Semiconductor packaging assembly

Abstract

The utility model discloses a semiconductor packaging assembly which comprises a box body, a clamping groove is arranged in the box body, the lower end of one side in the clamping groove is symmetrically and fixedly connected with fixing seats, one side of each fixing seat is fixedly connected with a spring, one end of each spring is fixedly connected with a first fixing block, and the other end of each spring is fixedly connected with a second fixing block. The outer side of the first fixing block is slidably connected with a second fixing block, and one side of the second fixing block is fixedly connected with a clamping block. During use, through the arrangement of the clamping groove, after the packaging part body is placed into the top of the protective pad in the box body, the cover body is held by hand to be clamped into the clamping groove in the box body, and then the packaging part body is clamped into the clamping groove in the box body; a first fixing block and a second fixing block which are fixed through a fixing base and a spring are clamped in the clamping groove in a sliding mode, and a dustproof film is arranged between the first fixing block and the second fixing block. And during clamping, after the spring subjected to extrusion force loses the extrusion force, the first fixing block is automatically driven to reset, and the clamping effect is completed.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor packaging component. Background Art

[0002] With the high integration, high performance and high speed of semiconductor chips, the requirements for semiconductor packaging technology are getting higher and higher, and miniaturization and large-scale production have become the development trend of semiconductor packaging. The traditional electronic packaging technology of bonding semiconductor chips with other components by wire bonding can no longer meet the current needs, and the flip chip bonding technology of bonding chips with other components by bumps has emerged. As we all know, semiconductor packaging and semiconductor packaging components are devices that use plastic shells to encapsulate and protect independent lenses, which have been widely used in the field of semiconductor packaging.

[0003] Some existing semiconductor packages and semiconductor package components are prone to damage to the semiconductor during the packaging process. After long-term use, dust is easily accumulated in the gaps of the package, which may have an adverse effect on the performance of the chip components, resulting in poor practicality. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the existing defects and provide a semiconductor packaging assembly to solve the problem of some existing semiconductor packages and semiconductor packaging assemblies proposed in the above background technology. The semiconductor packages and semiconductor packaging assemblies are prone to damage the semiconductor during the packaging process. After long-term use, dust is easily stored in the gaps of the packaging, which may have an adverse effect on the performance of the chip assembly, thereby resulting in poor practicality.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor packaging component, comprising a box body and a buffer pad, a snap-fit ​​groove is arranged inside the box body, a fixing seat is symmetrically fixedly connected to the lower end of one side of the snap-fit ​​groove, a spring is fixedly connected to one side of the fixing seat, a first fixing block is fixedly connected to one end of the spring, a second fixing block is slidably connected to the outer side of the first fixing block, a clamping block is fixedly connected to one side of the second fixing block, a sealing gasket is fixedly connected to the top of the box body, a cover body is fixedly connected to the top of the clamping block, a first baffle and a second baffle are symmetrically fixedly connected to the top of the box body, and a package body is slidably connected to the top of the box body.

[0006] Preferably, a dustproof film is slidably connected between the first fixing block and the second fixing block.

[0007] Preferably, two of the engaging grooves and two of the second fixing blocks are symmetrically arranged.

[0008] Preferably, the buffer pad is fixedly connected to one side of the top of the box body.

[0009] Preferably, the sealing gasket is made of soft rubber.

[0010] Preferably, a protective pad is slidably connected between the box body and the packaging body, and a plurality of the protective pads, the first baffle plate and the second baffle plate are symmetrically arranged.

[0011] Preferably, a buffer pad is provided at the lower end of the engaging groove, and the bottom of the buffer pad is fixedly connected to one side of the top of the box body.

[0012] Preferably, the outer surface of the spring is coated with an anti-oxidation layer.

[0013] Compared with the prior art, the present invention provides a semiconductor packaging assembly having the following beneficial effects:

[0014] 1. The utility model provides a locking groove. After the package body is placed on the top of the protective pad in the box body, the cover body is held and locked into the locking groove inside the box body. The first fixed block and the second fixed block fixed by the fixing seat and the spring inside the locking groove are slidably engaged. When the second fixed block slides into the lower end of the locking groove, the spring subjected to the squeezing force during the insertion loses the squeezing force and automatically resets with the first fixed block to complete the locking effect. The first baffle plate and the second baffle plate are fixedly connected inside the box body. The first baffle plate and the second baffle plate cross to form a grid, which is convenient for arranging and storing the package body, and then sealed with the tape on the outside of the box body. The operation is simple and convenient and the protective effect is good.

[0015] 2. The utility model provides a dustproof film between the box body and the engaging groove, which can not only increase the sealing effect, but also achieve a moisture-proof effect.

[0016] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The utility model has a scientific and reasonable structure, is safe and convenient to use, and provides great help to people. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is a schematic diagram of the axial structure of a semiconductor packaging assembly proposed by the utility model;

[0019] Figure 2 A schematic cross-sectional structure diagram of a semiconductor packaging assembly proposed by the utility model;

[0020] Figure 3 A schematic diagram of a vertical cross-sectional structure of a semiconductor packaging assembly proposed by the utility model;

[0021] Figure 4 for Figure 3 A schematic diagram of the enlarged structure at point A;

[0022] In the figure: box body 1, snap-fit ​​groove 2, fixing seat 3, spring 4, first fixing block 5, buffer pad 6, second fixing block 7, clamping block 8, dustproof film 9, sealing pad 10, cover body 11, tape 12, protective pad 13, first baffle 14, second baffle 15, packaging body 16. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4 The utility model provides a technical solution: a semiconductor packaging component, including a box body 1, a snap-fit ​​groove 2 is arranged inside the box body 1, a fixing seat 3 is symmetrically fixedly connected to the lower end of one side of the snap-fit ​​groove 2, a spring 4 is fixedly connected to one side of the fixing seat 3, a first fixing block 5 is fixedly connected to one end of the spring 4, a second fixing block 7 is slidably connected to the outer side of the first fixing block 5, a clamping block 8 is fixedly connected to one side of the second fixing block 7, a sealing gasket 10 is fixedly connected to the top of the box body 1, a cover body 11 is fixedly connected to the top of the clamping block 8, a first baffle 14 and a second baffle 15 are symmetrically fixedly connected to the top of the box body 1, a package body 16 is slidably connected to the top of the box body 1, and when the package body 16 is placed in After the top of the protective pad 13 in the box body 1 is pushed open, the cover body 11 is held and inserted into the locking groove 2 inside the box body 1. The first fixed block 5 and the second fixed block 7 fixed by the fixing seat 3 and the spring 4 inside the locking groove 2 are slidably engaged. When the second fixed block 7 slides into the lower end of the locking groove 2, the spring 4 that is subjected to the squeezing force when being inserted loses the squeezing force and automatically brings the first fixed block 5 to reset, thereby completing the locking effect. The box body 1 is fixedly connected with the first baffle plate 14 and the second baffle plate 15. The first baffle plate 14 and the second baffle plate 15 cross to form a grid, which is convenient for arranging and storing the packaging body 16, and then sealed with the tape 12 on the outside of the box body 1. The operation is simple and convenient and the protective effect is good.

[0025] In the utility model, preferably, a dustproof film 9 is slidably connected between the first fixing block 5 and the second fixing block 7. The dustproof film 9 is added between the box body 1 and the engaging groove 2, which can not only increase the sealing effect, but also have a moisture-proof effect.

[0026] In the present invention, preferably, two engaging grooves 2 and two second fixing blocks 7 are symmetrically arranged.

[0027] In the present invention, preferably, the buffer pad 6 is fixedly connected to one side of the top of the box body 1 .

[0028] In the present invention, preferably, the sealing pad 10 is made of soft rubber material, which has a better sealing effect.

[0029] In the present invention, preferably, a protective pad 13 is slidably connected between the box body 1 and the packaging body 16 , and a plurality of the protective pad 13 , the first baffle 14 and the second baffle 15 are symmetrically arranged.

[0030] In the present invention, preferably, a buffer pad 6 is provided at the lower end of the engaging groove 2 , and the bottom of the buffer pad 6 is fixedly connected to one side of the top of the box body 1 .

[0031] In the present invention, preferably, the outer surface of the spring 4 is coated with an anti-oxidation layer to prevent it from rusting, sticking and other undesirable phenomena due to oxidation after long-term use.

[0032] The working principle and use process of the utility model are as follows: when in use, by setting the locking groove 2, after the packaging body 16 is placed on the top of the protective pad 13 in the box body 1, the cover body 11 is held and locked into the locking groove 2 inside the box body 1, and the first fixed block 5 and the second fixed block 7 fixed by the fixing seat 3 and the spring 4 inside the locking groove 2 are slidably engaged, and a dustproof film 9 is arranged between the first fixed block 5 and the second fixed block 7. When the second fixed block 7 slides into the lower end of the locking groove 2, the spring 4 subjected to the squeezing force when being inserted loses the squeezing force and automatically resets with the first fixed block 5 to complete the locking effect. The first baffle plate 14 and the second baffle plate 15 are fixedly connected inside the box body 1, and the first baffle plate 14 and the second baffle plate 15 cross to form a grid, which is convenient for arranging and storing the packaging body 16, and then the tape 12 on the outside of the box body 1 is used for sealing.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging assembly, comprising a box body (1) and a buffer pad (6), characterized in that: The box body (1) is provided with a snap-fit ​​groove (2) inside, a fixing seat (3) is symmetrically fixedly connected at the lower end of one side inside the snap-fit ​​groove (2), a spring (4) is fixedly connected to one side of the fixing seat (3), one end of the spring (4) is fixedly connected to a first fixing block (5), a second fixing block (7) is slidably connected to the outer side of the first fixing block (5), a clamping block (8) is fixedly connected to one side of the second fixing block (7), a sealing gasket (10) is fixedly connected to the top of the box body (1), a cover body (11) is fixedly connected to the top of the clamping block (8), a first baffle (14) and a second baffle (15) are symmetrically fixedly connected to the top of the box body (1), and a packaging body (16) is slidably connected to the top of the box body (1).

2. A semiconductor package assembly according to claim 1, characterized in that: A dustproof film (9) is slidably connected between the first fixing block (5) and the second fixing block (7).

3. The semiconductor package assembly according to claim 1, characterized in that: The engaging grooves (2) and the second fixing blocks (7) are both symmetrically arranged in two.

4. The semiconductor package assembly according to claim 1, characterized in that: The buffer pad (6) is fixedly connected to one side of the top of the box body (1).

5. The semiconductor package assembly according to claim 1, characterized in that: The sealing pad (10) is made of soft rubber material.

6. The semiconductor package assembly according to claim 1, characterized in that: A protective pad (13) is slidably connected between the box body (1) and the packaging body (16), and a plurality of the protective pads (13), the first baffle plate (14) and the second baffle plate (15) are symmetrically arranged.

7. A semiconductor package assembly according to claim 6, characterized in that: A buffer pad (6) is provided at the lower end of the locking groove (2), and the bottom of the buffer pad (6) is fixedly connected to one side of the top of the box body (1).

8. The semiconductor package assembly according to claim 1, characterized in that: The outer surface of the spring (4) is coated with an anti-oxidation layer.

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