Novel packaging structure with double-sided heat dissipation function and capable of improving reliability
By adopting a new package structure with double-sided heat dissipation function in the chip packaging structure, using the combination of multi-layer conductive material and heat dissipation metal layer, the problems of high packaging complexity and low heat dissipation efficiency in the prior art are solved, and more efficient Chip heat dissipation management reduces costs and improves product competitiveness.
Patent Information
- Application Number
- CN202421043782.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-05-14
AI Technical Summary
The existing packaging structures have problems such as high complexity, high cost and low heat transfer efficiency in improving chip heat dissipation performance, which cannot meet the needs of efficient heat dissipation under high power and high current conditions.
A new package structure adopts a double-sided heat dissipation function. By printing a conductive material layer on the metal substrate frame and mounting a chip, combining conductive dielectric components and heat dissipation metal layer, multiple heat dissipation channels are formed, and current conduction and resistance are achieved through the electroplating process. Oxidation, increasing the area of the heat dissipation metal to improve heat dissipation efficiency.
It effectively reduces packaging costs, improves the heat dissipation efficiency of the chip, optimizes the working temperature management of the chip, reduces the packaging complexity, and enhances the competitiveness of the product.
Smart Images
Figure CN222300663U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a new packaging structure with double-sided heat dissipation function for improving reliability. Background Art
[0002] The integration of the IOT era and the AI era has given birth to an efficient social form, and scientific innovation is always the helmsman leading the trend of the times. Electronic information technology has penetrated into many fields such as industrial electronics, automotive electronics, and smart homes, and has deduced the route of the emerging era through big data statistics and computing power systems. In order to achieve efficient and accurate data statistics and deductions, thereby promoting the update and iteration of computing power chips, it has higher power consumption requirements for high-power and high-current working conditions. If the accumulated heat cannot be dissipated in time to ensure that the chip temperature is below the safe temperature, the chip's operating performance will be affected at the least, and it will be directly burned and paralyzed at the worst, which seriously restricts the rapid development of high-performance computing power systems.
[0003] The current mainstream packaging and heat dissipation solutions in the industry are:
[0004] An additional metal heat dissipation component carrier is added to the top of the chip and thinned after plastic packaging to ensure the leakage of the metal heat dissipation component. At the same time, a heat dissipation channel of the top heat dissipation component is established through the bonding interface at the bottom of the top heat dissipation component.
[0005] The above structure has the following deficiencies:
[0006] A metal heat dissipation component carrier is added to the chip surface, and the non-functional area on the chip surface is limited, which cannot enhance the utilization of the functional area, and the chip heat dissipation interface cannot be maximized;
[0007] It is necessary to first plastic seal and then thin it to ensure that the metal heat dissipation component carrier is exposed, which increases the plastic seal grinding process and makes the packaging process more complicated;
[0008] Adding the combination and welding of the heat dissipation component on the top of the metal heat dissipation component carrier increases the packaging structure cost and the complexity of the packaging process. Utility Model Content
[0009] The current packaging implementation process is complex, the overall cost is high, the heat dissipation channel is poor, and the temperature transfer of the chip itself cannot be improved. In view of the problem of heat power dissipation, it is impossible to achieve higher current and higher voltage product application areas.
[0010] The utility model aims to provide a new packaging structure with double-sided heat dissipation function to improve reliability.
[0011] A new packaging structure with double-sided heat dissipation function to improve reliability,
[0012] It includes N metal substrate frames, N≥2;
[0013] The first conductive material layer is printed on the upper surfaces of the N metal substrate frames;
[0014] The upper surface of the first conductive material layer is mounted with a first chip;
[0015] The first chips are all printed with a second conductive material layer, and the upper surface of the second conductive material layer is mounted with the same first conductive medium component;
[0016] A third conductive material layer is printed on the upper surface of the first conductive medium component in an area directly above the A metal substrate frames, 1≤A<N;
[0017] The third conductive material layer is mounted with a second conductive medium component;
[0018] The second conductive medium has a plurality of protrusions on its upper surface;
[0019] A plastic sealing layer is provided around the periphery of the entire internal component, and the lower surfaces of the N metal substrate frames, one end of the first conductive medium component, and the upper surfaces of all protrusions on the second conductive medium component are exposed outside the plastic sealing layer;
[0020] The upper surfaces of all the protrusions are connected to the same heat dissipation metal layer, and the upper surfaces of all the protrusions are in contact with the lower surface of the heat dissipation metal layer.
[0021] Furthermore, on the upper surface of the first conductive medium component, B fourth conductive material layers are printed in an area where the third conductive material layer is not printed and just above the metal substrate frame, and a second chip is mounted on each of the fourth conductive material layers. The second chip is electrically connected to the first conductive medium component through a welding wire, wherein 1≤B≤NA.
[0022] Specifically, the first conductive medium component and the second conductive medium component are made of metal.
[0023] Specifically, the first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.
[0024] Specifically, the heat dissipation metal layer is made of copper.
[0025] Specifically, N is 2, A is 1, and B is 1.
[0026] The entire internal component is covered with a plastic layer, and the lower surfaces of the N metal substrate frames are exposed to the outside. Another end of the first conductive medium component is protected by a film assistant mold (FAM) to ensure that one end is exposed outside the plastic layer.
[0027] The electroplating process is adopted to achieve the effect of electroplating anti-oxidation metal layer by conducting current on the front metal and the back metal.
[0028] The utility model has the following advantages over the prior art in terms of a new packaging structure with double-sided heat dissipation function that improves reliability:
[0029] (1) Product cost: The heat dissipation layer is adopted to effectively replace the external heat sink structure commonly used in the industry, reduce costs and enhance competitive advantages;
[0030] (2) Heat dissipation effect: directly exposing the heat-conducting metal outside the plastic package and taking the approach of expanding the metal area can achieve the largest area of welding for the rear-mounted heat sink, improve the heat dissipation transfer efficiency, and optimize the chip's operating speed;
[0031] (3) The current application of the packaging heat dissipation channels and process methods of this top heat dissipation structure is somewhat different from the existing solutions in the semiconductor packaging field. The overall heat dissipation industry still mainly achieves multi-functional heat dissipation by adding heat sinks or adding heat sinks on the top. The number of packaging heat dissipation channels can be increased to effectively transfer the temperature generated by the chip to the top heat dissipation channel, thereby reducing the impact of the chip junction temperature on the product itself. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 A schematic diagram of a new packaging structure with double-sided heat dissipation function to improve reliability provided in Example 1;
[0033] Figure 2 This is a schematic diagram of the product after step B1 in Example 1 is completed;
[0034] Figure 3 This is a schematic diagram of the product after step B2 in Example 1 is completed;
[0035] Figure 4 This is a schematic diagram of the product after step B3 in Example 1 is completed;
[0036] Figure 5 This is a schematic diagram of the product after step B4 in Example 1 is completed;
[0037] Figure 6 This is a schematic diagram of the product after step B5 in Example 1 is completed;
[0038] Figure 7 This is a schematic diagram of the product after step B6 in Example 1 is completed;
[0039] Figure 8 This is a schematic diagram of the product after step B7 in Example 1 is completed;
[0040] Fig. 9This is a schematic diagram of the product after step B8 in Example 1 is completed;
[0041] Fig.10 This is a schematic diagram of the product after step B9 in Example 1 is completed;
[0042] Fig.11 This is a schematic diagram of the product after step B10 in Example 1 is completed. DETAILED DESCRIPTION
[0043] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.
[0044] Example 1
[0045] like Figure 1 As shown, the utility model is a new packaging structure with double-sided heat dissipation function for improving reliability, comprising N metal substrate frames 1, N ≥ 2; the upper surfaces of the N metal substrate frames 1 are all printed with a first conductive material layer 2; the upper surfaces of the first conductive material layer 2 are all mounted with a first chip 3; the first chip 3 is all printed with a second conductive material layer 4, and the upper surfaces of the second conductive material layer 4 are all mounted with the same first conductive medium component 5; on the upper surface of the first conductive medium component 5, the area directly above the A metal substrate frames is printed with a third conductive material layer 6, 1≤A<N; the second conductive medium components 7 are mounted on the third conductive material layer 6; the upper surface of the second conductive medium 7 has a plurality of protrusions 8; the entire internal component is covered with a plastic sealing layer 9, and the lower surfaces of the N metal substrate frames, one end of the first conductive medium component 5, and the upper surfaces of all protrusions 13 on the second conductive medium component 7 are exposed outside the plastic sealing layer 11; the upper surfaces of all the protrusions 13 are connected to the same heat dissipation metal layer 12, and the upper surfaces of all the protrusions 13 are in contact with the lower surface of the heat dissipation metal layer 12. On the exposed surface of the conductive medium, a metal sputtering / copper plating process is adopted to realize the whole surface metallization process, so as to realize the expansion of the externally leaked conductive medium.
[0046] In this embodiment, B fourth conductive material layers 8 are printed on the upper surface of the first conductive medium component in an area where the third conductive material layer is not printed and just above the metal substrate frame, and second chips 9 are mounted on each of the fourth conductive material layers 8. The second chip 9 is electrically connected to the first conductive medium component 5 through a welding wire 10, wherein 1≤B≤NA.
[0047] Specifically, the first conductive medium component 5 and the second conductive medium component 7 are made of metal.
[0048] In this embodiment, the first conductive material layer 2 , the second conductive material layer 4 , the third conductive material layer 6 and the fourth conductive material layer 8 are made of metal.
[0049] In this embodiment, the heat dissipation metal layer 12 is made of copper.
[0050] In this embodiment, N is 2, A is 1, and B is 1.
[0051] Taking N as 2 as an example, a preparation process of a new packaging structure with double-sided heat dissipation function to improve reliability includes the following steps:
[0052] B1. Take two metal substrate frames 1 and print a first conductive material layer 2 on the upper surface thereof. Figure 2 ;
[0053] B2. Mounting the first chip 3 on the first conductive material layer 2, such as Figure 3 As shown;
[0054] B3, the second conductive material layer 4 is printed on the first chip, such as Figure 4 As shown;
[0055] B4, attaching the first conductive medium component 5 to the second conductive material layer 4, and printing the third conductive material layer 6 on the upper surface of the first conductive medium component 5, in the area directly above any of the metal substrate frames, such as Figure 5 As shown;
[0056] B5. Mount a second conductive medium component 7 on the third conductive material layer, wherein the upper surface of the second conductive medium component 7 has a plurality of protrusions 13, such as Figure 6 As shown;
[0057] B6. Print a fourth conductive material layer 8 on the upper surface of the first conductive medium component 5 in an area where the third conductive material layer 6 is not printed and just above the metal substrate frame. Figure 7 As shown;
[0058] B7, mounting the second chip 9 on the fourth conductive material layer 8, such as Figure 8 As shown;
[0059] B8, realize electrical connection between the second chip 9 and the first conductive medium component 7 through the bonding wire 10, such as Fig. 9 As shown;
[0060] B9. Performing plastic sealing on the internal component formed after step B9 to form a plastic sealing layer 11 on the periphery of the internal component, the lower surface of the metal substrate frame 1, one end of the second conductive medium component 5, and the upper surfaces of all protrusions 13 on the second conductive medium component 7 are exposed outside the plastic sealing layer 11. Fig.10 As shown;
[0061] B10, on the exposed surface of the conductive medium, a metal sputtering / copper plating process is used to realize the whole surface metallization process to form a heat dissipation metal layer 12, and the upper surface of all the protrusions 13 is in contact with the lower surface of the heat dissipation metal layer 12 to achieve the expansion of the external conductive medium. Fig.11 shown.
[0062] In this embodiment, the plastic sealing layer 11 of the high heat dissipation plastic sealing material using the FAM process is used to protect the internal product components and allow the metal terminals to leak out, while effectively isolating the influence of external water vapor and electrical interference, and copper plating / sputtering and electroplating processes are used to increase the heat dissipation metal layer 12 to achieve the expansion of the external leakage conductive medium.
[0063] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.
Claims
1. A new packaging structure with double-sided heat dissipation function to improve reliability, characterized in that: It includes N metal substrate frames, N≥2; The first conductive material layer is printed on the upper surfaces of the N metal substrate frames; The upper surface of the first conductive material layer is mounted with a first chip; The first chips are all printed with a second conductive material layer, and the upper surface of the second conductive material layer is mounted with the same first conductive medium component; A third conductive material layer is printed on the upper surface of the first conductive medium component in an area directly above the A metal substrate frames, 1≤A<N; The third conductive material layer is mounted with a second conductive medium component; The second conductive medium has a plurality of protrusions on its upper surface; A plastic sealing layer is provided around the periphery of the entire internal component, and the lower surfaces of the N metal substrate frames, one end of the first conductive medium component, and the upper surfaces of all protrusions on the second conductive medium component are exposed outside the plastic sealing layer; The upper surfaces of all the protrusions are connected to the same heat dissipation metal layer, and the upper surfaces of all the protrusions are in contact with the lower surface of the heat dissipation metal layer.
2. A new packaging structure with double-sided heat dissipation function for improving reliability as claimed in claim 1, characterized in that: On the upper surface of the first conductive medium component, B fourth conductive material layers are printed in an area where the third conductive material layer is not printed and just above the metal substrate frame, and a second chip is mounted on each of the fourth conductive material layers. The second chip is electrically connected to the first conductive medium component through a welding wire, wherein 1≤B≤NA.
3. A new packaging structure with double-sided heat dissipation function for improving reliability as claimed in claim 1 or 2, characterized in that: The first conductive medium component and the second conductive medium component are made of metal.
4. A new packaging structure with double-sided heat dissipation function for improving reliability as claimed in claim 2, characterized in that: The first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.
5. A new packaging structure with double-sided heat dissipation function for improving reliability as claimed in claim 1, characterized in that: The heat dissipation metal layer is made of copper.
6. A new packaging structure with double-sided heat dissipation function for improving reliability as claimed in claim 2, characterized in that: N is 2, A is 1, and B is 1.