Detection device for chip packaging

Abstract

The utility model relates to the technical field of detection devices, and discloses a detection device for chip packaging, which comprises a detection table and servo cylinders I. The servo cylinders I are symmetrically arranged on the rear side of the detection table, a supporting plate is arranged above the detection table, and the bottom surface of the rear side of the supporting plate is symmetrically fixed at the output ends of the servo cylinders I. The servo cylinders I are symmetrically arranged on the detection table. A plurality of positioning coamings are fixed on the top surface of the detection table at equal intervals, and detection probes are arranged above the positioning coamings, so that a packaged chip is positioned through the positioning coamings, detection result dislocation caused by low position of the chip during detection is avoided, and the chip can be accurately detected through an internal air suction assembly. And when the detection probe enters the positioning coaming, negative pressure is generated in the positioning coaming, so that the chip is fixed in the coaming, the problems that when an existing detection device for chip packaging is used, placing and taking of parts are inconvenient, and the accuracy of a detection result is easily affected are solved, and the practicability of the monitoring device is greatly improved.

Description

Technical Field

[0001] The utility model application relates to the technical field of detection devices, in particular to a detection device for chip packaging. Background Art

[0002] Chip packaging means that the contacts on the chip are connected to the pins of the package shell with wires, and the pins are connected to other devices through the wires on the printed circuit board. The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. Therefore, packaging plays an important role in CPU and other LSI integrated circuits.

[0003] When the chip is packaged, the pins need to be soldered to the chip contacts with tin. After completion, it is necessary to test whether the pins are connected. Currently, most long-term testing devices place the packaged chip in a test slot and then test it with a test probe. However, during the test, if the placement is not correct, there may be a test result of inability to connect. Positioning the chip can easily cause pressure and it is inconvenient to take it out after testing. Summary of the invention

[0004] In order to solve the problems that the existing chip packaging detection device is inconvenient to place and take out when in use and easily affects the accuracy of the detection result, the utility model provides a chip packaging detection device to solve the above problems.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A detection device for chip packaging, comprising a detection platform and a servo cylinder, wherein a servo cylinder is symmetrically arranged on the rear side of the detection platform, a support plate is arranged above the detection platform, and the rear bottom surface of the support plate is symmetrically fixed to the output end of the servo cylinder, a plurality of positioning panels are equidistantly fixed on the top surface of the detection platform, and detection probes are arranged above the positioning panels, a connecting plate is fixed to the top surface of each detection probe, and the top surface of the connecting plate is fixed to the bottom surface of the support plate by screws, a supporting plate is slidably arranged inside each positioning panel, and a fixing component is arranged below the supporting plate

[0007] Furthermore, the fixed component includes a fan and an air inlet, a placement cavity is opened at the lower part of the detection platform, and the fan is symmetrically arranged inside the placement cavity, an air outlet is opened through the bottom surface of the positioning enclosure for air outlet, and a dustproof net is fixed inside the air outlet, and each of the supporting plates is evenly spaced inside with a number of air inlets.

[0008] Furthermore, each of the connecting plates is configured in a "T" shape, and the outer surface of the top surface of each detection probe is slidably fitted with the inner wall of the positioning enclosure.

[0009] Furthermore, a supporting plate is slidably connected to the inside of the positioning enclosure, and connecting rods are fixed at the four corners of the bottom surface of the supporting plate. A servo cylinder 2 is arranged inside the placement cavity below the positioning enclosure, and the servo cylinder 2 is fixedly installed on the front and rear walls of the placement cavity. A support frame is fixed to the output end of the servo cylinder 2, and the bottom surface of each connecting rod is fixed to the top surface of the support frame.

[0010] Furthermore, a protective net is fixed on the inner walls of the upper and lower ends of each of the air inlet holes, and the height of each of the positioning enclosures is less than the height of the connecting rod.

[0011] Furthermore, a plurality of ventilation grooves are equidistantly provided inside the support frame below the air inlet, and a plurality of placement grooves cooperating with the supporting plate are provided on the top surface of the detection platform.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. In the utility model, the packaged chip is positioned by a positioning enclosure, so that the chip will not be misplaced due to the cheap position during detection, and through the internal suction component, when the detection probe enters the positioning enclosure, negative pressure is generated inside the enclosure, so that the chip is fixed inside the enclosure, which solves the problem that the existing chip packaging detection device is inconvenient to place and take out during use and is easy to affect the accuracy of the detection result, and greatly improves the practicality of the monitoring device.

[0014] 2. In the utility model, through the internal ejection structure, after the detection is completed, the servo cylinder 2 drives the support plate to move up through the support frame until the top surface of the support plate is directly flush with the top surface of the positioning fence, and the packaged chip can be directly taken out, which can better protect the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 is a schematic front view of the structure of a detection device according to an embodiment of the present application;

[0017] Figure 2 yes Figure 1 A schematic top view of the structure of the detection device in the illustrated embodiment;

[0018] Figure 3 yes Figure 1 A schematic front cross-sectional view of the detection device structure in the illustrated embodiment;

[0019] Figure 4 yes Figure 1 The schematic diagram of the cross-section from bottom view of the detection device structure in the illustrated embodiment.

[0020] The meanings of the reference numerals in the figure are: 1. test table; 2. servo cylinder one; 3. support plate; 4. connecting plate; 5. test probe; 6. positioning enclosure; 7. placement cavity; 8. fan; 9. air outlet; 10. supporting plate; 11. air inlet; 12. support frame; 13. servo cylinder two; 14. connecting rod. DETAILED DESCRIPTION

[0021] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] Reference Figure 1 , Figure 2 and Figure 3 A detection device for chip packaging comprises a detection platform 1 and a servo cylinder 2, a servo cylinder 2 is symmetrically arranged on the rear side of the detection platform 1, a support plate 3 is arranged above the detection platform 1, and the rear bottom surface of the support plate 3 is symmetrically fixed to the output end of the servo cylinder 2, a plurality of positioning panels 6 are equidistantly fixed on the top surface of the detection platform 1, and detection probes 5 are arranged above the positioning panels 6, each connecting plate 4 is arranged in a "T" shape, and the outer surface of the top surface of each detection probe 5 is slidably fitted with the inner wall of the positioning panel 6, a connecting plate 4 is fixed on the top surface of each detection probe 5, and the top surface of the connecting plate 4 is fixed to the bottom surface of the support plate 3 by screws, a supporting plate 10 is slidably arranged inside each positioning panel 6, a plurality of placement grooves cooperating with the supporting plate 10 are opened on the top surface of the detection platform 1, and a fixing component is arranged below the supporting plate 10.

[0023] Specifically, when inspection is required, the packaged chips are placed one by one on the top surface of the supporting plate 10 inside the positioning enclosure 6. After being fixed by the fixing assembly, the support plate 3 drives the servo cylinder 2 to move downward. When the servo cylinder 2 moves downward, it drives the detection probe 5 to move downward to inspect the packaged chips inside the positioning enclosure 6. After the inspection is completed, the support plate 3 drives the detection probe 5 to move upward to take out the chips inside the positioning enclosure 6. The replaceable design between the positioning enclosure 6 and the support plate 3 makes it convenient to adjust the detection probe 5 according to the chip type.

[0024] As an optimization solution, Figure 3 and Figure 4 As shown, the fixed component includes a fan 8 and an air inlet 11, a placement cavity 7 is opened at the lower part of the testing platform 1, and the fan 8 is symmetrically arranged inside the placement cavity 7, an air outlet 9 is opened through the bottom surface of the positioning enclosure 6 for air outlet, and a dustproof net is fixed inside the air outlet 9, and a plurality of air inlet holes 11 are equidistantly opened inside each supporting plate 10, and a protective net is fixed on the inner wall of the upper and lower ends of each air inlet hole 11.

[0025] Specifically, when the chip needs to be fixed, turn on the fan 8 and allow the fan 8 to run to exhaust air, thereby extracting the air inside the positioning enclosure 6, thereby generating negative pressure inside the air inlet 11, thereby fixing the chip on the surface of the support plate 10. After the inspection is completed, when the chip needs to be removed, turn off the fan 8 to release the suction generated by the fan 8.

[0026] As an optimization solution, Figure 3 and Figure 4 As shown, the positioning enclosure 6 is slidably connected to a supporting plate 10, and connecting rods 14 are fixed at the four corners of the bottom surface of the supporting plate 10. The height of each positioning enclosure 6 is less than the height of the connecting rod 14. A servo cylinder 13 is arranged inside the placement cavity 7 below the positioning enclosure 6, and the servo cylinder 13 is fixedly installed on the front and rear walls of the placement cavity 7. The output ends of the servo cylinder 13 are fixed with support frames 12. A plurality of ventilation grooves are equidistantly provided inside the support frame 12 below the air inlet 11, and the bottom surface of each connecting rod 14 is fixed to the top surface of the support frame 12.

[0027] Furthermore, when it is necessary to take out the chip inside the positioning enclosure 6, the servo cylinder 2 13 is turned on, so that the servo cylinder 2 13 runs to drive the support frame 12 to move upward. When the support frame 12 moves upward, the supporting plate 10 is pushed upward by the connecting rod 14. When the supporting plate 10 is pushed until it is flush with the top surface of the positioning enclosure 6, the chip can be quickly removed. After the removal is completed, the servo cylinder 2 13 runs to drive the supporting plate 10 to move to the inside of the positioning enclosure 6, and make the top surface of the supporting plate 10 flush with the bottom surface of the positioning enclosure 6.

[0028] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0029] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip packaging detection device, comprising a detection platform (1) and a servo cylinder (2), characterized in that: A servo cylinder (2) is symmetrically arranged on the rear side of the detection platform (1); a support plate (3) is arranged above the detection platform (1), and the rear bottom surface of the support plate (3) is symmetrically fixed to the output end of the servo cylinder (2); a plurality of positioning panels (6) are equidistantly fixed to the top surface of the detection platform (1), and detection probes (5) are arranged above the positioning panels (6); a connecting plate (4) is fixed to the top surface of each detection probe (5), and the top surface of the connecting plate (4) is fixed to the bottom surface of the support plate (3) by screws; a supporting plate (10) is slidably arranged inside each positioning panel (6), and a fixing component is arranged below the supporting plate (10).

2. The chip packaging detection device according to claim 1, characterized in that: The fixed component comprises a fan (8) and an air inlet (11); a placement cavity (7) is provided at the bottom of the test platform (1), and the fan (8) is symmetrically arranged inside the placement cavity (7); an air outlet (9) is provided through the bottom surface of the positioning enclosure (6) for air outlet, and a dustproof net is fixed inside the air outlet (9); and a plurality of air inlet holes (11) are equidistantly provided inside each of the supporting plates (10).

3. The chip packaging detection device according to claim 1, characterized in that: Each of the connecting plates (4) is configured in a "T" shape, and the outer surface of the top surface of each of the detection probes (5) is slidably fitted with the inner wall of the positioning enclosure (6).

4. The chip packaging detection device according to claim 1, characterized in that: The positioning enclosure (6) is slidably connected to a support plate (10) inside, and connecting rods (14) are fixed at the four corners of the bottom surface of the support plate (10). A servo cylinder 2 (13) is arranged inside the placement cavity (7) below the positioning enclosure (6), and the servo cylinder 2 (13) is fixedly mounted on the front and rear walls of the placement cavity (7). The output end of the servo cylinder 2 (13) is fixed to a support frame (12), and the bottom surface of each connecting rod (14) is fixed to the top surface of the support frame (12).

5. The chip packaging detection device according to claim 2, characterized in that: A protective net is fixed on the inner walls of the upper and lower ends of each of the air inlet holes (11), and the height of each of the positioning enclosures (6) is less than the height of the connecting rod (14).

6. The chip packaging detection device according to claim 5, characterized in that: A plurality of ventilation grooves are equidistantly provided inside the support frame (12) below the air inlet hole (11), and a plurality of placement grooves cooperating with the support plate (10) are provided on the top surface of the detection platform (1).

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