Sheet type conductive connecting sheet for semiconductor

Abstract

The utility model relates to the technical field of conductors, and discloses a sheet type conductive connecting sheet for a semiconductor, which comprises a connecting plate main body assembly, a dustproof sleeve assembly is arranged on the outer side of the connecting plate main body assembly, and an extension additional assembly is arranged on one side of the connecting plate main body assembly. According to the utility model, the extension additional assembly is arranged on the basis of the device, so that when the power line is connected, the power line without complete connection of a short interface can be connected through the interior of the assembly, and the shearing of the metal power line is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of conductors, in particular to a thin sheet type conductive connecting sheet used for semiconductors. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Semiconductors include thin sheets, and thin-sheet semiconductors need to be conductive through connecting sheets. The conductive connecting sheets are in contact with semiconductor chips to achieve the conductive effect. Conductive electrode sheets refer to components that connect power and circuits in circuits to achieve normal operation of electronic equipment. Conductive electrode sheets are mainly composed of two parts: a substrate and a conductive layer. Among them, the conductive layer is the key to achieving current conduction, and its material has an important influence on the conductivity, corrosion resistance, heat resistance and other properties of the electrode sheet. The conductive electrode sheet material has a very important influence on the service life and quality of electronic products. Therefore, when choosing, it is necessary to make comprehensive considerations based on the usage scenarios and requirements of your own products.

[0003] The application number is CN202322079145.2, which discloses a thin-sheet conductive connecting piece for semiconductors, including a shell, an insulating layer is arranged inside the shell, an anti-corrosion layer is pasted under the insulating layer, a thin-sheet semiconductor chip is arranged under the anti-corrosion layer, a transition heat sink is arranged under the thin-sheet semiconductor chip, and a bottom plate is arranged under the transition heat sink; this thin-sheet conductive connecting piece for semiconductors, through the arrangement of thin-sheet semiconductor chips, conductive connecting blocks, first copper plates, threaded grooves and bolts, when the thin-sheet semiconductor needs to be conductive, the first copper plate is inserted into the shell and aligned with the conductive connecting block once, and then the conductive connecting block is connected to the first copper plate by means of bolts. Through the arrangement of the bolts, the conductive connecting block and the first copper plate are connected more stably to avoid poor contact caused by conduction. Such an arrangement is simple and convenient to operate, and such a connection method is widely used.

[0004] Although the above utility model is provided with a thin semiconductor chip, a conductive connection block, a first copper plate, a threaded groove and bolts, when the thin-film semiconductor needs to be conductive, the first copper plate is inserted into the shell and aligned with the conductive connection block, and then the conductive connection block and the first copper plate are connected by means of bolts. Through the setting of the bolts, the connection between the conductive connection block and the first copper plate is more stable, avoiding poor contact due to conduction. Such a setting is simple and convenient to operate, and such a connection method is widely used. However, there is a disadvantage that when the device is connected to the power cord, the power cord needs to be two disconnected sections and then bound to the connecting head end. In this way, even a completely connected loop-shaped power cord needs to cut the material before it can be connected.

[0005] Therefore, it is necessary to install an extended additional component on the basis of the device so that when connecting the power cord, the power cord that is not fully connected to the disconnect interface can be connected through the inside of the component to avoid cutting of the metal power cord. Summary of the invention

[0006] The purpose of the utility model is to provide a thin sheet type conductive connecting sheet for semiconductors to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0008] The utility model discloses a thin sheet type conductive connecting piece for semiconductors, comprising a connecting plate main body component, a dust cover component is installed on the outer side of the connecting plate main body component, and an extended additional component is installed on one side of the connecting plate main body component.

[0009] Furthermore, the connecting plate main body component includes a main board, connecting heads are installed on both sides of the main board, and a connecting ring opening is opened in the middle position of the connecting head.

[0010] Furthermore, the dust cover assembly includes an intermediate cover, connecting head covers are installed on both sides of the intermediate cover, a reserved hole is opened in the middle of the connecting head cover, and a mounting cover hole is opened on the outer side, and the inner side of the reserved hole is hollowed out.

[0011] Furthermore, the extended additional component includes a tough spring 1 and a push-pull block, a connecting additional plate is installed on the outer side of the tough spring 1, a metal ball is installed in the middle of the outer side of the connecting additional plate, a push-pull plate is installed on the outer side of the metal ball, a tough spring 2 is installed on the inner side of the push-pull plate, and a limiting block is installed on the top of the other side, and the push-pull block is installed in the middle position of the outer side of the push-pull plate.

[0012] Furthermore, the connector includes an installation cavity and a push-pull cavity. The installation cavity is opened in the middle position of the outer side of the connector, and a limiting groove is opened on the top of the outer side. The push-pull cavity is opened in the inner wall of the outer edge of the connector, and a tough spring 2 is installed inside it.

[0013] Furthermore, the intermediate sleeve includes an anti-oxidation coating, which is installed on the outermost side, and an insulating coating is installed on the inner side thereof, a moisture-proof layer is installed on the inner side of the insulating coating, and an anti-corrosion layer is installed on the inner layer of the moisture-proof layer.

[0014] The utility model has the following beneficial effects:

[0015] (1) The utility model is a thin sheet-type conductive connecting piece for semiconductors. By installing an extended additional component on the base of the device, when connecting a power line, for a power line that does not have a short interface and is fully connected, the connection can be completed through the inside of the component, thereby avoiding the shearing of the metal power line.

[0016] (2) The utility model is a thin sheet type conductive connecting piece for semiconductors. By installing a dust cover assembly on the outside of the device, when using this assembly, this arrangement can prevent contact leakage, prevent moisture from affecting the connection piece's power supply, and prevent the connection piece from rotting or oxidizing and affecting the power supply.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of a thin sheet-type conductive connecting sheet for semiconductors according to the utility model;

[0020] Figure 2 It is a side view structural schematic diagram of a thin sheet-type conductive connecting sheet for semiconductors of the utility model;

[0021] Figure 3 This is a schematic diagram of the split structure of a thin sheet-type conductive connecting sheet for semiconductors according to the utility model;

[0022] Figure 4This is a schematic diagram of the structure of an extended additional component of a thin sheet-type conductive connecting sheet for a semiconductor according to the utility model;

[0023] Figure 5 This is a schematic diagram of the internal structure of a dust cover of a thin sheet-type conductive connecting sheet for a semiconductor according to the utility model;

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0025] In the figure: 1. connecting plate main body assembly; 2. dust cover assembly; 3. extended additional assembly; 101. main board; 102. connector; 103. connecting ring; 201. intermediate sleeve; 202. connector sleeve; 203. reserved hole; 204. hollowing; 205. mounting sleeve hole; 301. tough spring one; 302. connecting additional plate; 303. metal ball; 304. tough spring two; 305. push-pull plate; 306. limit block; 307. push-pull block; 1021. mounting cavity; 1022. push-pull cavity; 1023. limit groove; 2011. anti-oxidation coating; 2012. insulating coating; 2013. moisture-proof layer; 2014. anti-corrosion layer. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1 - Figure 5 As shown, the utility model is a sheet-type conductive connecting sheet for semiconductors, comprising a connecting plate main body component 1, a dust cover component 2 is installed on the outer side of the connecting plate main body component 1, and an extended additional component 3 is installed on one side thereof.

[0028] By installing an extension additional component 3 on the base of the device, when connecting the power cord, for the power cord that is not fully connected with the short interface, the connection can be completed through the inside of the component, avoiding the cutting of the metal power cord.

[0029] The connecting plate main body component 1 comprises a main board 101 , connecting heads 102 are installed on both sides of the main board 101 , and a connecting ring opening 103 is opened in the middle of the connecting head 102 .

[0030] The dustproof cover assembly 2 includes an intermediate cover 201, and connecting head covers 202 are installed on both sides of the intermediate cover 201. A reserved hole 203 is opened in the middle of the connecting head cover 202, and an installation cover hole 205 is opened on the outside. A hollow 204 is opened on the inner side of the reserved hole 203. The reserved holes 203 and the hollow 204 are set to prevent dust and avoid poor contact.

[0031] The extended additional component 3 includes a resilient spring 1 301 and a push-pull block 307. A connecting additional plate 302 is installed on the outer side of the resilient spring 1 301. A metal ball 303 is installed in the middle of the outer side of the connecting additional plate 302. A push-pull plate 305 is installed on the outer side of the metal ball 303. A resilient spring 2 304 is installed on the inner side of the push-pull plate 305, and a limiting block 306 is installed on the top of the other side. The push-pull block 307 is installed in the middle position of the outer side of the push-pull plate 305. Through the above settings, when connecting the power cord, for the power cord that is not fully connected with the short interface, the connection and conduction can be carried out through the metal ball 303.

[0032] The connector 102 includes an installation cavity 1021 and a push-pull cavity 1022. The installation cavity 1021 is opened in the middle position of the outer side of the connector 102, and a limiting groove 1023 is opened on the top of the outer side. The push-pull cavity 1022 is opened in the inner wall of the outer edge of the connector 102, and a resilient spring 304 is installed inside.

[0033] The middle sleeve 201 includes an anti-oxidation coating 2011, which is installed on the outermost side, and an insulating coating 2012 is installed on the inner side thereof, a moisture-proof layer 2013 is installed on the inner side of the insulating coating 2012, and an anti-corrosion layer 2014 is installed on the inner layer of the moisture-proof layer 2013. The setting of the middle sleeve 201 can prevent contact leakage, prevent the influence of moisture on the power supply of the connecting piece, and prevent the rot or oxidation of the connecting piece from affecting the power supply when using this component.

[0034] When using this device, first, when connecting the power cord, select the connection method according to the different power cords. When the connected power cord is a two-section metal wire, it can be conducted by tying it to the connecting ring 103. When the connected power cord is a completed metal wire, one end of the metal wire can be circled around the metal ball 303. To connect the metal ball 303, you only need to press the push-pull block 307 downward, and the push-pull plate 305 will be retracted into the interior through the tough spring 2 304 set on the inner side of the push-pull plate 305, and then the metal ball 303 inside will pop out to the outside through the tough spring 1 301 set inside. The spring is made of metal and connected to the inner wall of the connector 102, thereby achieving the conductive effect.

[0035] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A thin sheet-type conductive connecting sheet for semiconductors, comprising a connecting plate main body component (1), characterized in that: A dust cover assembly (2) is installed on the outer side of the connecting plate main body assembly (1), and an extension additional assembly (3) is installed on one side thereof.

2. A thin sheet-type conductive connecting sheet for semiconductors according to claim 1, characterized in that: The connecting plate main body component (1) comprises a main board (101), connecting heads (102) are installed on both sides of the main board (101), and a connecting ring opening (103) is provided in the middle of the connecting head (102).

3. A thin sheet-type conductive connecting sheet for semiconductors according to claim 1, characterized in that: The dust cover assembly (2) comprises an intermediate cover (201), connecting covers (202) are installed on both sides of the intermediate cover (201), a reserved hole (203) is opened in the middle of the connecting cover (202), and a mounting cover hole (205) is opened on the outside, and a hollow (204) is opened on the inside of the reserved hole (203).

4. A thin sheet-type conductive connecting sheet for semiconductors according to claim 1, characterized in that: The extension additional component (3) comprises a resilient spring 1 (301) and a push-pull block (307); a connecting additional plate (302) is installed on the outer side of the resilient spring 1 (301); a metal ball (303) is installed in the middle of the outer side of the connecting additional plate (302); a push-pull plate (305) is installed on the outer side of the metal ball (303); a resilient spring 2 (304) is installed on the inner side of the push-pull plate (305); a limit block (306) is installed on the top of the other side; and the push-pull block (307) is installed in the middle of the outer side of the push-pull plate (305).

5. A thin sheet-type conductive connecting sheet for semiconductors according to claim 2, characterized in that: The connector (102) comprises an installation cavity (1021) and a push-pull cavity (1022); the installation cavity (1021) is arranged at a middle position of the outer side of the connector (102), and a limiting groove (1023) is arranged at the top of the outer side; the push-pull cavity (1022) is arranged in the inner wall of the outer edge of the connector (102), and a second toughness spring (304) is installed inside the cavity.

6. A thin sheet-type conductive connecting sheet for semiconductors according to claim 3, characterized in that: The intermediate sleeve (201) comprises an anti-oxidation coating (2011), the anti-oxidation coating (2011) is installed on the outermost side, and an insulating coating (2012) is installed on the inner side thereof, a moisture-proof layer (2013) is installed on the inner side of the insulating coating (2012), and an anti-corrosion layer (2014) is installed on the inner layer of the moisture-proof layer (2013).

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