Circuit board with tin dragging pad

Abstract

The utility model discloses a circuit board with a tin dragging pad. The circuit board is characterized in that a chip is arranged on the upper end face of a substrate; the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly are parallel to the peripheral side of the chip and are sequentially arranged in the clockwise direction; the first tin dragging pad, the second tin dragging pad, the third tin dragging pad and the fourth tin dragging pad are sequentially arranged at four top corners of the substrate; the first tin dragging pad, the second tin dragging pad, the third tin dragging pad and the fourth tin dragging pad are all of a rectangular or irregular sheet-shaped structure. The first tin dragging pad is arranged between the fourth pin assembly and the first pin assembly in parallel, the second tin dragging pad is arranged between the first pin assembly and the second pin assembly in parallel, and the third tin dragging pad is arranged between the second pin assembly and the third pin assembly in parallel. And the fourth tin dragging pad is arranged between the third pin assembly and the fourth pin assembly in parallel. According to the utility model, the welding efficiency of the circuit board can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with a tin-drag pad. Background Art

[0002] QFN (Quad Flat No-lead Package) is an emerging surface mount chip packaging technology with small pad size, small volume, and plastic as sealing material. Since the large exposed pad in the center of the bottom is soldered to the heat dissipation pad of the PCB, QFN has excellent electrical and thermal performance. With the continuous update of QFN type component design, the number of pad arrangements is also increasing, and the pad spacing is significantly reduced. Therefore, during the SMT soldering process, the pads are prone to form tinning, which may cause short circuits or circuit board damage.

[0003] Therefore, the existing circuit board has the problem of low welding efficiency. Utility Model Content

[0004] The utility model aims to provide a circuit board with a tin-drag soldering pad, aiming to solve the problem of low soldering efficiency in the existing circuit boards.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: a circuit board with a tin-drag pad is provided, which includes: a substrate, a chip, a first tin-drag pad, a second tin-drag pad, a third tin-drag pad and a fourth tin-drag pad;

[0006] The chip is arranged on the upper end surface of the substrate, and the chip is a rectangular sheet structure;

[0007] A first pin assembly, a second pin assembly, a third pin assembly and a fourth pin assembly are arranged in a clockwise direction in parallel with the peripheral side of the chip; the long axis direction of the first pin assembly is perpendicular to the long axis directions of the second pin assembly and the fourth pin assembly, and the long axis direction of the third pin assembly is perpendicular to the long axis directions of the second pin assembly and the fourth pin assembly;

[0008] The chip is connected to the substrate through the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly;

[0009] The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are sequentially arranged at four vertex corners of the substrate;

[0010] The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular or irregular sheet structures;

[0011] The first tin-drag pad is arranged in parallel between the fourth pin assembly and the first pin assembly, the second tin-drag pad is arranged in parallel between the first pin assembly and the second pin assembly, the third tin-drag pad is arranged in parallel between the second pin assembly and the third pin assembly, and the fourth tin-drag pad is arranged in parallel between the third pin assembly and the fourth pin assembly.

[0012] Furthermore, the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular sheet structures.

[0013] Furthermore, the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all right-angled triangle sheet structures.

[0014] Furthermore, the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all L-shaped sheet structures.

[0015] Further, the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad all include a first long side and a second long side;

[0016] The ratio of the horizontal spacing of the first long side to the vertical spacing of the second long side is 1:1;

[0017] The horizontal spacing of the first long side is the spacing between the first long side and the adjacent pin assembly in the horizontal direction, and the vertical spacing of the second long side is the spacing between the second long side and the adjacent pin assembly in the vertical direction.

[0018] Furthermore, the horizontal spacing of the first long sides and the vertical spacing of the second long sides are within a range of 0.25 MM to 0.60 MM.

[0019] Furthermore, the length of the first long side is equal to the length of the second long side;

[0020] The length of the first long side and the length of the second long side are within a range of 0.50 MM to 0.90 MM.

[0021] Further, the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad each include an upper portion, a connecting portion and a lower portion;

[0022] The long axis direction of the upper part is perpendicular to the vertical direction of the lower part, and the length of the upper part is equal to the length of the lower part; the length of the upper part and the length of the lower part are within 0.20MM to 0.70MM.

[0023] Furthermore, the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly are all composed of a plurality of pins parallel to each other.

[0024] Furthermore, the pin is a rectangular sheet structure.

[0025] The utility model discloses a circuit board with a tin-drag pad, which comprises: a substrate, a chip, a first tin-drag pad, a second tin-drag pad, a third tin-drag pad and a fourth tin-drag pad; the chip is arranged on the upper end surface of the substrate, and the chip is a rectangular sheet structure; a first pin assembly, a second pin assembly, a third pin assembly and a fourth pin assembly are parallel to the peripheral side of the chip and arranged in sequence along the clockwise direction; the long axis direction of the first pin assembly is perpendicular to the long axis direction of the second pin assembly and the fourth pin assembly, and the long axis direction of the third pin assembly is perpendicular to the long axis direction of the second pin assembly and the fourth pin assembly; the chip is connected to the substrate through the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly. and the fourth pin assembly is connected to the substrate; the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are sequentially arranged at the four vertex corners of the substrate; the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular or irregular sheet structures; the first tin-drag pad is arranged in parallel between the fourth pin assembly and the first pin assembly, the second tin-drag pad is arranged in parallel between the first pin assembly and the second pin assembly, the third tin-drag pad is arranged in parallel between the second pin assembly and the third pin assembly, and the fourth tin-drag pad is arranged in parallel between the third pin assembly and the fourth pin assembly. The utility model can effectively avoid short circuit or damage to the circuit board caused by bridging tin during SMT welding by arranging tin-drag pads at the four vertex corners of the substrate, and can effectively improve the welding efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A first schematic diagram of a circuit board provided in an embodiment of the utility model;

[0028] Figure 2 A second schematic diagram of a circuit board provided in an embodiment of the utility model;

[0029] Figure 3 A third schematic diagram of a circuit board provided in an embodiment of the utility model.

[0030] Among them, the reference numerals in the figures are as follows:

[0031] 10. Circuit board; 11. Base plate; 12. Chip; 21. First tinning pad; 22. Second tinning pad; 23. Third tinning pad; 24. Fourth tinning pad; 31. First pin assembly; 32. Second pin assembly; 33. Third pin assembly; 34. Fourth pin assembly; 41. Upper part; 42. Lower part; L1. First long side; L2. Second long side; H1. Horizontal spacing; H2. Vertical spacing. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0034] It should also be understood that the terms used in the utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in the utility model specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0035] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0036] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 A first schematic diagram of a circuit board provided in an embodiment of the utility model; Figure 2 A second schematic diagram of a circuit board provided in an embodiment of the utility model; Figure 3 The third schematic diagram of the circuit board provided by the embodiment of the utility model. Figure 1 , Figure 2 and Figure 3 As shown, the utility model proposes a circuit board 10 with a tin-drag pad, which includes: a substrate 11, a chip 12, a first tin-drag pad 21, a second tin-drag pad 22, a third tin-drag pad 23 and a fourth tin-drag pad 24; the chip 12 is arranged on the upper end surface of the substrate 11, and the chip 12 is a rectangular sheet structure; a first pin assembly 31, a second pin assembly 32, a third pin assembly 33 and a fourth pin assembly 34 are parallel to the peripheral side of the chip 12 and arranged in sequence in a clockwise direction; the long axis direction of the first pin assembly 31 is perpendicular to the long axis direction of the second pin assembly 32 and the fourth pin assembly 34, and the long axis direction of the third pin assembly 33 is perpendicular to the long axis direction of the second pin assembly 32 and the fourth pin assembly 34; the chip 12 is connected to the substrate 11 through the first pin assembly 31, the second pin assembly 32, the third pin assembly 33 and the fourth pin assembly 34. The component 33 and the fourth pin component 34 are connected to the substrate 11; the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are arranged in sequence at the four vertex corners of the substrate 11; the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all rectangular or irregular sheet structures; the first tin-drag pad 21 is arranged in parallel between the fourth pin component 34 and the first pin component 31, the second tin-drag pad 22 is arranged in parallel between the first pin component 31 and the second pin component 32, the third tin-drag pad 23 is arranged in parallel between the second pin component 32 and the third pin component 33, and the fourth tin-drag pad 24 is arranged in parallel between the third pin component 33 and the fourth pin component 34.

[0037] In this embodiment, the circuit board 10 includes a substrate 11, a chip 12, a first tin-drag pad 21, a second tin-drag pad 22, a third tin-drag pad 23 and a fourth tin-drag pad 24; the chip 12 is arranged on the upper end surface of the substrate 11, and the chip 12 is a rectangular sheet structure. Preferably, the chip 12 is a square sheet structure; a first pin assembly 31, a second pin assembly 32, a third pin assembly 33 and a fourth pin assembly 34 are parallel to the peripheral side of the chip 12 and arranged in sequence in a clockwise direction; the long axis direction of the first pin assembly 31 is perpendicular to the long axis direction of the second pin assembly 32 and the fourth pin assembly 34, and the long axis direction of the third pin assembly 33 is perpendicular to the long axis direction of the second pin assembly 32 and the fourth pin assembly 34; the chip 12 is connected to the substrate 11 through the first pin assembly 31, the second pin assembly 32, the third pin assembly 33 and the fourth pin assembly 34. The pin assembly 33 and the fourth pin assembly 34 are connected to the substrate 11; the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are sequentially arranged at the four vertex corners of the substrate 11; the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all rectangular or irregular sheet structures; the first tin-drag pad 21 is arranged in parallel between the fourth pin assembly 34 and the first pin assembly 31, the second tin-drag pad 22 is arranged in parallel between the first pin assembly 31 and the second pin assembly 32, the third tin-drag pad 23 is arranged in parallel between the second pin assembly 32 and the third pin assembly 33, and the fourth tin-drag pad 24 is arranged in parallel between the third pin assembly 33 and the fourth pin assembly 34.The long axis direction of the first pin assembly 31 is perpendicular to the long axis directions of the second pin assembly 32 and the fourth pin assembly 34, and the long axis direction of the third pin assembly 33 is perpendicular to the long axis directions of the second pin assembly 32 and the fourth pin assembly 34; the chip 12 is connected to the substrate 11 through the first pin assembly 31, the second pin assembly 32, the third pin assembly 33 and the fourth pin assembly 34; the first tinning pad 21, the second tinning pad 22, the third tinning pad 23 and the fourth tinning pad 24 are sequentially arranged at the four vertex corners of the substrate 11; The first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all rectangular or irregular sheet structures; the first tin-drag pad 21 is arranged in parallel between the fourth pin assembly 34 and the first pin assembly 31, the second tin-drag pad 22 is arranged in parallel between the first pin assembly 31 and the second pin assembly 32, the third tin-drag pad 23 is arranged in parallel between the second pin assembly 32 and the third pin assembly 33, and the fourth tin-drag pad 24 is arranged in parallel between the third pin assembly 33 and the fourth pin assembly 34.

[0038] In one embodiment, if Figure 1 As shown, the first tin-drag pad 21 , the second tin-drag pad 22 , the third tin-drag pad 23 and the fourth tin-drag pad 24 are all rectangular sheet structures.

[0039] In this embodiment, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all rectangular sheet structures; preferably, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all square structures.

[0040] In one embodiment, if Figure 1 and Figure 3 As shown, the first tin-drag pad 21 , the second tin-drag pad 22 , the third tin-drag pad 23 and the fourth tin-drag pad 24 are all right-angled triangle sheet structures.

[0041] In this embodiment, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all right-angled triangle sheet structures; further, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all isosceles right-angled triangle sheet structures; wherein, one right-angled side of a tin-drag pad faces an adjacent pin component, and the other right-angled side faces another adjacent pin component.

[0042] In one embodiment, if Figure 1 and Figure 2 As shown, the first tin-drag pad 21 , the second tin-drag pad 22 , the third tin-drag pad 23 and the fourth tin-drag pad 24 are all L-shaped sheet structures.

[0043] In this embodiment, the size and position of the tin-drag pad are pre-set according to the QFN package size, and the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all L-shaped sheet structures.

[0044] In one embodiment, if Figure 1 As shown, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 all include a first long side L1 and a second long side L2; the ratio of the horizontal spacing H1 of the first long side L1 to the vertical spacing H2 of the second long side L2 is 1:1; the horizontal spacing H1 of the first long side L1 is the spacing between the first long side L1 and the adjacent pin assembly in the horizontal direction, and the vertical spacing H2 of the second long side L2 is the spacing between the second long side L2 and the adjacent pin assembly in the vertical direction.

[0045] In this embodiment, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 all include a first long side L1 and a second long side L2; the ratio of the horizontal spacing H1 of the first long side L1 to the vertical spacing H2 of the second long side L2 is 1:1, which can effectively avoid the occurrence of bridging during SMT soldering and cause short circuit or damage to the circuit board, thereby improving the soldering efficiency of the circuit board; the horizontal spacing H1 of the first long side L1 is the spacing between the first long side L1 and the adjacent pin assembly in the horizontal direction, and the vertical spacing H2 of the second long side L2 is the spacing between the second long side L2 and the adjacent pin assembly in the vertical direction.

[0046] In one embodiment, if Figure 1 As shown, the horizontal spacing H1 of the first long side L1 and the vertical spacing H2 of the second long side L2 are within a range of 0.25 MM to 0.60 MM.

[0047] In this embodiment, the horizontal spacing H1 of the first long side L1 and the vertical spacing H2 of the second long side L2 are within the range of 0.25MM to 0.60MM; preferably, the horizontal spacing H1 of the first long side L1 and the vertical spacing H2 of the second long side L2 are within the range of 0.35MM to 0.50MM; more preferably, the horizontal spacing H1 of the first long side L1 and the vertical spacing H2 of the second long side L2 are both 0.41MM.

[0048] In one embodiment, if Figure 1As shown, the length of the first long side L1 is equal to the length of the second long side L2; the length of the first long side L1 and the length of the second long side L2 are within a range of 0.50 MM to 0.90 MM.

[0049] In this embodiment, the length of the first long side L1 is equal to the length of the second long side L2; the length of the first long side L1 and the length of the second long side L2 are within the range of 0.50MM to 0.90MM; preferably, the length of the first long side L1 and the length of the second long side L2 are both 0.71MM.

[0050] In one embodiment, if Figure 1 and Figure 2 As shown, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 all include an upper part, a connecting part and a lower part; the long axis direction of the upper part is perpendicular to the vertical direction of the lower part, and the length of the upper part is equal to the length of the lower part; the length of the upper part and the length of the lower part are within 0.20MM~0.70MM.

[0051] In this embodiment, when the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 are all L-shaped sheet structures, the first tin-drag pad 21, the second tin-drag pad 22, the third tin-drag pad 23 and the fourth tin-drag pad 24 all include an upper part 41, a connecting part and a lower part 42; the long axis direction of the upper part is perpendicular to the vertical direction of the lower part, and the length of the upper part is equal to the length of the lower part; the length of the upper part and the length of the lower part are within 0.20MM~0.70MM; preferably, the length of the upper part and the length of the lower part are both 0.46MM.

[0052] In one embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the first pin assembly 31, the second pin assembly 32, the third pin assembly 33 and the fourth pin assembly 34 are all composed of a plurality of pins parallel to each other.

[0053] In this embodiment, the first pin assembly 31, the second pin assembly 32, the third pin assembly 33 and the fourth pin assembly 34 are all composed of a plurality of pins parallel to each other, and the pins can be made of copper pins or tinned copper clad steel wires.

[0054] In one embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the pin is a rectangular sheet structure.

[0055] In this embodiment, the pins are rectangular sheet structures and can play a connecting role.

[0056] The utility model discloses a circuit board with a tin-drag pad, which comprises: a substrate, a chip, a first tin-drag pad, a second tin-drag pad, a third tin-drag pad and a fourth tin-drag pad; the chip is arranged on the upper end surface of the substrate, and the chip is a rectangular sheet structure; a first pin assembly, a second pin assembly, a third pin assembly and a fourth pin assembly are parallel to the peripheral side of the chip and arranged in sequence along the clockwise direction; the long axis direction of the first pin assembly is perpendicular to the long axis direction of the second pin assembly and the fourth pin assembly, and the long axis direction of the third pin assembly is perpendicular to the long axis direction of the second pin assembly and the fourth pin assembly; the chip is connected to the substrate through the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly. and the fourth pin assembly is connected to the substrate; the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are sequentially arranged at the four vertex corners of the substrate; the first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular or irregular sheet structures; the first tin-drag pad is arranged in parallel between the fourth pin assembly and the first pin assembly, the second tin-drag pad is arranged in parallel between the first pin assembly and the second pin assembly, the third tin-drag pad is arranged in parallel between the second pin assembly and the third pin assembly, and the fourth tin-drag pad is arranged in parallel between the third pin assembly and the fourth pin assembly. The utility model can effectively avoid short circuit or damage to the circuit board caused by bridging tin during SMT welding by arranging tin-drag pads at the four vertex corners of the substrate, and can effectively improve the welding efficiency of the circuit board.

[0057] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A circuit board with a tin-drag pad, characterized in that: The circuit board comprises: a substrate, a chip, a first tinning pad, a second tinning pad, a third tinning pad and a fourth tinning pad; The chip is arranged on the upper end surface of the substrate, and the chip is a rectangular sheet structure; A first pin assembly, a second pin assembly, a third pin assembly and a fourth pin assembly are arranged in a clockwise direction in parallel with the peripheral side of the chip; the long axis direction of the first pin assembly is perpendicular to the long axis directions of the second pin assembly and the fourth pin assembly, and the long axis direction of the third pin assembly is perpendicular to the long axis directions of the second pin assembly and the fourth pin assembly; The chip is connected to the substrate through the first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly; The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are sequentially arranged at four vertex corners of the substrate; The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular or irregular sheet structures; The first tin-drag pad is arranged in parallel between the fourth pin assembly and the first pin assembly, the second tin-drag pad is arranged in parallel between the first pin assembly and the second pin assembly, the third tin-drag pad is arranged in parallel between the second pin assembly and the third pin assembly, and the fourth tin-drag pad is arranged in parallel between the third pin assembly and the fourth pin assembly.

2. The circuit board with tin-drag pad according to claim 1, characterized in that: The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all rectangular sheet structures.

3. The circuit board with tin-drag pad according to claim 1, characterized in that: The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all right-angled triangle sheet structures.

4. The circuit board with tin-drag pad according to claim 1, characterized in that: The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad are all L-shaped sheet structures.

5. The circuit board with tin-drag pad according to claim 1, characterized in that: The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad all include a first long side and a second long side; The ratio of the horizontal spacing of the first long side to the vertical spacing of the second long side is 1:1; The horizontal spacing of the first long side is the spacing between the first long side and the adjacent pin assembly in the horizontal direction, and the vertical spacing of the second long side is the spacing between the second long side and the adjacent pin assembly in the vertical direction.

6. The circuit board with tin-drag pad according to claim 5, characterized in that: The horizontal spacing of the first long sides and the vertical spacing of the second long sides are within a range of 0.25 MM to 0.60 MM.

7. The circuit board with tin-drag pad according to claim 5, characterized in that: The length of the first long side is equal to the length of the second long side; The length of the first long side and the length of the second long side are within a range of 0.50 MM to 0.90 MM.

8. The circuit board with tin-drag pad according to claim 3, characterized in that: The first tin-drag pad, the second tin-drag pad, the third tin-drag pad and the fourth tin-drag pad each include an upper portion, a connecting portion and a lower portion; The long axis direction of the upper part is perpendicular to the vertical direction of the lower part, and the length of the upper part is equal to the length of the lower part; the length of the upper part and the length of the lower part are within 0.20MM to 0.70MM.

9. The circuit board with tin-drag pad according to claim 1, characterized in that: The first pin assembly, the second pin assembly, the third pin assembly and the fourth pin assembly are all composed of a plurality of pins parallel to each other.

10. The circuit board with tin-drag pad according to claim 9, characterized in that: The pin is a rectangular sheet structure.

Images