to a semi-enclosed structure, and the depth of the placement groove 2 is greater than the thickness of the chip body 3. The placement groove 2 is used to place the chip body 3, so that the chip body 3 is just stuck in the placement groove 2 and fixed. When the chip body 3 needs to be taken out, insert a finger into the arc groove 4 to press against the edge of the chip body 3, so that the chip body 3 can be quickly removed without causing damage to the chip body 3. The upper surface edge of the chip body 3 is integrated with a bump 5, and the bump 5 and the One end of the gold wire 6 is connected, and the other end of the gold wire 6 is connected to the pin 7, and the pin 7 is arranged at the edge of the base 1. A wiring groove 8 is opened on the upper surface of the base 1, and the two ends of the wiring groove 8 are respectively connected to the placement groove 2 and the pin installation groove 9. The gold wire 6 is arranged inside the wiring groove 8. The arrangement of the wiring groove 8 can protect the gold wire 6 to a certain extent to prevent the gold wire 6 from being pressed. The bump 5 is connected to the pin 7 through the gold wire 6, and one end of the pin 7 is welded inside the pin installation groove 9. The circuit inside the chip body 3 is connected to the bump 5 on the edge, and then connected to the pin 7 one by one through the gold wire 6. The arrangement of the pin installation groove 9 is used to fix one end of the pin 7 on the base 1 for subsequent use;

[0023] The package cover plate 10 is covered on the top of the base 1, and positioning blocks 11 are provided on both the front and rear sides of the pressing composite plate 13, and the positioning blocks 11 are fixed to the lower surface of the package cover plate 10, and the upper surface of the base 1 is provided with positioning grooves 12 adapted to the positioning blocks 11. When the chip body 3 and the gold wire 6 are fixed, the package cover plate 10 is covered on the top of the base 1. The arrangement of the positioning blocks 11 and the positioning grooves 12 is conducive to the alignment of the package cover plate 10 and the base 1. Finally, glue is used to bond the edges of the package cover plate 10 and the base 1 together to realize the chip packaging. The middle of the lower surface of the package cover plate 10 is arranged A pressing composite plate 13 is provided, and the pressing composite plate 13 includes a stainless steel sheet 1301, an elastic plate 1302 and a rubber pad 1303. The elastic plate 1302 is fixed to the lower surface of the stainless steel sheet 1301, and the rubber pad 1303 is glued to the lower surface of the elastic plate 1302. The packaging cover plate 10 covers the upper surface of the base 1, and the pressing composite plate 13 covers the upper surface of the chip body 3. The arrangement of the stainless steel sheet 1301 enhances the ability of the chip body 3 to resist puncture. The arrangement of the elastic plate 1302 and the rubber pad 1303 enhances the anti-impact ability of the chip body 3, which is beneficial to protecting the chip body 3.

[0024] Working principle: When in use, first clamp the chip body 3 in the placement groove 2, fix the position of the chip body 3 through the placement groove 2, connect the circuit inside the chip body 3 to the bump 5 on the edge, and connect to the pin 7 one by one through the gold wire 6. One end of the pin 7 is fixed inside the pin installation groove 9. Under the cooperation of the bump 5 and the gold wire 6, the circuit inside the chip body 3 is connected to the pin 7. When the chip body 3 and the gold wire 6 are fixed, cover the package cover 10 on the top of the base 1. When assembling the package cover 10, align the positioning block 11 with the positioning groove 12 and insert it. The mutual cooperation of the grooves 12 is conducive to the alignment of the packaging cover plate 10 and the base 1. Finally, glue is used to bond the edges of the packaging cover plate 10 and the base 1 together to achieve chip packaging. The gold wire 6 is installed inside the wiring groove 8 to avoid excessive squeezing of the gold wire 6 by the packaging cover plate 10. Since the depth of the placement groove 2 is greater than the thickness of the chip body 3, the pressing composite plate 13 will not excessively press the chip body 3 while covering the upper surface of the chip body 3. The pressing composite plate 13 is composed of a stainless steel sheet 1301, an elastic plate 1302 and a rubber pad 1303, which enhances the chip body 3's ability to resist puncture and impact.

[0025] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0026] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the protection content of the present invention.

[0027] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging device, comprising a base (1) and a packaging cover plate (10), characterized in that: A placement groove (2) is provided in the middle of the base (1), and arc grooves (4) are provided at both upper and lower ends of the placement groove (2), a chip body (3) is provided inside the placement groove (2), a bump (5) is provided integrally on the upper surface edge of the chip body (3), and the bump (5) is connected to one end of a gold wire (6), and the other end of the gold wire (6) is connected to a pin (7), and the pin (7) is provided on the edge of the base (1); The packaging cover plate (10) covers the top of the base (1), and a pressing composite plate (13) is installed in the middle of the lower surface of the packaging cover plate (10), and the pressing composite plate (13) comprises a stainless steel sheet (1301), an elastic plate (1302) and a rubber pad (1303), the elastic plate (1302) is fixed to the lower surface of the stainless steel sheet (1301), and the rubber pad (1303) is glued to the lower surface of the elastic plate (1302).

2. A packaging device according to claim 1, characterized in that: The placement groove (2) and the chip body (3) are arranged to form a semi-enclosed structure, and the depth of the placement groove (2) is greater than the thickness of the chip body (3).

3. A packaging device according to claim 1, characterized in that: A wiring groove (8) is provided on the upper surface of the base (1), and two ends of the wiring groove (8) are respectively connected to the placement groove (2) and the pin installation groove (9).

4. A packaging device according to claim 1, characterized in that: The bump (5) is connected to the pin (7) via a gold wire (6), and one end of the pin (7) is welded inside the pin mounting groove (9).

5. A packaging device according to claim 1, characterized in that: Positioning blocks (11) are provided on both the front and rear sides of the pressing composite plate (13), and the positioning blocks (11) are fixed to the lower surface of the packaging cover plate (10), and the upper surface of the base (1) is provided with positioning grooves (12) adapted to the positioning blocks (11).

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