Plastic pin for bonding crystal

Abstract

The utility model provides a plastic pin for bonding a crystal. The plastic pin comprises a plastic pin seat, a plurality of first plastic heads, a plurality of second plastic heads and a plastic pin handle, the first rubber heads are arranged on the rubber needle seat. The second rubber heads are arranged on the rubber needle seat. The plastic needle handle is connected to the plastic needle seat. Wherein the plastic needle seat is arranged between the plastic needle handle and the first plastic heads and the second plastic heads. Wherein the sizes of the first rubber heads are different from those of the second rubber heads. According to the utility model, the two different plastic pins are arranged on the same plastic pin seat to simultaneously coat the glue on the glue coating points with different specifications, so that the crystal bonding operation can be effectively carried out, the working hours consumed by the crystal bonding operation are reduced, the utilization rate of a machine is improved, the investment cost of equipment is reduced, and the productivity is improved.

Description

Technical Field

[0001] The utility model relates to a glue needle, in particular to a glue needle used for crystal bonding. Background Art

[0002] The die bonding process has gradually gained attention because its efficiency is crucial to the production capacity of the final product. In recent years, automated equipment has been widely used to replace traditional manual operations to improve operating efficiency. However, despite a certain degree of improvement, the industry is still not satisfied with this.

[0003] Existing glue needles face challenges such as high die bonding time, high equipment investment costs, low machine utilization, low production capacity, and inefficient die bonding operations. In order to further improve the efficiency and quality of the die bonding process, we are currently actively improving the glue needles. Utility Model Content

[0004] The utility model provides a glue needle, which is helpful to solve the problems of the existing glue needles.

[0005] The glue needle disclosed in the utility model comprises: a glue needle seat, a plurality of first glue heads, a plurality of second glue heads and a glue needle handle. The first glue heads are arranged on the glue needle seat. The second glue heads are arranged on the glue needle seat. The glue needle handle is connected to the glue needle seat. The glue needle seat is arranged between the glue needle handle and the first glue heads and the second glue heads. The sizes of the first glue heads are different from the sizes of the second glue heads.

[0006] According to the glue needle disclosed in the utility model, two different glue needles are arranged on the same glue needle seat to simultaneously apply glue to glue points of different specifications, so that the die bonding operation can be carried out efficiently, the working hours of the die bonding operation can be reduced, the machine utilization rate can be improved, the equipment investment cost can be reduced, and the production capacity can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a three-dimensional schematic diagram of a glue needle according to an embodiment of the utility model.

[0008] Figure 2 for Figure 1 A partial enlarged schematic diagram of the glue needle.

[0009] Figure 3 for Figure 2 Schematic side view of the glue needle.

[0010] Figure 4 for Figure 1 Schematic diagram of the glue needle during positioning.

[0011] [Description of Reference Numerals]

[0012] 100: Glue needle

[0013] 110: Glue needle seat

[0014] 120: First rubber head

[0015] 130: Second rubber head

[0016] 140: Glue needle handle

[0017] D1,D2,MD: distance

[0018] FD: First Direction

[0019] GP1: First specification glue point

[0020] GP2: Second specification glue point

[0021] PCB: Printed Circuit Board DETAILED DESCRIPTION

[0022] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient for ordinary technicians in the field to understand the technical content of the present invention and implement it accordingly. According to the contents disclosed in this specification, the claims and the drawings, ordinary technicians in the field can easily understand the relevant purposes and advantages of the present invention. The following examples are to further explain the viewpoints of the present invention in detail, but are not intended to limit the scope of the present invention in any way.

[0023] The existing die bonding operation mode is: one type of electronic component die bonding operation is matched with one type of glue needle, that is, different types of glue needles are used to apply glue independently. When a product requires more die bonding, the die bonding operation will take more time, resulting in low machine utilization, low production capacity and inefficient die bonding operation. Furthermore, the procurement cycle of this type of die bonding machine is long and the equipment investment cost is huge.

[0024] According to one embodiment of the utility model, the glue needle includes: a glue needle seat, three first glue heads, six second glue heads and a glue needle handle. These first glue heads are arranged on the glue needle seat along a first direction, and these second glue heads are arranged on the glue needle seat in a 2×3 matrix, and the first direction is the long side direction of the 2×3 matrix. The glue needle handle is connected to the glue needle seat. The glue needle seat is arranged between the glue needle handle and the first glue heads and the second glue heads. The minimum distance between the first glue heads and the second glue heads can be 0.075 mm. The shape of the first glue heads is a rectangular cylinder, and the shape of the second glue heads is a rectangular cylinder. The first glue heads are located on one side of the second glue heads.

[0025] Some or all of the technical features disclosed in the embodiments of the present utility model may be configured in combination to achieve corresponding effects.

[0026] Please refer to Figures 1 to 3 , Figure 1 is a three-dimensional schematic diagram of a glue needle according to an embodiment of the utility model. Figure 2 for Figure 1 A partial enlarged schematic diagram of the glue needle, and Figure 3 for Figure 2 Schematic side view of the glue needle.

[0027] The glue needle 100 may include a glue needle seat 110 , three first glue heads 120 , six second glue heads 130 and a glue needle handle 140 .

[0028] The first glue head 120 may be disposed on the glue needle seat 110 , the second glue head 130 may be disposed on the glue needle seat 110 , and the glue needle handle 140 may be connected to the glue needle seat 110 .

[0029] Specifically, the first glue heads 120 may be disposed on the glue needle holder 110 along the first direction FD, and the second glue heads 130 may be disposed on the glue needle holder 110 in a 2×3 matrix, and the first direction FD may be the long side direction of the 2×3 matrix. The glue needle holder 110 may be disposed between the glue needle handle 140 and the first glue heads 120 and the second glue heads 130. The first glue heads 120 may be located on one side of the second glue heads 130.

[0030] In this embodiment, the first adhesive head 120 and the second adhesive head 130 can be applied to die bonding operations of different types of electronic components. Specifically, the first adhesive heads 120 can be photodiode adhesive heads, which are applied to, for example, die bonding operations of bonding a photodiode array (PD array) to a circuit board. The second adhesive heads 130 can be transimpedance amplifier adhesive heads, which are applied to, for example, die bonding operations of bonding a transimpedance amplifier (TIA) to a circuit board, but are not limited thereto.

[0031] In this embodiment, the first adhesive heads 120 may be in the shape of a rectangular column, and the second adhesive heads 130 may be in the shape of a rectangular column, but the shapes of the adhesive heads are not limited thereto.

[0032] In this embodiment, the size of the first glue heads 120 may be different from the size of the second glue heads 130, but the size of the glue heads is not limited thereto. For example, the size of the glue heads may be changed according to the required glue application points.

[0033] In this embodiment, the distance D1 between two adjacent first glue heads 120 may be smaller than the distance D2 between two adjacent second glue heads 130, but the distance between two adjacent glue heads is not limited thereto. For example, the distance between two adjacent glue heads may be changed according to the required glue application points.

[0034] In the present embodiment, the minimum distance MD between these first glue heads 120 and these second glue heads 130 may be between 0.050 mm and 0.100 mm. In detail, the minimum distance MD between these first glue heads 120 and these second glue heads 130 may be 0.075 mm, but the minimum distance between these glue heads is not limited thereto. For example, the minimum distance between these glue heads may be changed according to the required glue application point. The minimum distance MD between these first glue heads 120 and these second glue heads 130 may match the minimum distance between the photodiode array and the transimpedance amplifier, and further may match the minimum distance between the photodiode array and the transimpedance amplifier after they are bonded to the circuit board. Here, the "matching" may refer to the minimum distance MD being substantially equal to the distance between the glue application point of the photodiode array closest to the transimpedance amplifier and the glue application point of the transimpedance amplifier closest to the photodiode array.

[0035] The total cross-sectional area of ​​these first glue heads 120 may be smaller than the area of ​​the photodiode array. Further, the area of ​​the photodiode array may refer to the area of ​​the bonding surface used to bond with the circuit board, such as the bottom surface area of ​​the photodiode array. The sum of the cross-sectional areas of the three first glue heads 120 may be smaller than the bonding surface area of ​​the photodiode array. In addition, the total cross-sectional area of ​​these second glue heads 130 may be smaller than the area of ​​the transimpedance amplifier. Further, the area of ​​the transimpedance amplifier may refer to the area of ​​the bonding surface used to bond with the circuit board, such as the bottom surface area of ​​the transimpedance amplifier. The sum of the cross-sectional areas of the six second glue heads 130 may be smaller than the bonding surface area of ​​the transimpedance amplifier.

[0036] Please refer to the schematic diagram of using the glue needle of the utility model Figure 4 . Figure 4 for Figure 1 Schematic diagram of the glue needle during positioning.

[0037] During the die bonding process, the glue needle 100 may first take glue from the glue dispensing tray (not shown) and then position the glue needle 100 (e.g. Figure 4 As shown, the first glue head 120 is then glued to the first specification glue point GP1 on the printed circuit board PCB and the second glue head 130 is glued to the second specification glue point GP2 on the printed circuit board PCB, so as to facilitate the bonding of the PDarray and TIA to the printed circuit board PCB. Thus, the utility model sets two different glue needles on the same glue needle seat to glue the glue points of different specifications at the same time, so that the bonding operation can be carried out efficiently, the working hours spent on the bonding operation can be reduced, the utilization rate of the machine can be improved, and the equipment investment cost can be reduced. In addition, compared with the traditional glue needle, the glue needle of the utility model can increase the production capacity by 20%.

Claims

1. A glue needle for die bonding, characterized in that: Include: A plastic needle holder; A plurality of first glue heads are arranged on the glue needle seat; A plurality of second glue heads are disposed on the glue needle seat; and A glue needle handle connected to the glue needle seat; Wherein, the glue needle seat is arranged between the glue needle handle and the plurality of first glue heads and the plurality of second glue heads; The size of the first plurality of adhesive heads is different from the size of the second plurality of adhesive heads.

2. The adhesive needle for die bonding according to claim 1, characterized in that: The plurality of first rubber heads are photodiode rubber heads, and the plurality of second rubber heads are transimpedance amplifier rubber heads.

3. The adhesive needle for die bonding according to claim 2, characterized in that: The number of the multiple first glue heads is three, the number of the multiple second glue heads is six, the multiple first glue heads are arranged on the glue needle seat along a first direction, and the multiple second glue heads are arranged on the glue needle seat in the form of a 2×3 matrix, and the first direction is the long side direction of the 2×3 matrix.

4. The adhesive needle for die bonding according to claim 3, characterized in that: The distance between two adjacent ones of the plurality of first adhesive heads is smaller than the distance between two adjacent ones of the plurality of second adhesive heads.

5. The adhesive needle for die bonding according to claim 3, characterized in that: The minimum distance between the plurality of first glue heads and the plurality of second glue heads matches the minimum distance between a photodiode array and a transimpedance amplifier.

6. The adhesive needle for die bonding according to claim 3, characterized in that: A minimum distance between the plurality of first glue heads and the plurality of second glue heads is between 0.050 mm and 0.100 mm.

7. The adhesive needle for die bonding according to claim 6, characterized in that: The minimum distance between the plurality of first adhesive heads and the plurality of second adhesive heads is 0.075 mm.

8. The adhesive needle for die bonding according to claim 1, characterized in that: The first plurality of adhesive heads have a rectangular cylindrical shape, and the second plurality of adhesive heads have a rectangular cylindrical shape.

9. The adhesive needle for die bonding according to claim 3, characterized in that: The plurality of first adhesive heads are located on one side of the plurality of second adhesive heads.

10. The adhesive needle for die bonding according to claim 1, characterized in that: The total cross-sectional area of ​​the plurality of first rubber heads is smaller than the area of ​​a photodiode array, and the total cross-sectional area of ​​the plurality of second rubber heads is smaller than the area of ​​a transimpedance amplifier.

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