Semiconductor material performance testing device

Abstract

The utility model belongs to the technical field of semiconductors, and particularly discloses a semiconductor material performance testing device which comprises a device frame, the top of the device frame is rotationally connected with a testing table through a driving mechanism, a rubber plug is arranged on the testing table, and the top of the device frame is fixedly connected with a vertical frame. The inner surface of the vertical frame is sleeved with a threaded rod in a threaded mode, a rotary knob is arranged at the top of the threaded rod, a bottom frame is fixedly connected to the bottom of the threaded rod, a friction assembly is arranged on the bottom frame, the driving mechanism comprises a motor fixedly installed in the device frame, and the output end of the motor is fixedly connected with a driving shaft. According to the semiconductor material performance testing device, the screw rod is driven to move downwards by rotating the knob, the testing device can adjust the abutting force applied by the testing head to the semiconductor material, different abrasion degrees can be caused by different abutting forces, and therefore accurate abrasion testing can be carried out according to requirements.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor material performance testing device. Background Art

[0002] Semiconductor materials are a type of material between conductors and insulators. Their electrical conductivity is between conductors and insulators. When the temperature rises, the electrical conductivity will increase. The conductivity of semiconductor materials is mainly determined by their electronic structure. They are widely used in fields such as electronics and optoelectronics.

[0003] In some semiconductor devices, the quality of the contact interface has a great impact on the performance, such as metal-semiconductor contact. Therefore, it is necessary to perform wear testing on the contact interface of the semiconductor material. Currently, there are few testing devices for this purpose, and it is difficult to perform fast and effective wear testing on semiconductor materials. Utility Model Content

[0004] In view of this, the purpose of the present invention is to solve the shortcomings existing in the background technology and to propose a semiconductor material performance testing device to solve the problems existing in the prior art.

[0005] To achieve the above purpose, the utility model provides a semiconductor material performance testing device, including a device frame, the top of the device frame is rotatably connected to a test bench through a driving mechanism, a rubber plug is provided on the test bench, the top of the device frame is fixedly connected to a stand, the inner surface of the stand is threadedly sleeved with a screw, the top of the screw is provided with a knob, the bottom of the screw is fixedly connected to a base frame, and a friction assembly is provided on the base frame.

[0006] Preferably, the driving mechanism comprises a motor fixedly mounted inside the device frame, and an output end of the motor is fixedly connected to a driving shaft, so that the test bench can be rotated through the driving mechanism, thereby driving the semiconductor material in the test bench to rotate.

[0007] Preferably, a driving gear is provided at one end of the driving shaft away from the motor, and a driven gear is meshedly connected to the outer surface of the driving gear.

[0008] Preferably, a rotating shaft is fixedly connected to the top of the driven gear, and the top of the rotating shaft is fixedly connected to the bottom of the test bench.

[0009] Preferably, the friction assembly includes a plurality of groups of openings formed on the outer surface of the base frame, and an embedded groove is formed inside the base frame.

[0010] Preferably, a test head is movably inserted inside the base frame, and a rubber ring is provided on the outer surface of the test head, and the rubber ring can be completely embedded in the embedded groove.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. The semiconductor material performance testing device drives the screw rod downward by rotating the knob. The testing device can adjust the holding force applied by the test head to the semiconductor material. Different holding forces will lead to different degrees of wear, so that accurate wear testing can be performed according to needs.

[0013] 2. The semiconductor material performance testing device can perform corresponding wear tests on different positions of the semiconductor material by replacing the test table to different openings, so that the durability and stability of the semiconductor material in different areas can be comprehensively evaluated. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of this application;

[0015] Figure 2 This is a schematic diagram of the surface structure of the stand for this application;

[0016] Figure 3 This is a schematic diagram of the internal structure of the chassis of this application;

[0017] Figure 4 This is a schematic diagram of the test bench structure for this application.

[0018] Among them: 1. Device frame; 2. Motor; 3. Drive shaft; 4. Active gear; 5. Driven gear; 6. Rotating shaft; 7. Test bench; 8. Stand; 9. Screw; 10. Knob; 11. Base frame; 12. Opening; 13. Embedded groove; 14. Test head; 15. Rubber ring; 16. Rubber plug. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] See also Figure 1-4 A semiconductor material performance testing device includes a device frame 1, the top of the device frame 1 is rotatably connected to a test bench 7 through a driving mechanism, a rubber plug 16 is provided on the test bench 7, the top of the device frame 1 is fixedly connected to a stand 8, the inner surface of the stand 8 is threadedly sleeved with a screw 9, the top of the screw 9 is provided with a knob 10, the bottom of the screw 9 is fixedly connected to a base frame 11, and the base frame 11 is provided with a friction component.

[0021] Through the above technical solution, during the process of testing semiconductor materials, the device places a circular semiconductor material with its axis hollowed out in the test bench 7, passes the rubber plug 16 through the semiconductor material and is inserted into the test bench 7 to basically stabilize the semiconductor material, and the semiconductor material can be tested for friction damage under the action of the driving mechanism and the friction component.

[0022] Specifically, the driving mechanism includes a motor 2 fixedly installed inside the device frame 1 , and an output end of the motor 2 is fixedly connected to a driving shaft 3 .

[0023] Through the above technical solution, after the motor 2 is turned on, the driving shaft 3 can be driven to rotate, and the driving gear 4 can be linked to rotate.

[0024] Specifically, a driving gear 4 is disposed at one end of the driving shaft 3 away from the motor 2 , and a driven gear 5 is meshedly connected to the outer surface of the driving gear 4 .

[0025] Through the above technical solution, the driving gear 4 and the driven gear 5 can form a complete bevel gear, which can transmit power and motion.

[0026] Specifically, the top of the driven gear 5 is fixedly connected to the rotating shaft 6 , and the top of the rotating shaft 6 is fixedly connected to the bottom of the test bench 7 .

[0027] Through the above technical solution, the rotation of the rotating shaft 6 will cause the circular semiconductor material inside the test bench 7 to rotate synchronously.

[0028] Specifically, the friction assembly includes a plurality of groups of openings 12 formed on the outer surface of the base frame 11 , and an embedded groove 13 is formed inside the base frame 11 .

[0029] Through the above technical solution, multiple groups of openings 12 are designed so as to perform wear tests at different positions of the test bench 7 without moving the semiconductor material.

[0030] Specifically, a test head 14 is movably inserted into the bottom frame 11 , and a rubber ring 15 is provided on the outer surface of the test head 14 .

[0031] Through the above technical solution, the rubber ring 15 is inserted into the embedded groove 13 to stably insert the test head 14 into the opening 12 .

[0032] Working principle: When the device is used, first place the circular semiconductor material with the axis hollowed out in the test bench 7, and then insert the rubber plug 16 into the hole of the test bench 7 after passing through the semiconductor material, so as to stabilize the semiconductor material. Then, according to the position of the semiconductor material to be polished, insert the test head 14 into the corresponding opening 12. When the rubber ring 15 is completely embedded in the embedded groove 13, the test head 14 can be kept in a stable state during the test. Then, the knob 10 is rotated to drive the screw rod 9 to rotate. The screw rod 9 will gradually move downward while rotating, and then the chassis 11 will gradually approach the semiconductor material while rotating until the test is completed. The test head 14 is pressed against the semiconductor material with a suitable force (different pressure of resistance here will result in different degrees of wear), and finally the motor 2 is turned on to drive the drive shaft 3 to rotate. After the cooperation of the driving gear 4 and the driven gear 5, force and motion can be transmitted, thereby causing the rotating shaft 6 to rotate, that is, the test table 7 at the top of the rotating shaft 6 rotates synchronously. At this time, the semiconductor material is rubbed by the circular track made by the test head 14 on its surface during the rotation process, so that a quick and effective wear test can be performed, and by replacing the test head 14 into different openings 12, corresponding wear tests can be performed on different positions on the surface of the semiconductor material.

[0033] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor material performance testing device, comprising a device frame (1), characterized in that: The top of the device frame (1) is rotatably connected to a test bench (7) through a driving mechanism, a rubber plug (16) is provided on the test bench (7), the top of the device frame (1) is fixedly connected to a stand frame (8), a screw rod (9) is threadedly sleeved on the inner surface of the stand frame (8), a knob (10) is provided on the top of the screw rod (9), the bottom of the screw rod (9) is fixedly connected to a base frame (11), and a friction assembly is provided on the base frame (11).

2. A semiconductor material performance testing device according to claim 1, characterized in that: The driving mechanism comprises a motor (2) fixedly mounted inside a device frame (1), and an output end of the motor (2) is fixedly connected to a driving shaft (3).

3. A semiconductor material performance testing device according to claim 2, characterized in that: A driving gear (4) is provided at one end of the driving shaft (3) away from the motor (2), and a driven gear (5) is meshingly connected to the outer surface of the driving gear (4).

4. A semiconductor material performance testing device according to claim 3, characterized in that: The top of the driven gear (5) is fixedly connected to a rotating shaft (6), and the top of the rotating shaft (6) is fixedly connected to the bottom of the test bench (7).

5. A semiconductor material performance testing device according to claim 1, characterized in that: The friction assembly comprises a plurality of groups of openings (12) formed on the outer surface of a base frame (11), and an embedded groove (13) is formed inside the base frame (11).

6. A semiconductor material performance testing device according to claim 5, characterized in that: A test head (14) is movably inserted into the interior of the base frame (11), and a rubber ring (15) is provided on the outer surface of the test head (14).

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