Circuit board dry film residue squeezing processing device

Abstract

The utility model discloses a circuit board dry film residue squeezing processing device. Comprising a rack, a supporting platform arranged on the rack, a sliding rail arranged on the supporting platform, a film residue storage box slidably connected with the sliding rail, a push-pull device connected with the film residue storage box and used for pushing and pulling the film residue storage box, and an extrusion device arranged on the rack and used for extruding film residues in the film residue storage box. A liquid outlet is formed in the bottom of the film residue containing box and connected with the waste liquid collecting tank. According to the circuit board dry film residue squeezing treatment device, the film residues are treated in a mechanical squeezing mode, the treatment efficiency is high, the dehydration effect is good, the film residues are convenient to transport, and the transportation cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a circuit board dry film residue squeezing treatment device. Background Art

[0002] Dry film is an important material in the manufacturing process of circuit boards. It is generally composed of polyethylene film, polyester film, and photoresist layer. The polyethylene film is the surface covering layer, which plays a protective role on the photosensitive adhesive layer. The polyester film is the support of the photoresist layer, which makes it coated into a film. After the polyester film is irradiated by the ultraviolet light source of the exposure machine, a polymerization reaction occurs to form a substance attached to the board surface, which can prevent the erosion of chemical solutions and become a barrier between the circuit and the copper surface and the chemical solutions.

[0003] Commonly used production processes for circuit boards include positive film processes and negative film processes. Both processes require that the film in the unexposed area be stripped off with sodium hydroxide chemical solution before etching and then discarded. Dry film residue is generally semi-solid, with a moisture content of up to 60%-100%. Since dry film residue is strongly alkaline, has high COD, and contains resins and other harmful substances, it is a hazardous waste controlled by the state and must be handled by a qualified hazardous waste treatment agency.

[0004] At present, the treatment method of dry film residue is: in the production process of circuit boards, the dry film residue after peeling is usually directly packed up and placed outdoors, exposed to the sun or naturally dried to remove the moisture in the waste film residue, and then collected and handed over to hazardous waste treatment agencies for treatment. This treatment method has the following problems:

[0005] 1. Because circuit board manufacturers continuously produce film slag every day, especially large PCB manufacturers, the film slag waste is produced by tons. It is impossible to remove all the moisture in the film slag by sun exposure or natural air drying, and the subsequent treatment cost is high;

[0006] 2. Because the treated film residue contains moisture, exposure to sunlight or natural air drying will pollute the environment, and the evaporation of moisture will also cause air pollution;

[0007] 3. Water leakage during transportation will also cause environmental pollution.

[0008] In view of this, it is necessary to provide a new device to solve the above technical problems. Utility Model Content

[0009] The technical problem to be solved by the utility model is to provide a circuit board dry film residue squeezing processing device, which adopts a mechanical extrusion method to process the film residue, has high processing efficiency, good dehydration effect, facilitates the transportation of the film residue, and reduces transportation costs.

[0010] The technical solution of the utility model is as follows:

[0011] A circuit board dry film residue squeezing and processing device comprises a frame, a supporting platform arranged on the frame, a slide rail arranged on the supporting platform, a film residue storage box slidably connected to the slide rail, a push-pull device connected to the film residue storage box and used for pushing and pulling the film residue storage box, and a squeezing device arranged on the frame for squeezing the film residue in the film residue storage box; a drain port is provided at the bottom of the film residue storage box, and the drain port is connected to a waste liquid collection tank.

[0012] Furthermore, the extrusion device includes a pressure providing device and an extrusion plate connected to the pressure providing device. When working, the extrusion plate covers the surface of the film residue filled in the film residue storage box.

[0013] Furthermore, the pressure providing device is a hydraulic device.

[0014] Furthermore, the slide rail extends outside the support platform.

[0015] Furthermore, the slide rail includes two baffles arranged at intervals, a limit plate formed by bending and extending inward from the top of the baffle, and a support block arranged at the bottom of the baffle for supporting the film residue storage box, and the film residue storage box slides in the area enclosed by the support block, the baffle and the limit plate.

[0016] Furthermore, the slide rail also includes an end plate connected to one end of the baffle, and the push-pull device includes a power device and a first push-pull rod connected to the power device, and the first push-pull rod passes through the end plate and is connected to the film residue storage box.

[0017] Furthermore, the first push-pull rod passes through the end plate and is detachably connected to the film residue storage box.

[0018] Furthermore, the film residue storage box includes a box body, a discharge port arranged at the bottom of the box body, a sealing plate that passes through one side of the box body and is slidable for sealing or opening the discharge port, and a second push-pull rod arranged at the end of the sealing plate;

[0019] Applying an outward pulling force to the second push-pull rod causes the sealing plate to slide outward and the material outlet to open; applying an inward pushing force to the second push-pull rod causes the sealing plate to slide inward and seal the material outlet.

[0020] Furthermore, it also includes a level sensor for detecting the amount of film residue in the film residue storage box, and a controller, the level sensor is electrically connected to the controller, and the controller is used to control the working state of the extrusion device.

[0021] Compared with the prior art, the circuit board dry film residue squeezing treatment device provided by the utility model has the following beneficial effects:

[0022] 1. The circuit board dry film residue squeezing and processing device provided by the utility model adopts an extrusion device to squeeze and dehydrate the film residue collected in the film residue storage box, which has the characteristics of high processing efficiency and good dehydration effect. The solid film residue after dehydration is extruded and formed, which is convenient for collection and transportation, and the formed solid film residue saves transportation space and reduces transportation costs. The use of the processing device of the utility model can reduce the pollution of the atmosphere caused by the air drying of the film residue in the prior art, as well as the environmental pollution caused by water leakage during transportation.

[0023] Second, the circuit board dry film residue squeezing and processing device provided by the utility model adopts a push-pull device to drive the film residue storage box to slide along the slide rail. When the level sensor detects that the film residue in the film residue storage box has collected a certain amount, the push-pull device works to pull the film residue storage box to the working position, and the controller controls the squeezing device to work. The squeezing device mechanically squeezes the film residue in the film residue storage box to dehydrate the film residue and form solid film residue. The circuit board dry film residue squeezing and processing device of the utility model is an automatic processing device with high working efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a structural schematic diagram of a circuit board dry film residue squeezing and processing device of the utility model;

[0026] Figure 2 yes Figure 1 A schematic diagram of another angle of the circuit board dry film residue squeezing treatment device shown;

[0027] Figure 3 yes Figure 1 A schematic diagram of one state of a film residue storage box in a circuit board dry film residue squeezing and processing device is shown;

[0028] Figure 4 yes Figure 1 A schematic diagram of another state of the film residue storage box in the circuit board dry film residue squeezing and processing device shown;

[0029] Figure 5 yes Figure 3 A schematic diagram of the film residue storage box shown from another angle. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are further described below.

[0031] It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as there is no conflict between them.

[0032] Please refer to Figure 1 and Figure 2 ,in Figure 1 It is a structural schematic diagram of a circuit board dry film residue squeezing and processing device of the utility model. Figure 2 yes Figure 1 The schematic diagram of the circuit board dry film residue squeezing and processing device shown in another angle. The circuit board dry film residue squeezing and processing device of the utility model comprises a frame 1, a support platform 2 arranged on the frame 1, a slide rail 3 arranged on the support platform, a film residue storage box 4 slidably connected to the slide rail 3, a push-pull device 5 connected to the film residue storage box, and an extrusion device 6 arranged on the frame. Among them, the push-pull device 5 is used to apply a force to the film residue storage box to make it slide along the extension direction of the slide rail 3, so as to facilitate the filling of film residue into the film residue storage box, or to take out the dry film residue after squeezing; the extrusion device 6 is used to mechanically squeeze the film residue in the film residue storage box to remove the moisture of the film residue.

[0033] In the utility model, the slide rail 3 preferably extends to the outside of the support platform 2, so that the film residue storage box 4 can slide to the outside of the support platform, which is convenient for filling the film residue and taking it out after processing. When working, the film residue storage box 4 is first pushed to the outside of the support platform by the push-pull device 5. Since there is no obstruction above the film residue storage box, it is convenient for the film residue storage box to collect film residues. When the amount of film residue collected in the film residue storage box reaches a certain amount, the film residue storage box is pulled to the working position by the push-pull device 5, that is, located below the extrusion device 6, and the film residue is extruded by the extrusion device 6. After the extrusion is completed, the push-pull device 5 is started again, so that the film residue storage box slides along the slide rail to the outside of the support platform again, and the film residue formed in the film residue storage box can be taken out.

[0034] In the process of the film residue storage box 4 sliding along the slide rail 3, in order to prevent the film residue storage box from being misplaced or tipped over, the slide rail 3 is preferably designed to have a limiting structure. Specifically, the slide rail 3 includes two baffles 31 arranged at intervals, a limiting plate 32 formed by bending and extending inward from the top of the baffle 31, and a support block 33 provided at the bottom of the baffle 31 for supporting the film residue storage box. The film residue storage box 4 slides in the area enclosed by the support block, the baffle and the limiting plate. Among them, the support block 33 can be a split structure, that is, it consists of two parts, which are respectively connected to the bottom of the corresponding baffle.

[0035] Please refer to Figure 3-Figure 5 ,in Figure 3 yes Figure 1 A schematic diagram of one state of a film residue storage box in a circuit board dry film residue squeezing and processing device is shown; Figure 4 yes Figure 1 A schematic diagram of another state of the film residue storage box in the circuit board dry film residue squeezing and processing device shown; Figure 5 yes Figure 3 The schematic diagram of the film residue storage box from another angle is shown. The film residue storage box 4 is used to fill the film residue, and it is an open structure. The film residue storage box 4 includes a box body 41, a discharge port 42 arranged at the bottom of the box body, a sealing plate 43 that passes through one side of the box body and can slide, and a second push-pull rod 44 arranged at the end of the sealing plate. When an outward pulling force is applied to the second push-pull rod 44, the sealing plate 43 slides outward, and the discharge port 42 is opened for film residue unloading. At this time, the film residue falls from the discharge port, as shown in FIG. Figure 4 Applying an inward thrust to the second push-pull rod 44, the sealing plate 43 slides inward to seal the discharge port 42, as shown Figure 3 As shown, the extrusion device 6 can apply pressure to squeeze out the moisture of the film residue. During the extrusion process, the film residue is separated into dry and wet parts, so it is necessary to discharge the moisture separated from the film residue in time. Correspondingly, a drain port (not shown) is provided at the bottom of the film residue storage box 4, and the drain port is connected to the waste liquid collection tank to quickly discharge the generated liquid. In the utility model, when there is no discharge port at the bottom of the film residue storage box 4, the film residue can be removed by a device such as a manipulator.

[0036] The push-pull device 5 includes a first push-pull rod 51, one end of which is connected to the film residue storage box, and the connection mode can be a fixed connection or a detachable connection. In order to improve the stability of the push-pull device, in this embodiment, the slide rail 3 also includes an end plate 34 connected to one end of the baffle, and the first push-pull rod 51 passes through the end plate 34. At this time, the end plate 34 serves as a support member for the first push-pull rod 51 to keep the push-pull rod running smoothly. In this embodiment, the first push-pull rod can be driven by a power device (not shown) so that the movement of the film residue storage box along the slide rail can be automatically controlled. Correspondingly, the power device can be a motor or a hydraulic device.

[0037] The extrusion device 6 includes a pressure providing device 61 and an extrusion plate 62 connected to the pressure providing device 61. When working, the extrusion plate 62 covers the surface of the film residue filled in the film residue storage box, wherein the pressure providing device 61 is a hydraulic device. The hydraulic pressure, extrusion time and other parameters of the pressure providing device 61 are adjustable.

[0038] In order to improve the degree of automation of the circuit board dry film residue squeezing and processing device of the utility model, preferably, a level sensor (not shown) is set on the frame, and the extrusion device and the push-pull device are automatically controlled by the controller. Among them, the level sensor is used to detect the amount of film residue in the film residue storage box, and send the detection signal to the controller. When the detected film residue filling amount reaches the set value, the push-pull device 5 works to pull the film residue storage box to the working position. When the film residue storage box is in place, the controller controls the extrusion device to work. Under the action of the pressure providing device, the extrusion plate applies pressure to the film residue to achieve solid-liquid separation. The stop action of the extrusion device can be controlled by setting the extrusion time. After the extrusion work is completed, the pressure providing device drives the extrusion plate to reset, and the push-pull device pushes the film residue storage box to slide along the slide rail and slide to the outside of the support platform, and applies an outward pulling force to the second push-pull rod to make the sealing plate slide outward, and the discharge port of the film residue storage box is opened. The film residue after squeezing automatically falls off, completing a cycle.

[0039] In addition to using level sensors to detect the amount of film slag, the actions of the push-pull device and the extrusion device can also be manually controlled through human observation.

[0040] The above is a detailed description of the embodiments of the present invention, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principle and spirit of the present invention still fall within the scope of protection of the present invention.

Claims

1. A circuit board dry film residue squeezing treatment device, characterized in that: It includes a frame, a supporting platform arranged on the frame, a slide rail arranged on the supporting platform, a film residue storage box slidably connected to the slide rail, a push-pull device connected to the film residue storage box and used for pushing and pulling the film residue storage box, and a squeezing device arranged on the frame for squeezing the film residue in the film residue storage box; a drain port is provided at the bottom of the film residue storage box, and the drain port is connected to a waste liquid collection tank.

2. The circuit board dry film residue squeezing treatment device according to claim 1, characterized in that: The extrusion device comprises a pressure providing device and an extrusion plate connected to the pressure providing device. When working, the extrusion plate covers the surface of the film residue filled in the film residue storage box.

3. The circuit board dry film residue squeezing treatment device according to claim 2, characterized in that: The pressure providing device is a hydraulic device.

4. The circuit board dry film residue squeezing treatment device according to claim 1, characterized in that: The slide rail extends outside the support platform.

5. The circuit board dry film residue squeezing treatment device according to claim 4, characterized in that: The slide rail includes two baffles arranged at intervals, a limit plate formed by bending and extending inward from the top of the baffle, and a support block arranged at the bottom of the baffle for supporting the film residue storage box. The film residue storage box slides in an area enclosed by the support block, the baffle and the limit plate.

6. The circuit board dry film residue squeezing treatment device according to claim 5, characterized in that: The slide rail also includes an end plate connected to one end of the baffle, and the push-pull device includes a power device and a first push-pull rod connected to the power device, and the first push-pull rod passes through the end plate and is connected to the film residue storage box.

7. The circuit board dry film residue squeezing treatment device according to claim 6, characterized in that: The first push-pull rod passes through the end plate and is detachably connected to the film residue storage box.

8. The circuit board dry film residue squeezing treatment device according to any one of claims 1 to 7, characterized in that: The film residue storage box comprises a box body, a discharge port arranged at the bottom of the box body, a sealing plate passing through one side of the box body and slidable for sealing or opening the discharge port, and a second push-pull rod arranged at the end of the sealing plate; Applying an outward pulling force to the second push-pull rod, the sealing plate slides outward, and the discharge port opens; An inward thrust is applied to the second push-pull rod, and the sealing plate slides inward to seal the discharge port.

9. The circuit board dry film residue squeezing treatment device according to claim 1, characterized in that: It also includes a level sensor for detecting the amount of film residue in the film residue storage box, and a controller. The level sensor is electrically connected to the controller, and the controller is used to control the working state of the extrusion device.

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