Bottom supporting plate

Abstract

The utility model provides a bottom supporting plate, and belongs to the technical field of batteries. The bottom supporting plate comprises a plate body, at least one hot melting boss is arranged on the plate body, the top face of the hot melting boss is higher than the top face of the plate body, the bottom face of the hot melting boss is higher than the bottom face of the plate body, and a deformation vacant area is formed between the bottom face of the hot melting boss and the bottom face of the plate body. The low-thickness plate body is adopted, and the total thickness of the plate body is increased by hot melting the hot melting bosses, so that the cost can be effectively reduced; the thickness of a hot melting position is effectively reduced, and the cell assembly ratio and capacity are improved; and interference between the pole group and the R angle of the shell is effectively prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field of batteries and relates to a bottom support plate. Background Art

[0002] When the electrode group and the shell are assembled, a bottom support plate is provided between the electrode group and the bottom of the shell, which can be hot-melted with the mylar film on the electrode group to wrap the electrode group and prevent the electrode group from contacting the shell. In order to prevent the four sides of the bottom of the electrode group from interfering with the internal R angle of the bottom of the shell, the bottom support plate must have a certain thickness. However, increasing the thickness of the bottom support plate will increase the cost. In addition, since the bottom support plate and the mylar film are fixed by hot-melt fixing method, the hot-melt process of the mylar film and the bottom support plate will cause the hot melting point of the mylar film and the bottom support plate to deform, resulting in the thickening of the size thickness here, thereby affecting the battery cell assembly ratio. Utility Model Content

[0003] The purpose of the utility model is to provide a bottom support plate in view of the above problems.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A bottom support plate comprises a plate body, wherein at least one hot melt boss is arranged on the plate body, the top surface of the hot melt boss is higher than the top surface of the plate body, the bottom surface of the hot melt boss is higher than the bottom surface of the plate body, and a deformation space is formed between the bottom surface of the hot melt boss and the bottom surface of the plate body.

[0006] The hot-melt boss on the top surface of the plate body can raise the total thickness of the plate body, that is, it is only necessary to hot-melt a hot-melt boss on a plate body with low thickness to increase the total thickness of the plate body, thereby improving the battery cell assembly ratio and reducing the cost of structural parts. It can effectively reduce the thickness of the plate body and reduce costs. The hot-melt boss and the mylar film on the pole group wrap the pole group after hot-melting, and the hot-melt boss has a certain height, which can prevent the pole group from interfering with the R angle of the shell. The deformation gap formed between the bottom surface of the hot-melt boss and the bottom surface of the plate body can prevent the increase in the thickness of the plate body caused by hot-melt deformation, which can effectively reduce the thickness of the hot-melt position and improve the battery cell assembly ratio and capacity.

[0007] In the above-mentioned bottom support plate, the bottom surface of the hot melt boss is higher than the top surface of the plate body.

[0008] The bottom surface of the hot melt boss is higher than the top surface of the plate body, ensuring that the hot melt boss has a certain height, which is used to raise the total thickness of the low-thickness plate body to reduce costs and prevent interference between the pole group and the R angle of the shell. The deformation gap between the hot melt boss and the plate body can effectively reduce the thickness of the hot melt position and improve the battery cell assembly ratio and capacity.

[0009] In the above-mentioned bottom support plate, the hot melt boss includes a top plate and a surrounding plate, and the top plate, the surrounding plate and the plate body are connected into an integrated structure.

[0010] A hot-melt boss consisting of a top plate and a surrounding plate is formed on the plate body by hot-melt.

[0011] In the above-mentioned bottom support plate, the top plate is circular or rectangular.

[0012] The top plate is circular or rectangular and adapted to the bottom of the pole group.

[0013] In the above-mentioned bottom support plate, the top plate and the surrounding plate are provided with a first annular chamfer; a second annular chamfer is provided between the surrounding plate and the plate body; the top surface of the top plate, the bottom surface of the top plate, the top surface of the plate body and the bottom surface of the plate body are all parallel to each other.

[0014] The first round chamfer between the top plate and the enclosure and the second round chamfer between the enclosure and the plate body can avoid scratches on the pole group caused by sharp edges and can reduce stress concentration during hot melting. The top surface of the top plate, the bottom surface of the top plate, the top surface of the plate body and the bottom surface of the plate body are all parallel to each other to facilitate the assembly of the plate body and ensure sufficient contact between the top plate and the mylar film at the bottom of the pole group.

[0015] In the above-mentioned bottom support plate, the plate body is rectangular, wherein two adjacent corners are provided with arc chamfers, and two corners opposite to the arc chamfers are provided with chamfers.

[0016] The arc chamfers on two adjacent corners of the plate body and the chamfers on two opposite corners facilitate the assembly of the plate body.

[0017] In the above-mentioned bottom support plate, at least one row of the hot-melt bosses is provided on the plate body, and at least two hot-melt bosses are provided on each row.

[0018] At least one row of hot-melt bosses is provided on the plate body, and at least two hot-melt bosses are provided on each row, which can ensure sufficient contact between the hot-melt bosses and the mylar film at the bottom of the electrode group, thereby ensuring the quality of the hot-melt connection.

[0019] In the above-mentioned bottom support plate, the thickness of the plate body is 0.2mm-0.5mm.

[0020] The thickness of the plate body is 0.2mm-0.5mm. By using a low-thickness plate body and setting a hot-melt boss to raise the total thickness of the plate body, the cost can be effectively reduced.

[0021] In the above-mentioned bottom support plate, the thickness of the plate body is 0.3 mm.

[0022] The thickness of the plate is 0.3 mm. Using a low-thickness plate can effectively reduce costs.

[0023] In the above-mentioned bottom support plate, the plate body is provided with positioning holes respectively located at both ends of the hot melt boss.

[0024] The positioning holes on the plate body at both ends of the hot melt boss are used for installation and positioning of the plate body.

[0025] Compared with the existing technology, the advantages of the utility model are: 1. The total thickness of the plate body is increased by hot-melting the hot-melt bosses, which can effectively reduce the cost. 2. The thickness of the hot-melt position is effectively reduced, and the battery cell assembly ratio and capacity are improved. 3. The pole group is effectively prevented from interfering with the R angle of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of the plate;

[0027] Figure 2 is a side view of the plate;

[0028] Figure 3 It is a top view of the plate;

[0029] Figure 4 is a schematic structural diagram of the plate body in the second embodiment;

[0030] Figure 5 is a side view of the plate body in the second embodiment;

[0031] Figure 6 is a top view of the plate body in the second embodiment;

[0032] Figure 7 is a schematic diagram of the structure of the plate body in the third embodiment;

[0033] Figure 8 is a side view of the plate body in the second embodiment;

[0034] Fig. 9 It is a top view of the plate body in the second embodiment.

[0035] In the figure, the plate body 1, the hot melt boss 2, the deformation blank area 3, the top plate 5, the surrounding plate 6, the first round chamfer 7, the second round chamfer 8, the arc chamfer 9, the chamfer 10, and the positioning hole 11. DETAILED DESCRIPTION

[0036] Embodiment 1

[0037] like Figure 1-Figure 3 As shown, a bottom support plate includes a plate body 1, on which is provided at least one hot melt boss 2, the top surface of the hot melt boss 2 is higher than the top surface of the plate body 1, the bottom surface of the hot melt boss 2 is higher than the bottom surface of the plate body 1, and a deformation space 3 is formed between the bottom surface of the hot melt boss 2 and the bottom surface of the plate body 1.

[0038] In the utility model, the plate body 1 is arranged between the pole group and the bottom of the shell, and the hot-melt boss 2 on the plate body 1 is hot-melted with the mylar film on the pole group to wrap the pole group to prevent the pole group from contacting the bottom of the shell.

[0039] The hot-melt boss 2 on the top surface of the plate body 1 can raise the total thickness of the plate body 1, that is, it is only necessary to hot-melt the hot-melt boss 2 on the low-thickness plate body 1 to increase the total thickness of the plate body 1, thereby improving the battery cell assembly ratio and reducing the cost of structural parts. The thickness of the plate body 1 can be effectively reduced to reduce the cost. The hot-melt boss 2 and the mylar film on the pole group are hot-melted to wrap the pole group, and the hot-melt boss 2 has a certain height, which can prevent the pole group from interfering with the R angle of the shell. The deformation space 3 formed between the bottom surface of the hot-melt boss 2 and the bottom surface of the plate body 1 can prevent the thickness of the plate body 1 from increasing due to hot-melt deformation, which can effectively reduce the thickness of the hot-melt position and improve the battery cell assembly ratio and capacity.

[0040] Specifically, combined with Figure 2 As shown, the bottom surface of the hot melt boss 2 is higher than the top surface of the plate body 1.

[0041] The bottom surface of the hot melt boss 2 is higher than the top surface of the plate body 1, ensuring that the hot melt boss 2 has a certain height, which is used to raise the total thickness of the low-thickness plate body 1 to reduce costs and prevent interference between the pole group and the R angle of the shell. The deformation space 3 between the hot melt boss 2 and the plate body 1 can effectively reduce the thickness of the hot melt position and improve the battery cell assembly ratio and capacity.

[0042] Specifically, combined with Figure 1-Figure 3 As shown, the hot melt boss 2 includes a top plate 5 and a surrounding plate 6, and the top plate 5, the surrounding plate 6 and the plate body 1 are connected to form an integrated structure.

[0043] A hot-melt boss 2 consisting of a top plate 5 and a surrounding plate 6 is formed on the plate body 1 by hot-melt.

[0044] Specifically, combined with Figure 1 As shown, the top plate 5 is circular or rectangular.

[0045] The top plate 5 is circular or rectangular and is adapted to the bottom of the pole group.

[0046] Preferably, combined Figure 1-Figure 3 As shown, the top plate 5 and the surrounding plate 6 are provided with an annular first round chamfer 7; an annular second round chamfer 8 is provided between the surrounding plate 6 and the plate body 1; the top surface of the top plate 5, the bottom surface of the top plate 5, the top surface of the plate body 1 and the bottom surface of the plate body 1 are all parallel to each other.

[0047] The first round chamfer 7 between the top plate 5 and the surrounding plate 6 and the second round chamfer 8 between the surrounding plate 6 and the plate body 1 can avoid scratches on the pole group caused by sharp edges and can reduce stress concentration during hot melting. The top surface of the top plate 5, the bottom surface of the top plate 5, the top surface of the plate body 1 and the bottom surface of the plate body 1 are all parallel to each other to facilitate the assembly of the plate body 1 and to ensure sufficient contact between the top plate 5 and the mylar film at the bottom of the pole group.

[0048] Preferably, combined Figure 3 As shown, the plate body 1 is rectangular, wherein arc chamfers 9 are provided on two adjacent corners, and chamfers 10 are provided on two corners opposite to the arc chamfers 9.

[0049] The arc chamfers 9 on two adjacent corners of the plate body 1 and the chamfers 10 on two opposite corners facilitate the assembly of the plate body 1 .

[0050] Preferably, combined Figure 2 As shown, the thickness of the plate body 1 is 0.2 mm-0.5 mm.

[0051] The thickness of the plate body 1 is 0.2 mm-0.5 mm. By using a low-thickness plate body 1 and arranging a hot-melt boss 2 to raise the total thickness of the plate body 1, the cost can be effectively reduced.

[0052] Specifically, combined with Figure 2 As shown, the thickness of the plate body 1 is 0.3 mm.

[0053] The thickness of the plate body 1 is 0.3 mm. Using a low-thickness plate body 1 can effectively reduce costs.

[0054] Specifically, combined with Figure 1 As shown, the plate body 1 is provided with positioning holes 11 respectively located at the two ends of the hot melt boss 2.

[0055] The positioning holes 11 on the plate body 1 and located at both ends of the hot melt boss 2 are used for installation and positioning of the plate body 1.

[0056] The working principle of the utility model is as follows: the plate body 1 is arranged between the pole group and the bottom of the shell, and the hot-melt boss 2 on the plate body 1 and the mylar film on the pole group are hot-melted to wrap the pole group to prevent the pole group from contacting the bottom of the shell; the hot-melt boss 2 on the top surface of the plate body 1 can raise the total thickness of the plate body 1, that is, it is only necessary to hot-melt the hot-melt boss 2 on the plate body 1 with low thickness to increase the total thickness of the plate body 1, thereby improving the battery cell assembly ratio and reducing the cost of structural parts, and can effectively reduce the thickness of the plate body 1 and reduce the cost. The hot-melt boss 2 and the mylar film on the pole group are hot-melted to wrap the pole group and the hot-melt boss 2 has a certain height, which can prevent the pole group from interfering with the R angle of the shell, and the deformation space 3 formed between the bottom surface of the hot-melt boss 2 and the bottom surface of the plate body 1 can prevent the thickness of the plate body 1 from increasing after hot-melting deformation, and can effectively reduce the thickness of the hot-melt position, thereby improving the battery cell assembly ratio and capacity;

[0057] The bottom surface of the hot melt boss 2 is higher than the top surface of the plate body 1, ensuring that the hot melt boss 2 has a certain height, which is used to raise the total thickness of the low-thickness plate body 1 to reduce costs and prevent interference between the pole group and the R angle of the shell. The deformation space 3 between the hot melt boss 2 and the plate body 1 can effectively reduce the thickness of the hot melt position and improve the battery cell assembly ratio and capacity;

[0058] A hot-melt boss 2 consisting of a top plate 5 and a surrounding plate 6 is formed on the plate body 1 by hot-melting; the top plate 5 is circular or rectangular and adapted to the bottom of the pole group;

[0059] The first round chamfer 7 between the top plate 5 and the surrounding plate 6 and the second round chamfer 8 between the surrounding plate 6 and the plate body 1 can avoid scratches on the pole group caused by sharp edges and can reduce stress concentration during hot melting. The top surface of the top plate 5, the bottom surface of the top plate 5, the top surface of the plate body 1 and the bottom surface of the plate body 1 are parallel to each other to facilitate assembly of the plate body 1 and ensure sufficient contact between the top plate 5 and the mylar film at the bottom of the pole group.

[0060] The arc chamfers 9 on the two adjacent corners of the plate body 1 and the chamfers 10 on the two opposite corners facilitate the assembly of the plate body 1; the thickness of the plate body 1 is 0.2mm-0.5mm, and the low-thickness plate body 1 is adopted, and the total thickness of the plate body 1 is raised by setting the hot-melt boss 2, which can effectively reduce the cost; the thickness of the plate body 1 is 0.3mm, and the low-thickness plate body 1 is adopted, which can effectively reduce the cost;

[0061] The positioning holes 11 on the plate body 1 and located at both ends of the hot melt boss 2 are used for installation and positioning of the plate body 1.

[0062] Embodiment 2

[0063] like Figure 4-Figure 6 As described above, the structure and working principle of this embodiment are basically the same as those of the first embodiment, except that at least one row of hot melt bosses 2 is provided on the plate body 1, and at least two hot melt bosses 2 are provided on each row.

[0064] At least one row of hot melt bosses 2 is provided on the plate body 1 to ensure sufficient contact between the hot melt bosses 2 and the mylar film at the bottom of the electrode group, thereby ensuring the quality of the hot melt connection.

[0065] Embodiment 3

[0066] like Figure 7-Figure 9 As described above, the structure and working principle of this embodiment are basically the same as those of the first embodiment, except that two rows of hot melt bosses 2 are provided on the plate body 1, and at least two hot melt bosses 2 are provided on each row.

[0067] Two rows of hot melt bosses 2 are arranged on the plate body 1 and at least two hot melt bosses 2 are arranged on each row, which can ensure sufficient contact between the hot melt bosses 2 and the mylar film at the bottom of the electrode group, thereby ensuring the quality of the hot melt connection.

[0068] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0069] Although this article uses the plate body 1, hot-melt boss 2, deformation blank area 3, top plate 5, enclosure 6, first round chamfer 7, second round chamfer 8, arc chamfer 9, chamfer 10, positioning hole 11, etc. more frequently, these terms are used only to more conveniently describe and explain the essence of the utility model; interpreting them as any additional restrictions is contrary to the spirit of the utility model.

Claims

1. A bottom support plate, comprising a plate body (1), characterized in that: At least one hot melt boss (2) is provided on the plate body (1), the top surface of the hot melt boss (2) is higher than the top surface of the plate body (1), the bottom surface of the hot melt boss (2) is higher than the bottom surface of the plate body (1), and a deformation space (3) is formed between the bottom surface of the hot melt boss (2) and the bottom surface of the plate body (1).

2. The bottom support plate according to claim 1, characterized in that: The bottom surface of the hot-melt boss (2) is higher than the top surface of the plate body (1).

3. The bottom support plate according to claim 2, characterized in that: The hot melt boss (2) comprises a top plate (5) and a surrounding plate (6), and the top plate (5), the surrounding plate (6) and the plate body (1) are connected to form an integrated structure.

4. The bottom support plate according to claim 3, characterized in that: The top plate (5) is circular or rectangular.

5. The bottom support plate according to claim 3, characterized in that: The top plate (5) and the enclosure plate (6) are provided with an annular first round chamfer (7); an annular second round chamfer (8) is provided between the enclosure plate (6) and the plate body (1); the top surface of the top plate (5), the bottom surface of the top plate (5), the top surface of the plate body (1) and the bottom surface of the plate body (1) are all parallel to each other.

6. The bottom support plate according to claim 1, characterized in that: The plate body (1) is rectangular in shape, wherein two adjacent corners are provided with arc chamfers (9), and two corners opposite to the arc chamfers (9) are provided with chamfers (10).

7. The bottom support plate according to any one of claims 1 to 6, characterized in that: At least one row of the hot-melt bosses (2) is provided on the plate body (1), and at least two hot-melt bosses (2) are provided on each row.

8. The bottom support plate according to any one of claims 1 to 6, characterized in that: The thickness of the plate body (1) is 0.2 mm-0.5 mm.

9. The bottom support plate according to claim 8, characterized in that: The thickness of the plate body (1) is 0.3 mm.

10. The bottom support plate according to any one of claims 1 to 6, characterized in that: The plate body (1) is provided with positioning holes (11) respectively located at two ends of the hot-melt boss (2).

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